SG10201704389PA - Mold, imprinting method, imprint apparatus, and method for manufacturing a semiconductor article - Google Patents
Mold, imprinting method, imprint apparatus, and method for manufacturing a semiconductor articleInfo
- Publication number
- SG10201704389PA SG10201704389PA SG10201704389PA SG10201704389PA SG10201704389PA SG 10201704389P A SG10201704389P A SG 10201704389PA SG 10201704389P A SG10201704389P A SG 10201704389PA SG 10201704389P A SG10201704389P A SG 10201704389PA SG 10201704389P A SG10201704389P A SG 10201704389PA
- Authority
- SG
- Singapore
- Prior art keywords
- mold
- manufacturing
- imprint apparatus
- semiconductor article
- imprinting
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/016—Manufacture or treatment using moulds
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016130918A JP6748496B2 (ja) | 2016-06-30 | 2016-06-30 | モールド、インプリント方法、インプリント装置および物品製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201704389PA true SG10201704389PA (en) | 2018-01-30 |
Family
ID=60806962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201704389PA SG10201704389PA (en) | 2016-06-30 | 2017-05-30 | Mold, imprinting method, imprint apparatus, and method for manufacturing a semiconductor article |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20180004091A1 (https=) |
| JP (1) | JP6748496B2 (https=) |
| KR (1) | KR102280003B1 (https=) |
| CN (1) | CN107561855A (https=) |
| SG (1) | SG10201704389PA (https=) |
| TW (1) | TWI643019B (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6815894B2 (ja) * | 2017-02-27 | 2021-01-20 | 株式会社ディスコ | 静電チャックテーブルの使用方法 |
| CN108445711A (zh) * | 2018-03-13 | 2018-08-24 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
| US11281095B2 (en) | 2018-12-05 | 2022-03-22 | Canon Kabushiki Kaisha | Frame curing template and system and method of using the frame curing template |
| JP2021027107A (ja) | 2019-08-01 | 2021-02-22 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| JP7374666B2 (ja) * | 2019-08-29 | 2023-11-07 | キヤノン株式会社 | インプリント方法、前処理装置、インプリント用基板、および基板の製造方法 |
| JP7346268B2 (ja) * | 2019-12-05 | 2023-09-19 | キヤノン株式会社 | インプリント用のテンプレート、テンプレートを用いたインプリント方法 |
| JP7465146B2 (ja) * | 2020-05-12 | 2024-04-10 | キヤノン株式会社 | インプリント方法、インプリント装置、判定方法及び物品の製造方法 |
| CN117761966A (zh) * | 2020-07-01 | 2024-03-26 | 吉佳蓝科技股份有限公司 | 纳米压印用复制模制作装置 |
| US11747731B2 (en) | 2020-11-20 | 2023-09-05 | Canon Kabishiki Kaisha | Curing a shaped film using multiple images of a spatial light modulator |
| JP7710313B2 (ja) | 2021-05-27 | 2025-07-18 | キヤノン株式会社 | モールド、インプリント装置、および物品の製造方法 |
| TWI872651B (zh) * | 2023-08-18 | 2025-02-11 | 光群雷射科技股份有限公司 | 組版式壓印設備 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3410089B2 (ja) * | 1991-11-13 | 2003-05-26 | 株式会社東芝 | 露光用マスクの製造方法及び露光方法 |
| US9573319B2 (en) * | 2007-02-06 | 2017-02-21 | Canon Kabushiki Kaisha | Imprinting method and process for producing a member in which a mold contacts a pattern forming layer |
| JP5182470B2 (ja) | 2007-07-17 | 2013-04-17 | 大日本印刷株式会社 | インプリントモールド |
| JP4799575B2 (ja) * | 2008-03-06 | 2011-10-26 | 株式会社東芝 | インプリント方法 |
| JP5257225B2 (ja) * | 2009-04-28 | 2013-08-07 | 大日本印刷株式会社 | ナノインプリント用モールドおよびその製造方法 |
| JP5531702B2 (ja) * | 2010-03-23 | 2014-06-25 | 旭硝子株式会社 | 遮光膜付ガラス基板および液晶表示装置 |
| JP6029494B2 (ja) * | 2012-03-12 | 2016-11-24 | キヤノン株式会社 | インプリント方法およびインプリント装置、それを用いた物品の製造方法 |
| WO2014115728A1 (ja) * | 2013-01-24 | 2014-07-31 | 綜研化学株式会社 | 光透過型インプリント用モールド、大面積モールドの製造方法 |
| JP6368075B2 (ja) * | 2013-06-26 | 2018-08-01 | キヤノン株式会社 | モールド |
| JP5909210B2 (ja) * | 2013-07-11 | 2016-04-26 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| JP6097704B2 (ja) * | 2014-01-06 | 2017-03-15 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| JP2015144193A (ja) * | 2014-01-31 | 2015-08-06 | 株式会社東芝 | インプリント方法、テンプレートおよびインプリント装置 |
| TWI662591B (zh) * | 2014-07-08 | 2019-06-11 | Soken Chemical & Engineering Co., Ltd. | 使用分步重複用壓印用模具的分步重複壓印方法、及分步重複用壓印用模具之製造方法 |
| JP5900589B2 (ja) * | 2014-12-12 | 2016-04-06 | 大日本印刷株式会社 | インプリント用モールド、アライメント方法、インプリント方法、およびインプリント装置 |
| JP2016028442A (ja) * | 2015-10-08 | 2016-02-25 | 大日本印刷株式会社 | テンプレート |
-
2016
- 2016-06-30 JP JP2016130918A patent/JP6748496B2/ja not_active Expired - Fee Related
-
2017
- 2017-05-30 SG SG10201704389PA patent/SG10201704389PA/en unknown
- 2017-06-09 TW TW106119300A patent/TWI643019B/zh not_active IP Right Cessation
- 2017-06-22 US US15/630,600 patent/US20180004091A1/en not_active Abandoned
- 2017-06-22 KR KR1020170078955A patent/KR102280003B1/ko not_active Expired - Fee Related
- 2017-06-28 CN CN201710506145.2A patent/CN107561855A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20180004091A1 (en) | 2018-01-04 |
| KR102280003B1 (ko) | 2021-07-21 |
| CN107561855A (zh) | 2018-01-09 |
| TW201802578A (zh) | 2018-01-16 |
| TWI643019B (zh) | 2018-12-01 |
| KR20180003437A (ko) | 2018-01-09 |
| JP6748496B2 (ja) | 2020-09-02 |
| JP2018006553A (ja) | 2018-01-11 |
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