CN107561855A - 模具、压印方法、压印装置和用于制造半导体制品的方法 - Google Patents

模具、压印方法、压印装置和用于制造半导体制品的方法 Download PDF

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Publication number
CN107561855A
CN107561855A CN201710506145.2A CN201710506145A CN107561855A CN 107561855 A CN107561855 A CN 107561855A CN 201710506145 A CN201710506145 A CN 201710506145A CN 107561855 A CN107561855 A CN 107561855A
Authority
CN
China
Prior art keywords
light
pattern
mold
substrate
mould
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710506145.2A
Other languages
English (en)
Chinese (zh)
Inventor
筱田健郎
筱田健一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN107561855A publication Critical patent/CN107561855A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
CN201710506145.2A 2016-06-30 2017-06-28 模具、压印方法、压印装置和用于制造半导体制品的方法 Pending CN107561855A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016130918A JP6748496B2 (ja) 2016-06-30 2016-06-30 モールド、インプリント方法、インプリント装置および物品製造方法
JP2016-130918 2016-06-30

Publications (1)

Publication Number Publication Date
CN107561855A true CN107561855A (zh) 2018-01-09

Family

ID=60806962

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710506145.2A Pending CN107561855A (zh) 2016-06-30 2017-06-28 模具、压印方法、压印装置和用于制造半导体制品的方法

Country Status (6)

Country Link
US (1) US20180004091A1 (https=)
JP (1) JP6748496B2 (https=)
KR (1) KR102280003B1 (https=)
CN (1) CN107561855A (https=)
SG (1) SG10201704389PA (https=)
TW (1) TWI643019B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108445711A (zh) * 2018-03-13 2018-08-24 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6815894B2 (ja) * 2017-02-27 2021-01-20 株式会社ディスコ 静電チャックテーブルの使用方法
US11281095B2 (en) 2018-12-05 2022-03-22 Canon Kabushiki Kaisha Frame curing template and system and method of using the frame curing template
JP2021027107A (ja) 2019-08-01 2021-02-22 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7374666B2 (ja) * 2019-08-29 2023-11-07 キヤノン株式会社 インプリント方法、前処理装置、インプリント用基板、および基板の製造方法
JP7346268B2 (ja) * 2019-12-05 2023-09-19 キヤノン株式会社 インプリント用のテンプレート、テンプレートを用いたインプリント方法
JP7465146B2 (ja) * 2020-05-12 2024-04-10 キヤノン株式会社 インプリント方法、インプリント装置、判定方法及び物品の製造方法
CN117761966A (zh) * 2020-07-01 2024-03-26 吉佳蓝科技股份有限公司 纳米压印用复制模制作装置
US11747731B2 (en) 2020-11-20 2023-09-05 Canon Kabishiki Kaisha Curing a shaped film using multiple images of a spatial light modulator
JP7710313B2 (ja) 2021-05-27 2025-07-18 キヤノン株式会社 モールド、インプリント装置、および物品の製造方法
TWI872651B (zh) * 2023-08-18 2025-02-11 光群雷射科技股份有限公司 組版式壓印設備

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200918289A (en) * 2007-07-17 2009-05-01 Dainippon Printing Co Ltd Imprint mold
CN101600993A (zh) * 2007-02-06 2009-12-09 佳能株式会社 刻印方法和刻印装置
CN104281003A (zh) * 2013-07-11 2015-01-14 佳能株式会社 压印装置以及物品的制造方法
JP2015144193A (ja) * 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
WO2016006592A1 (ja) * 2014-07-08 2016-01-14 綜研化学株式会社 ステップアンドリピート用インプリント用モールド及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3410089B2 (ja) * 1991-11-13 2003-05-26 株式会社東芝 露光用マスクの製造方法及び露光方法
JP4799575B2 (ja) * 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
JP5257225B2 (ja) * 2009-04-28 2013-08-07 大日本印刷株式会社 ナノインプリント用モールドおよびその製造方法
JP5531702B2 (ja) * 2010-03-23 2014-06-25 旭硝子株式会社 遮光膜付ガラス基板および液晶表示装置
JP6029494B2 (ja) * 2012-03-12 2016-11-24 キヤノン株式会社 インプリント方法およびインプリント装置、それを用いた物品の製造方法
WO2014115728A1 (ja) * 2013-01-24 2014-07-31 綜研化学株式会社 光透過型インプリント用モールド、大面積モールドの製造方法
JP6368075B2 (ja) * 2013-06-26 2018-08-01 キヤノン株式会社 モールド
JP6097704B2 (ja) * 2014-01-06 2017-03-15 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP5900589B2 (ja) * 2014-12-12 2016-04-06 大日本印刷株式会社 インプリント用モールド、アライメント方法、インプリント方法、およびインプリント装置
JP2016028442A (ja) * 2015-10-08 2016-02-25 大日本印刷株式会社 テンプレート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101600993A (zh) * 2007-02-06 2009-12-09 佳能株式会社 刻印方法和刻印装置
TW200918289A (en) * 2007-07-17 2009-05-01 Dainippon Printing Co Ltd Imprint mold
CN104281003A (zh) * 2013-07-11 2015-01-14 佳能株式会社 压印装置以及物品的制造方法
JP2015144193A (ja) * 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
WO2016006592A1 (ja) * 2014-07-08 2016-01-14 綜研化学株式会社 ステップアンドリピート用インプリント用モールド及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108445711A (zh) * 2018-03-13 2018-08-24 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置

Also Published As

Publication number Publication date
US20180004091A1 (en) 2018-01-04
SG10201704389PA (en) 2018-01-30
KR102280003B1 (ko) 2021-07-21
TW201802578A (zh) 2018-01-16
TWI643019B (zh) 2018-12-01
KR20180003437A (ko) 2018-01-09
JP6748496B2 (ja) 2020-09-02
JP2018006553A (ja) 2018-01-11

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