CN107962317A - 一种水基免清洗型助焊剂 - Google Patents
一种水基免清洗型助焊剂 Download PDFInfo
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- CN107962317A CN107962317A CN201711041890.0A CN201711041890A CN107962317A CN 107962317 A CN107962317 A CN 107962317A CN 201711041890 A CN201711041890 A CN 201711041890A CN 107962317 A CN107962317 A CN 107962317A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Detergent Compositions (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711041890.0A CN107962317B (zh) | 2017-10-31 | 2017-10-31 | 一种水基免清洗型助焊剂 |
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CN201711041890.0A CN107962317B (zh) | 2017-10-31 | 2017-10-31 | 一种水基免清洗型助焊剂 |
Publications (2)
Publication Number | Publication Date |
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CN107962317A true CN107962317A (zh) | 2018-04-27 |
CN107962317B CN107962317B (zh) | 2020-07-24 |
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CN201711041890.0A Active CN107962317B (zh) | 2017-10-31 | 2017-10-31 | 一种水基免清洗型助焊剂 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108188616A (zh) * | 2017-12-30 | 2018-06-22 | 刘滨 | 一种环保型无卤助焊剂的制备方法 |
CN108817731A (zh) * | 2018-07-04 | 2018-11-16 | 中原工学院 | 一种低温、无卤、低固含量改性松香型助焊剂及制备方法 |
CN108994485A (zh) * | 2018-10-26 | 2018-12-14 | 长沙浩然医疗科技有限公司 | 一种助焊剂及其制备方法 |
CN109175769A (zh) * | 2018-09-30 | 2019-01-11 | 苏州优诺电子材料科技有限公司 | 连续纤维增强Sn-Bi-Zn系无铅焊料及其制备方法 |
CN110732805A (zh) * | 2018-10-16 | 2020-01-31 | 嘉兴学院 | 高密度组装部件用免清洗助焊剂及其制备方法 |
CN112589318A (zh) * | 2020-11-12 | 2021-04-02 | 深圳市晨日科技股份有限公司 | 一种水溶性无铅助焊膏、水洗锡膏及其制备方法 |
Citations (7)
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JPH051393A (ja) * | 1990-07-19 | 1993-01-08 | Electroplating Eng Of Japan Co | 銀銅合金メツキ浴及び銀銅合金ロウ材 |
CN101157168A (zh) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | 无铅焊料丝用松香型无卤素免清洗助焊剂 |
CN104070308A (zh) * | 2014-06-23 | 2014-10-01 | 华南理工大学 | 无卤素免清洗光亮型焊锡丝用松香基助焊剂及其制备方法 |
CN104400257A (zh) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | 一种免清洗无铅低银焊膏用助焊剂 |
CN104607826A (zh) * | 2014-12-09 | 2015-05-13 | 华南理工大学 | 一种用于铝低温软钎焊的免清洗固态助焊剂及制备方法 |
CN104942480A (zh) * | 2015-06-29 | 2015-09-30 | 东莞市千岛金属锡品有限公司 | 一种用于不锈钢软钎焊的固态助焊剂及制备方法 |
US20150367617A1 (en) * | 2013-08-09 | 2015-12-24 | Metna Co | Joining via Nano-Scale Reinforced Bonding Media: Materials, Procedures and Applications Thereof |
-
2017
- 2017-10-31 CN CN201711041890.0A patent/CN107962317B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH051393A (ja) * | 1990-07-19 | 1993-01-08 | Electroplating Eng Of Japan Co | 銀銅合金メツキ浴及び銀銅合金ロウ材 |
CN101157168A (zh) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | 无铅焊料丝用松香型无卤素免清洗助焊剂 |
US20150367617A1 (en) * | 2013-08-09 | 2015-12-24 | Metna Co | Joining via Nano-Scale Reinforced Bonding Media: Materials, Procedures and Applications Thereof |
CN104070308A (zh) * | 2014-06-23 | 2014-10-01 | 华南理工大学 | 无卤素免清洗光亮型焊锡丝用松香基助焊剂及其制备方法 |
CN104400257A (zh) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | 一种免清洗无铅低银焊膏用助焊剂 |
CN104607826A (zh) * | 2014-12-09 | 2015-05-13 | 华南理工大学 | 一种用于铝低温软钎焊的免清洗固态助焊剂及制备方法 |
CN104942480A (zh) * | 2015-06-29 | 2015-09-30 | 东莞市千岛金属锡品有限公司 | 一种用于不锈钢软钎焊的固态助焊剂及制备方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108188616A (zh) * | 2017-12-30 | 2018-06-22 | 刘滨 | 一种环保型无卤助焊剂的制备方法 |
CN108817731A (zh) * | 2018-07-04 | 2018-11-16 | 中原工学院 | 一种低温、无卤、低固含量改性松香型助焊剂及制备方法 |
CN108817731B (zh) * | 2018-07-04 | 2020-04-10 | 中原工学院 | 一种低温、无卤、低固含量改性松香型助焊剂及制备方法 |
CN109175769A (zh) * | 2018-09-30 | 2019-01-11 | 苏州优诺电子材料科技有限公司 | 连续纤维增强Sn-Bi-Zn系无铅焊料及其制备方法 |
CN110732805A (zh) * | 2018-10-16 | 2020-01-31 | 嘉兴学院 | 高密度组装部件用免清洗助焊剂及其制备方法 |
CN108994485A (zh) * | 2018-10-26 | 2018-12-14 | 长沙浩然医疗科技有限公司 | 一种助焊剂及其制备方法 |
CN108994485B (zh) * | 2018-10-26 | 2021-01-05 | 众潮电科(深圳)有限公司 | 一种助焊剂及其制备方法 |
CN112589318A (zh) * | 2020-11-12 | 2021-04-02 | 深圳市晨日科技股份有限公司 | 一种水溶性无铅助焊膏、水洗锡膏及其制备方法 |
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Publication number | Publication date |
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CN107962317B (zh) | 2020-07-24 |
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Effective date of registration: 20180425 Address after: 213016 room 602, unit 53, Baiyun New Village, Zhong Lou District, Changzhou, Jiangsu. Applicant after: Tian Qiuzhen Address before: 213102 2531, science and Education City, Changwu Middle Road, Wujin District, Changzhou, Jiangsu, 2531, 2531, 2531 Applicant before: CHANGZHOU FINESTONE AUTOMATION EQUIPMENT Co.,Ltd. |
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Effective date of registration: 20200628 Address after: No.386, zhongaozhang village, Daxi Town, Wenling City, Taizhou City, Zhejiang Province Applicant after: ZHEJIANG SHUANGYU TECHNOLOGY Co.,Ltd. Address before: 213016 room 602, unit 53, Baiyun New Village, Zhong Lou District, Changzhou, Jiangsu. Applicant before: Tian Qiuzhen |
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Effective date of registration: 20230517 Address after: Room 401, Building 7, Yunli Intelligent Park, Shutianpu Community, Matian Street, Guangming District, Shenzhen City, Guangdong Province, 518000 Patentee after: SHENZHEN AONIU TECHNOLOGY Co.,Ltd. Address before: 317500 no.386, zhongaozhang village, Daxi Town, Wenling City, Taizhou City, Zhejiang Province Patentee before: ZHEJIANG SHUANGYU TECHNOLOGY Co.,Ltd. |