CN107922708A - 树脂组合物、感光性树脂组合物、树脂膜和电子装置 - Google Patents

树脂组合物、感光性树脂组合物、树脂膜和电子装置 Download PDF

Info

Publication number
CN107922708A
CN107922708A CN201680048062.7A CN201680048062A CN107922708A CN 107922708 A CN107922708 A CN 107922708A CN 201680048062 A CN201680048062 A CN 201680048062A CN 107922708 A CN107922708 A CN 107922708A
Authority
CN
China
Prior art keywords
formula
resin
polymer
combination
organic group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680048062.7A
Other languages
English (en)
Chinese (zh)
Inventor
穴田亘平
大西治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN107922708A publication Critical patent/CN107922708A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
    • C08G81/02—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers at least one of the polymers being obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14—Modified phenol-aldehyde condensates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
CN201680048062.7A 2015-08-21 2016-07-21 树脂组合物、感光性树脂组合物、树脂膜和电子装置 Pending CN107922708A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015163438 2015-08-21
JP2015-163438 2015-08-21
PCT/JP2016/071401 WO2017033633A1 (ja) 2015-08-21 2016-07-21 樹脂組成物、感光性樹脂組成物、樹脂膜および電子装置

Publications (1)

Publication Number Publication Date
CN107922708A true CN107922708A (zh) 2018-04-17

Family

ID=58101193

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680048062.7A Pending CN107922708A (zh) 2015-08-21 2016-07-21 树脂组合物、感光性树脂组合物、树脂膜和电子装置

Country Status (5)

Country Link
JP (3) JP6354802B2 (ko)
KR (1) KR101927037B1 (ko)
CN (1) CN107922708A (ko)
TW (1) TWI694098B (ko)
WO (1) WO2017033633A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110511532A (zh) * 2019-09-25 2019-11-29 河南工业大学 一种马来酸酐-丙烯酸酯共聚物改性酚醛树脂
CN113811556A (zh) * 2019-05-08 2021-12-17 住友电木株式会社 感光性树脂组合物、树脂膜和电子装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6338034B1 (ja) * 2016-09-28 2018-06-06 住友ベークライト株式会社 摩擦材用フェノール樹脂組成物および摩擦材
JP7088640B2 (ja) * 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP7043756B2 (ja) * 2017-08-31 2022-03-30 住友ベークライト株式会社 感光性樹脂組成物、パターン形成方法、電子デバイスの製造方法、ポリマーおよびポリマーの製造方法
JP7020018B2 (ja) * 2017-09-15 2022-02-16 住友ベークライト株式会社 ゴム組成物
JP6764885B2 (ja) * 2018-01-11 2020-10-07 Ｊｆｅケミカル株式会社 熱硬化性樹脂組成物およびその硬化物
JP6950573B2 (ja) * 2018-02-26 2021-10-13 Jnc株式会社 熱硬化性組成物
JP7559421B2 (ja) 2020-03-02 2024-10-02 住友ベークライト株式会社 カラーフィルタまたはブラックマトリクス形成用ポリマー溶液
JP7173380B2 (ja) * 2020-09-23 2022-11-16 住友ベークライト株式会社 ポリマー、ポリマーの製造方法、ポリマー溶液および感光性樹脂組成物

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6416925B1 (en) * 1997-02-18 2002-07-09 Fuji Photo Film Co., Ltd. Positive working photosensitive composition
US6534235B1 (en) * 2000-10-31 2003-03-18 Kansai Research Institute, Inc. Photosensitive resin composition and process for forming pattern
CN1500119A (zh) * 2001-02-26 2004-05-26 音思万有限公司 正向光界定多聚羧酸酚醛和热固化树脂组合物
CN103370347A (zh) * 2010-11-24 2013-10-23 普罗米鲁斯有限责任公司 可自成像成膜聚合物、其组合物以及由其制得的器件和结构
CN104216222A (zh) * 2013-05-29 2014-12-17 住友电木株式会社 感光性树脂组合物和电子装置
CN104216228A (zh) * 2013-05-29 2014-12-17 住友电木株式会社 负型感光性树脂组合物、电子装置和聚合物
JP5672403B1 (ja) * 2014-05-26 2015-02-18 住友ベークライト株式会社 感光性樹脂組成物および電子装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595243A (ja) * 1982-07-02 1984-01-12 Hitachi Ltd 放射線感応性組成物及びパタ−ン形成方法
US5110700A (en) * 1990-12-28 1992-05-05 Xerox Corporation Electrophotographic imaging member
JPH06305076A (ja) * 1993-04-26 1994-11-01 Hitachi Chem Co Ltd 金属ベースメラミン樹脂化粧板の製造方法
JP3429852B2 (ja) * 1993-06-04 2003-07-28 シップレーカンパニー エル エル シー ネガ型感光性組成物
WO1996023007A1 (en) * 1995-01-27 1996-08-01 Raychem Corporation Gels from anhydride-containing polymers
JP3944966B2 (ja) * 1996-09-30 2007-07-18 日本ゼオン株式会社 変性ノルボルネン系重合体及びその製造方法
JP2000122278A (ja) * 1998-10-21 2000-04-28 Okamoto Kagaku Kogyo Kk 感光性組成物および感光性平版印刷版
JP3615981B2 (ja) * 1999-11-24 2005-02-02 クラリアント インターナショナル リミテッド 感光性樹脂組成物
US6449918B1 (en) * 1999-11-08 2002-09-17 Premark Rwp Holdings, Inc. Multipanel floor system panel connector with seal
CN1717630A (zh) * 2003-06-30 2006-01-04 株式会社新克 正型感光性组合物
JP2005105209A (ja) * 2003-10-01 2005-04-21 Yokohama Rubber Co Ltd:The 高減衰エラストマー組成物
JP4951200B2 (ja) * 2004-08-20 2012-06-13 東洋インキＳｃホールディングス株式会社 カラーフィルタ
JP2015166431A (ja) * 2014-03-04 2015-09-24 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ及び積層板
JP6287652B2 (ja) * 2014-07-10 2018-03-07 日油株式会社 感光性樹脂組成物およびその用途
JP6528421B2 (ja) * 2015-01-28 2019-06-12 住友ベークライト株式会社 感光性樹脂組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6416925B1 (en) * 1997-02-18 2002-07-09 Fuji Photo Film Co., Ltd. Positive working photosensitive composition
US6534235B1 (en) * 2000-10-31 2003-03-18 Kansai Research Institute, Inc. Photosensitive resin composition and process for forming pattern
CN1500119A (zh) * 2001-02-26 2004-05-26 音思万有限公司 正向光界定多聚羧酸酚醛和热固化树脂组合物
CN103370347A (zh) * 2010-11-24 2013-10-23 普罗米鲁斯有限责任公司 可自成像成膜聚合物、其组合物以及由其制得的器件和结构
CN104216222A (zh) * 2013-05-29 2014-12-17 住友电木株式会社 感光性树脂组合物和电子装置
CN104216228A (zh) * 2013-05-29 2014-12-17 住友电木株式会社 负型感光性树脂组合物、电子装置和聚合物
JP5672403B1 (ja) * 2014-05-26 2015-02-18 住友ベークライト株式会社 感光性樹脂組成物および電子装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
俞铁铭 等: "《精细有机单元反应与工艺》", 31 January 2015, 浙江大学出版社 *
段行信: "《实用精细有机合成手册》", 31 January 2000, 化学工业出版社 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113811556A (zh) * 2019-05-08 2021-12-17 住友电木株式会社 感光性树脂组合物、树脂膜和电子装置
CN113811556B (zh) * 2019-05-08 2024-05-28 住友电木株式会社 感光性树脂组合物、树脂膜和电子装置
CN110511532A (zh) * 2019-09-25 2019-11-29 河南工业大学 一种马来酸酐-丙烯酸酯共聚物改性酚醛树脂
CN110511532B (zh) * 2019-09-25 2022-03-25 河南工业大学 一种马来酸酐-丙烯酸酯共聚物改性酚醛树脂

Also Published As

Publication number Publication date
WO2017033633A1 (ja) 2017-03-02
JP2017039909A (ja) 2017-02-23
TWI694098B (zh) 2020-05-21
JP6354802B2 (ja) 2018-07-11
JP2018172700A (ja) 2018-11-08
KR101927037B1 (ko) 2018-12-07
TW201718719A (zh) 2017-06-01
KR20180031804A (ko) 2018-03-28
JP6414352B2 (ja) 2018-10-31
JP6468393B2 (ja) 2019-02-13
JP2018109196A (ja) 2018-07-12

Similar Documents

Publication Publication Date Title
CN107922708A (zh) 树脂组合物、感光性树脂组合物、树脂膜和电子装置
JP7283515B2 (ja) 化合物、樹脂、組成物並びにレジストパターン形成方法及び回路パターン形成方法
WO2018016614A1 (ja) 化合物、樹脂、組成物及びパターン形成方法
TW200813628A (en) Photosensitive insulating resin composition, hardened product thereof and circuit board comprising the same
JPWO2018016615A1 (ja) 化合物、樹脂、組成物並びにレジストパターン形成方法及び回路パターン形成方法
TW200905383A (en) Photosensitive insulating resin composition
WO2018016648A1 (ja) 化合物、樹脂、組成物及びパターン形成方法
JP7290114B2 (ja) 化合物、樹脂、組成物及びパターン形成方法
WO2018016634A1 (ja) 化合物、樹脂及び組成物、並びにレジストパターン形成方法及び回路パターン形成方法
JP7205716B2 (ja) 化合物、樹脂、組成物並びにレジストパターン形成方法及び回路パターン形成方法
JP7452947B2 (ja) 化合物、樹脂、組成物、並びにレジストパターン形成方法及び回路パターン形成方法
JP2006154779A (ja) ポジ型感光性絶縁樹脂組成物およびその硬化物
JP7205715B2 (ja) 化合物、樹脂、組成物並びにレジストパターン形成方法及び回路パターン形成方法
WO2018135498A1 (ja) 化合物、樹脂、組成物及びパターン形成方法
JPWO2018056277A1 (ja) 化合物、樹脂、組成物、並びにレジストパターン形成方法及び回路パターン形成方法
JP2020170103A (ja) 感光性樹脂組成物、樹脂膜、及び、電子装置
WO2018052028A1 (ja) 化合物、樹脂、組成物及びパターン形成方法
JP2018115249A (ja) 樹脂組成物、感光性樹脂組成物、樹脂膜および電子装置
JP7139622B2 (ja) 化合物、樹脂、組成物及びパターン形成方法
JP2018127564A (ja) 樹脂組成物、感光性樹脂組成物、樹脂膜および電子装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180417

WD01 Invention patent application deemed withdrawn after publication