CN107846786B - 布线基板的制造方法 - Google Patents

布线基板的制造方法 Download PDF

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Publication number
CN107846786B
CN107846786B CN201711315848.3A CN201711315848A CN107846786B CN 107846786 B CN107846786 B CN 107846786B CN 201711315848 A CN201711315848 A CN 201711315848A CN 107846786 B CN107846786 B CN 107846786B
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China
Prior art keywords
solder resist
resist layer
thickness
electronic component
connection pad
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CN201711315848.3A
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Chinese (zh)
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CN107846786A (zh
Inventor
丰田裕二
后闲宽彦
川合宣行
中川邦弘
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Mitsubishi Paper Mills Ltd
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Mitsubishi Paper Mills Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201711315848.3A 2013-06-14 2014-06-05 布线基板的制造方法 Active CN107846786B (zh)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
JP2013-125179 2013-06-14
JP2013125179 2013-06-14
JP2013-131839 2013-06-24
JP2013131839 2013-06-24
JP2013139706 2013-07-03
JP2013-139706 2013-07-03
JP2013150824 2013-07-19
JP2013-150824 2013-07-19
JP2013-150825 2013-07-19
JP2013150825 2013-07-19
JP2013-151335 2013-07-22
JP2013151335 2013-07-22
JP2014111574 2014-05-29
JP2014-111574 2014-05-29
CN201480033751.1A CN105309053B (zh) 2013-06-14 2014-06-05 布线基板的制造方法

Related Parent Applications (1)

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CN201480033751.1A Division CN105309053B (zh) 2013-06-14 2014-06-05 布线基板的制造方法

Publications (2)

Publication Number Publication Date
CN107846786A CN107846786A (zh) 2018-03-27
CN107846786B true CN107846786B (zh) 2021-03-05

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CN201711315848.3A Active CN107846786B (zh) 2013-06-14 2014-06-05 布线基板的制造方法
CN201711315868.0A Pending CN107809854A (zh) 2013-06-14 2014-06-05 布线基板的制造方法

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JP (3) JP6224531B2 (enExample)
KR (1) KR102082641B1 (enExample)
CN (3) CN105309053B (enExample)
TW (1) TWI700974B (enExample)
WO (1) WO2014199890A1 (enExample)

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JP2016012702A (ja) * 2014-06-30 2016-01-21 ファナック株式会社 ソルダコートの濡れ性と耐食性を両立させたプリント基板およびその製造方法
TWI645760B (zh) * 2017-10-27 2018-12-21 南亞電路板股份有限公司 電路板及其製造方法
CN108289388A (zh) * 2017-12-07 2018-07-17 江门崇达电路技术有限公司 一种预防上锡不良的pcb制作方法
JP7142604B2 (ja) * 2019-05-15 2022-09-27 日本特殊陶業株式会社 配線基板およびその製造方法
TWI731376B (zh) * 2019-07-22 2021-06-21 頎邦科技股份有限公司 具有粗化防焊層的軟質線路基板及其製造方法
JP7498550B2 (ja) * 2019-09-11 2024-06-12 太陽ホールディングス株式会社 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法
JP7498549B2 (ja) * 2019-09-11 2024-06-12 太陽ホールディングス株式会社 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法
JP2021163851A (ja) * 2020-03-31 2021-10-11 三菱製紙株式会社 ソルダーレジストパターンの形成方法
US12309941B2 (en) 2020-04-20 2025-05-20 Lg Innotek Co., Ltd. Circuit board
CN113747681B (zh) * 2020-05-27 2023-01-17 庆鼎精密电子（淮安）有限公司 嵌埋元件的软硬结合电路板及其制作方法
KR102870606B1 (ko) 2020-06-17 2025-10-15 엘지이노텍 주식회사 회로기판
US11551939B2 (en) * 2020-09-02 2023-01-10 Qualcomm Incorporated Substrate comprising interconnects embedded in a solder resist layer
KR102894228B1 (ko) 2020-09-22 2025-12-01 삼성전자 주식회사 인터포저 및 이를 포함하는 반도체 패키지
US12230562B2 (en) 2021-04-07 2025-02-18 Mediatek Inc. Three-dimensional pad structure and interconnection structure for electronic devices
TWI780783B (zh) * 2021-06-18 2022-10-11 大陸商律勝科技（蘇州）有限公司 印刷電路板之製造方法及具保護層之印刷電路板
CN114486887B (zh) * 2022-01-10 2025-09-23 珠海市龙昌电路科技有限公司 不同阻焊层厚度的无铅喷锡制程能力测试方法及管控方法
CN116801482B (zh) * 2022-03-18 2024-05-10 华为技术有限公司 电路板组件及其加工方法、电子设备
CN116113159A (zh) * 2022-12-30 2023-05-12 沪士电子股份有限公司 一种不变更叠层降低pcb板外层损耗方法
KR102674312B1 (ko) * 2023-01-13 2024-06-12 엘지이노텍 주식회사 반도체 패키지

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JPH11191670A (ja) * 1997-12-25 1999-07-13 Victor Co Of Japan Ltd プリント配線基板及びその製造方法
CN1717628A (zh) * 2003-11-11 2006-01-04 三菱化学株式会社 可固化组合物、固化产品、滤色器和液晶显示器件
CN103109588A (zh) * 2010-09-28 2013-05-15 三菱制纸株式会社 阻焊图案的形成方法

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JP5255545B2 (ja) 2009-09-29 2013-08-07 三菱製紙株式会社 ソルダーレジストの形成方法
KR101047139B1 (ko) * 2009-11-11 2011-07-07 삼성전기주식회사 단층 보드온칩 패키지 기판 및 그 제조방법
JP5444050B2 (ja) * 2010-03-12 2014-03-19 三菱製紙株式会社 ソルダーレジストパターンの形成方法
JP5830925B2 (ja) 2011-05-10 2015-12-09 日立化成株式会社 プリント配線板の製造方法
JP3182371U (ja) * 2012-02-10 2013-03-21 三菱製紙株式会社 レジスト層の薄膜化処理装置

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Publication number Priority date Publication date Assignee Title
JPH11191670A (ja) * 1997-12-25 1999-07-13 Victor Co Of Japan Ltd プリント配線基板及びその製造方法
CN1717628A (zh) * 2003-11-11 2006-01-04 三菱化学株式会社 可固化组合物、固化产品、滤色器和液晶显示器件
CN103109588A (zh) * 2010-09-28 2013-05-15 三菱制纸株式会社 阻焊图案的形成方法

Also Published As

Publication number Publication date
JP6224531B2 (ja) 2017-11-01
JP2017195380A (ja) 2017-10-26
CN105309053A (zh) 2016-02-03
TW201513758A (zh) 2015-04-01
KR102082641B1 (ko) 2020-02-28
CN105309053B (zh) 2018-03-09
TWI700974B (zh) 2020-08-01
JP2018139319A (ja) 2018-09-06
JP6514808B2 (ja) 2019-05-15
KR20160020407A (ko) 2016-02-23
CN107809854A (zh) 2018-03-16
WO2014199890A1 (ja) 2014-12-18
CN107846786A (zh) 2018-03-27
JP6416324B2 (ja) 2018-10-31
JP2016006809A (ja) 2016-01-14

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