KR930012181A - 후막 구리 페이스트 조성물 - Google Patents

후막 구리 페이스트 조성물 Download PDF

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Publication number
KR930012181A
KR930012181A KR1019920024054A KR920024054A KR930012181A KR 930012181 A KR930012181 A KR 930012181A KR 1019920024054 A KR1019920024054 A KR 1019920024054A KR 920024054 A KR920024054 A KR 920024054A KR 930012181 A KR930012181 A KR 930012181A
Authority
KR
South Korea
Prior art keywords
thick film
copper
paste composition
particles
flake
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019920024054A
Other languages
English (en)
Korean (ko)
Inventor
에드워드 테일러 배리
쓰찌야 모또히꼬
오까베 찌에
Original Assignee
원본미기재
이. 아이. 듀우판 드 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 이. 아이. 듀우판 드 네모아 앤드 캄파니 filed Critical 원본미기재
Publication of KR930012181A publication Critical patent/KR930012181A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1019920024054A 1991-12-13 1992-12-12 후막 구리 페이스트 조성물 Ceased KR930012181A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35234791A JP3507084B2 (ja) 1991-12-13 1991-12-13 銅導体組成物
JP91-352347 1991-12-13

Publications (1)

Publication Number Publication Date
KR930012181A true KR930012181A (ko) 1993-07-20

Family

ID=18423439

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920024054A Ceased KR930012181A (ko) 1991-12-13 1992-12-12 후막 구리 페이스트 조성물

Country Status (5)

Country Link
EP (1) EP0546560A1 (cg-RX-API-DMAC7.html)
JP (1) JP3507084B2 (cg-RX-API-DMAC7.html)
KR (1) KR930012181A (cg-RX-API-DMAC7.html)
CN (1) CN1075378A (cg-RX-API-DMAC7.html)
TW (1) TW245801B (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990022214A (ko) * 1995-06-06 1999-03-25 윌리암 제이. 버크 미세 전기도관 제조방법
JP4146119B2 (ja) * 2001-12-04 2008-09-03 Ｊｆｅミネラル株式会社 導電ペースト用銅合金粉
DE102005043242A1 (de) * 2005-09-09 2007-03-15 Basf Ag Dispersion zum Aufbringen einer Metallschicht
US8419981B2 (en) * 2010-11-15 2013-04-16 Cheil Industries, Inc. Conductive paste composition and electrode prepared using the same
JP5971250B2 (ja) 2011-08-03 2016-08-17 日立化成株式会社 組成物セット、導電性基板及びその製造方法並びに導電性接着材組成物
KR101411012B1 (ko) * 2011-11-25 2014-06-24 제일모직주식회사 태양전지 전극용 페이스트 및 이를 이용한 전극 및 태양전지
CN103310870A (zh) * 2012-03-12 2013-09-18 深圳市圣龙特电子有限公司 一种硅太阳能电池电极用无铅铜浆及其制备方法
AT512041B1 (de) * 2012-05-04 2013-05-15 Mikroelektronik Ges Mit Beschraenkter Haftung Ab Verfahren zur Herstellung eines metallisierten Substrats
SG2013066683A (en) * 2012-09-10 2014-04-28 Heraeus Precious Metals North America Conshohocken Llc Low firing temperature copper composition
JP6487700B2 (ja) * 2015-01-26 2019-03-20 田中貴金属工業株式会社 ビア電極用導電性ペースト組成物
JP7172224B2 (ja) * 2018-07-19 2022-11-16 昭和電工マテリアルズ株式会社 導体形成用組成物、及び、導体層を有する物品の製造方法
EP4235773A3 (en) * 2018-09-07 2023-10-04 Ferro Corporation Conductive thick film paste for silicon nitride and other substrates
CN111761050B (zh) * 2019-04-01 2022-06-03 广州力及热管理科技有限公司 以金属浆料制作毛细结构的方法
US11222878B2 (en) 2019-04-30 2022-01-11 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Electronic power module
CN117529786A (zh) * 2021-06-24 2024-02-06 杜邦中国有限公司 包含铜颗粒的导电浆料及其生产电子元件的用途

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2286160A1 (fr) * 1974-09-30 1976-04-23 Eaton Manford Nouveau materiau resilient conducteur de l'electricite sous pression
US4247594A (en) * 1979-04-30 1981-01-27 Marshall & Pike Enterprises Inc. Electrically conductive resinous composition
US4884754A (en) * 1989-01-03 1989-12-05 Gte Products Corporation Process for producing fine copper flakes

Also Published As

Publication number Publication date
JP3507084B2 (ja) 2004-03-15
TW245801B (cg-RX-API-DMAC7.html) 1995-04-21
CN1075378A (zh) 1993-08-18
EP0546560A1 (en) 1993-06-16
JPH05166409A (ja) 1993-07-02

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E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

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