CN1076272C - 含有增粘层的多层结构 - Google Patents
含有增粘层的多层结构 Download PDFInfo
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- CN1076272C CN1076272C CN96111302A CN96111302A CN1076272C CN 1076272 C CN1076272 C CN 1076272C CN 96111302 A CN96111302 A CN 96111302A CN 96111302 A CN96111302 A CN 96111302A CN 1076272 C CN1076272 C CN 1076272C
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- Prior art keywords
- layer
- sandwich construction
- adhesion promoting
- silane
- prepreg
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- 125000003545 alkoxy group Chemical group 0.000 claims description 14
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- 150000004985 diamines Chemical class 0.000 description 3
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- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- 125000003277 amino group Chemical group 0.000 description 1
- QDHUQRBYCVAWEN-UHFFFAOYSA-N amino prop-2-enoate Chemical group NOC(=O)C=C QDHUQRBYCVAWEN-UHFFFAOYSA-N 0.000 description 1
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- 238000006664 bond formation reaction Methods 0.000 description 1
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- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
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- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
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- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
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- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Reinforced Plastic Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US505,741 | 1995-07-24 | ||
| US505741 | 1995-07-24 | ||
| US08/505,741 US5614324A (en) | 1995-07-24 | 1995-07-24 | Multi-layer structures containing a silane adhesion promoting layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1145849A CN1145849A (zh) | 1997-03-26 |
| CN1076272C true CN1076272C (zh) | 2001-12-19 |
Family
ID=24011633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96111302A Expired - Fee Related CN1076272C (zh) | 1995-07-24 | 1996-07-23 | 含有增粘层的多层结构 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5614324A (OSRAM) |
| EP (1) | EP0756443B1 (OSRAM) |
| JP (2) | JP3163011B2 (OSRAM) |
| KR (1) | KR100276010B1 (OSRAM) |
| CN (1) | CN1076272C (OSRAM) |
| DE (1) | DE69625554T2 (OSRAM) |
| IN (1) | IN188605B (OSRAM) |
| TW (1) | TW440529B (OSRAM) |
Families Citing this family (24)
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| GB2328322A (en) * | 1997-08-12 | 1999-02-17 | Shipley Co Llc | Multilayer PCB manufacture with dielectric material matched to photo-resist material |
| US6284309B1 (en) | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
| US6174561B1 (en) | 1998-01-30 | 2001-01-16 | James M. Taylor | Composition and method for priming substrate materials |
| US6555170B2 (en) | 1998-01-30 | 2003-04-29 | Duratech Industries, Inc. | Pre-plate treating system |
| US6413923B2 (en) * | 1999-11-15 | 2002-07-02 | Arch Specialty Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
| EP1342395A2 (en) * | 2000-08-15 | 2003-09-10 | WORLD PROPERTIES, INC, an Illinois Corporation | Multi-layer circuits and methods of manufacture thereof |
| JP2002064277A (ja) * | 2000-08-22 | 2002-02-28 | Ibiden Co Ltd | 多層プリント配線板および多層プリント配線板の製造方法 |
| JP2002084073A (ja) * | 2000-09-07 | 2002-03-22 | Ibiden Co Ltd | 多層プリント配線板および多層プリント配線板の製造方法 |
| US20050208278A1 (en) * | 2001-08-22 | 2005-09-22 | Landi Vincent R | Method for improving bonding of circuit substrates to metal and articles formed thereby |
| JP2005502192A (ja) * | 2001-08-22 | 2005-01-20 | ワールド プロパティーズ インク． | 回路基板の金属への接着を改善する方法及びその方法で製作された物品 |
| JP4298943B2 (ja) * | 2001-10-18 | 2009-07-22 | 日鉱金属株式会社 | 銅箔表面処理剤 |
| CN100376386C (zh) * | 2001-11-01 | 2008-03-26 | 荒川化学工业株式会社 | 聚酰亚胺-金属层压体和聚酰胺酰亚胺-金属层压体 |
| CN1910041B (zh) * | 2004-01-13 | 2012-11-07 | 宇部兴产株式会社 | 聚酰亚胺-金属层压体和聚酰亚胺电路板 |
| DE102004005824A1 (de) * | 2004-02-06 | 2005-08-25 | Degussa Ag | Organosiliciumeinheiten enthaltende Zubereitung auf Acrylatbasis, deren Herstellung und deren Verwendung |
| EP1978024A1 (en) * | 2007-04-04 | 2008-10-08 | Atotech Deutschland Gmbh | Silane compositions comprising novel crosslinking agents |
| WO2010107534A1 (en) * | 2009-03-20 | 2010-09-23 | Dow Global Technologies Inc. | Multilayer structure and method of making the same |
| CN101917826B (zh) * | 2010-08-03 | 2013-08-21 | 东莞市仁吉电子材料有限公司 | 印刷电路板基板中,增加导电体与非导电高分子介电层之间结合力的方法 |
| CN104073176B (zh) * | 2013-03-25 | 2015-10-14 | 中国石油天然气集团公司 | 一种提高三层聚乙烯涂层和液体补口涂层粘结性的方法 |
| CN104073175B (zh) * | 2013-03-25 | 2016-03-09 | 中国石油天然气集团公司 | 一种聚氨酯涂层与三层聚乙烯涂层化学键粘结的方法 |
| EP2857407B1 (en) * | 2013-10-03 | 2017-02-01 | Shin-Etsu Chemical Co., Ltd. | Organosilicon compound, making method, adhesive composition, and article |
| JP6523942B2 (ja) * | 2014-12-19 | 2019-06-05 | 四国化成工業株式会社 | 無機材料または樹脂材料の表面処理液、表面処理方法およびその利用 |
| DE102014119576A1 (de) * | 2014-12-23 | 2016-06-23 | Ernst-Moritz-Arndt-Universität Greifswald | Pharmazeutische Arzneimittelform zur Applikation auf Schleimhäuten |
| CN106626580B (zh) | 2015-10-28 | 2019-12-24 | 财团法人工业技术研究院 | 复合积层板 |
| CN109479377A (zh) * | 2016-05-18 | 2019-03-15 | 伊索拉美国有限公司 | 电路板的制造方法 |
Citations (4)
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| JPS6177535A (ja) * | 1984-09-25 | 1986-04-21 | Niles Parts Co Ltd | 車両用定速走行装置 |
| EP0353766A2 (en) * | 1988-08-04 | 1990-02-07 | The B.F. Goodrich Company | Polynorbornene laminates |
| US4923734A (en) * | 1988-12-23 | 1990-05-08 | The B. F. Goodrich Company | Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers |
| CN1089213A (zh) * | 1988-12-23 | 1994-07-13 | B.F.谷德里奇公司 | 聚降冰片烯半固化片层压到导电表面上的层压板 |
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| US3508983A (en) * | 1967-04-24 | 1970-04-28 | Schjeldahl Co G T | Use of a silane coating to bond copper to plastic in making a printed circuit |
| US3708458A (en) * | 1971-03-16 | 1973-01-02 | Upjohn Co | Copolyimides of benzophenone tetracarboxylic acid dianhydride and mixture of diisocyanates |
| JPS56111289A (en) * | 1980-02-07 | 1981-09-02 | Fujitsu Ltd | Method of manufacturing copperrlined laminate |
| DE3208198A1 (de) * | 1982-03-06 | 1983-09-08 | Nippon Denkai Co., Ltd., Tokyo | Verfahren zur verbindung von kupferfolie mit laminat-formmaterial |
| JPS6094348A (ja) * | 1983-10-28 | 1985-05-27 | 松下電工株式会社 | 銅張積層板の製法 |
| US4624978A (en) * | 1983-11-14 | 1986-11-25 | Rogers Corporation | High temperature polyimide processing aid |
| JPH062828B2 (ja) * | 1986-05-15 | 1994-01-12 | 宇部興産株式会社 | ポリイミドフイルムの製造法 |
| US4902731A (en) * | 1986-08-27 | 1990-02-20 | Hercules Incorporated | Organosilicon prepolymers |
| US4732858A (en) * | 1986-09-17 | 1988-03-22 | Brewer Science, Inc. | Adhesion promoting product and process for treating an integrated circuit substrate |
| US5189128A (en) * | 1988-06-20 | 1993-02-23 | Ciba-Geigy Corporation | Solution stable polyimide resin systems |
| US4923678A (en) * | 1989-02-14 | 1990-05-08 | The B. F. Goodrich Company | Low dielectric constant prepreg based on blends of polynorbornene and polyolefins derived form C2 -C4 monomers |
| JPH07120564B2 (ja) * | 1989-10-02 | 1995-12-20 | 日本電解株式会社 | 抵抗層付導電材料及び抵抗層付プリント回路基板 |
| US5145937A (en) * | 1989-11-09 | 1992-09-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polyimides with carbonyl and ether connecting groups between the aromatic rings |
| US5227244A (en) * | 1990-09-21 | 1993-07-13 | E. I. Du Pont De Nemours And Company | Polyimide film with metal salt coating resulting in improved adhesion |
| US5114757A (en) * | 1990-10-26 | 1992-05-19 | Linde Harold G | Enhancement of polyimide adhesion on reactive metals |
| JPH0539295A (ja) * | 1991-08-02 | 1993-02-19 | Nikko Kyodo Co Ltd | 金属表面処理剤 |
| JPH06177535A (ja) * | 1992-12-09 | 1994-06-24 | Japan Energy Corp | 金属表面処理剤 |
| JPH06177536A (ja) * | 1992-12-09 | 1994-06-24 | Japan Energy Corp | 金属表面処理剤 |
-
1995
- 1995-07-24 US US08/505,741 patent/US5614324A/en not_active Expired - Lifetime
-
1996
- 1996-05-30 IN IN987CA1996 patent/IN188605B/en unknown
- 1996-06-11 TW TW085106999A patent/TW440529B/zh not_active IP Right Cessation
- 1996-07-10 JP JP18103496A patent/JP3163011B2/ja not_active Expired - Fee Related
- 1996-07-22 EP EP96305356A patent/EP0756443B1/en not_active Expired - Lifetime
- 1996-07-22 DE DE69625554T patent/DE69625554T2/de not_active Expired - Fee Related
- 1996-07-23 KR KR1019960029661A patent/KR100276010B1/ko not_active Expired - Fee Related
- 1996-07-23 CN CN96111302A patent/CN1076272C/zh not_active Expired - Fee Related
-
2000
- 2000-05-15 JP JP2000142378A patent/JP2001030428A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6177535A (ja) * | 1984-09-25 | 1986-04-21 | Niles Parts Co Ltd | 車両用定速走行装置 |
| EP0353766A2 (en) * | 1988-08-04 | 1990-02-07 | The B.F. Goodrich Company | Polynorbornene laminates |
| US4923734A (en) * | 1988-12-23 | 1990-05-08 | The B. F. Goodrich Company | Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers |
| CN1089213A (zh) * | 1988-12-23 | 1994-07-13 | B.F.谷德里奇公司 | 聚降冰片烯半固化片层压到导电表面上的层压板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3163011B2 (ja) | 2001-05-08 |
| IN188605B (OSRAM) | 2002-10-19 |
| US5614324A (en) | 1997-03-25 |
| KR100276010B1 (ko) | 2000-12-15 |
| EP0756443A1 (en) | 1997-01-29 |
| TW440529B (en) | 2001-06-16 |
| JP2001030428A (ja) | 2001-02-06 |
| KR970009483A (ko) | 1997-02-24 |
| CN1145849A (zh) | 1997-03-26 |
| DE69625554T2 (de) | 2003-11-20 |
| JPH0939152A (ja) | 1997-02-10 |
| EP0756443B1 (en) | 2003-01-02 |
| DE69625554D1 (de) | 2003-02-06 |
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Granted publication date: 20011219 Termination date: 20100723 |