CN107534085A - 电工薄层的室温生产方法、其用途、以及以这种方式获得的薄层加热系统 - Google Patents
电工薄层的室温生产方法、其用途、以及以这种方式获得的薄层加热系统 Download PDFInfo
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- CN107534085A CN107534085A CN201680023248.7A CN201680023248A CN107534085A CN 107534085 A CN107534085 A CN 107534085A CN 201680023248 A CN201680023248 A CN 201680023248A CN 107534085 A CN107534085 A CN 107534085A
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- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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Abstract
可以用作加热电阻体和/或导电层基底的电工薄层在已建立的方法中以高价格并且极慢地生产。此问题凭借氧化还原反应性沉积的基层得以解决,该基层含有石墨、在室温下形成并且在该基层上,在同样的意义上,金属在数分钟到几秒之内通过氧化还原反应,在室温下和在最后的固化过程期间形成微米级的金属层。以这种方式可获得的双层是高度柔性的,允许在铜层上进行焊接,并且可以特别有利地用作薄层加热系统。
Description
技术领域
本发明总体上可以归属于电工薄层(electrotechnical thin layer)领域。该技术领域在涉及诸位发明人的DE 10 2015 102 801中明显地定义。可以从本申请和其中引用的现有技术中获得已知的措施、特征和方法。
背景技术
本发明涉及可用作导体层并可用于薄层加热器的接触的电工薄层、特别是电工层序列的生产方法。
本文中要求保护的主题是在生产薄层加热器的背景下发现的。
自1921年以来,从DE 390 400 A已知的是加热电阻体可以通过初步沉淀、铺展和干燥作为水玻璃、石墨和各种盐的混合物生产。相应地,DE 410 375 A传授了此种层的物理干燥,该层最后用酸进行表面调节。这些已建立的方法的缺点是干燥分散体的过程纯粹是物理的并且因此耗费很长的时间。
作为替代方案,DE 839 396 B传授了将加热丝包封在石英玻璃外壳中,以便因此获得耐久的热辐射器。这种设计不利地要求通过在高至非常高的温度下熔化将该加热丝并入纯石英玻璃中。如在DE 1 446 978 A中披露的替代复合体也要求高温以便生产作为固态加热元件的致密Si-SiC-C复合体。如DD 266 693 A1中所述,将石墨和另外的添加物作为松散床安排在两个电极之间的替代设计也不利地设想了适合材料对的大体积安排。DE 196479 35 B4也传授了在电极之间以厚层施用与水玻璃共混的石墨、碳和/或碳纤维的混合物。这也带来了以下缺点:电极可能被腐蚀性的水玻璃侵蚀并且因此必须以足够的厚度执行。与上述相比,本发明的不同之处在于它定位于薄膜领域中。
相应地针对薄加热膜的DE 3 650 278 T2通过比较更加相关。然而,此文献再次不利地传授了需要大量能量的聚合物膜的碳化,必要的是通过在1800℃下转化将所述膜转化为石墨膜。
因此,本发明的目的是克服现有技术的缺点并提供一种方法和根据该方法的电工薄层,尽管在室温下进行工业加工并且以大面积制造,该方法可以提供薄层,这些薄层是固体、稳定的、优选可用作加热层,并且虽然如此在其用于薄层接触连接的电工特性方面可修改具有足够的导电性。
此目的是根据独立权利要求的特征实现的。由从属权利要求和下面的描述,有利的实施例将是明显的。
发明内容
本发明提供了一种通过以下方式生产电工薄层的室温方法:在区域内提供分散体中的导电和/或半导电无机附聚物并将它们固化以形成层,其特征在于该固化在室温下进行并且该固化通过与至少一种试剂接触来加速。
在优选的实施例中,电工基层在这里通过分散在区域内提供并固化以得到层;在该方法中,将至少包含微米尺度石墨的主要水性碳悬浮液与至少包含铝和/或铁的碱溶性工业金属的至少一种金属粉末(至多为微米尺度粉末)混合,该微米尺度石墨具有无定形碳组分和任选地最高达按重量计49%的包括烟灰、活性炭、焦油、导电炭黑、炉黑、炭黑、灯黑、ESD黑的相关碳多晶型物的添加物。然后将该悬浮液调节至大于7的反应性pH,并且金属至少部分溶解。如此产生的还原层被施用并经受至少初步固化以形成稳定边缘外壳,其中以薄层施用的该悬浮液至少通过伴随的UV暴露固化。
随后,为了优选生产导电的电工薄层,在该还原基层上提供金属(优选铜)的具有低硫酸含量的新鲜分散体,并在室温下进行完全固化,该固化通过5分钟内的还原沉积来加速,其中沉积在微米范围内的金属层。
有利地,如此产生的电工薄层序列可用作可焊接的、可印刷的金属层,更优选用作薄层加热器。
更优选地,通过建立的焊接方法使双层接触允许施用有帮助的和/或必需的触点和/或电路,这使得许多电工薄层产品能够成本极低。对于柔性地负载在膜或纸上的双层的生产成本在从1至10欧元/平方米的范围内的情况下,本发明在有利的双层组合中提供了创造价值的巨大潜力。
具体实施方式和有利特征
本发明提供了一种通过以下方式生产电工薄层的室温方法:在区域内提供分散体中的导电和/或半导电无机附聚物并将它们固化以形成层,其特征在于
-该固化在室温下进行,并且
-该固化通过与至少一种试剂接触来加速。
优选地,该方法的特征在于,形成PV层序列。
优选地,该方法的特征在于,所施用的该至少一个基层是包含至少一种链形成元素的附聚物的层,该链形成元素选自下组,该组由以下各项组成:硼、铝、镓、铟、碳、硅、锗、锡、铅、磷、砷、锑、硫、硒、碲、溴、碘。
优选地,该方法的特征在于,该基层以主要水性悬浮液的形式提供并通过伴随的反应固化。
优选地,该方法的特征在于,该基层以水性悬浮液的形式提供,调节至反应性pH并施用,并在室温下经受至少初步固化。
优选地,该方法的特征在于,该基层以包含烟灰、石墨、活性炭、焦油、导电炭黑、炉黑、炭黑、灯黑、ESD黑中至少一种类型的碳多晶型物的水性碳悬浮液的形式提供,调节至反应性pH并作为氧化或还原层固化。
优选地,该方法的特征在于,该pH通过加入至少一种化合物来调节,该化合物选自下组,该组由以下各项组成:氢氧化钠溶液、氢氧化钾溶液、氢氧化钙、氢氧化钡、氨、盐酸、硫酸、硝酸、过氧化氢、磷酸、抗坏血酸、柠檬酸、酒石酸、羧酸盐、羧酸、胺、氨基酸。
优选地,该方法的特征在于,该层在施用之前作为自由流动的混合物或溶液与至少一种来自下组的金属混合,该组由以下各项组成:Li、Na、K、Be、Mg、Ca、Sr、Ba、B、Al、Ga、In、Tl、Si、Ge、Sn、Pb、As、Sb、Se、Te、Ti、Zr、Cr、Mn、Fe、Co、Ni、Cu、Zn、Hg、Au、Ag、Pt、Pd、Cd,其中该金属在适当的pH设置下至少部分溶解。
优选地,该方法的特征在于,所使用的该基层是呈自由流动的混合物或溶液形式的层,该自由流动的混合物或溶液以薄层施用并最终通过由至少一种措施辅助的伴随的反应固化,所述至少一种措施选自下组,该组由以下各项组成:UV暴露、与CO2接触、与酸性气体接触、与碱性气体接触、与氧化气体接触、与还原气体接触、与酰基氯接触、与尿素溶液、与金属氧化物分散体接触、与金属羰基化物接触、与金属络合物接触、与金属化合物接触、与金属盐接触、与水接触。
优选生产电工薄层、特别是基层的室温方法,其中分散体中的导电和/或半导电无机附聚物在区域内提供并固化以形成层,其特征在于
-该固化在室温下进行,
-该固化通过与至少一种试剂接触来加速,
-所施用的该至少一个基层是包括至少一种链形成元素的附聚物的层,该链形成元素由碳组成,在这种情况下
-该基层作为主要水性碳悬浮液
-至少包含微米尺度石墨,该微米尺度石墨具有无定形碳组分和任选地最高达49%的烟灰、活性炭、焦油、导电炭黑、炉黑、炭黑、灯黑、ESD黑的添加物,
-与碱溶性金属、优选至少一种来自下组的金属的至少一种金属粉末混合,该组由以下各项组成:硅、铝、镓、铟、镁、钙、钡、铁、钴、镍、铜、锌,更优选硅、铝和铁,该金属粉末至多为微米尺度粉末,
-将该悬浮液调节至大于7的反应性pH并作为还原层施用,并至少经受初步固化以形成稳定边缘外壳,其中
-将以薄层施用的该悬浮液至少通过伴随的UV暴露进行固化。
优选地,该方法的特征在于,在室温下,为了生产导电的电工薄层,将分散体中的无机附聚物在区域内提供并固化以形成层,其中
-金属或金属化合物的分散体
-在还原或氧化基层上提供,
-该固化在室温下进行,其中
-该固化通过与该至少一种金属化合物接触以沉积该金属或金属氧化物而加速。
优选地,该方法的特征在于,基层以包含碳、硅、铝和铁的碱性还原层的形式提供。
优选地,该方法的特征在于,所使用的分散体是水性微酸性铜溶液,优选新鲜的微酸性硫酸铜溶液,其中沉积铜层。
优选地,该方法的特征在于,在不超过5分钟、优选1至2分钟内、更优选在30秒内沉积厚度最高达100微米、优选0.5至80微米、更优选3±2.5微米的金属层。
优选地,该方法的特征在于,沉积厚度为至少0.5微米、具有的电导率为约100欧姆/厘米、优选0.5至10欧姆/厘米、更优选2±1.5欧姆/厘米的铜层。
优选地,该方法的特征在于,在该铜层顶上沉积或形成另外的电工层。
优选地,该方法的特征在于,在基层顶上的限定区域中施用并固化覆盖层,并且然后在仍然暴露的区域中形成作为电极层的金属层。
优选地,该方法的特征在于,使基层在初步措施中带静电、优选在与聚合物层摩擦接触中带静电、更优选在与尼龙刷辊摩擦接触中带静电。
优选地,该方法的特征在于,该方法在印刷机中进行。
优选使用通过本发明的方法获得的电工薄层序列,其中该电工薄层序列可用作可焊接金属层、集成电路的导体层、电路的电阻层、半导体层、电阻式传感器、电容式传感器、湿度传感器、光刻胶、氧化/还原气体的传感器、电容器、铁电活性层、二极管、薄层电阻加热器、晶体管、场效晶体管、双极晶体管、定量光电池、光伏层序列、触摸传感器。
该薄层序列优选通过本发明的方法作为电工双层、优选薄层加热器来获得,该薄层序列具有在任选载体顶上的固化的碱性还原性基层,该基层包含
-呈石墨和任选地最高达49%的另外的碳多晶型物和/或碳产品形式的碳,
-至少部分溶解的铁和/或铝,该铁和/或铝的纯度为96%、具有4%的典型杂质如硅、硼、铝、磷、镁、钙、锌,
-固化的水玻璃,
-金属硅酸盐;
以及
在其上还原性沉积的金属层,优选由铜构成,在这种情况下
-该金属层具有2.5±2.475欧姆/厘米的金属电导率,
并且任选地,优选在铜层的情况下,
-该双层具有优选地在2.7±1伏特的范围内的二极管齐纳电压,
-该双层具有优选地在40±39.98微法拉的范围内的电容,更优选地,其中跨过该双层的电阻的最高达25%纯粹是电容性质的并且对高频下的阻抗没有贡献。
附图说明
参考图形,这些图展示了:
图1:制备性还原沉积的并且至少部分固化的基层的以俯视图示出的有利实施例;
图2:防止在深色区域中形成金属层的覆盖层的以俯视图示出的有利实施例。
参考工作实例的具体实施方式
在有利的实施例中,提供了水性石墨分散体。在此分散体中,微米尺度石墨含有比例最高达49%的另外的碳产品,例如无定形石墨、活性炭、导电炭黑、烟灰、具有油残余物/烟灰组分和/或焦油组分的润滑石墨。将工业铝和工业铁的微米尺度金属粉末混合物以约50重量百分比混合到该水性石墨分散体中。将pH调节至从12至14,其中部分溶解金属粉末,并将反应混合物在冷却的搅拌器系统中匀化,任选地在可流动性方面用二氧化硅进行调节,并通过辊或筛网系统在如图1所展示的预定区域中印刷到柔性纸片上,并且在最高达10秒内经受至少部分初步固化-任选地在UV暴露下。拉出特征、可流动性和均匀性可以通过改性剂和辅助剂如乳化剂、消泡剂、触变剂、碱性缓冲体系、具有硅氧烷共聚物(特别是每聚合的(perpolymerized)硅氧烷共聚物)的粘合促进剂来调节。
在纯石墨的情况下,所获得的基层具有在每厘米从兆欧到垓欧的范围内的电导率;任选地与导电金属氧化物和/或建立的电解质组合的导电炭黑的添加物能够将电导率降低几个数量级至千欧范围。根据作为AC或DC加热层的计划用途,电阻可以设定在极高的水平(对于AC)或另外在低水平(对于DC)。在每种情况下,发现已经使得为还原性且碱性的层可有利地用作金属导电层的基层。在根据图2施用覆盖层之后,在图2中以白色画出轮廓的区域中,通过与新鲜生产的具有低硫酸含量的铜溶液接触可能在数秒至数分钟内产生几微米厚度的高导电性金属层。以球状附聚物形式获得的铜层在30秒至几分钟之后具有微米的厚度,牢固且耐久地粘附在基层上,并具有0.05至5欧姆/厘米的电导率。通过常规焊剂接合可以将附加的触点和/或电路施用到最终干燥且漂洗的铜层上。诸位发明人假定新鲜还原层可能是快速镀铜的合理解释:借助于石墨,还原条件储存在固溶体中并且可以在最终固化过程中主动地并且有效地加速镀铜。微米范围内的铜层因此可以在数秒内产生,否则仅可能在替代化学方法中具有微米每小时的沉积速率。
工业实用性
在已建立的方法中,以高成本并且极慢地生产可用作加热电阻体和/或导体层基底的电工薄层。
此问题通过在室温下形成的氧化还原反应性沉积的含石墨的基层得以解决,在该基层上,金属通过氧化还原反应在数分钟或几秒内以相应的方式在室温下在最终固化期间形成微米级的金属层。
可如此获得的双层是高度柔性的,允许焊接到铜层上,并且可以特别有利地用作薄层加热器。
Claims (21)
1.一种通过以下方式生产电工薄层的室温方法:在区域内提供分散体中的导电和/或半导电无机附聚物并将它们固化以形成层,其特征在于
-该固化在室温下进行,并且
-该固化通过与至少一种试剂接触来加速。
2.如前一权利要求所述的方法,其特征在于,形成PV层序列。
3.如前述权利要求中任一项所述的方法,其特征在于,所施用的该至少一个基层是包含至少一种链形成元素的附聚物的层,该链形成元素选自下组,该组由以下各项组成:硼、铝、镓、铟、碳、硅、锗、锡、铅、磷、砷、锑、硫、硒、碲、溴、碘。
4.如前一权利要求所述的方法,其特征在于,该基层以主要水性分散体的形式提供并通过伴随的反应固化。
5.如前两项权利要求中任一项所述的方法,其特征在于,该基层以水性悬浮液的形式提供,调节至反应性pH并施用,并在室温下经受至少初步固化。
6.如前三项权利要求中任一项所述的方法,其特征在于,该基层以包含烟灰、石墨、活性炭、焦油、导电炭黑、炉黑、炭黑、灯黑、ESD黑中至少一种类型的碳多晶型物的水性碳悬浮液的形式提供,调节至反应性pH并作为氧化或还原层固化。
7.如前四项权利要求中任一项所述的方法,其特征在于,该pH通过加入至少一种化合物来调节,该化合物选自下组,该组由以下各项组成:氢氧化钠溶液、氢氧化钾溶液、氢氧化钙、氢氧化钡、氨、盐酸、硫酸、硝酸、过氧化氢、磷酸、抗坏血酸、柠檬酸、酒石酸、羧酸盐、羧酸、胺、氨基酸。
8.如前述权利要求中任一项所述的方法,其特征在于,该层在施用之前作为自由流动的混合物或溶液与至少一种来自下组的金属混合,该组由以下各项组成:Li、Na、K、Be、Mg、Ca、Sr、Ba、B、Al、Ga、In、Tl、Si、Ge、Sn、Pb、As、Sb、Se、Te、Ti、Zr、Cr、Mn、Fe、Co、Ni、Cu、Zn、Hg、Au、Ag、Pt、Pd、Cd,其中该金属在适当的pH设置下至少部分溶解。
9.如前述权利要求中任一项所述的方法,其特征在于,所使用的该基层是呈自由流动的混合物或溶液形式的层,该自由流动的混合物或溶液以薄层施用并最终通过由至少一种措施辅助的伴随的反应固化,所述至少一种措施选自下组,该组由以下各项组成:UV暴露、与CO2接触、与酸性气体接触、与碱性气体接触、与氧化气体接触、与还原气体接触、与酰基氯接触、与尿素溶液、与金属氧化物分散体接触、与金属羰基化物接触、与金属络合物接触、与金属化合物接触、与金属盐接触、与水接触。
10.一种如前述权利要求中任一项所述的产生电工薄层、特别是基层的室温方法,其中分散体中的导电和/或半导电无机附聚物在区域内提供并固化以形成层,其特征在于
-该固化在室温下进行,
-该固化通过与至少一种试剂接触来加速,
-所施用的该至少一个基层是包括至少一种链形成元素的附聚物的层,该链形成元素由碳组成,在这种情况下
-将该基层作为至少包含微米尺度石墨的主要水性碳悬浮液,该微米尺度石墨具有无定形碳组分和任选地最高达49%的烟灰、活性炭、焦油、导电炭黑、炉黑、炭黑、灯黑、ESD黑的添加物,
-与碱溶性金属、优选至少一种来自下组的金属的至少一种金属粉末混合,该组由以下各项组成:硅、铝、镓、铟、镁、钙、钡、铁、钴、镍、铜、锌,更优选硅、铝和铁,该金属粉末至多为微米尺度粉末,
-将该悬浮液调节至大于7的反应性pH并作为还原层施用,并至少经受初步固化以形成稳定边缘外壳,其中
-将以薄层施用的该悬浮液至少通过伴随的UV暴露进行固化。
11.如前述权利要求中任一项所述的方法,其特征在于,在室温下,为了生产导电的电工薄层,将分散体中的无机附聚物在区域内提供并固化以形成层,其特征在于
-金属或金属化合物的分散体
-在还原或氧化基层上提供,
-该固化在室温下进行,其中
-该固化通过与该至少一种金属化合物接触以沉积该金属或金属氧化物而加速。
12.如前一权利要求所述的方法,其特征在于,基层以包含碳、硅、铝和铁的碱性还原层的形式提供。
13.如前两项权利要求中任一项所述的方法,其特征在于,所使用的该分散体是水性微酸性铜溶液,优选新鲜的微酸性硫酸铜溶液,其中沉积铜层。
14.如前三项权利要求中任一项所述的方法,其特征在于,在不超过5分钟、优选1至2分钟内、更优选在30秒内沉积厚度最高达100微米、优选0.5至80微米、更优选3±2.5微米的金属层。
15.如前述权利要求中任一项所述的方法,其特征在于,沉积厚度为至少0.5微米、具有的电导率为约100欧姆/厘米、优选0.5至10欧姆/厘米、更优选2±1.5欧姆/厘米的铜层。
16.如前一权利要求所述的方法,其特征在于,在该铜层顶上沉积或形成另外的电工层。
17.如前六项权利要求中任一项所述的方法,其特征在于,在基层顶上的限定区域中施用并固化覆盖层,并且然后在仍然暴露的区域中形成作为电极层的金属层。
18.如前述权利要求中任一项所述的方法,其特征在于,使基层在初步措施中带静电、优选在与聚合物层摩擦接触中带静电、更优选在与尼龙刷辊摩擦接触中带静电。
19.如前八项权利要求中任一项所述的方法,其特征在于,该方法在印刷机中进行。
20.根据前述权利要求中任一项获得的电工薄层序列的用途,其特征在于,该电工薄层序列可用作可焊接金属层、集成电路的导体层、电路的电阻层、半导体层、电阻式传感器、电容式传感器、湿度传感器、光刻胶、氧化/还原气体的传感器、电容器、铁电活性层、二极管、薄层电阻加热器、晶体管、场效晶体管、双极晶体管、定量光电池、光伏层序列、触摸传感器。
21.电工双层、优选薄层加热器,根据前述权利要求中任一项获得的,具有
在任选载体顶上的固化的碱性还原性基层,该基层包含
-呈石墨和任选地最高达49%的另外的碳多晶型物和/或碳产品形式的碳,
-至少部分溶解的铁和/或铝,该铁和/或铝的纯度为96%、具有4%的典型杂质如硅、硼、铝、磷、镁、钙、锌,
-固化的水玻璃,
-金属硅酸盐;
以及
在其上还原性沉积的金属层,优选由铜构成,在这种情况下
-该金属层具有2.5±2.475欧姆/厘米的金属电导率,
并且任选地,优选在铜层的情况下,
-该双层具有优选地在2.7±1伏特的范围内的二极管齐纳电压,
-该双层具有优选地在40±39.98微法拉的范围内的电容,更优选地,其中跨过该双层的电阻的最高达25%纯粹是电容性质的并且对高频下的阻抗没有贡献。
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