JP3163011B2 - 接着増進層を含む多層構造体 - Google Patents
接着増進層を含む多層構造体Info
- Publication number
- JP3163011B2 JP3163011B2 JP18103496A JP18103496A JP3163011B2 JP 3163011 B2 JP3163011 B2 JP 3163011B2 JP 18103496 A JP18103496 A JP 18103496A JP 18103496 A JP18103496 A JP 18103496A JP 3163011 B2 JP3163011 B2 JP 3163011B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- layer
- silane
- multilayer structure
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- QDHUQRBYCVAWEN-UHFFFAOYSA-N amino prop-2-enoate Chemical group NOC(=O)C=C QDHUQRBYCVAWEN-UHFFFAOYSA-N 0.000 description 9
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- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000002335 surface treatment layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- LTOKKZDSYQQAHL-UHFFFAOYSA-N trimethoxy-[4-(oxiran-2-yl)butyl]silane Chemical compound CO[Si](OC)(OC)CCCCC1CO1 LTOKKZDSYQQAHL-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Reinforced Plastic Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/505,741 | 1995-07-24 | ||
| US08/505,741 US5614324A (en) | 1995-07-24 | 1995-07-24 | Multi-layer structures containing a silane adhesion promoting layer |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000142378A Division JP2001030428A (ja) | 1995-07-24 | 2000-05-15 | 接着増進層を含む多層構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0939152A JPH0939152A (ja) | 1997-02-10 |
| JP3163011B2 true JP3163011B2 (ja) | 2001-05-08 |
Family
ID=24011633
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18103496A Expired - Fee Related JP3163011B2 (ja) | 1995-07-24 | 1996-07-10 | 接着増進層を含む多層構造体 |
| JP2000142378A Pending JP2001030428A (ja) | 1995-07-24 | 2000-05-15 | 接着増進層を含む多層構造体 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000142378A Pending JP2001030428A (ja) | 1995-07-24 | 2000-05-15 | 接着増進層を含む多層構造体 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5614324A (OSRAM) |
| EP (1) | EP0756443B1 (OSRAM) |
| JP (2) | JP3163011B2 (OSRAM) |
| KR (1) | KR100276010B1 (OSRAM) |
| CN (1) | CN1076272C (OSRAM) |
| DE (1) | DE69625554T2 (OSRAM) |
| IN (1) | IN188605B (OSRAM) |
| TW (1) | TW440529B (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170107449A (ko) * | 2014-12-23 | 2017-09-25 | 에른스트-모리츠-아른츠 유니버시태트 그레이프스발트 | 점막에 적용하기 위한 약제학적 제형 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2328322A (en) * | 1997-08-12 | 1999-02-17 | Shipley Co Llc | Multilayer PCB manufacture with dielectric material matched to photo-resist material |
| US6284309B1 (en) | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
| US6174561B1 (en) | 1998-01-30 | 2001-01-16 | James M. Taylor | Composition and method for priming substrate materials |
| US6555170B2 (en) | 1998-01-30 | 2003-04-29 | Duratech Industries, Inc. | Pre-plate treating system |
| US6413923B2 (en) * | 1999-11-15 | 2002-07-02 | Arch Specialty Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
| EP1342395A2 (en) * | 2000-08-15 | 2003-09-10 | WORLD PROPERTIES, INC, an Illinois Corporation | Multi-layer circuits and methods of manufacture thereof |
| JP2002064277A (ja) * | 2000-08-22 | 2002-02-28 | Ibiden Co Ltd | 多層プリント配線板および多層プリント配線板の製造方法 |
| JP2002084073A (ja) * | 2000-09-07 | 2002-03-22 | Ibiden Co Ltd | 多層プリント配線板および多層プリント配線板の製造方法 |
| US20050208278A1 (en) * | 2001-08-22 | 2005-09-22 | Landi Vincent R | Method for improving bonding of circuit substrates to metal and articles formed thereby |
| JP2005502192A (ja) * | 2001-08-22 | 2005-01-20 | ワールド プロパティーズ インク． | 回路基板の金属への接着を改善する方法及びその方法で製作された物品 |
| JP4298943B2 (ja) * | 2001-10-18 | 2009-07-22 | 日鉱金属株式会社 | 銅箔表面処理剤 |
| CN100376386C (zh) * | 2001-11-01 | 2008-03-26 | 荒川化学工业株式会社 | 聚酰亚胺-金属层压体和聚酰胺酰亚胺-金属层压体 |
| CN1910041B (zh) * | 2004-01-13 | 2012-11-07 | 宇部兴产株式会社 | 聚酰亚胺-金属层压体和聚酰亚胺电路板 |
| DE102004005824A1 (de) * | 2004-02-06 | 2005-08-25 | Degussa Ag | Organosiliciumeinheiten enthaltende Zubereitung auf Acrylatbasis, deren Herstellung und deren Verwendung |
| EP1978024A1 (en) * | 2007-04-04 | 2008-10-08 | Atotech Deutschland Gmbh | Silane compositions comprising novel crosslinking agents |
| WO2010107534A1 (en) * | 2009-03-20 | 2010-09-23 | Dow Global Technologies Inc. | Multilayer structure and method of making the same |
| CN101917826B (zh) * | 2010-08-03 | 2013-08-21 | 东莞市仁吉电子材料有限公司 | 印刷电路板基板中,增加导电体与非导电高分子介电层之间结合力的方法 |
| CN104073176B (zh) * | 2013-03-25 | 2015-10-14 | 中国石油天然气集团公司 | 一种提高三层聚乙烯涂层和液体补口涂层粘结性的方法 |
| CN104073175B (zh) * | 2013-03-25 | 2016-03-09 | 中国石油天然气集团公司 | 一种聚氨酯涂层与三层聚乙烯涂层化学键粘结的方法 |
| EP2857407B1 (en) * | 2013-10-03 | 2017-02-01 | Shin-Etsu Chemical Co., Ltd. | Organosilicon compound, making method, adhesive composition, and article |
| JP6523942B2 (ja) * | 2014-12-19 | 2019-06-05 | 四国化成工業株式会社 | 無機材料または樹脂材料の表面処理液、表面処理方法およびその利用 |
| CN106626580B (zh) | 2015-10-28 | 2019-12-24 | 财团法人工业技术研究院 | 复合积层板 |
| CN109479377A (zh) * | 2016-05-18 | 2019-03-15 | 伊索拉美国有限公司 | 电路板的制造方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3508983A (en) * | 1967-04-24 | 1970-04-28 | Schjeldahl Co G T | Use of a silane coating to bond copper to plastic in making a printed circuit |
| US3708458A (en) * | 1971-03-16 | 1973-01-02 | Upjohn Co | Copolyimides of benzophenone tetracarboxylic acid dianhydride and mixture of diisocyanates |
| JPS56111289A (en) * | 1980-02-07 | 1981-09-02 | Fujitsu Ltd | Method of manufacturing copperrlined laminate |
| DE3208198A1 (de) * | 1982-03-06 | 1983-09-08 | Nippon Denkai Co., Ltd., Tokyo | Verfahren zur verbindung von kupferfolie mit laminat-formmaterial |
| JPS6094348A (ja) * | 1983-10-28 | 1985-05-27 | 松下電工株式会社 | 銅張積層板の製法 |
| US4624978A (en) * | 1983-11-14 | 1986-11-25 | Rogers Corporation | High temperature polyimide processing aid |
| JPS6177535A (ja) * | 1984-09-25 | 1986-04-21 | Niles Parts Co Ltd | 車両用定速走行装置 |
| JPH062828B2 (ja) * | 1986-05-15 | 1994-01-12 | 宇部興産株式会社 | ポリイミドフイルムの製造法 |
| US4902731A (en) * | 1986-08-27 | 1990-02-20 | Hercules Incorporated | Organosilicon prepolymers |
| US4732858A (en) * | 1986-09-17 | 1988-03-22 | Brewer Science, Inc. | Adhesion promoting product and process for treating an integrated circuit substrate |
| US5189128A (en) * | 1988-06-20 | 1993-02-23 | Ciba-Geigy Corporation | Solution stable polyimide resin systems |
| US4910077A (en) * | 1988-08-04 | 1990-03-20 | B.F. Goodrich Company | Polynorbornene laminates and method of making the same |
| US4923678A (en) * | 1989-02-14 | 1990-05-08 | The B. F. Goodrich Company | Low dielectric constant prepreg based on blends of polynorbornene and polyolefins derived form C2 -C4 monomers |
| MX166210B (es) * | 1988-12-23 | 1992-12-23 | Goodrich Co B F | Procedimiento para obtener un laminado y el laminado asi obtenido |
| US4923734A (en) * | 1988-12-23 | 1990-05-08 | The B. F. Goodrich Company | Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers |
| JPH07120564B2 (ja) * | 1989-10-02 | 1995-12-20 | 日本電解株式会社 | 抵抗層付導電材料及び抵抗層付プリント回路基板 |
| US5145937A (en) * | 1989-11-09 | 1992-09-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polyimides with carbonyl and ether connecting groups between the aromatic rings |
| US5227244A (en) * | 1990-09-21 | 1993-07-13 | E. I. Du Pont De Nemours And Company | Polyimide film with metal salt coating resulting in improved adhesion |
| US5114757A (en) * | 1990-10-26 | 1992-05-19 | Linde Harold G | Enhancement of polyimide adhesion on reactive metals |
| JPH0539295A (ja) * | 1991-08-02 | 1993-02-19 | Nikko Kyodo Co Ltd | 金属表面処理剤 |
| JPH06177535A (ja) * | 1992-12-09 | 1994-06-24 | Japan Energy Corp | 金属表面処理剤 |
| JPH06177536A (ja) * | 1992-12-09 | 1994-06-24 | Japan Energy Corp | 金属表面処理剤 |
-
1995
- 1995-07-24 US US08/505,741 patent/US5614324A/en not_active Expired - Lifetime
-
1996
- 1996-05-30 IN IN987CA1996 patent/IN188605B/en unknown
- 1996-06-11 TW TW085106999A patent/TW440529B/zh not_active IP Right Cessation
- 1996-07-10 JP JP18103496A patent/JP3163011B2/ja not_active Expired - Fee Related
- 1996-07-22 EP EP96305356A patent/EP0756443B1/en not_active Expired - Lifetime
- 1996-07-22 DE DE69625554T patent/DE69625554T2/de not_active Expired - Fee Related
- 1996-07-23 KR KR1019960029661A patent/KR100276010B1/ko not_active Expired - Fee Related
- 1996-07-23 CN CN96111302A patent/CN1076272C/zh not_active Expired - Fee Related
-
2000
- 2000-05-15 JP JP2000142378A patent/JP2001030428A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170107449A (ko) * | 2014-12-23 | 2017-09-25 | 에른스트-모리츠-아른츠 유니버시태트 그레이프스발트 | 점막에 적용하기 위한 약제학적 제형 |
Also Published As
| Publication number | Publication date |
|---|---|
| IN188605B (OSRAM) | 2002-10-19 |
| US5614324A (en) | 1997-03-25 |
| CN1076272C (zh) | 2001-12-19 |
| KR100276010B1 (ko) | 2000-12-15 |
| EP0756443A1 (en) | 1997-01-29 |
| TW440529B (en) | 2001-06-16 |
| JP2001030428A (ja) | 2001-02-06 |
| KR970009483A (ko) | 1997-02-24 |
| CN1145849A (zh) | 1997-03-26 |
| DE69625554T2 (de) | 2003-11-20 |
| JPH0939152A (ja) | 1997-02-10 |
| EP0756443B1 (en) | 2003-01-02 |
| DE69625554D1 (de) | 2003-02-06 |
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