CN107866724A - 半导体装置的制造方法和半导体制造装置 - Google Patents

半导体装置的制造方法和半导体制造装置 Download PDF

Info

Publication number
CN107866724A
CN107866724A CN201710865633.2A CN201710865633A CN107866724A CN 107866724 A CN107866724 A CN 107866724A CN 201710865633 A CN201710865633 A CN 201710865633A CN 107866724 A CN107866724 A CN 107866724A
Authority
CN
China
Prior art keywords
semiconductor wafer
adhesive
grinding
semiconductor
bonding agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710865633.2A
Other languages
English (en)
Chinese (zh)
Inventor
三井贵彦
山本荣
山本荣一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okamoto Corp
Original Assignee
Okamoto Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okamoto Corp filed Critical Okamoto Corp
Publication of CN107866724A publication Critical patent/CN107866724A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/008—Machines comprising two or more tools or having several working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B24B55/08—Dust extraction equipment on grinding or polishing machines specially designed for belt grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02016—Backside treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
CN201710865633.2A 2016-09-23 2017-09-22 半导体装置的制造方法和半导体制造装置 Pending CN107866724A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-185300 2016-09-23
JP2016185300A JP6850099B2 (ja) 2016-09-23 2016-09-23 半導体装置の製造方法及び半導体製造装置

Publications (1)

Publication Number Publication Date
CN107866724A true CN107866724A (zh) 2018-04-03

Family

ID=61752408

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710865633.2A Pending CN107866724A (zh) 2016-09-23 2017-09-22 半导体装置的制造方法和半导体制造装置

Country Status (4)

Country Link
JP (1) JP6850099B2 (enExample)
KR (1) KR102466056B1 (enExample)
CN (1) CN107866724A (enExample)
TW (1) TWI746645B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857601A (zh) * 2018-07-25 2018-11-23 浙江工业大学 钴基合金的光催化加工方法及其设备
CN115989110A (zh) * 2020-08-27 2023-04-18 富士胶片株式会社 经加工的基材的制造方法、半导体元件的制造方法、及临时粘接剂层形成用组合物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10388535B1 (en) * 2018-05-25 2019-08-20 Powertech Technology Inc. Wafer processing method with full edge trimming
JP7258489B2 (ja) * 2018-08-21 2023-04-17 株式会社岡本工作機械製作所 半導体装置の製造方法及び製造装置
JP7270373B2 (ja) * 2018-12-20 2023-05-10 株式会社岡本工作機械製作所 樹脂を含む複合基板の研削方法及び研削装置
KR102455146B1 (ko) * 2020-02-10 2022-10-17 주식회사 나노인 기판의 구조충진을 위한 가역적 코팅 방법 및 봉지 방법
CN115302345B (zh) * 2022-08-30 2024-03-15 福建融玻科技有限公司 一种防眩光玻璃显示屏薄板划痕修复平磨抛光机

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1536634A (zh) * 2003-04-08 2004-10-13 ������������ʽ���� 半导体晶片的制造方法
JP2005116610A (ja) * 2003-10-03 2005-04-28 Nitto Denko Corp 半導体ウエハの加工方法および半導体ウエハ加工用粘着シート
JP2010023119A (ja) * 2008-07-15 2010-02-04 Okamoto Machine Tool Works Ltd 半導体基板の平坦化装置および平坦化方法
US20100112909A1 (en) * 2008-02-22 2010-05-06 Nihon Micro Coating Co., Ltd. Method of and apparatus for abrading outer peripheral parts of a semiconductor wafer
CN103042449A (zh) * 2011-10-11 2013-04-17 株式会社迪思科 晶片磨削方法
JP2014053351A (ja) * 2012-09-05 2014-03-20 Disco Abrasive Syst Ltd ウエーハの加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109679A (ja) * 1991-10-15 1993-04-30 Nec Corp 半導体装置の製造方法
JP2004207459A (ja) * 2002-12-25 2004-07-22 Disco Abrasive Syst Ltd 半導体ウェーハの研削方法
JP4447280B2 (ja) * 2003-10-16 2010-04-07 リンテック株式会社 表面保護用シートおよび半導体ウエハの研削方法
JP4752384B2 (ja) * 2005-08-02 2011-08-17 株式会社東京精密 ウェーハ外周研削方法及びウェーハ外周研削装置
JP2012074545A (ja) * 2010-09-29 2012-04-12 Okamoto Machine Tool Works Ltd 保護フィルム貼付半導体基板の裏面研削方法
JP2013008915A (ja) * 2011-06-27 2013-01-10 Toshiba Corp 基板加工方法及び基板加工装置
JP5959188B2 (ja) * 2011-12-05 2016-08-02 株式会社ディスコ ウエーハの加工方法
JP2013247135A (ja) * 2012-05-23 2013-12-09 Disco Abrasive Syst Ltd ウエーハの加工方法
JP6057592B2 (ja) * 2012-08-06 2017-01-11 株式会社ディスコ ウエーハの加工方法
JP5827277B2 (ja) * 2013-08-02 2015-12-02 株式会社岡本工作機械製作所 半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1536634A (zh) * 2003-04-08 2004-10-13 ������������ʽ���� 半导体晶片的制造方法
JP2005116610A (ja) * 2003-10-03 2005-04-28 Nitto Denko Corp 半導体ウエハの加工方法および半導体ウエハ加工用粘着シート
US20100112909A1 (en) * 2008-02-22 2010-05-06 Nihon Micro Coating Co., Ltd. Method of and apparatus for abrading outer peripheral parts of a semiconductor wafer
JP2010023119A (ja) * 2008-07-15 2010-02-04 Okamoto Machine Tool Works Ltd 半導体基板の平坦化装置および平坦化方法
CN103042449A (zh) * 2011-10-11 2013-04-17 株式会社迪思科 晶片磨削方法
JP2014053351A (ja) * 2012-09-05 2014-03-20 Disco Abrasive Syst Ltd ウエーハの加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857601A (zh) * 2018-07-25 2018-11-23 浙江工业大学 钴基合金的光催化加工方法及其设备
CN115989110A (zh) * 2020-08-27 2023-04-18 富士胶片株式会社 经加工的基材的制造方法、半导体元件的制造方法、及临时粘接剂层形成用组合物

Also Published As

Publication number Publication date
JP2018049973A (ja) 2018-03-29
TW201814847A (zh) 2018-04-16
JP6850099B2 (ja) 2021-03-31
KR102466056B1 (ko) 2022-11-10
TWI746645B (zh) 2021-11-21
KR20180033088A (ko) 2018-04-02

Similar Documents

Publication Publication Date Title
TWI746645B (zh) 半導體裝置的製造方法和半導體製造裝置
KR102541126B1 (ko) 정전 흡착 척, 그 제조 방법 및 반도체 장치의 제조 방법
JP5671510B2 (ja) 半導体デバイス基板の研削方法
TWI822931B (zh) 包含樹脂的複合基板的磨削方法和磨削裝置
CN102848305B (zh) 被加工物的磨削方法
JP3924641B2 (ja) 半導体ウェーハの製造方法
TW201921460A (zh) 基板處理方法
JP2012204545A (ja) 半導体装置の製造方法および製造装置
CN110977754A (zh) 矩形基板的磨削方法
JP2015216281A (ja) 半導体基板の平坦化加工方法
JP5498857B2 (ja) ウェーハの加工方法
CN113400101A (zh) 磨削方法
JP7187113B2 (ja) 再生ウェーハの製造方法
JP2005103696A (ja) 研磨装置
JP6796978B2 (ja) 半導体装置の製造方法
CN111799218A (zh) 晶片的分割方法
CN111276397A (zh) 晶片的加工方法
JP6541476B2 (ja) ウェーハの研磨方法
KR101554815B1 (ko) 관통전극 웨이퍼 제조방법
JP7313775B2 (ja) ウェーハの加工方法
JP2013258203A (ja) ウェーハの加工方法
JP2014053357A (ja) ウエーハの加工方法
WO2001096065A1 (en) Method for polishing work
JP7680273B2 (ja) 研磨装置及び研磨方法
JP7166728B2 (ja) 被加工物の加工方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180403