CN107924817B - 检测设备、压印装置、制造物品的方法、照明光学系统以及检测方法 - Google Patents
检测设备、压印装置、制造物品的方法、照明光学系统以及检测方法 Download PDFInfo
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- CN107924817B CN107924817B CN201680048330.5A CN201680048330A CN107924817B CN 107924817 B CN107924817 B CN 107924817B CN 201680048330 A CN201680048330 A CN 201680048330A CN 107924817 B CN107924817 B CN 107924817B
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- alignment mark
- illumination
- angular distribution
- optical system
- detection
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/28—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with deflection of beams of light, e.g. for direct optical indication
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-164014 | 2015-08-21 | ||
| JP2015164014A JP6632252B2 (ja) | 2015-08-21 | 2015-08-21 | 検出装置、インプリント装置、物品の製造方法及び照明光学系 |
| PCT/JP2016/003582 WO2017033410A1 (en) | 2015-08-21 | 2016-08-03 | Detection device, imprint apparatus, method of manufacturing article, illumination optical system, and detection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107924817A CN107924817A (zh) | 2018-04-17 |
| CN107924817B true CN107924817B (zh) | 2021-09-10 |
Family
ID=58099700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680048330.5A Active CN107924817B (zh) | 2015-08-21 | 2016-08-03 | 检测设备、压印装置、制造物品的方法、照明光学系统以及检测方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10732523B2 (enExample) |
| JP (1) | JP6632252B2 (enExample) |
| KR (1) | KR102082584B1 (enExample) |
| CN (1) | CN107924817B (enExample) |
| WO (1) | WO2017033410A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10502830B2 (en) | 2016-10-13 | 2019-12-10 | Waymo Llc | Limitation of noise on light detectors using an aperture |
| JP7057094B2 (ja) * | 2017-10-13 | 2022-04-19 | キヤノン株式会社 | 位置検出装置、インプリント装置および、物品製造方法 |
| JP7030533B2 (ja) * | 2018-01-15 | 2022-03-07 | キオクシア株式会社 | インプリント装置、インプリント方法、及び半導体装置の製造方法 |
| JP7038562B2 (ja) * | 2018-02-13 | 2022-03-18 | キヤノン株式会社 | 検出装置、リソグラフィ装置、および物品の製造方法 |
| NL2021404B1 (en) * | 2018-07-27 | 2020-01-31 | Wavin Bv | A system and a method for building a road |
| US11561284B2 (en) | 2018-11-02 | 2023-01-24 | Waymo Llc | Parallax compensating spatial filters |
| JP7257853B2 (ja) * | 2019-04-02 | 2023-04-14 | キヤノン株式会社 | 位置検出装置、露光装置および物品製造方法 |
| KR102665402B1 (ko) | 2019-04-08 | 2024-05-09 | 에이에스엠엘 홀딩 엔.브이. | 센서 장치, 및 리소그래피 측정 방법 |
| JP7328806B2 (ja) * | 2019-06-25 | 2023-08-17 | キヤノン株式会社 | 計測装置、リソグラフィ装置、および物品の製造方法 |
| WO2021060739A1 (ko) * | 2019-09-27 | 2021-04-01 | 주식회사 엘지화학 | 마킹을 이용한 광학 필름, 광학 필름 제조 장치 및 제조 방법 |
| JP7500258B2 (ja) * | 2020-04-10 | 2024-06-17 | キヤノン株式会社 | 検出装置、リソグラフィ装置、物品の製造方法、及び検出方法 |
| JP7716925B2 (ja) * | 2020-08-28 | 2025-08-01 | キヤノン株式会社 | 計測装置、計測方法、リソグラフィー装置、物品製造方法およびモデル |
| JP7614858B2 (ja) | 2021-01-26 | 2025-01-16 | キヤノン株式会社 | 検出装置、リソグラフィ装置、および物品製造方法 |
| US12090714B2 (en) | 2021-02-03 | 2024-09-17 | Tpi Composites, Inc. | Spatial coordinate tracking of wind turbine assembly components using laser projection system |
| JP7550814B2 (ja) * | 2022-05-18 | 2024-09-13 | キヤノン株式会社 | 検出装置、リソグラフィ装置、物品製造方法および検出システム |
| JP2023177409A (ja) * | 2022-06-02 | 2023-12-14 | キヤノン株式会社 | インプリント装置、インプリント方法、物品の製造方法、及びコンピュータプログラム |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103105127A (zh) * | 2011-10-21 | 2013-05-15 | 佳能株式会社 | 检测器、压印装置以及物品制造方法 |
| CN103913960A (zh) * | 2013-01-02 | 2014-07-09 | 台湾积体电路制造股份有限公司 | 用于光刻对准的系统和方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6483101A (en) * | 1987-09-25 | 1989-03-28 | Matsushita Electric Industrial Co Ltd | Diffracted beam separation optical system |
| JPH05259029A (ja) * | 1992-03-12 | 1993-10-08 | Nikon Corp | 位置検出装置 |
| JPH07321028A (ja) * | 1994-05-27 | 1995-12-08 | Nikon Corp | アライメント装置 |
| JP2002122412A (ja) * | 2000-10-17 | 2002-04-26 | Nikon Corp | 位置検出装置、露光装置およびマイクロデバイスの製造方法 |
| TW567406B (en) | 2001-12-12 | 2003-12-21 | Nikon Corp | Diffraction optical device, refraction optical device, illuminating optical device, exposure system and exposure method |
| KR101547077B1 (ko) * | 2003-04-09 | 2015-08-25 | 가부시키가이샤 니콘 | 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
| TWI569308B (zh) | 2003-10-28 | 2017-02-01 | 尼康股份有限公司 | 照明光學裝置、曝光裝置、曝光方法以及元件製造 方法 |
| JP4497949B2 (ja) | 2004-02-12 | 2010-07-07 | キヤノン株式会社 | 露光装置 |
| JP4865270B2 (ja) * | 2005-07-28 | 2012-02-01 | キヤノン株式会社 | 露光装置、及びそれを用いたデバイス製造方法 |
| US7397042B2 (en) * | 2005-08-24 | 2008-07-08 | Dr. Chip Biotechnology Incorporation | Optical detection apparatus and method thereof |
| JP2008270726A (ja) | 2007-03-23 | 2008-11-06 | Advanced Lcd Technologies Development Center Co Ltd | 結晶化装置、結晶化方法、デバイス、および光変調素子 |
| CN101688940B (zh) * | 2007-05-09 | 2017-02-08 | 瑞尔D股份有限公司 | 用于立体投影的偏振转换系统和方法 |
| US10114213B2 (en) * | 2008-04-04 | 2018-10-30 | Cvi Laser, Llc | Laser systems and optical devices for manipulating laser beams |
| US20190142257A1 (en) * | 2010-03-30 | 2019-05-16 | 3Shape A/S | Scanning of cavities with restricted accessibility |
| US8842294B2 (en) | 2011-06-21 | 2014-09-23 | Canon Kabushiki Kaisha | Position detection apparatus, imprint apparatus, and position detection method |
| JP2013175684A (ja) * | 2012-02-27 | 2013-09-05 | Canon Inc | 検出器、インプリント装置及び物品を製造する方法 |
| WO2017140528A1 (en) * | 2016-02-19 | 2017-08-24 | Asml Netherlands B.V. | Method of measuring a structure, inspection apparatus, lithographic system, device manufacturing method and wavelength-selective filter for use therein |
-
2015
- 2015-08-21 JP JP2015164014A patent/JP6632252B2/ja active Active
-
2016
- 2016-08-03 WO PCT/JP2016/003582 patent/WO2017033410A1/en not_active Ceased
- 2016-08-03 KR KR1020187007830A patent/KR102082584B1/ko active Active
- 2016-08-03 US US15/753,924 patent/US10732523B2/en active Active
- 2016-08-03 CN CN201680048330.5A patent/CN107924817B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103105127A (zh) * | 2011-10-21 | 2013-05-15 | 佳能株式会社 | 检测器、压印装置以及物品制造方法 |
| CN103913960A (zh) * | 2013-01-02 | 2014-07-09 | 台湾积体电路制造股份有限公司 | 用于光刻对准的系统和方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102082584B1 (ko) | 2020-02-27 |
| US20180259863A1 (en) | 2018-09-13 |
| WO2017033410A1 (en) | 2017-03-02 |
| JP2017041608A (ja) | 2017-02-23 |
| CN107924817A (zh) | 2018-04-17 |
| KR20180041736A (ko) | 2018-04-24 |
| JP6632252B2 (ja) | 2020-01-22 |
| US10732523B2 (en) | 2020-08-04 |
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