CN107417862B - 寡聚物、包含其的组合物及复合材料 - Google Patents

寡聚物、包含其的组合物及复合材料 Download PDF

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CN107417862B
CN107417862B CN201611270235.8A CN201611270235A CN107417862B CN 107417862 B CN107417862 B CN 107417862B CN 201611270235 A CN201611270235 A CN 201611270235A CN 107417862 B CN107417862 B CN 107417862B
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oligomer
resin
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formula
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CN107417862A (zh
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洪铭聪
李云卿
杨伟达
鄞盟松
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Industrial Technology Research Institute ITRI
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Abstract

本发明提供一种寡聚物、包含其的组合物及复合材料。该寡聚物可为反应物(a)及反应物(b)反应的产物，其中该寡聚物的数目平均分子量可为1,000至10,000；反应物(a)可为反应物(c)及反应物(d)反应的产物；反应物(b)可为具有式(I)结构的化合物、具有式(II)结构的化合物、具有式(III)结构的化合物、具有式(IV)结构的化合物、或上述的组合其中，a可为0或1、以及，R1可独立为H、或其中，b可为0或1至6的整数、c可为0或1、d可为0或1至6的整数、以及至少一R1可不为氢；反应物(c)为具有式(V)结构的化合物、具有式(VI)结构的化合物、或上述的组合其中，R2独立为C5‑10烷基；反应物(d)为具有式(VII)结构的化合物

Description

寡聚物、包含其的组合物及复合材料
技术领域
本发明关于一种寡聚物、包含其的组合物及复合材料。
背景技术
新时代的电子产品趋向轻薄短小，并适合高频传输，因此电路板的配线走向高密度化。高频电子元件与电路板接合，为了维持传输速率及保持传输讯号完整性，电路板基板材料必须兼具较低的介电常数(dielectric constant、Dk)及耗散因子(dissipationfactor、Df)。
由于传统电路板材料其介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)普遍偏高，因此如何改善电路板基板材料的介电常数及耗散因子，为目前印刷电路板制程的重要课题。
发明内容
根据本发明实施例，本发明提供一种寡聚物。该寡聚物可为反应物(a)及反应物(b)反应的产物，其中该寡聚物的数目平均分子量可为1,000至10,000；反应物(a)可为反应物(c)及反应物(d)反应的产物；反应物(b)可为具有式(I)结构的化合物、具有式(II)结构的化合物、具有式(III)结构的化合物、具有式(IV)结构的化合物、或上述的组合
其中，a可为0或1、以及，R1可独立为H、或其中，b可为0或1至6的整数、c可为0或1、d可为0或1至6的整数、以及至少一R1可不为氢；反应物(c)为具有式(V)结构的化合物、具有式(VI)结构的化合物、或上述的组合
其中，R2独立为C5-10烷基；反应物(d)为具有式(VII)结构的化合物
其中，e为0或1至10的整数。
根据本发明实施例，本发明亦提供一种组合物，包含：100重量份的上述寡聚物；以及20-110重量份的交联剂。
根据本发明实施例，本发明亦提供一种复合材料，包含：上述组合物所形成的固化物或半固化物；以及基材，其中该固化物或半固化物位于该基材之上或位于该基材之中。
实施方式
本发明实施例提供一种寡聚物、包含其的组合物及复合材料。根据本发明的实施例，寡聚物可为反应物(a)及反应物(b)(例如具有两个或以上可进行加成反应的烯烃官能团)的反应(例如加成聚合反应)产物。根据本发明的实施例，寡聚物可为由环状烯烃类进行加成反应所得，且具有枝状结构(branched structure)。根据本发明的实施例，寡聚物可通过反应物组成及比例控制所得的寡聚物的数目平均分子量(例如介于1,000至10,000之间)。根据本发明的实施例，寡聚物具有高热稳定性、以及于有机溶剂中拥有良好的溶解度，增加其可加工性。根据本发明的实施例，寡聚物与已知作为印刷电路板材质的树脂具有良好的可相容性，因此在将寡聚物与上述树脂混合形成组合物时，不易有相分离的现象发生。根据本发明的实施例，寡聚物具有较低极性，且其化学结构中具备可交联的官能团，有利于后续应用于基板材料中，增加基板材料的机械强度。本发明实施例亦提供一种包含上述寡聚物的组合物及包含其固化物或半固化物的复合材料(例如为预浸片)。本发明所述的组合物的固化物具有较低的介电常数(dielectric constant、Dk)及耗散因子(dissipationfactor、Df)，可作为高频基板材料，解决插入损失(insertion loss)的问题。
根据本发明的实施例，该寡聚物可为反应物(a)及反应物(b)的反应(例如加成聚合反应)产物。根据本发明的实施例，该寡聚物数目平均分子量可约介于1,000至10,000，例如约介于1,000至9,000、约介于1,000至8,000、约介于1,000至7,000、约介于1,000至6,000、约介于1,000至5,000、约介于1,000至4,000、约介于1,000至3,000、或约介于1,000至2,500。如此一来，所得的寡聚物于有机溶剂中拥有良好的溶解度，增加其可加工性。反应物(b)可为至少一种具有式(I)结构的化合物、具有式(II)结构的化合物、具有式(III)结构的化合物、具有式(IV)结构的化合物、或上述的组合
其中，a可为0或1、以及，R1可独立为H、或其中，b可为0或1至6的整数(例如1、2、3、4、5、或6)、c可为0或1、d可为0或1至6的整数(例如1、2、3、4、5、或6)。举例来说，R1可例如为 根据本发明实施例，若反应物(b)为具有式(IV)结构的化合物，则至少一R1可不为氢。
根据本发明实施例，该反应物(b)可为 或上述的组合。
根据本发明实施例，该反应物(a)可为反应物(c)及反应物(d)的反应(例如加成聚合反应)产物。其中，该反应物(c)可为至少一种具有式(V)结构的化合物、具有式(VI)结构的化合物、或上述的组合
其中，R2可独立为C5-10烷基，举例来说，R2可独立为直链或分支(linear orbranched)烷基，例如为直链或分支的具有5、6、7、8、9、或10个碳的烷基。根据本发明某些实施例，该反应物(c)可为 或上述的组合。该反应物(d)可为至少一种具有式(VII)结构的化合物
其中，e为0或1至10的整数(例如e为1、2、3、4、5、6、7、8、9、或10)。根据本发明某些实施例，该反应物(d)可为 或上述的组合。
根据本发明实施例，该反应物(c)及该反应物(d)的重量比可约为1:10至10:1，例如约为1:10至5:1、约为1:10至3:1、约为1:10至1:1、约为1:5至5:1、约为1:5至3:1、或约为1:5至1:1。若该反应物(c)及该反应物(d)的重量比过低，则所得的寡聚物分子量可能较低且产率差；若该反应物(c)及该反应物(d)的重量比过高，则所得的寡聚物分子量可能过大且溶解度差不易加工。
根据本发明实施例，该反应物(c)及该反应物(d)的重量比值可约介于1:10至1:1之间，以使所得寡聚物于有机溶剂中拥有良好的溶解度，并使得包含该寡聚物的组合物更有利于后续的制程(例如：将该组合物涂布于基材上、或是将基材含浸于该组合物中)。
根据本发明实施例，该反应物(c)及该反应物(b)的重量比可约为1:1至20:1，例如约为1:1至15:1、约为1:1至10:1、约为1:1至9:1、约为3:1至15:1、约为3:1至10:1、或约为3:1至9:1。若该反应物(c)及该反应物(b)的重量比过低，则可能难以形成枝状结构寡聚物；若该反应物(c)及该反应物(d)的重量比过高，则可能导至寡聚物分子量过大、溶解度不佳不易加工。
根据本发明实施例，当该反应物(c)及该反应物(d)的重量比值约介于1:10至1:1之间(例如约介于1:5至1:1之间)、及/或该反应物(c)及该反应物(b)的重量比值约介于1:1至10:1之间(例如约介于3:1至10:1之间)，该寡聚物于室温下可完全溶解于重量与该寡聚物相同的甲苯中。根据本发明实施例，经由该反应物(b)、反应物(c)、及该反应物(d)的比例调配，可控制组合物(包含该寡聚物与交联剂)所得的固化物的性质，例如，具有较低的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)。
根据本发明实施例，上述寡聚物的制备方式可包含：先将反应物(c)与该反应物(d)反应并维持第一时间形成反应物(a)(反应物(c)与反应物(d)的加成反应产物)，接着加入该反应物(b)与反应物(a)进行反应(例如加成反应)，并维持第二时间。根据本发明实施例，上述寡聚物的制备方式可包含：先将反应物(c)与该反应物(d)在催化剂组合物存在之下进行反应并维持第一时间形成反应物(a)(反应物(c)与反应物(d)的加成反应产物)，接着加入该反应物(b)与反应物(a)进行加成反应，并维持第二时间。其中，该第一时间可例如约为数分钟至48小时(例如约为30分钟至10小时或约为1小时至8小时)，而该第二时间可例如约为24小时至72小时。根据本发明实施例，可通过控制该第一时间来调整所获得的反应物(a)的分子量，进而达到控制所得寡聚物分子量的目的。此外，该寡聚物分子量可通过该第二时间加以控制。
根据本发明实施例，该催化剂组合物可包含加成聚合催化剂，例如，含钛的催化剂、含锆的催化剂、含钯的催化剂、含铝的催化剂、或上述的组合。此外，该催化剂组合物可进一步包含助催化剂、链转移剂、或上述的组合。根据本发明实施例，本发明对于所使用的加成聚合催化剂、助催化剂、及链转移剂并无特别的限制，可为已知用来进行环烯烃加成聚合的加成聚合催化剂、助催化剂、及链转移剂。
根据本发明实施例，本发明亦提供一种组合物，包含100重量份的上述寡聚物，以及约20-110重量份的交联剂(例如约20-100重量份的交联剂、约30-100重量份的交联剂、或是约40-100重量份的交联剂)。该交联剂可为小分子型交联剂、寡聚物型交联剂、高分子型交联剂、或上述的组合。举例来说，该交联剂可例如为乙二醇二甲基丙烯酸酯(ethyleneglycol dimethacrylate、EGDMA)、1,4-丁二醇二丙烯酸酯(1,4-butanediol diacrylate)、三聚氰酸三烯丙基酯(triallyl cyanurate)、三烯丙基异三聚氰酸酯(triallylisocyanurate、TAIC)、三甲代烯丙基异三聚氰酸酯(trimethallyl isocyanurate、TMAIC)、丙烯酸丁酯(butyl acrylate)、丙烯酸-2-羟乙基酯(2-Hydroxyethyl Acrylate)、邻苯二甲酸二烯丙酯(diallyl phthalate)、间苯二甲酸二烯丙酯(diallyl isophthalate)、对苯二甲酸二烯丙酯(diallyl terephthalate)、丙烯酸羟丙酯(hydroxypropyl acrylate)、甲基丙烯酸2-羟乙酯(2-hydroxyethyl methacrylate)、水解聚马来酸酐(hydrolyzedpolymaleic anhydride)、1,2,4-苯三甲酸三烯丙酯(1,2,4-triallyl trimellitate)、二乙烯苯(divinylbenzene)、或上述的组合。
根据本发明实施例，本发明所述组合物，可进一步包含20-200重量份的树脂(例如约20-180重量份的树脂、约20-160重量份的树脂、20-100重量份的树脂、或约40-200重量份的树脂)。该树脂可例如已知作为印刷电路板材质的树脂，且本发明所述的寡聚物与该等树脂具有良好的可相容性，因此在将树脂与本发明所述寡聚物混合形成本发明所述组合物时，不易有相分离的现象发生。举例来说，该树脂可为环氧树脂(epoxy resin)、氰酸酯树脂(cyanate resin)、苯酚树脂(phenol resin)、酚醛树脂(novolac resin)、聚苯乙烯树脂(polystyrene resin)、苯乙烯丁二烯共聚物树脂(styrene-butadiene copolymerresin)、聚酰胺树脂(polyamide resin)、聚酰亚胺树脂(polyimide resin)、马来酰亚胺(maleimide)树脂、双马来酰亚胺(bismaleimide)树脂、聚苯醚树脂(polyphenylene etherresin)、或上述的组合。
根据本发明实施例，本发明所述的组合物可更包含1-30重量份的添加剂(例如约1-25重量份的添加剂、或约1-20重量份的添加剂)，其中该添加剂可为起始剂、硬化剂、平坦剂、填充物、色料、消泡剂、耐燃剂、或上述的组合。
根据本发明实施例，该起始剂可为过氧化物起始剂，例如苯甲酰基过氧化物(benzoyl peroxide)、1,1-双(叔丁基过氧基)环己烷(1,1-bis(tert-butylperoxy)cyclohexane)、2,5-双(叔丁基过氧基)-2,5-二甲基环己烷(2,5-bis(tert-butylperoxy)-2,5-dimethylcyclohexane)、2,5-双(叔丁基过氧基)-2,5-二甲基-3-环己炔(2,5-bis(tert-butylperoxy)-2,5-dimethyl-3-cyclohexyne)、双(1-(叔丁基过氧基)-1-甲基乙基)苯(bis(1-(tert-butylpeorxy)-1-methy-ethyl)benzene)、叔丁基过氧化氢(tert-butyl hydroperoxide)、叔丁基过氧化物(tert-butyl peroxide)、过氧化苯甲酸叔丁酯(tert-butyl peroxybenzoate)、氢过氧化枯烯(Cumene hydroperoxide)、环己酮基过氧化物(cyclohexanone peroxide)、过氧化二异丙苯(dicumyl peroxide)、过氧化月桂酰(lauroyl peroxide)、或上述的组合。
根据本发明实施例，该硬化剂可视选用的树脂种类做调整，例如可为咪唑(imidazole)化合物，例如2-十一烷基咪唑(2-undecylimidazole)、2-十七烷基咪唑(2-heptadecylimidazole)、2-甲基咪唑(2-methylimidazole)、2-乙基-4-甲基咪唑(2-ethyl-4-methylimidazole)、2-苯基咪唑(2-phenylimidazole)、2-苯基-4-甲基咪唑(2-phenyl-4-methylimidazole)、1-苯甲基-2-甲基咪唑(1-benzyl-2-methylimidazole)、1-苯甲基-2-苯基咪唑(1-benzyl-2-phenylimidazole)、1,2-二甲基咪唑(1,2-dimethylimidazole)、1-氰基乙基-2-甲基咪唑(1-cyanoethyl-2-methylimidazole)、1-氰基乙基-2-乙基-4-甲基咪唑(1-cyanoethyl-2-ethyl-4-methylimidazole)、1-氰基乙基-2-十一烷基咪唑(1-cyanoethyl-2-undecylimidazole)、1-氰基乙基-2-苯基咪唑(1-cyanoethyl-2-phenylimidazole)、1-氰基乙基-2-十一烷基咪唑鎓偏苯三酸盐(1-cyanoethyl-2-undecylimidazolium trimeritate)、1-氰基乙基-2-苯基咪唑鎓偏苯三酸盐(1-cyanoethyl-2-phenyl imidazolium trimeritate)、2-苯基-4,5-二羟基甲基咪唑(2-phenyl-4,5-dihydroxymethylimidazole)、2-苯基-4-甲基-5-二羟基甲基咪唑(2-phenyl-4-methyl-5-dihydroxymethylimidazole)、或上述的组合。
根据本发明实施例，该耐燃剂可为含溴或含磷耐燃剂，而填充剂可为有机粉体或无机粉体，例如Al(OH)3、Al2O3、Mg(OH)2、MnO2、SiO2、或聚亚酰胺粉体。
根据本发明实施例，由于本发明所述组合物包含上述寡聚物，因此该组合物的固化产物具有较低的介电常数(dielectric constant、Dk)及耗散因子(dissipationfactor、Df)，适合作为高频基板材料。
根据本发明实施例，本发明亦提供一种复合材料。该复合材料可包含上述组合物所形成的固化物或半固化物；以及基材，其中该固化物或半固化物位于该基材之上或位于该基材之中。根据本发明实施例，该基材可为玻璃纤维、或铜箔。举例来说，该复合材料可包含预浸片，而该预浸片的制备方式系将玻璃纤维(作为基材)含浸于上述组合物中。接着，对该组合物进行半固化，得到该预浸片。此外，该复合材料可进一步包含铜箔，而该复合材料可为铜箔基板、或印刷电路板。
为了让本发明的上述和其他目的、特征、和优点能更明显易懂，下文特举数实施例及比较实施例，作详细说明如下：
寡聚物的制备
实施例1：
首先，将18克的降冰片烯(norbornene)(191.18mmol)(作为反应物(c))、18克的乙烯基降冰片烯(vinyl norbornene)(146.76mmol)(作为反应物(d))、以及150毫升的二氯甲烷(CH2Cl2)混合，得到第一溶液。接着，将0.6克的双(丙腈)-二氯化钯(II)(bis(propanenitrile)dichloropalladium(II))、0.312毫升的丙腈(propanenitrile)、以及150毫升的二氯甲烷(CH2Cl2)在氮气下加入一反应瓶中。均匀搅拌后，加入1.3克六氟锑酸银(AgSbF6)于该反应瓶中。接着，搅拌30分钟后，将第一溶液加入该反应瓶中。搅拌2小时后，加入2克的降冰片二烯(21.71mmol)(作为反应物(b))于该反应瓶中。接着，搅拌48小时后，经纯化、再结晶与过滤收集沉淀物，并将所得沉淀物于60℃下进行烘干，收集产物，得到寡聚物(1)。以SEC/MALS/VIS分支率测量法测得寡聚物(1)的分枝率(branching ratio)约为73％，表示具有枝状结构。接着，测量寡聚物(1)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例2：
依实施例1所述的方式进行，除了将降冰片烯的重量由18克增加至27克，而将乙烯基降冰片烯的重量由18克降低至9克，得到寡聚物(2)。接着，测量寡聚物(2)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例3：
依实施例1所述的方式进行，除了将降冰片烯的重量由18克增加至24克，而将乙烯基降冰片烯的重量由18克降低至12克，得到寡聚物(3)。接着，测量寡聚物(3)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例4：
依实施例1所述的方式进行，除了将降冰片烯的重量由18克降低至12克，而将乙烯基降冰片烯的重量由18克增加至24克，得到寡聚物(4)。以SEC/MALS/VI分支率测量法测得寡聚物(4)的分枝率(branching ratio)约为68％，表示具有枝状结构。接着，测量寡聚物(4)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例5：
依实施例1所述的方式进行，除了将降冰片烯的重量由18克降低至9克，而将乙烯基降冰片烯的重量由18克增加至27克，得到寡聚物(5)。接着，测量寡聚物(5)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例6：
依实施例1所述的方式进行，除了将降冰片烯的重量由18克降低至7.2克，而将乙烯基降冰片烯的重量由18克增加至28.8克，得到寡聚物(6)。接着，测量寡聚物(6)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例7：
依实施例1所述的方式进行，除了将降冰片烯的重量由18克降低至6克，而将乙烯基降冰片烯的重量由18克增加至30克，得到寡聚物(7)。接着，测量寡聚物(7)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例8：
依实施例1所述的方式进行，除了将降冰片二烯置换为双环戊二烯(dicyclopentadiene)，得到寡聚物(8)。接着，测量寡聚物(8)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例9：
依实施例1所述的方式进行，除了将降冰片二烯置换为化合物(1)(结构为)，得到寡聚物(9)。接着，测量寡聚物(9)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例10：
依实施例1所述的方式进行，除了将降冰片二烯置换为化合物(2)(结构为)，得到寡聚物(10)。接着，测量寡聚物(10)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
实施例11：
首先，将3克的化合物(3)(结构为)(7.5mmol)、9克的乙烯基降冰片烯(vinyl norbornene)(75mmol)、以及60毫升的二氯甲烷(CH2Cl2)混合，得到第一溶液。接着，将0.239克的双(丙腈)-二氯化钯(II)(bis(propanenitrile)dichloropalladium(II))、0.119毫升的丙腈(propanenitrile)、以及180毫升的二氯甲烷(CH2Cl2)在氮气下加入一反应瓶中。均匀搅拌后，加入0.567克六氟锑酸银(AgSbF6)于该反应瓶中。接着，搅拌30分钟后，将第一溶液加入该反应瓶中。搅拌2小时后，加入0.67克的降冰片二烯(7.27mmol)于该反应瓶中。接着，搅拌24小时后，经纯化、再结晶与过滤收集沉淀物，并将所得沉淀物于60℃下进行烘干，收集产物，得到寡聚物(11)。接着，测量寡聚物(11)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
比较例1：
依实施例11所述的方式进行，除了不添加降冰片二烯，得到寡聚物(12)。接着，测量寡聚物(12)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
比较例2：
首先，将4.5克的化合物(3)(结构为)(11.29mmol)(作为反应物(c))、2.7克的化合物(4)(结构为)(7.98mmol)(作为反应物(c))、4.5克的降冰片烯(norbornene)(47.80mmol)(作为反应物(c))、以及30毫升的二氯甲烷(CH2Cl2)混合，得到第一溶液。接着，将0.3克的双(丙腈)-二氯化钯(II)(bis(propanenitrile)dichloropalladium(II))、0.156毫升的丙腈(propanenitrile)、以及50毫升的二氯甲烷(CH2Cl2)在氮气下加入一反应瓶中。均匀搅拌后，加入0.75克六氟锑酸银(AgSbF6)于该反应瓶中。接着，搅拌30分钟后，将第一溶液加入该反应瓶中。搅拌2小时后，加入1.3克的降冰片二烯(14.11mmol)(作为反应物(b))于该反应瓶中。接着，搅拌24小时后，经纯化、再结晶与过滤收集沉淀物，并将所得沉淀物于60℃下进行烘干，收集产物，得到寡聚物(13)。接着，测量寡聚物(13)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
比较例3：
依比较例2所述的方式进行，除了不添加降冰片二烯，得到寡聚物(14)。接着，测量寡聚物(14)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
比较例4：
依实施例1所述的方式进行，除了不添加降冰片二烯，得到寡聚物(15)。接着，测量寡聚物(15)的数目平均分子量(Mn)、及分子量分布值(polydispersity index、PDI)，结果如表1所示。
表1
溶解度测试
测量实施例1至7所得的寡聚物(1)-(7)在溶剂中的溶解度。该在溶剂中的溶解度测试方式包含以下步骤。在室温下将该寡聚物加入溶剂中，其中寡聚物与溶剂的重量比为1:1。在搅拌10分钟后，观察寡聚物溶解于溶剂的重量百分比，测试结果如表2所示。
表2
由表2可得知，本发明的实施例皆对有机溶剂有良好的溶解度，甚至当降冰片烯与乙烯基降冰片烯的比例小于1:1(例如介于1:10至1:1或介于1:5至1:1)之间时，所得寡聚物于有机溶剂中拥有更好的溶解度，增加其可加工性。
组合物及其固化物的性质测量
实施例12
将实施例1所得的寡聚物(1)(50重量份)及苯乙烯与丁二烯的共聚物树脂(由Sartomer制造、商品编号Ricon 100、分子量4,500)(50重量份)加入一反应瓶中，并加甲苯(60重量份)作为溶剂。均匀混合后，加入40重量份的1,3,5-三-2-丙烯基-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮(1,3,5-tri-2-propenyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione、TAIC)以及6重量份的起始剂(1,3-二(叔丁基过氧化异丙基)苯、由日油股份有限公司制造及贩售、商品编号为Perbutyl P)于该反应瓶中，得到一组合物。接着，利用刮刀涂布法(使用300μm刮刀、且涂布机转速为300rpm)将上述组合物涂布于一铜箔(由古河铜箔制造及贩售)上。接着，将涂布有该组合物铜箔于氮气中加热至90℃维持30分钟后，接着加热至160℃维持10分钟。接着，于氮气中加热至210℃维持2小时后，加热至250℃维持4小时。最后，移除铜箔并将所得的固化物裁切，得到基材(1)(3mm×8cm)。
使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(1)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表3所示。
比较例5
依实施例12所述的方式进行，除了将实施例1所得的寡聚物(1)以比较例4所得的寡聚物(15)取代，得到基材(2)。接着，使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(2)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表3所示。
表3
由于实施例1所述的寡聚物(1)进一步添加降冰片二烯进行加成聚合反应，所以寡聚物(1)具有枝状结构(branched structure)。与线性寡聚物(例如寡聚物(15))相比，具有枝状结构的寡聚物(1)具有较低的结晶度(crystallinity)，因此分子量较易控制且溶解度良好，并显现出良好的加工性。由表3可得知，与比较例5所述由线性寡聚物(15)制备的基材(2)相比，由于实施例12所述的基材(1)系由包含具有枝状结构的寡聚物(1)所制备而得，因此所得的基材(1)有较低介电常数及较低介电损失因子。
本发明的实施例寡聚物系有添加反应物(b)进行聚合反应，具有枝状结构(branched structure)，其分支率约达50％以上。
实施例13
依实施例12所述的方式进行，除了将实施例1所得的寡聚物(1)以实施例8所得的寡聚物(8)取代，得到基材(3)。接着，使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(3)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表4所示。
实施例14
依实施例12所述的方式进行，除了将实施例1所得的寡聚物(1)以实施例9所得的寡聚物(9)取代，得到基材(4)。接着，使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(4)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表4所示。
表4
由表4可得知，由于寡聚物(8)-(9)与寡聚物(1)同样具有枝状结构，因此由寡聚物(8)-(9)所制备而得的基材亦具有较低介电常数及较低介电损失因子。
实施例15
依实施例12所述的方式进行，除了将实施例1所得的寡聚物(1)以实施例4所得的寡聚物(4)取代，得到基材(5)。接着，使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(5)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表5所示。
实施例16
依实施例12所述的方式进行，除了将实施例1所得的寡聚物(1)以实施例5所得的寡聚物(5)取代，得到基材(6)。接着，使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(6)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表5所示。
实施例17
依实施例12所述的方式进行，除了将实施例1所得的寡聚物(1)以实施例6所得的寡聚物(6)取代，得到基材(7)。接着，使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(7)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表5所示。
比较例6
依实施例12所述的方式进行，除了将实施例1所得的寡聚物(1)以比较例1所得的寡聚物(12)取代，得到基材(8)。接着，使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(8)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表5所示。
比较例7
依实施例12所述的方式进行，除了将实施例1所得的寡聚物(1)以比较例2所得的寡聚物(13)取代，得到基材(9)。接着，使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(9)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表5所示。
比较例8
依实施例12所述的方式进行，除了将实施例1所得的寡聚物(1)以比较例3所得的寡聚物(14)取代，得到基材(10)。接着，使用微波诱电分析仪(microwave dielectrometer，购自AET公司)于10GHz频率下测量基材(10)的介电常数(dielectric constant、Dk)及耗散因子(dissipation factor、Df)，结果如表5所示。
表5
由表5可得知，由包含本发明所述组合物(包含本发明所述具有枝状结构的寡聚物)所制备而得的基材，具有较低介电常数及较低介电损失因子。
由表3至表5可得知，由于本发明所述的组合物包含本发明所述的寡聚物，因此其固化产物具有较低的介电常数(dielectric constant、Dk)(小于或等于2.5(于10GHz时))及耗散因子(dissipation factor、Df)(小于或等于0.0020(于10GHz时))，适合作为高频基板材料。
虽然本发明已以数个实施例揭露如上，然其并非用以限定本发明，任何本技术领域中具有通常知识者，在不脱离本发明的精神和范围内，当可作任意的更动与润饰，因此本发明的保护范围当视后附的权利要求所界定者为准。

Claims (17)

1.一种寡聚物，其为反应物(a)及反应物(b)的反应产物，其中该寡聚物的数目平均分子量为1,000至10,000；反应物(a)为反应物(c)及反应物(d)的反应产物；反应物(b)为具有式(I)结构的化合物、具有式(II)结构的化合物、具有式(III)结构的化合物、具有式(IV)结构的化合物、式的化合物、或上述的组合
其中，a为0或1、以及，R1独立为H、或其中，b为0或1至6的整数、c为0或1、d为0或1至6的整数、以及至少一R1不为氢；反应物(c)为具有式(V)结构的化合物、具有式(VI)结构的化合物、或上述的组合
其中，R2独立为C5-10烷基；反应物(d)为具有式(VII)结构的化合物
其中，e为0或1至10的整数，其中该反应物(c)及该反应物(d)的重量比为1:10至10:1，以及该反应物(c)及该反应物(b)的重量比为1:1至20:1。
2.如权利要求1所述的寡聚物，其中该反应物(c)及该反应物(d)的重量比为1:10至1:1。
3.如权利要求2所述的寡聚物，其中该寡聚物于室温下完全溶解于重量与该寡聚物相同的甲苯中。
4.如权利要求1所述的寡聚物，其中该反应物(c)及该反应物(b)的重量比为1:1至10:1。
5.如权利要求1所述的寡聚物，其中该反应物(b)为
6.如权利要求1所述的寡聚物，其中该反应物(b)为
7.如权利要求1所述的寡聚物，其中该反应物(c)为
8.如权利要求1所述的寡聚物，其中该反应物(d)为 或上述的组合。
9.一种组合物，包含：
100重量份的权利要求1所述寡聚物；以及
20-110重量份的交联剂。
10.如权利要求9所述的组合物，其中该交联剂为乙二醇二甲基丙烯酸酯(ethyleneglycol dimethacrylate、EGDMA)、1,4-丁二醇二丙烯酸酯(1,4-butanediol diacrylate)、三聚氰酸三烯丙基酯(triallyl cyanurate)、三烯丙基异三聚氰酸酯(triallylisocyanurate、TAIC)、三甲代烯丙基异三聚氰酸酯(trimethallyl isocyanurate、TMAIC)、丙烯酸-2-羟乙基酯(2-Hydroxyethyl Acrylate)、邻苯二甲酸二烯丙酯(diallylphthalate)、间苯二甲酸二烯丙酯(diallyl isophthalate)、对苯二甲酸二烯丙酯(diallyl terephthalate)、丙烯酸羟丙酯(hydroxypropyl acrylate)、甲基丙烯酸2-羟乙酯(2-hydroxyethyl methacrylate)、1,2,4-苯三甲酸三烯丙酯(1,2,4-triallyltrimellitate)、二乙烯苯(divinylbenzene)、或上述的组合。
11.如权利要求9所述的组合物，还包含：
1-200重量份的树脂。
12.如权利要求11所述的组合物，其中该树脂为环氧树脂(epoxy resin)、氰酸酯树脂(cyanate resin)、苯酚树脂(phenol resin)、酚醛树脂(novolac resin)、聚苯乙烯树脂(polystyrene resin)、苯乙烯丁二烯共聚物树脂(styrene-butadiene copolymerresin)、聚酰胺树脂(polyamide resin)、聚酰亚胺树脂(polyimide resin)、马来酰亚胺(maleimide)树脂、双马来酰亚胺(bismaleimide)树脂、聚苯醚树脂(polyphenylene etherresin)、或上述的组合。
13.如权利要求9所述的组合物，还包含：
1-30重量份的添加剂。
14.如权利要求13所述的组合物，其中该添加剂为起始剂、硬化剂、平坦剂、填充物、色料、消泡剂、耐燃剂、或上述的组合。
15.一复合材料，包含：
权利要求9所述组合物所形成的固化物或半固化物；以及基材，其中该固化物或半固化物位于该基材之上或位于该基材之中。
16.如权利要求15所述的复合材料，其中该基材为玻璃纤维、或铜箔。
17.如权利要求15所述的复合材料，其中该复合材料为铜箔基板、或印刷电路板。
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