CN108048793A - Metallic plate, the manufacturing method of metallic plate and the method using metallic plate manufacture deposition mask - Google Patents
Metallic plate, the manufacturing method of metallic plate and the method using metallic plate manufacture deposition mask Download PDFInfo
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- CN108048793A CN108048793A CN201711267429.7A CN201711267429A CN108048793A CN 108048793 A CN108048793 A CN 108048793A CN 201711267429 A CN201711267429 A CN 201711267429A CN 108048793 A CN108048793 A CN 108048793A
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- metallic plate
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- 230000008021 deposition Effects 0.000 title claims abstract description 214
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000005530 etching Methods 0.000 claims abstract description 52
- 238000000137 annealing Methods 0.000 claims abstract description 22
- 238000000151 deposition Methods 0.000 claims description 210
- 239000002184 metal Substances 0.000 claims description 100
- 229910052751 metal Inorganic materials 0.000 claims description 100
- 239000000463 material Substances 0.000 claims description 77
- 239000000758 substrate Substances 0.000 claims description 60
- 230000008020 evaporation Effects 0.000 claims description 49
- 238000001704 evaporation Methods 0.000 claims description 49
- 238000007740 vapor deposition Methods 0.000 claims description 34
- 238000005096 rolling process Methods 0.000 claims description 29
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 10
- 229910001374 Invar Inorganic materials 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 22
- 239000002585 base Substances 0.000 description 17
- 239000011368 organic material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012216 screening Methods 0.000 description 4
- 238000010025 steaming Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 210000002027 skeletal muscle Anatomy 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/22—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling plates, strips, bands or sheets of indefinite length
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
- C23F1/04—Chemical milling
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to metallic plate, the manufacturing method of metallic plate and the methods using metallic plate manufacture deposition mask.The object of the present invention is to provide a kind of metallic plates for making the small deposition mask of warpage.In the case of being etched to the sample obtained from the metallic plate after annealing operation, the curvature k of the warpage of the sample after etching is 0.008mm‑1Below.
Description
The application is divisional application, the China national Application No. 201480003438.3 of original application, and the applying date is
On January 10th, 2014, entitled " metallic plate, the manufacturing method of metallic plate and the side using metallic plate manufacture deposition mask
Method ".
Technical field
The present invention relates to be used to manufacture the metallic plate of deposition mask by forming 2 or more through holes.The present invention also relates to
And the manufacturing method of metallic plate.Moreover, it relates to it manufactures to be deposited with desired pattern using metallic plate
Deposition mask method.
Background technology
In recent years, the display device for being used in the portable devices such as smart mobile phone and tablet computer, it is desirable that fine,
Such as picture element density is more than 300ppi.In addition, in portable device, need improving on correspondence is full HD, it is this
In the case of, the picture element density requirement of display device is such as more than 450ppi.
Since response is good, power consumption is low, organic EL display is attracted attention.Pixel shape as organic EL display
Into method, it is known that method be, using the deposition mask for including the through hole arranged with desired pattern, with desired figure
Case forms pixel.Specifically, first, deposition mask is made to be sealed at the substrate of organic EL display, it then, will be closely sealed
Deposition mask and substrate put into evaporation coating device together, carry out the vapor deposition of organic material etc..Generally manufacture obtains deposition mask as follows:
Through hole is formed on a metal plate by using the etching of photolithographic techniques, so as to manufacture above-mentioned vapor deposition mask
(such as patent document 1).
Prior art literature
Patent document
Patent document 1:Japanese Unexamined Patent Publication 2004-39319 publications
The content of the invention
In the case of the film forming for carrying out evaporation material on substrate using deposition mask, not only substrate, deposition mask are also attached
Evaporation material.For example, there is also along the significantly inclined direction of the normal direction compared with deposition mask in evaporation material
And fly to the evaporation material of substrate, such evaporation material can be reached before substrate is reached the wall surface of the through hole of deposition mask from
And adhere to.In this case, it is believed that evaporation material is difficult to adhere to the wall of the through hole positioned at deposition mask in a substrate
Region near face, as a result, the thickness ratio other parts of the evaporation material of attachment are small or generate unattached evaporation material
Part.That is, it is considered that the vapor deposition of the near wall of the through hole of deposition mask is unstable.Therefore, in order to form organic EL
The pixel of display device and in the case of using deposition mask, the dimensional accuracy and positional precision of pixel reduce, as a result, causing
The luminous efficiency of organic EL display reduces.
It is such in order to solve the problems, such as, consider to be thinned for manufacturing the thickness of the metallic plate of deposition mask.This is because
By reducing the thickness of metallic plate, the wall face height of the through hole of deposition mask can be made to become smaller, can reduced as a result, in evaporation material
Be attached to perforation wall surface of the hole on evaporation material ratio.But the small metallic plate of thickness in order to obtain, in rolling base material
It needs to increase rolling rate when manufacturing metallic plate.Here, rolling rate refers to utilize (thickness-metallic plate of base material)/(thickness of base material
Degree) calculate value.In the case of the heat treatments such as annealing are implemented after rolling, usual rolling rate is bigger, residues in answering for metallic plate
Power, that is, residual stress is also bigger.If residual stress is big, when forming through hole on a metal plate by etching, in metallic plate
Implement the one side of etching, residual stress eliminates, as a result, warpage occurs for obtained deposition mask.In the case where warpage is big,
Deposition mask cannot be made fully to be sealed at the substrate of organic EL display, as a result, obtained organic EL display
Pixel dimensional accuracy and positional precision reduce.
The object of the present invention is to provide it is a kind of can effectively solve the problems, such as such metallic plate, metallic plate manufacturing method and
The manufacturing method of deposition mask.
1st the present invention relates to a kind of manufacturing method of metallic plate, the metallic plates to be used for by forming 2 or more through holes
Deposition mask is manufactured, wherein, the above-mentioned through hole of above-mentioned deposition mask is above-mentioned by being etched to be formed to above-mentioned metallic plate
The manufacturing method of metallic plate possesses following processes:Rolling process rolls base material to obtain with thickness t0Above-mentioned gold
Belong to plate;And annealing operation, above-mentioned metallic plate is annealed to remove the internal stress of above-mentioned metallic plate, above-mentioned metallic plate has the 1st
Face and the 2nd face, the 1st face and the 2nd face are orthogonal compared with the thickness direction of above-mentioned metallic plate and opposite each other, to from above-mentioned
In the case that the sample obtained in above-mentioned metallic plate after annealing operation is etched, the curvature of the warpage of the sample after etching
K is 0.008mm-1Hereinafter, above-mentioned curvature k is following values:First, length is obtained from the above-mentioned metallic plate after above-mentioned annealing operation
The above-mentioned sample of 170mm, width 30mm, then, by the both ends except length direction in above-mentioned sample rise the region within 10mm with
Outer long 150mm, the region of width 30mm are as being etched region, from above-mentioned 1st surface side in the region that is etched of above-mentioned sample
Whole region is etched the sample, until the thickness for being etched region reaches 1/3 × t0Above and 2/3 × t0With
Under scope in, thereafter, the above-mentioned sample after etching is placed in predetermined mounting table according to its side for horizontal mode,
Then, the above-mentioned of distance x (mm) and above-mentioned sample between the end of the above-mentioned length direction for being etched region of above-mentioned sample is measured
The depth y (mm) of the warpage in region is etched, thereafter, distance x between above-mentioned end and above-mentioned depth y is substituted into following formula, is thus asked
Go out the curvature k,
K=1/ ρ, ρ=(y/2)+(x2/8y)。
In the manufacturing method of the metallic plate based on the present invention, above-mentioned annealing operation can stretch above-mentioned gold in length direction
While belonging to plate, implemented.
In the manufacturing method of the metallic plate based on the present invention, above-mentioned annealing operation can be batched in above-mentioned metallic plate in core
Implement in the state of on material.
In the manufacturing method of the metallic plate based on the present invention, the coefficient of thermal expansion of preferably above-mentioned base material is the heat with substrate
The equal value of the coefficient of expansion, on the substrate across the deposition mask manufactured by above-mentioned metallic plate and forming a film has evaporation material.
In the manufacturing method of the metallic plate based on the present invention, above-mentioned metallic plate can contain invar alloy material.
2nd present invention is related to a kind of metallic plate, which is to be steamed by forming 2 or more through holes to be used to manufacture
The metallic plate of mask is plated, wherein, above-mentioned metallic plate has thickness t0, also, above-mentioned metallic plate has the 1st face and the 2nd face, and this
1 face and the 2nd face be orthogonal compared with the thickness direction of above-mentioned metallic plate and opposite each other, to being obtained from above-mentioned metallic plate
In the case that sample is etched, the curvature k of the warpage of the sample after etching is 0.008mm-1Hereinafter, under above-mentioned curvature k is
State value:First, long 170mm, the above-mentioned sample of width 30mm are obtained from above-mentioned metallic plate, then, length will be removed in above-mentioned sample
The region conduct that long 150mm, width 30mm beyond the region within 10mm are played in the both ends in degree direction is etched region, from above-mentioned the
1 surface side is etched above-mentioned sample in the whole region for being etched region of above-mentioned sample, until described be etched region
Thickness reaches 1/3 × t0Above and 2/3 × t0In following scope, thereafter, by the above-mentioned sample after etching according to its side be water
Flat mode is placed in predetermined mounting table, then, measures the end of the above-mentioned length direction for being etched region of above-mentioned sample
The depth y (mm) of the above-mentioned warpage for being etched region of distance x (mm) and above-mentioned sample between portion, thereafter, by above-mentioned end spacing
Following formula is substituted into from x and above-mentioned depth y, above-mentioned curvature k is thus obtained,
K=1/ ρ, ρ=(y/2)+(x2/8y)。
The coefficient of thermal expansion of metallic plate based on present invention value preferably equal with the coefficient of thermal expansion of substrate, the substrate
On across the deposition mask manufactured by above-mentioned metallic plate and forming a film has evaporation material.
Metallic plate based on the present invention can contain invar alloy material.
3rd present invention is related to a kind of manufacturing method of deposition mask, which, which possesses, is formed with 2 or more and penetrates through
The effective coverage in hole and the peripheral region around above-mentioned effective coverage, wherein, which includes following processes:
Prepare the process of metallic plate, which has thickness t0, there is the 1st face and the 2nd face, the 1st face and the 2nd face are compared with above-mentioned
The thickness direction of metallic plate is orthogonal and opposite each other;With recess portion formation process, in this process, etched from above-mentioned 1st surface side
Metallic plate is stated, above-mentioned for marking from the formation of the 1st surface side in the region of the above-mentioned metallic plate of above-mentioned effective coverage for being formed
The recess portion of through hole, in the case where the sample to being obtained from above-mentioned metallic plate is etched, sample after etching is stuck up
Bent curvature k is 0.008mm-1Hereinafter, above-mentioned curvature k is following values:First, long 170mm, width are obtained from above-mentioned metallic plate
The above-mentioned sample of 30mm, then, by the length in addition to the region within 10mm is played at the both ends of length direction in above-mentioned sample
150mm, the region of width 30mm are as region is etched, from above-mentioned 1st surface side in the entire area for being etched region of above-mentioned sample
Domain is etched above-mentioned sample, until the thickness for being etched region reaches 1/3 × t0Above and 2/3 × t0Following model
In enclosing, thereafter, the above-mentioned sample after etching is placed in for horizontal mode in predetermined mounting table according to its side, then,
Distance x (mm) and the above-mentioned of above-mentioned sample between the end of the above-mentioned length direction for being etched region of above-mentioned sample is measured to be etched
Distance x between above-mentioned end and above-mentioned depth y thereafter, is substituted into following formula, is thus obtained above-mentioned by the depth y (mm) of the warpage in region
Curvature k,
K=1/ ρ, ρ=(y/2)+(x2/8y)。
In the recess portion formation process of the manufacturing method of the deposition mask based on the present invention, it can exist from above-mentioned 1st surface side
The whole region in above-mentioned 1st face is etched above-mentioned metallic plate.
It, can be from above-mentioned 1st surface side in the above-mentioned recess portion formation process of the manufacturing method of the deposition mask based on the present invention
Whole region in above-mentioned 1st face is etched above-mentioned metallic plate, until etched thickness reaches 1/3 × t0Above and 2/3 × t0
In following scope.
In the manufacturing method of the deposition mask based on the present invention, the coefficient of thermal expansion for preferably stating metallic plate is and substrate
The equal value of coefficient of thermal expansion, on the substrate across the deposition mask manufactured by above-mentioned metallic plate and forming a film has evaporation material.
In the manufacturing method of the deposition mask based on the present invention, above-mentioned metallic plate can contain invar alloy material.
According to the present invention, it can obtain the small deposition mask of warpage.Therefore the fully closely sealed deposition mask of substrate can be tied
Fruit can improve the dimensional accuracy and positional precision for being attached to the evaporation material on substrate.
Description of the drawings
Fig. 1 is for illustrating the figure of one embodiment of the present invention, to show to include the deposition mask device of deposition mask
An example schematic perspective view.
Fig. 2 is for illustrating the figure for the method being deposited using deposition mask device shown in FIG. 1.
Fig. 3 is the top partial view diagram for showing deposition mask shown in FIG. 1.
Fig. 4 is the sectional view along the IV-IV lines of Fig. 3.
Fig. 5 is the sectional view along the V-V lines of Fig. 3.
Fig. 6 is the sectional view along the line VI -- VI of Fig. 3.
Fig. 7 (a) is to show to obtain having the figure of the process of the metallic plate of desired thickness, Fig. 7 by rolling base material
(b) it is that the figure of the process annealed to the metallic plate as obtained from rolling is shown.
Fig. 8 (a) is the figure for showing the sample cut out from the metallic plate obtained using the process shown in Fig. 7 (a), (b), is schemed
8 (b) is shows as obtained from being etched the 1st face to the sample shown in Fig. 8 (a) figure of etched sample.
Fig. 9 (a), (b) are the stereogram for showing the appearance that the etched sample shown in Fig. 8 (b) is placed in mounting table
And top view.
Figure 10 is the schematic diagram of an example progress overall description for the manufacturing method to deposition mask shown in FIG. 1.
Figure 11 is for illustrating the figure of an example of the manufacturing method of deposition mask, to show in the section along normal direction
Go out the figure of long metal sheet.
Figure 12 is for illustrating the figure of an example of the manufacturing method of deposition mask, to show in the section along normal direction
Go out the figure of long metal sheet.
Figure 13 is for illustrating the figure of an example of the manufacturing method of deposition mask, to show in the section along normal direction
Go out the figure of long metal sheet.
Figure 14 is for illustrating the figure of an example of the manufacturing method of deposition mask, to show in the section along normal direction
Go out the figure of long metal sheet.
Figure 15 is for illustrating the figure of an example of the manufacturing method of deposition mask, to show in the section along normal direction
Go out the figure of long metal sheet.
Figure 16 is for illustrating the figure of an example of the manufacturing method of deposition mask, to show in the section along normal direction
Go out the figure of long metal sheet.
Figure 17 is for illustrating the figure of an example of the manufacturing method of deposition mask, to show in the section along normal direction
Go out the figure of long metal sheet.
Figure 18 is for illustrating the figure of a variation of deposition mask and deposition mask device.
Figure 19 (a)~(c) is for illustrating the figure for the method for obtaining sample from metallic plate in embodiment.
Specific embodiment
One embodiment of the present invention is illustrated referring to the drawings.It is it should be noted that appended in this specification
Attached drawing in, for the ease of illustration and it can be readily appreciated that for size ratio of engineer's scale and length and width in kind etc., suitably comparative example
Size ratio of ruler and length and width etc. is changed and exaggerated.
Fig. 1~Figure 17 is for illustrating the figure based on one embodiment of the present invention.In following embodiment and its change
It in shape example, is illustrated by taking the manufacturing method of deposition mask as an example, which is used for when manufacturing organic EL display
Organic material is patterned with desired pattern on substrate.But, however it is not limited to such application, for for various use
The manufacturing method of the deposition mask on way, the applicable present invention.
It should be noted that in this specification, " plate ", " piece ", the term of " film " are not only based on the difference in address
Just can mutually it distinguish.For example, " plate " is also comprising the concept that can be described as component as piece or film, thus, for example " metal
Plate " and component only not cannot distinguish between out ibid in address for being known as " sheet metal " or " metal film ".
In addition, " plate face (unilateral, film surface) " refers in entirety or gross examination of skeletal muscle as the plate (sheet, membranaceous) of object
In the case of component, the face consistent with in-plane of the plate-shaped member (sheet component, film member) as object.Separately
Outside, the normal direction that is used for the component of plate (sheet, membranaceous) refers to the plate face (unilateral, film surface) compared with the component
Normal direction.
In addition, on being used in this specification to shape or geometric condition and physical characteristic and their degree
Carry out specific such as the terms and length such as " parallel ", " orthogonal ", " identical ", " equal ", the value of angle and physical characteristic
Deng being not limited to stringent meaning, but the scope comprising the degree that can expect said function explains.
(deposition mask device)
First, an example on the deposition mask device comprising the deposition mask as manufacturing method object, referring especially to
Fig. 1~Fig. 6 is illustrated.Herein, Fig. 1 is the stereogram for an example for showing the deposition mask device comprising deposition mask, and Fig. 2 is
For illustrating the figure of the application method of deposition mask device shown in FIG. 1.Fig. 3 is the vertical view that deposition mask is shown from the 1st surface side
Figure, Fig. 4~Fig. 6 are the sectional view of each position of Fig. 3.
Fig. 1 and deposition mask device 10 shown in Fig. 2 possess the deposition mask 20 being made of rectangular metal plate 21 and install
In the frame 15 of the peripheral portion of deposition mask 20.Deposition mask 20 is equipped with substantial amounts of through hole 25, which is
The metallic plate 21 for having the 1st opposite each other face 21a and the 2nd face 21b at least from the 1st face 21a is etched and is formed.Such as
Shown in Fig. 2, which faces the substrate such as glass substrate 92 as vapor deposition object according to deposition mask 20
Below mode be supported in evaporation coating device 90, for substrate carry out evaporation material vapor deposition.
In evaporation coating device 90, using the magnetic force from magnetite (not shown), deposition mask 20 and glass substrate 92 are closely sealed.It steams
In plating appts 90, in the lower section of deposition mask device 10, it is configured with and accommodates evaporation material (being as an example luminous organic material)
98 crucible 94 and the heater 96 of heating crucible 94.Evaporation material 98 in crucible 94 is issued in the heating from heater 96
Angerization distils and is attached to the surface of glass substrate 92.As described above, substantial amounts of through hole is formed in deposition mask 20
25, evaporation material 98 is attached to glass substrate 92 by the through hole 25.As a result, according to the through hole with deposition mask 20
The 25 corresponding desired pattern in position, evaporation material 98 form a film in the surface of glass substrate 92.
(deposition mask)
The following detailed description of deposition mask 20.As shown in Figure 1, in present embodiment, deposition mask 20 is by 21 structure of metallic plate
Into with substantially quadrangle form in top view, further precisely in a top view with substantially rectangular profile.Vapor deposition
The metallic plate 21 of mask 20, which includes regularly arranged formation, to be had the effective coverage 22 of through hole 25 and surrounds the week of effective coverage 22
Enclose region 23.Peripheral region 23 is the region for being used to support effective coverage 22, is not intended to vapor deposition to the vapor deposition on substrate
Material by region.For example, the deposition mask 20 used in the vapor deposition of the luminous organic material of organic EL display
In, effective coverage 22 is with forming the area of pixel by the vapor deposition of luminous organic material on substrate (glass substrate 92)
The region in deposition mask 20 that domain faces is with forming made organic EL display substrate on substrate
Display surface area surface pair deposition mask 20 in region.It, can also be in 23 shape of peripheral region but based on various purposes
Into through hole or recess portion.In example shown in FIG. 1, each effective coverage 22 has substantially quadrangle form in a top view, into one
Step precisely has substantially rectangular profile in a top view.
In the example in the figures, the effective coverage 22 of 2 or more is along a side parallel with one side of deposition mask 20
It configures to across predetermined interval, while matches somebody with somebody along the other direction orthogonal with said one direction across predetermined interval
It puts.In example illustrated, an effective coverage 22 corresponds to an organic EL display.That is, vapor deposition according to figure 1 is covered
Mold device 10 (deposition mask 20) can carry out repeating vapor deposition paragraph by paragraph (multiaspect, which is paid, steams).
As shown in figure 3, in the example in the figures, it is effective at this in 2 or more the through holes 25 that each effective coverage 22 is formed
It is arranged at predetermined intervals respectively along two mutually orthogonal directions in region 22.On the perforation formed on the metallic plate 21
An example in hole 25 is further described in detail referring especially to Fig. 3~Fig. 6.
As shown in Fig. 4~Fig. 6,2 or more through holes 25 extend between the 1st face 20a and the 2nd face 20b and penetrate through vapor deposition
Mask 20, the 1st face 20a are the one side along normal direction of deposition mask 20, and the 2nd face 20b is deposition mask 20
The opposite side along normal direction.In example illustrated, as being explained in detail below, from the method as deposition mask
1st face 21a sides of the metallic plate 21 of the one side in line direction are by being etched in the 1st recess portion 30 of formation on metallic plate 21, from as gold
The 2nd face 21b sides for belonging to the opposite side of the normal direction of plate 21 form second recesses 35 on metallic plate 21, utilize the 1st recess portion 30
Through hole 25 is formed with second recesses 35.
As shown in Fig. 3~Fig. 6, from the 1st face 20a lateral 2nd faces 20b sides of deposition mask 20, on the edge of deposition mask 20
The position of normal direction, sectional area of each 1st recess portion 30 in the section of the plate face along deposition mask 20 gradually becomes
It is small.As shown in Figure 3, the wall surface 31 of the 1st recess portion 30 in its whole region in the direction that the normal direction with deposition mask 20 is intersected
Extension is exposed towards the one side of the normal direction along deposition mask 20.Similarly, in deposition mask 20 along normal direction
Position, sectional area of each second recesses 35 in the section of the plate face along deposition mask 20 can be from deposition mask 20
The 2nd face 20b lateral 1st faces 20a sides taper into.The wall surface 36 of second recesses 35 its whole region with deposition mask 20
Normal direction intersect direction extension, towards along deposition mask 20 normal direction opposite side expose.
It should be noted that as shown in Fig. 4~Fig. 6, the wall surface 31 of the 1st recess portion 30 passes through with the wall surface 36 of second recesses 35
The connecting portion 41 of all shapes and connect.Connecting portion 41 is by inclined 1st recess portion 30 of normal direction compared with deposition mask
The crest line of protruding portion that wall surface 31 and the wall surface 36 of the inclined second recesses 35 of normal direction compared with deposition mask merge into and
It marks.Also, connecting portion 41 marks the breakthrough part 42 of the area minimum of through hole 25 in the top view of deposition mask 20.
As shown in Fig. 4~Fig. 6, the 2nd face of the face of the opposite side along normal direction of deposition mask, i.e. deposition mask 20
On 20b, adjacent two through holes 25 are spaced from each other along the plate face of deposition mask.Manufacturing method i.e., as be described hereinafter, from steaming
The 2nd face 21b sides for plating the corresponding metallic plates 21 of the 2nd face 20b of mask 20 are etched the metallic plate 21 and make second recesses
When 35, remaining has the 2nd face 21b of metallic plate 21 between two adjacent second recesses 35.
On the other hand, as shown in Fig. 4~Fig. 6, in deposition mask along the one side of normal direction, i.e. deposition mask 20
1st face 20a sides, adjacent two the 1st recess portions 30 connect.Manufacturing method i.e., as be described hereinafter, from the 1st face with deposition mask 20
When 1st face 21a sides of the corresponding metallic plates 21 of 20a are etched the metallic plate 21 and form 1 recess portion 30, adjacent two
Remaining there will not be the 1st face 21a of metallic plate 21 between a 1st recess portion 30.That is, the 1st face 21a of metallic plate 21 is in effective coverage 22
Whole region be etched.Using the 1st face 20a of the deposition mask 20 formed by such 1st recess portion 30, according to such as figure
1st face 20a of deposition mask 20 shown in 2 in face of evaporation material 98 mode using in the case of the deposition mask 20, can be effective
Improve the utilization ratio of evaporation material 98.
As shown in Fig. 2, in the case where deposition mask device 10 is contained in evaporation coating device 90, such as double dot dash line in Fig. 4
Shown, the 1st face 20a of deposition mask 20 is located at 94 side of crucible for maintaining evaporation material 98, the 2nd face 20b of deposition mask 20
In face of glass substrate 92.Therefore, evaporation material 98 is attached to glass substrate 92 by gradually smaller 1st recess portion 30 of sectional area
On.As shown by the arrows in Figure 4, evaporation material 98 from crucible 94 to glass substrate 92 not only along the normal direction of glass substrate 92
It is mobile, and sometimes in the larger inclined direction movement of the normal direction compared with glass substrate 92.At this point, deposition mask 20
Thickness it is big when, the evaporation material 98 of inclination movement much can reach the 1st before glass substrate 92 is reached by through hole 25
The wall surface 31 of recess portion 30 and adhere to.In addition, in the region faced with through hole 25 on glass substrate 92, vapor deposition material can be generated
Material 98 is easy to the region reached and is difficult to the part reached.Therefore, in order to improve the utilization ratio (film forming efficiency of evaporation material:
The ratio being attached on glass substrate 92) and save expensive evaporation material and make the film forming that make use of expensive evaporation material
Stablize in desired region and equably implemented, it is important that according to the evaporation material 98 for making inclination movement as far as possible
The mode of glass substrate 92 is reached to form deposition mask 20.That is, in Fig. 4~Fig. 6 orthogonal with piece face of deposition mask 20
Section in, the minimum angles θ 1 (with reference to Fig. 4) that straight line L1 formed compared with the normal direction of deposition mask 20 is made fully to become
It is favourable greatly, the straight line L1 is recessed by the connecting portion 41 and the 1st for being used as the part with minimum sectional area of through hole 25
Any other position of the wall surface 31 in portion 30.
As for increasing one of method of angle, θ 1, it is contemplated that reduce the thickness of deposition mask 20, make as a result,
The wall surface 31 of 1st recess portion 30, the height of the wall surface 36 of second recesses 35 become smaller.I.e., it is possible to say, as forming deposition mask
20 metallic plate 21, it is preferable to use the metallic plates 21 that thickness is as thin as possible in the range of it can ensure that the intensity of deposition mask 20.
As for increasing the other methods of angle, θ 1, it is also contemplated that optimize the profile of the 1st recess portion 30.Such as root
According to present embodiment, converged by the wall surface 31 of two adjacent the 1st recess portions 30, compared to do not converge with other recess portions have with
The recess portion of wall surface (profile) shown in dotted line, can significantly increase the angle, θ 1.Illustrate its reason below.
As being explained in detail below, the 1st recess portion 30 be by the 1st face 21a to metallic plate 21 be etched and
It is formed.By etching the wall surface shape generally in curved surface of the recess portion formed, which corrodes direction.Therefore,
It is precipitous in the region of etching starting side by the wall surface 31 for etching the recess portion formed, in the one side opposite with etching starting side
The most deep one side of region, i.e. recess portion is significantly tilted compared with the normal direction of metallic plate 21.On the other hand, it is illustrated that steaming
It plating in mask 20, the wall surface 31 of adjacent two the 1st recess portions 30 converges in etching starting side, therefore, two the 1st recess portions 30
The outer profile of part 43 that converges of front edge 32 of wall surface 31 be not precipitous shape, but the shape of chamfering.Therefore, may be used
So that the wall surface 31 for forming most 1st recess portion 30 of through hole 25 effectively inclines compared with the normal direction of deposition mask
Tiltedly.I.e., it is possible to increase angle, θ 1.
Using the deposition mask 20 based on present embodiment, the whole region in effective coverage 22 can effectively increase the 1st
The tilt angle theta 1 that the wall surface 31 of recess portion 30 is formed with the normal direction of deposition mask.Vapor deposition material can be effectively improved as a result,
While the utilization ratio of material 98, implement in high precision and steadily the vapor deposition under desired pattern.
In addition, described in manufacturing method as be described hereinafter, from the 1st of metallic plate 21 corresponding with the 1st face 20a of deposition mask 20 the
In the case that face 21a sides are etched the metallic plate 21 and make the 1st recess portion 30, for forming the effective of deposition mask 20
The whole region of the metallic plate 21 in region 22, the 1st face 21a of the metallic plate 21 are etched due to etching.That is, the edge of deposition mask
Peripheral regions 23 along normal direction of the maximum gauge Ta in the effective coverage 22 of normal direction compared with deposition mask
Interior maximum gauge Tb is less than 100%.In this way, from the aspect of the utilization ratio for improving evaporation material, preferably make effective district
Thickness integral thinned in domain 22.On the other hand, from deposition mask intensity aspect, deposition mask along normal direction
Effective coverage 22 in maximum gauge Ta be preferably that maximum in the peripheral region 23 along normal direction of deposition mask is thick
Spend more than the 50% of Tb.Maximum gauge Ta in effective coverage 22 is more than 50% of the maximum gauge Tb in peripheral region 23
In the case of, when being tensioned deposition mask 20 on frame 15, it can effectively inhibit deposition mask 20 in effective coverage 22
Deformation, can effectively implement the vapor deposition under desired pattern as a result,.
But thickness small metallic plate 21 is, it is necessary to increase by rolling base material come when manufacturing metallic plate 21 in order to obtain
Rolling rate.But rolling rate is bigger, the stress i.e. residual stress for residuing in metallic plate is also bigger.If residual stress is big, losing
When carving metallic plate 21 and making deposition mask 20, the one side of the implementation etching in metallic plate 21, residual stress is eliminated,
As a result, obtained deposition mask 20 can generate warpage.It it is believed that in the case that warpage is big, can not fill deposition mask 20
It is point close in substrate 92, as a result, the positional precision of vapor deposition reduces.In addition, in the present embodiment, as described above, to metallic plate
It is etched in the wide cut region of the effective coverage 22 of 21 the 1st face 21a, in such as whole region, thus makes deposition mask
20.Therefore, compared with the situation that the part of only the 1st face 21a is etched, remnants that the 1st face 21a sides of metallic plate 21 are eliminated
The degree of stress becomes larger, as a result, the possibility that warpage occurs also becomes larger.Therefore, as described later, it is important that filter out into
It is used to be difficult to generate the metallic plate 21 of warpage during deposition mask 20.
As described above, in present embodiment, through hole 25 configures in a predetermined pattern in each effective coverage 22.It needs
It is bright, it is intended in the case of carrying out colored display, steaming can be made along the orientation (an above-mentioned direction) of through hole 25
Plating mask 20 (deposition mask device 10) and glass substrate 92 relatively move bit by bit, successively the red organic hair of vapor deposition
The luminous organic material of luminescent material, the luminous organic material of green and blueness.
It should be noted that the frame 15 of deposition mask device 10 is installed on the peripheral portion of the deposition mask 20 of rectangle.Frame
Deposition mask is maintained at the state of tensioning by frame 15 in the way of bending deposition mask 20.Deposition mask 20 and frame 15
It is fixed each other by such as spot welding.
Implement the inside of evaporation coating device 90 of the vapor deposition treatment under high-temperature atmosphere.Therefore, during vapor deposition treatment, it is maintained at steaming
Deposition mask 20, frame 15 and substrate 92 inside plating appts 90 are also heated.At this point, deposition mask, frame 15 and substrate 92
Show the behavior of the change in size based on each thermal expansion.In this case, if deposition mask 20, frame 15 and substrate
92 coefficient of thermal expansion difference is larger, then misplaces due to the difference of their change in size, as a result, being attached to substrate 92
On evaporation material dimensional accuracy and positional precision can reduce.It is such in order to solve the problems, such as, preferably deposition mask 20 and frame
The coefficient of thermal expansion of frame 15 is equal value with the coefficient of thermal expansion of substrate 92.For example, use glass substrate 92 as substrate 92
When, as deposition mask 20 and the material of frame 15, the alloy i.e. invar alloy added with 36% nickel in iron can be used
Material.
Below to playing an important role of that the present embodiment of such composition and effect illustrate.Here, first to being used for
The manufacturing method for manufacturing the metallic plate of deposition mask illustrates.Then to using obtained metallic plate manufacture deposition mask
Method illustrates.Thereafter, to use obtained deposition mask carried out on substrate evaporation material vapor deposition method carry out
Explanation.
(manufacturing method of metallic plate)
First, the manufacturing method of metallic plate is said with reference to Fig. 7 (a), 7 (b), Fig. 8 (a), 8 (b) and Fig. 9 (a), 9 (b)
It is bright.To show to obtain having the figure of the process of the metallic plate of desired thickness by rolling base material, Fig. 7 (b) is Fig. 7 (a)
The figure of process to being annealed by rolling obtained metallic plate is shown.Fig. 8 (a) is to show from utilization Fig. 7 (a), 7 (b)
The figure of the sample cut out in the metallic plate that shown process obtains, Fig. 8 (b) are to show through the to the sample shown in Fig. 8 (a)
The figure of etched sample obtained from 1 face is etched.Fig. 9 (a), (b) are respectively to show that the sample cut out from metallic plate carries
It is placed in the stereogram and top view of the appearance in mounting table.
[rolling process]
First as shown in Fig. 7 (a), prepare the base material 55 containing invar alloy material, to including a pair of of Rolling roller 56a, 56b
Rolling device 56 transmit the base material 55.The base material 55 between a pair of of Rolling roller 56a, 56b is reached by a pair of of Rolling roller 56a, 56b
Rolling as a result, the thickness of base material 55 reduces, while is stretched along the conveying direction.Thickness t can be arrived as a result,0Long metal sheet
64.As shown in Fig. 7 (a), long metal sheet 64 can be batched in forming coiling body 62 on core 61.
[annealing operation]
Thereafter, in order to eliminate because being accumulated during rolling in the residual stress in long metal sheet 64, as shown in Fig. 7 (b), using moving back
Fiery device 57 anneals to long metal sheet 64.It, can be while by long metal sheet 64 in direction of transfer (length as shown in Fig. 7 (b)
Direction) it stretches while implementing annealing operation.As a result, residual stress is can obtain be removed to a certain degree, thickness t0Length
Metallic plate 64.As shown in Fig. 7 (b), long metal sheet 64 can be batched in forming coiling body 62 on core 61.Need what is illustrated
It is thickness t0Maximum gauge Tb generally equal in the peripheral region 23 of deposition mask 20.
It should be noted that the form of rolling process and annealing operation is not particularly limited to Fig. 7 (a), the shape shown in (b)
State.For example, rolling process can be implemented using 2 couples or more Rolling roller 56a, 56b.In addition it is also possible to by the way that work will be rolled
Sequence and annealing operation are repeated 2 times or more to make thickness t0Long metal sheet 64.In addition, in Fig. 7 (b), annealing is shown
Process stretches long metal sheet 64 while the example implemented in length direction on one side, but it's not limited to that, can also
It is taken up in long metal sheet 64 and implements annealing operation in the state of core 61.It should be noted that it is rolled up in long metal sheet 64
It is taken in the case of implementing annealing operation in the state of core 61, the volume with coiling body 62 can be generated on long metal sheet 64 sometimes
The problem of taking the corresponding warpage in footpath.Therefore, according to the material for batching footpath, forming base material 55 of coiling body 62, while will long gold
Belong to plate 64 to be stretched in length direction while it is favourable to implement annealing operation.
[inspection operation]
Thereafter, the inspection operation checked the degree of the warpage of obtained long metal sheet 64 is implemented.First, as schemed
Shown in 8 (a), long l, width w and thickness t are cut out from long metal sheet 640Sample 75.In Fig. 8 (a), the 1st face of sample 75 and the 2nd
Face is represented respectively with symbol 75a and 75b.1st face 75a and the 2nd face 75b is the face orthogonal with the thickness direction of sample 75, and
For face opposite each other.In addition, in Fig. 8, extend between the 1st face 75a and the 2nd face 75b and in the length direction of sample 75
A pair of of side represented respectively with symbol 75c and 75d.Long l, width w and thickness t0It can be obtained as described later according to by long metal sheet 64
The size of deposition mask 20 etc. it is appropriate determine, such as reach that long l is 170mm, width w is 30mm, thickness t0For more than 0.020mm and
In the scope of below 0.100mm.
Then, as shown in Fig. 8 (b), from the 1st face 75a sides the 1st face 75a the whole region for being etched region 75f by sample
Product 75 etch, until the thickness for being etched region 75f of sample 75 is t1.It should be noted that region 75f is etched as sample
The region being etched in 75.For example, it is except both ends 75g1,75g2 of length direction rise by sample 75 to be etched region 75f
l1、l2Within region beyond region.Length l near both ends 75g1,75g21、l2Region be the area not being etched
Domain.As described later, such region not being etched ensures the stability of sample 75 when sample 75 is placed in mounting table
Aspect etc. play a role.
From Fig. 8 (b), the length l for being etched region 75f of the length direction of sample 753It is the length l from sample 75
In subtract length l1With length l2Length afterwards.Length l1With length l2It is appropriate to determine, so that sample 75 is placed in mounting table
When ensure the stability of sample 75, such as be 10mm.In this case, the length l for being etched region 75f of length direction3
For 150mm.
The thickness t of sample 75 after etching1It is appropriate according to the degree for the etching for making deposition mask 20 and implementing
It determines, such as thickness t1For 1/3 × t0Above and 2/3 × t0In following scope.Herein, due in sample 75 with to a certain degree
Residual stress is had accumulated, therefore by being etched from the 1st face 75a sides to sample 75, warpage is generated in sample 75.It is right below
The process for measuring the curvature of warpage illustrates.
As for evaluating the method for the warpage of sample, it is known that method be that one end of sample is supported to make sample in the air
Suspension, while calculate the curvature of sample warpage.But in this case, in the measurement result of the curvature of warpage, not only reflect
The residual stress that results from eliminate element, also reflect result from sample dead weight element.It accordingly, it is believed that cannot be accurate
Ground evaluation result from residual stress sample warpage.Here, according to the present embodiment, as shown in Fig. 9 (a), according to sample 75
Side 75c sample 75 is placed in predetermined mounting table 76 for horizontal mode, calculate sticking up for sample 75 in this state
Bent curvature.Therefore, according to the present embodiment, can more accurately evaluate result from residual stress sample 75 warpage.
It should be noted that near both ends 75g1,75g2 of sample 75, length l is remained1、l2Have script thickness t0Area
Therefore domain, can be such that sample 75 steadily stands in mounting table 76.In addition, the both ends 75g1 of easy sample 75 dominated by hand,
75g2.Further, as described later, when obtaining the operation of sample 75 includes the process for cutting off a part for metallic plate, institute is cut off
The influence of the strain of cause is by with script thickness t0Region absorbed, therefore can prevent or inhibit cut-out caused by strain shadow
It rings to involve and is etched region 75f.
The specific method of the curvature k for the warpage for being used to calculate sample 75 is illustrated below.Fig. 9 (b) is shown from upper
Top view when side's observation is in the alongst sample 75 of the state of generation warpage.In Fig. 9 (b), sample 75 is eclipsed
The a pair of end portions for carving the length direction of region 75f is represented with symbol 75e.First, to the length for being etched region 75f of sample 75
The depth y (mm) of the warpage for being etched region 75f of distance x (mm) and sample 75 is measured between the end in direction.It needs
Bright, the depth y of warpage refers to, the straight line that a pair of end portions 75e for being etched region 75f of sample 75 is linked to be and sample 75
It is etched the maximum of the distance between region 75f.Then, the warpage for being etched region 75f of sample 75 is calculated based on following formula
Corresponding radius of curvature ρ.
ρ=(y/2)+(x2/8y)
Then the curvature k of the warpage of sample 75 is calculated based on following formula.
K=1/ ρ
In this way, the curvature k (mm of the warpage of sample 75 can be obtained-1)。
Thereafter, the value based on obtained curvature k implements the screening of long metal sheet 64.Here, the value for selecting curvature k is
Above-mentioned long metal is used only in the long metal sheet 64 of sample 75 below a reference value in the manufacturing process of aftermentioned deposition mask 20
Thus plate 64 implements the screening of long metal sheet 64.According to for the positional precision required by the vapor deposition for having used deposition mask 20
Deng suitably determining a reference value, such as it is 0.008mm to have selected the value of curvature k-1The long metal sheet 64 of following sample 75 is recognized
It is set to non-defective unit.By as implementation screening, even if because deposition mask 20 manufacturing process etching and in deposition mask
In the case of generating warpage in 20, the degree of the warpage can also be made in permissible range.Manufactured vapor deposition can be improved as a result,
The characteristic of mask 20.In addition, the yield rate during the manufacturing process of deposition mask 20 can be improved.
It should be noted that as shown in Fig. 9 (a), between mounting table and sample 75,77 grade of squared paper can also be set to use
In making range determination easy means.It can make the measure of distance x (mm) and the depth y (mm) of warpage between above-mentioned end as a result,
Easily, so as to calculating curvature k rapidly.
In addition, as shown in Fig. 9 (a), it can be in a manner that the mounting surface 76a of mounting sample 75 can be in vertical direction vibration
Hollow bulb 76b is formed in mounting table 76.In this case, first, in mounting table 76 or on mounting table 76 is configured at
Sample 75 is loaded on squared paper 77, then, by mounting surface 76a being made to shake in vertical direction mounting surface 76a percussions etc.
It is dynamic, so as to which the frictional force generated between sample 75 and mounting table 76 or squared paper 77 is made to be eliminated or is mitigated.
It can inhibit as a result, and occur the influence of frictional force in the measurement result of curvature.Do not have to the size of mounting table 76 and hollow bulb 76b etc.
It is particularly limited to, such as the width of mounting table 76 and length are 300mm, the thickness of mounting table 76 is 50mm.In addition, mounting table
76 hollow bulb 76b can be formed in a manner that the mounting surface 76a of such as mounting table 76 and the thickness of bottom surface are respectively 5mm.
The material for forming mounting table 76 is not particularly limited, such as mounting table 76 can be made of acrylic resin.
(manufacturing method of deposition mask)
In the following, referring especially to Figure 10~Figure 17, to manufacturing deposition mask 20 using the long metal sheet 64 as above filtered out
Method illustrate.In the manufacturing method of deposition mask 20 described below, as shown in Figure 10, long metal sheet 64 is supplied,
Through hole 25, further severing long metal sheet 64, so as to which the metallic plate 21 obtained by sheet is formed are formed on the long metal sheet 64
Deposition mask 20.
More specifically, the manufacturing method of deposition mask 20 includes:The process for the long metal sheet 64 that supply extension becomes band;
The etching that make use of photolithographic techniques is implemented on long metal sheet 64, is formed on long metal sheet 64 from the 1st face 64a sides
The process of 1st recess portion 30;With the etching that make use of photolithographic techniques is implemented on long metal sheet 64, in long metal sheet
The process for forming second recesses 35 on 64 from the 2nd face 64b sides.Also, it is formed at the 1st recess portion 30 and second recesses of long metal sheet 64
35 mutually communicate, so as to produce through hole 25 on long metal sheet 64.In example shown in Fig. 10, the shape of second recesses 35
Implement into process before the formation process of the 1st recess portion 30, and in the formation process of second recesses 35 and the shape of the 1st recess portion 30
Into the process for being further provided with being sealed made second recesses 35 between process.Each process described further below.
Figure 10 shows to make the manufacture device 60 of deposition mask 20.As shown in Figure 10, first, prepare long metal
Plate 64 is batched in the coiling body 62 formed on core 61.Also, coiling body 62 is unreeled by rotating the core 61, so as to such as
The long metal sheet 64 that supply extension becomes band as shown in Figure 10.It should be noted that long metal sheet 64 is formed with through hole 25
The metallic plate 21 of sheet is formed afterwards and then forms deposition mask 20.
The long metal sheet 64 being supplied to is sent to Etaching device (etching unit) 70 by transfer roller 72.Using etching unit
70, implement each processing shown in Figure 11~Figure 17.First, as shown in figure 11, formed on the 1st face 64a of long metal sheet 64 anti-
Agent pattern (also referred to as resist) 65a is lost, and Resist patterns is formed (also referred to as on the 2nd face 64b of long metal sheet 64
For resist) 65b.Specifically, implemented as follows.First, on the 1st face 64a of long metal sheet 64 (in the paper of Figure 11
Downside face on) and the 2nd face 64b on be coated with minus photonasty anticorrosive additive material, form resist on long metal sheet 64
Film.Then, glass dry plate is prepared, the glass dry plate is so that light will not be penetrated to the region to be removed in resist film, by glass
Glass dry plate is configured on resist film.Thereafter, resist film is exposed across glass dry plate, further resist film develops.
In this way, Resist patterns (also referred to as resist) 65a can be formed on the 1st face 64a of long metal sheet 64, in long metal sheet 64
The 2nd face 64b on form Resist patterns (also referred to as resist) 65b.
It should be noted that as photonasty anticorrosive additive material, the photonasty anticorrosive additive material of eurymeric can be used.It is this
In the case of, as exposed mask, penetrated using light is made to the exposed mask in the region to be removed in resist film.
Then, as shown in figure 12, using the Resist patterns 65b formed on long metal sheet 64 as mask, etching solution is used
(such as iron chloride (III) solution), from the 2nd face 64b lateral erosions of long metal sheet 64.For example, etching solution from nozzle across against corrosion
Agent pattern 65b sprays to the 2nd face 64b of long metal sheet 64, and the nozzle configuration is in the 2nd face 64b of the long metal sheet 64 with transmission
The one side faced.As a result, as shown in figure 12, in the region not covered by Resist patterns 65b in long metal sheet 64, etching
Erosion caused by liquid promotes.In this way, substantial amounts of second recesses 35 are formed on long metal sheet 64 from the 2nd face 64b sides.
Thereafter, as shown in figure 13, have indefatigable resin 69 using to etching solution, the second recesses 35 formed are coated.
That is, have indefatigable resin 69 using to etching solution, second recesses 35 are sealed.In the example shown in Figure 13, the film of resin 69
It is formed in the way of formed second recesses 35 but also the 2nd face 64b (Resist patterns 65b) of covering are not only covered.
Then, as shown in figure 14, the 2nd etching is carried out to long metal sheet 64.In the 2nd etching, long metal sheet 64 is only
It is etched from the 1st face 64a sides, from the 1st face 64a sides, the formation of the 1st recess portion 30 promotes.Due to the 2nd face 64b of long metal sheet 64
Side is coated with has indefatigable resin 69 to etching solution, therefore, the second recesses for forming desired shape is etched by the 1st time
35 shape is not damaged.
Part based on the erosion of etching being contacted with etching solution in long metal sheet 64 carries out.Therefore, corrode not only
It promotes in the normal direction (thickness direction) of long metal sheet 64, is also promoted in the direction of the plate face along long metal sheet 64.It is tied
Fruit, as shown in figure 15, the normal direction for being etched in long metal sheet 64 promote and the 1st recess portion 30 are made to be connected with second recesses 35, not only
In this way, two the 1st recess portions 30 being respectively formed in the position that the adjacent two hole 66a with Resist patterns 65a is faced are in place
Converge on the inside of bridge portion 67a between two hole 66a.
As shown in figure 16, the etching from the 1st face 64a sides of long metal sheet 64 is pushed further into.As shown in figure 16, it is adjacent
What two the 1st recess portions 30 merged converges the disengaging of part 43 Resist patterns 65a, being somebody's turn to do under Resist patterns 65a
Converge in part 43, corroding caused by etching also promotes in the normal direction (thickness direction) of metallic plate 64.As a result, towards along
The sharp part 43 of converging in the one side of the normal direction of deposition mask is etched from the one side of the normal direction along deposition mask,
So as to be chamfered as shown in Figure 16.It can make the wall surface 31 of the 1st recess portion 30 as a result, compared with the normal direction institute of deposition mask
The tiltangleθ 1 of formation increases.
In this way, the erosion of the 1st face 64a of the long metal sheet 64 based on etching in long metal sheet 64 for forming effective district
It is promoted in the whole region in domain 22.As a result, for formed long metal sheet 64 in the region of effective coverage 22 along normal side
To maximum gauge Ta compared to etching before long metal sheet 64 maximum gauge Tb it is thinning.
As described above, the etching from the 1st face 64a sides of long metal sheet 64 only promotes preset amount, to long metal sheet
64 the 2nd etching terminates.At this point, the thickness direction of the 1st recess portion 30 along long metal sheet 64, which extends to, reaches second recesses 35
At position, so as to form through hole 25 on long metal sheet 64 using the 1st recess portion 30 and second recesses 35 that mutually communicate.
Thereafter, as shown in figure 17, resin 69 is removed from long metal sheet 64.It can by using such as alkali system stripper
Remove resin film 69.It should be noted that in the case of using alkali system stripper, as shown in figure 17, also removed simultaneously with resin 69
Remove Resist patterns 65a, 65b.
Using to clamp transfer roller 72,72 that the state of the long metal sheet 64 rotated to disconnecting device (cutting unit)
73 transmission are thusly-formed the long metal sheet 64 of a large amount of through holes 25.It should be noted that by using the transfer roller 72,72
It rotates and acts on the tension (drawing force) of long metal sheet 64, rotate above-mentioned supply core 61, so as to be supplied by coiling body 62
To long metal sheet 64.
Thereafter, the long metal sheet 64 for being formed with a large amount of recess portions 61 is cut into using disconnecting device (cutting unit) 73 predetermined
Length, so as to obtain being formed with the sheet metal plate 21 of a large amount of through holes 25.
It operates as above, the available deposition mask 20 being made of the metallic plate 21 for being formed with a large amount of through holes 25.Here, root
According to present embodiment, the whole region of the 1st face 21a of metallic plate 21 in effective coverage 22 is etched.Therefore, deposition mask 20 is made
Effective coverage 22 thickness reduce, and can make the 1st face 21a sides formed two the 1st recess portions 30 wall surface 31 elder generation
The outer profile for the part 43 that end margin 32 converges is the shape of chamfering.Therefore, above-mentioned angle, θ 1 can be increased, can be improved as a result,
The utilization ratio of evaporation material and the positional precision of vapor deposition.
But the whole region of the 1st face 21a of metallic plate 21 in effective coverage 22, which is etched, can increase the 1st face 21a
The difference of the degree of the etching of side and the degree of the etching of the 2nd face 21b sides.That is, between the 1st face 21a sides and the 2nd face 21b sides
The residual stress that can be eliminated unbalanced or even the metallic plate 21 i.e. warpage of deposition mask 20 can be generated.Here, according to
Present embodiment, the long metal sheet 64 that the degree of the warpage as described above based on sample 75 has been used to filter out in advance.Therefore, i.e.,
Make in the case of being had differences in the degree between the 1st face 21a sides and the 2nd face 21b sides in etching, deposition mask can also be made
The degree of warpage caused by 20 is in permissible range.Therefore, according to the present embodiment, by reducing the thickness of deposition mask 20
The tilt angle theta 1 of the wall surface 31 of 1st recess portion 30 of degree and increase deposition mask 20 can improve the utilization ratio of evaporation material
Positional precision with vapor deposition, the reduction for the warpage that can be optimized profile, deposition mask 20 can be made and deposition mask 20
The raising of the yield rate of manufacturing process is realized simultaneously.Therefore, the deposition mask 20 with excellent specific property can be steadily provided.
(evaporation coating method)
Then, illustrated to using obtained deposition mask 20 that evaporation material is deposited in the method on substrate 92.
First, as shown in Fig. 2, making deposition mask 20 and substrate 92 closely sealed.At this point, deposition mask 20 is tensioned on frame 15, from
And make the face of deposition mask 20 parallel to the face of substrate 92.Here, according to the present embodiment, the warpage based on sample 75 is used
Degree and the long metal sheet 64 filtered out in advance.Therefore, compared with the situation of such screening is not carried out, deposition mask 20 is stuck up
Bent degree is equably reduced.It therefore, can be flat compared with substrate 92 by the way that appropriate tension is applied to deposition mask 20
Deposition mask 20 is kept capablely.That is, in order to correct the warpage caused by the elimination of internal stress (residual stress), without that will make
The high-tension that deposition mask 20 generates the degree of fold is applied to deposition mask 20.Therefore, it can make deposition mask 20 fully and base
Plate 92 is closely sealed, and thereby, it is possible to evaporation material is deposited on substrate 92 with high positional precision.Therefore, it is formed with by vapor deposition
During the pixel of machine EL display devices, the dimensional accuracy and positional precision of the pixel of organic EL display can be improved.It can make as a result,
Make the organic EL display of fine.
It should be noted that in example shown in above-mentioned present embodiment, 2 or more of deposition mask 20
Effective coverage 22 is configured along a direction parallel with one side of deposition mask 20 across predetermined interval, and edge
The other direction orthogonal with said one direction to be configured across predetermined interval.But it's not limited to that, such as schemes
Shown in 18, deposition mask 20 can also include the effective coverage 22 of 2 or more to form a line along a direction and vapor deposition is covered
Mold device 10, which has, on the direction orthogonal with its length direction (direction) arranges and is installed on 2 or more on frame 15
Deposition mask 20.The method of deposition mask as manufacture 20 is not particularly limited.It is, for example, possible to use having and Figure 18
The long metal sheet 64 of shown 20 corresponding width of deposition mask is metallic plate 21 to manufacture deposition mask 20.Alternatively, along
After a long metal sheet 64 i.e. direction of metallic plate 21 and other direction form the effective coverage 22 of 2 or more, by metallic plate 21
It is cut off along its length direction, so as to which the deposition mask 20 shown in Figure 18 can also be made.
Embodiment
The present invention is further illustrated below by embodiment, but as long as without departing from its main points, the present invention is just not limited to
The record of following embodiment.
(making of sample)
First, above-mentioned rolling process and annealing operation are implemented to the base material containing invar alloy material, so as to manufacture tool
There are the width and t of 500mm0Thickness the coiling body (the 1st coiling body) that batches of long metal sheet.Thereafter, by the 1st coiling body
The length of 300mm is cut out, so as to obtain the metallic plate 63 shown in Figure 19 (a).In Figure 19 (a), arrow D1 corresponds to rolling process
When direction of transfer, rolling direction, arrow D2 correspond to rolling process when width.
Then, as shown in Figure 19 (b), multi-disc sample 75 is obtained from metallic plate 63.The size of sample 75 for long 170mm ×
Wide 30mm.It should be noted that the length direction of sample 75 is the direction parallel with arrow D1, and the width of sample 75
For the direction parallel with arrow D2.The piece number that sample 75 is obtained from 1 metallic plate 63 is 15.It is taken as from metallic plate 63
The method for obtaining multi-disc sample 75, has used etching.Specifically, first, the 1st surface side of metallic plate 63 and the 2nd surface side this two
Side sets Resist patterns, and Resist patterns covering should become the region of sample 75 and the outer frame part 63a of metallic plate 63.It connects
It, using the Resist patterns as mask, metallic plate 63 is etched from the 1st surface side and the 2nd this both sides of surface side.As a result, such as
Shown in Figure 19 (b), formd between the region that should become sample 75 in the outer frame part 63a and metallic plate 63 of metallic plate 63
Through hole 63b.It should be noted that etching is according to for connecting the connection of the outer frame part 63a of metallic plate 63 and sample 75
Mode that portion 63c is retained is implemented.The size of connecting portion 63c is long 3mm × wide 1mm or so.
Then, as shown in Figure 19 (c), the whole of region 75f is etched in the 1st face 75a from the 1st face 75a sides of sample 75
A region is etched sample 75, until the thickness for being etched region 75f of sample 75 reaches (1/2-8/100) × t0More than
And (1/2+8/100) × t0In following scope.Thereafter, by cutting off connecting portion 63c, taken out from metallic plate 63 etched
15 samples 75.It should be noted that the influence of the strain caused by cut-out involves and is etched region 75f in order to prevent, as
The means of connecting portion 63c are cut off, fine scissors can be used.
It should be noted that forming above-mentioned through hole 63b on metallic plate 63 and make sample 75 is etched region
The thickness of 75f is (1/2-8/100) × t0Above and (1/2+8/100) × t0Same etching can be passed through in following scope
It handles and implements simultaneously.
(calculating of the curvature of sample)
In the following, it is similary with the situation of above-mentioned inspection operation, the song of the warpage in etched each sample 75 is obtained successively
Rate k (mm-1).Specifically, first, in a manner that the side 75c of sample 75 is horizontal, sample 75 is loaded across squared paper 77
In on the mounting surface 76a of mounting table 76 for being formed with hollow bulb 76b.Then, vibration is applied to the mounting surface 76a of mounting table 76,
Until the state of the warpage of visual lower sample 75 does not change.Thereafter, it is etched using the scale reading of squared paper 77
The depth y (mm) of the warpage for being etched region 75f of distance x (mm) and sample 75 between the end of the length direction of region 75f.It connects
It, radius of curvature ρ corresponding with the warpage for being etched region 75f of sample 75 is calculated based on following formula.
ρ=(y/2)+(x2/8y)
Then, the curvature k of the warpage of sample 75 is calculated based on following formula.
K=1/ ρ
In the measurement result of the curvature k of warpage in 15 samples 75 obtained from the 1st coiling body, maximum 7.6
×10-3mm-1。
(evaluation of 1 effect)
Using the manufacturing method of above-mentioned deposition mask, deposition mask is manufactured by the long metal sheet of the 1st coiling body.Then survey
The curling of fixed obtained deposition mask.It should be noted that curling refers to, situation about deposition mask being placed on horizontal plane
The maximum that lower the shown deposition mask in vertical direction rises and falls.As a result, obtained by the long metal sheet of the 1st coiling body
The curling of deposition mask is 0.25mm.
(evaluation of 2 effects)
Using the deposition mask made by the long metal sheet of the 1st coiling body, the vapor deposition of progress evaporation material on substrate.It needs
It is noted that the pattern of a large amount of through holes formed on the deposition mask used is item corresponding with picture element density 300ppi
Line pattern.In addition, as evaporation material, the green luminous organic material for radiating green light has been used.Thereafter, on vapor deposition
In each layer of 2 layers or more of the green light emitting layer formed by green with luminous organic material on substrate, their center is measured
Coordinate position and feature sizes.In addition, for the centre coordinate position determined and feature sizes, calculated respectively compared with design
The bias of value.And judge whether bias is below feasible value.At this point, the feasible value of the bias of centre coordinate position is
± 4 μm, the feasible value of the bias of feature sizes is ± 2 μm.As a result, any one of centre coordinate position and feature sizes
Bias is below feasible value.That is, any one of the positional precision of evaporation material and dimensional accuracy are also good (OK).
The measurement result of the curvature of the sample obtained from the 1st coiling body is shown and on by the 1st coiling body in table 1
Long metal sheet make above-mentioned 1 effect of deposition mask and the evaluation result of 2 effects.In addition, the feelings with the 1st coiling body
Condition similarly, by the base material containing invar alloy material produces the coiling body of the 2nd coiling body~the 20th.Further, wound with the 1st
The situation of body implements the curvature of the sample obtained from each coiling body similarly, for the coiling body of the 2nd coiling body~the 20th
It measures and on above-mentioned 1 effect of deposition mask of long metal sheet making by each coiling body and the evaluation of 2 effects.
As a result table 1 is shown in together.
【Table 1】
As shown in table 1, the curvature of the sample obtained from the coiling body of the 1st coiling body~the 10th is 0.008mm-1Below.
Also, the curling of the deposition mask made by the long metal sheet of the coiling body of the 1st coiling body~the 10th is below 0.25mm.Into
And in the vapor deposition for having used deposition mask that the long metal sheet by the coiling body of the 1st coiling body~the 10th makes, evaporation material
Positional precision and dimensional accuracy are good (OK).
In contrast, the curvature of the sample obtained from the coiling body of the 11st coiling body~the 20th is more than 0.008mm-1.Separately
Outside, the curling of the deposition mask made by the long metal sheet of the coiling body of the 11st coiling body~the 20th is more than 0.25mm.And then
In the vapor deposition for having used the deposition mask made by the long metal sheet of the coiling body of the 11st coiling body~the 20th, one of evaporation material
The positional precision and whole dimensional accuracies divided are bad (NG), all bad (NG) in terms of comprehensive.That is, it is deposited on substrate
Evaporation material positions and dimensions compared with the deviation of design for outside permissible range.
It is possible thereby to think, the curvature by using acquired sample is 0.008mm-1Following coiling body can obtain
Deposition mask with good vapor deposition characteristic.
Symbol description
20 deposition masks
1st face of 20a deposition masks
2nd face of 20b deposition masks
21 metallic plates
1st face of 21a metallic plates
2nd face of 21b metallic plates
22 effective coverages
23 peripheral regions
25 through holes
30 the 1st recess portions
31 wall surfaces
35 second recesses
36 wall surfaces
55 base materials
56 rolling devices
57 annealing devices
61 cores
62 coiling bodies
64 long metal sheets
1st face of 64a long metal sheets
2nd face of 64b long metal sheets
75 samples
1st face of 75a samples
2nd face of 75b samples
75c, 75d side
75f is etched region
76 mounting tables
76a mounting surfaces
76b hollow bulbs
77 squared papers
Claims (12)
1. a kind of manufacturing method of metallic plate, which is used to manufacture deposition mask by forming 2 or more through holes,
In,
The through hole of the deposition mask by being etched to be formed to the metallic plate,
The manufacturing method of the metallic plate possesses following processes:
Rolling process rolls base material to obtain with thickness t0The metallic plate;With
Annealing operation anneals the metallic plate to remove the internal stress of the metallic plate,
The metallic plate has the 1st face and the 2nd face, the 1st face and the 2nd face compared with the metallic plate thickness direction it is orthogonal,
And it is opposite each other,
In the case where the sample to being obtained from the metallic plate after the annealing operation is etched, the sample after etching
The curvature k of the warpage of product is 0.008mm-1Hereinafter,
The curvature k is the value being obtained as follows:First, long 170mm, width are obtained from the metallic plate after the annealing operation
The sample of 30mm, then, by the length in addition to the region within 10mm is played at the both ends of length direction in the sample
150mm, the region of width 30mm are as region is etched, from the 1st surface side in the entire area for being etched region of the sample
Domain is etched the sample, until the thickness for being etched region reaches 1/3 × t0Above and 2/3 × t0Following model
In enclosing, thereafter, the sample after etching is placed in for horizontal mode in predetermined mounting table according to its side, then,
Measure distance x (mm) and the sample between the end of the length direction for being etched region of the sample described in be etched
Distance x between the end and depth y thereafter, is substituted into following formula, is thus obtained described by the depth y (mm) of the warpage in region
Curvature k,
K=1/ ρ, ρ=(y/2)+(x2/8y)。
2. the manufacturing method of metallic plate as described in claim 1, wherein, while length direction stretches the metallic plate,
Implement the annealing operation.
3. the manufacturing method of metallic plate as described in claim 1, wherein, in a state that the metal plate coils are taken on core
Implement the annealing operation.
4. such as manufacturing method of claims 1 to 3 any one of them metallic plate, wherein, the coefficient of thermal expansion of the base material is
The equal value with the coefficient of thermal expansion of substrate, on the substrate across the deposition mask manufactured by the metallic plate and forming a film has vapor deposition
Material.
5. the manufacturing method of metallic plate as described in claim 1, wherein, the base material contains invar alloy material.
6. the manufacturing method of metallic plate as described in claim 1, wherein, according to its side it is water by the sample after etching
Flat mode is placed in after predetermined mounting table, and mounting table is applied and is vibrated.
7. a kind of manufacturing method of deposition mask, which possesses the effective coverage and position for being formed with 2 or more through holes
Peripheral region around the effective coverage, wherein, which includes following processes:
Prepare the process of metallic plate, which has thickness t0, there is the 1st face and the 2nd face, the 1st face and the 2nd face compared with
The thickness direction of the metallic plate is orthogonal and opposite each other;With
Recess portion formation process in this process, is etched the metallic plate from the 1st surface side, described for being formed
It is formed from the 1st surface side to mark the recess portion of the through hole in the region of the metallic plate of effective coverage;
In the case where the sample to being obtained from the metallic plate is etched, the curvature k of the warpage of the sample after etching
For 0.008mm-1Hereinafter,
The curvature k is the value being obtained as follows:First, long 170mm, the sample of width 30mm are obtained from the metallic plate,
Then, by the sample in addition to the region within 10mm is played at the both ends of length direction long 150mm, the region of width 30mm
As region is etched, the sample is lost in the whole region for being etched region of the sample from the 1st surface side
It carves, until the thickness for being etched region reaches 1/3 × t0Above and 2/3 × t0In following scope, thereafter, after etching
The sample be placed according to its side in predetermined mounting table for horizontal mode, then, measure the described of the sample
It is etched the depth y of the warpage for being etched region of distance x (mm) and the sample between the end of the length direction in region
(mm), distance x between the end and depth y thereafter, is substituted into following formula, the curvature k is thus obtained,
K=1/ ρ, ρ=(y/2)+(x2/8y)。
8. the manufacturing method of deposition mask as claimed in claim 7, wherein, in the recess portion formation process, from the described 1st
Whole region of the surface side in the 1st face is etched the metallic plate.
9. the manufacturing method of deposition mask as claimed in claim 8, wherein, in the recess portion formation process, from the described 1st
Whole region of the surface side in the 1st face is etched the metallic plate, until etched thickness reaches 1/3 × t0Above and 2/
3×t0In following scope.
10. such as manufacturing method of claim 7~9 any one of them deposition mask, wherein, the thermal expansion system of the metallic plate
Number for the value equal with the coefficient of thermal expansion of substrate, on the substrate across the deposition mask manufactured by the metallic plate and forming a film has
Evaporation material.
11. the manufacturing method of deposition mask as claimed in claim 7, wherein, the metallic plate contains invar alloy material.
12. the manufacturing method of deposition mask as claimed in claim 7, wherein, by the sample after etching according to its side
After being placed in predetermined mounting table for horizontal mode, mounting table is applied and is vibrated.
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Cited By (1)
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Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5455099B1 (en) | 2013-09-13 | 2014-03-26 | 大日本印刷株式会社 | Metal plate, metal plate manufacturing method, and mask manufacturing method using metal plate |
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CN110760793A (en) * | 2015-04-24 | 2020-02-07 | Lg伊诺特有限公司 | Deposition mask |
JP6237972B1 (en) * | 2016-04-14 | 2017-11-29 | 凸版印刷株式会社 | Vapor deposition mask substrate, vapor deposition mask substrate production method, and vapor deposition mask production method |
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WO2018051443A1 (en) * | 2016-09-14 | 2018-03-22 | シャープ株式会社 | Mask sheet, deposition mask, and display panel manufacturing method |
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KR102441908B1 (en) * | 2016-11-18 | 2022-09-08 | 다이니폰 인사츠 가부시키가이샤 | deposition mask |
JP7121918B2 (en) * | 2016-12-14 | 2022-08-19 | 大日本印刷株式会社 | Evaporation mask device and method for manufacturing evaporation mask device |
JP6851820B2 (en) * | 2016-12-28 | 2021-03-31 | マクセルホールディングス株式会社 | Thin-film deposition mask and its installation method and manufacturing method |
WO2018131474A1 (en) * | 2017-01-10 | 2018-07-19 | 大日本印刷株式会社 | Vapor deposition mask, method for manufacturing vapor deposition mask device, and method for manufacturing vapor deposition mask |
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WO2022092848A1 (en) * | 2020-10-30 | 2022-05-05 | 에이피에스홀딩스 주식회사 | Deposition mask |
KR20220069397A (en) * | 2020-11-20 | 2022-05-27 | 엘지이노텍 주식회사 | Deposition mask for oled pixel deposition |
CN113005399A (en) * | 2021-02-23 | 2021-06-22 | 合肥鑫晟光电科技有限公司 | Mask plate manufacturing method and mask plate |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1316016A (en) * | 1999-05-07 | 2001-10-03 | 松下电子工业株式会社 | Stainless steel plate for shadow mask and method for production thereof and shadow mask |
JP2003272839A (en) * | 2002-03-14 | 2003-09-26 | Dainippon Printing Co Ltd | Manufacturing method of masking member for evaporation treatment |
JP2005105406A (en) * | 2003-09-10 | 2005-04-21 | Nippon Seiki Co Ltd | Mask for vapor deposition |
CN1621555A (en) * | 2003-04-10 | 2005-06-01 | 株式会社半导体能源研究所 | Mask and container and manufacturing apparatus |
CN102162082A (en) * | 2010-02-12 | 2011-08-24 | 株式会社爱发科 | Vapor plating mask, vapor plating device and film formation method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1034237A (en) * | 1996-07-30 | 1998-02-10 | Sumitomo Metal Ind Ltd | Production of cold rolling stainless steel sheet with excellent flatness |
JP2000319728A (en) * | 1999-05-07 | 2000-11-21 | Sumitomo Metal Ind Ltd | Manufacture of metal sheet for shadow mask |
JP2001131707A (en) * | 1999-10-29 | 2001-05-15 | Dainippon Printing Co Ltd | Shadow mask for color cathode-ray tube |
JP3573047B2 (en) | 2000-02-10 | 2004-10-06 | 住友金属工業株式会社 | Manufacturing method of stainless steel sheet with excellent flatness after etching |
JP3651432B2 (en) * | 2001-09-25 | 2005-05-25 | セイコーエプソン株式会社 | Mask, manufacturing method thereof, and manufacturing method of electroluminescence device |
JP4126648B2 (en) * | 2002-07-01 | 2008-07-30 | 日立金属株式会社 | Method for manufacturing metal mask member |
KR100523430B1 (en) * | 2002-08-23 | 2005-10-25 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | MILD STEEL STEM AND Fe-Ni ALLOY BASED STEM FOR SHADOW MASK HAVING GOOD SHAPE AFTER ETCHING |
JP2004185890A (en) * | 2002-12-02 | 2004-07-02 | Hitachi Metals Ltd | Metal mask |
EP1449596A1 (en) * | 2003-02-24 | 2004-08-25 | Corus Technology BV | A method for processing a steel product, and product produced using said method |
JP4089632B2 (en) * | 2003-03-07 | 2008-05-28 | セイコーエプソン株式会社 | Mask manufacturing method, mask manufacturing apparatus, and film forming method of light emitting material |
JP2004362908A (en) * | 2003-06-04 | 2004-12-24 | Hitachi Metals Ltd | Metal mask and manufacturing method thereof |
JP2005042147A (en) * | 2003-07-25 | 2005-02-17 | Dainippon Screen Mfg Co Ltd | Method of producing mask for vapor deposition, and mask for vapor deposition |
JP5151004B2 (en) * | 2004-12-09 | 2013-02-27 | 大日本印刷株式会社 | Metal mask unit and manufacturing method thereof |
JP2006247721A (en) * | 2005-03-11 | 2006-09-21 | Jfe Steel Kk | Method and apparatus for straightening shape of metallic sheet using roll having uneven cross-sectional shape for pinching metallic sheet |
KR100763538B1 (en) * | 2006-08-29 | 2007-10-05 | 삼성전자주식회사 | Method of forming mask pattern and method of forming fine pattern using the same in a semiconductor device fabricating |
CN200989993Y (en) * | 2006-12-22 | 2007-12-12 | 上海集成电路研发中心有限公司 | Long mask plate for double-exposure |
KR100796617B1 (en) | 2006-12-27 | 2008-01-22 | 삼성에스디아이 주식회사 | Mask device and manufacturing thereof and organic light emitting display device comprising the same |
JP4985227B2 (en) * | 2007-08-24 | 2012-07-25 | 大日本印刷株式会社 | Vapor deposition mask, vapor deposition mask device, vapor deposition mask manufacturing method, vapor deposition mask device production method, and vapor deposition mask sheet-like member production method |
JP5262226B2 (en) * | 2007-08-24 | 2013-08-14 | 大日本印刷株式会社 | Vapor deposition mask and method of manufacturing vapor deposition mask |
WO2011122608A1 (en) * | 2010-03-30 | 2011-10-06 | Hoya株式会社 | Method for manufacturing substrate for photomask blank, method for manufacturing photomask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
KR101693578B1 (en) * | 2011-03-24 | 2017-01-10 | 삼성디스플레이 주식회사 | Vapor deposition mask |
-
2013
- 2013-07-24 JP JP2013153920A patent/JP5382257B1/en active Active
-
2014
- 2014-01-10 KR KR1020157009821A patent/KR101761494B1/en active IP Right Grant
- 2014-01-10 CN CN201711267436.7A patent/CN107858644A/en active Pending
- 2014-01-10 WO PCT/JP2014/050346 patent/WO2014109394A1/en active Application Filing
- 2014-01-10 KR KR1020177020095A patent/KR102087056B1/en active IP Right Review Request
- 2014-01-10 CN CN201711267429.7A patent/CN108048793B/en active Active
- 2014-01-10 CN CN201480003438.3A patent/CN104838037B/en active Active
- 2014-01-10 CN CN201911326369.0A patent/CN110938798A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1316016A (en) * | 1999-05-07 | 2001-10-03 | 松下电子工业株式会社 | Stainless steel plate for shadow mask and method for production thereof and shadow mask |
JP2003272839A (en) * | 2002-03-14 | 2003-09-26 | Dainippon Printing Co Ltd | Manufacturing method of masking member for evaporation treatment |
CN1621555A (en) * | 2003-04-10 | 2005-06-01 | 株式会社半导体能源研究所 | Mask and container and manufacturing apparatus |
JP2005105406A (en) * | 2003-09-10 | 2005-04-21 | Nippon Seiki Co Ltd | Mask for vapor deposition |
CN102162082A (en) * | 2010-02-12 | 2011-08-24 | 株式会社爱发科 | Vapor plating mask, vapor plating device and film formation method |
Non-Patent Citations (1)
Title |
---|
阳兆祥: "《交通事故力学鉴定教程》", 31 October 2002, 广西科学技术出版社 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112752860A (en) * | 2018-09-27 | 2021-05-04 | 日铁化学材料株式会社 | Metal mask material, manufacturing method thereof and metal mask |
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JP2014148740A (en) | 2014-08-21 |
CN108048793B (en) | 2020-11-03 |
KR20150103655A (en) | 2015-09-11 |
CN107858644A (en) | 2018-03-30 |
WO2014109394A1 (en) | 2014-07-17 |
CN104838037B (en) | 2017-11-21 |
KR102087056B1 (en) | 2020-03-10 |
CN104838037A (en) | 2015-08-12 |
JP5382257B1 (en) | 2014-01-08 |
KR102087056B9 (en) | 2022-08-02 |
CN110938798A (en) | 2020-03-31 |
KR20170087533A (en) | 2017-07-28 |
KR101761494B1 (en) | 2017-07-25 |
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