CN1075378A - 厚膜铜浆组合物 - Google Patents

厚膜铜浆组合物 Download PDF

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Publication number
CN1075378A
CN1075378A CN92114433A CN92114433A CN1075378A CN 1075378 A CN1075378 A CN 1075378A CN 92114433 A CN92114433 A CN 92114433A CN 92114433 A CN92114433 A CN 92114433A CN 1075378 A CN1075378 A CN 1075378A
Authority
CN
China
Prior art keywords
copper
sheet
composition
particle
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN92114433A
Other languages
English (en)
Chinese (zh)
Inventor
巴里·爱德华·泰勒
土屋元彦
冈部千惠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN1075378A publication Critical patent/CN1075378A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN92114433A 1991-12-13 1992-12-12 厚膜铜浆组合物 Pending CN1075378A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35234791A JP3507084B2 (ja) 1991-12-13 1991-12-13 銅導体組成物
JP352347/91 1991-12-13

Publications (1)

Publication Number Publication Date
CN1075378A true CN1075378A (zh) 1993-08-18

Family

ID=18423439

Family Applications (1)

Application Number Title Priority Date Filing Date
CN92114433A Pending CN1075378A (zh) 1991-12-13 1992-12-12 厚膜铜浆组合物

Country Status (5)

Country Link
EP (1) EP0546560A1 (cg-RX-API-DMAC7.html)
JP (1) JP3507084B2 (cg-RX-API-DMAC7.html)
KR (1) KR930012181A (cg-RX-API-DMAC7.html)
CN (1) CN1075378A (cg-RX-API-DMAC7.html)
TW (1) TW245801B (cg-RX-API-DMAC7.html)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100397530C (zh) * 2001-12-04 2008-06-25 川铁矿业株式会社 导电浆料用铜合金粉末
CN101283414B (zh) * 2005-09-09 2011-09-14 巴斯夫欧洲公司 施加金属层用的含有两种不同金属的分散体
CN102467989A (zh) * 2010-11-15 2012-05-23 第一毛织株式会社 导电浆料组合物以及包含其的电极
CN103310870A (zh) * 2012-03-12 2013-09-18 深圳市圣龙特电子有限公司 一种硅太阳能电池电极用无铅铜浆及其制备方法
CN104271300A (zh) * 2012-05-04 2015-01-07 Ab微电子有限公司 用于制备金属化的由铝组成的基材的方法
TWI593765B (zh) * 2012-09-10 2017-08-01 賀利氏貴金屬北美康舍霍肯有限責任公司 低燒製溫度之銅組合物
CN111761050A (zh) * 2019-04-01 2020-10-13 广州力及热管理科技有限公司 以金属浆料制作毛细结构的方法
CN117529786A (zh) * 2021-06-24 2024-02-06 杜邦中国有限公司 包含铜颗粒的导电浆料及其生产电子元件的用途

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990022214A (ko) * 1995-06-06 1999-03-25 윌리암 제이. 버크 미세 전기도관 제조방법
JP5971250B2 (ja) 2011-08-03 2016-08-17 日立化成株式会社 組成物セット、導電性基板及びその製造方法並びに導電性接着材組成物
KR101411012B1 (ko) * 2011-11-25 2014-06-24 제일모직주식회사 태양전지 전극용 페이스트 및 이를 이용한 전극 및 태양전지
JP6487700B2 (ja) * 2015-01-26 2019-03-20 田中貴金属工業株式会社 ビア電極用導電性ペースト組成物
JP7172224B2 (ja) * 2018-07-19 2022-11-16 昭和電工マテリアルズ株式会社 導体形成用組成物、及び、導体層を有する物品の製造方法
EP4235773A3 (en) * 2018-09-07 2023-10-04 Ferro Corporation Conductive thick film paste for silicon nitride and other substrates
US11222878B2 (en) 2019-04-30 2022-01-11 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Electronic power module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2286160A1 (fr) * 1974-09-30 1976-04-23 Eaton Manford Nouveau materiau resilient conducteur de l'electricite sous pression
US4247594A (en) * 1979-04-30 1981-01-27 Marshall & Pike Enterprises Inc. Electrically conductive resinous composition
US4884754A (en) * 1989-01-03 1989-12-05 Gte Products Corporation Process for producing fine copper flakes

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100397530C (zh) * 2001-12-04 2008-06-25 川铁矿业株式会社 导电浆料用铜合金粉末
CN101283414B (zh) * 2005-09-09 2011-09-14 巴斯夫欧洲公司 施加金属层用的含有两种不同金属的分散体
CN102467989A (zh) * 2010-11-15 2012-05-23 第一毛织株式会社 导电浆料组合物以及包含其的电极
CN103310870A (zh) * 2012-03-12 2013-09-18 深圳市圣龙特电子有限公司 一种硅太阳能电池电极用无铅铜浆及其制备方法
CN104271300A (zh) * 2012-05-04 2015-01-07 Ab微电子有限公司 用于制备金属化的由铝组成的基材的方法
CN104271300B (zh) * 2012-05-04 2018-12-14 Ab微电子有限公司 用于制备金属化的由铝组成的基材的方法
TWI593765B (zh) * 2012-09-10 2017-08-01 賀利氏貴金屬北美康舍霍肯有限責任公司 低燒製溫度之銅組合物
CN111761050A (zh) * 2019-04-01 2020-10-13 广州力及热管理科技有限公司 以金属浆料制作毛细结构的方法
CN111761050B (zh) * 2019-04-01 2022-06-03 广州力及热管理科技有限公司 以金属浆料制作毛细结构的方法
CN117529786A (zh) * 2021-06-24 2024-02-06 杜邦中国有限公司 包含铜颗粒的导电浆料及其生产电子元件的用途

Also Published As

Publication number Publication date
JP3507084B2 (ja) 2004-03-15
TW245801B (cg-RX-API-DMAC7.html) 1995-04-21
KR930012181A (ko) 1993-07-20
EP0546560A1 (en) 1993-06-16
JPH05166409A (ja) 1993-07-02

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