TW245801B - - Google Patents
Info
- Publication number
- TW245801B TW245801B TW081110311A TW81110311A TW245801B TW 245801 B TW245801 B TW 245801B TW 081110311 A TW081110311 A TW 081110311A TW 81110311 A TW81110311 A TW 81110311A TW 245801 B TW245801 B TW 245801B
- Authority
- TW
- Taiwan
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35234791A JP3507084B2 (ja) | 1991-12-13 | 1991-12-13 | 銅導体組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW245801B true TW245801B (zh) | 1995-04-21 |
Family
ID=18423439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW081110311A TW245801B (zh) | 1991-12-13 | 1992-12-23 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0546560A1 (zh) |
JP (1) | JP3507084B2 (zh) |
KR (1) | KR930012181A (zh) |
CN (1) | CN1075378A (zh) |
TW (1) | TW245801B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990022394A (ko) * | 1995-06-06 | 1999-03-25 | 윌리암 제이. 버크 | 동전기 펌프 |
JP4146119B2 (ja) * | 2001-12-04 | 2008-09-03 | Jfeミネラル株式会社 | 導電ペースト用銅合金粉 |
DE102005043242A1 (de) * | 2005-09-09 | 2007-03-15 | Basf Ag | Dispersion zum Aufbringen einer Metallschicht |
US8419981B2 (en) * | 2010-11-15 | 2013-04-16 | Cheil Industries, Inc. | Conductive paste composition and electrode prepared using the same |
EP2741300B1 (en) * | 2011-08-03 | 2019-04-17 | Hitachi Chemical Company, Ltd. | Composition set, conductive substrate and method of producing the same, and conductive adhesive composition |
KR101411012B1 (ko) * | 2011-11-25 | 2014-06-24 | 제일모직주식회사 | 태양전지 전극용 페이스트 및 이를 이용한 전극 및 태양전지 |
CN103310870A (zh) * | 2012-03-12 | 2013-09-18 | 深圳市圣龙特电子有限公司 | 一种硅太阳能电池电极用无铅铜浆及其制备方法 |
AT512041B1 (de) * | 2012-05-04 | 2013-05-15 | Mikroelektronik Ges Mit Beschraenkter Haftung Ab | Verfahren zur Herstellung eines metallisierten Substrats |
EP2706538A3 (en) * | 2012-09-10 | 2014-04-23 | Heraeus Precious Metals North America Conshohocken LLC | Low firing temperature copper composition |
JP6487700B2 (ja) * | 2015-01-26 | 2019-03-20 | 田中貴金属工業株式会社 | ビア電極用導電性ペースト組成物 |
EP4235773A3 (en) * | 2018-09-07 | 2023-10-04 | Ferro Corporation | Conductive thick film paste for silicon nitride and other substrates |
CN111761050B (zh) * | 2019-04-01 | 2022-06-03 | 广州力及热管理科技有限公司 | 以金属浆料制作毛细结构的方法 |
US11222878B2 (en) | 2019-04-30 | 2022-01-11 | Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Electronic power module |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2286160A1 (fr) * | 1974-09-30 | 1976-04-23 | Eaton Manford | Nouveau materiau resilient conducteur de l'electricite sous pression |
US4247594A (en) * | 1979-04-30 | 1981-01-27 | Marshall & Pike Enterprises Inc. | Electrically conductive resinous composition |
US4884754A (en) * | 1989-01-03 | 1989-12-05 | Gte Products Corporation | Process for producing fine copper flakes |
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1991
- 1991-12-13 JP JP35234791A patent/JP3507084B2/ja not_active Expired - Fee Related
-
1992
- 1992-12-11 EP EP92121111A patent/EP0546560A1/en not_active Withdrawn
- 1992-12-12 KR KR1019920024054A patent/KR930012181A/ko not_active Application Discontinuation
- 1992-12-12 CN CN92114433A patent/CN1075378A/zh active Pending
- 1992-12-23 TW TW081110311A patent/TW245801B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP3507084B2 (ja) | 2004-03-15 |
CN1075378A (zh) | 1993-08-18 |
KR930012181A (ko) | 1993-07-20 |
JPH05166409A (ja) | 1993-07-02 |
EP0546560A1 (en) | 1993-06-16 |