CN107293500A - 一种系统级封装打线方法及装置 - Google Patents

一种系统级封装打线方法及装置 Download PDF

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CN107293500A
CN107293500A CN201710509770.2A CN201710509770A CN107293500A CN 107293500 A CN107293500 A CN 107293500A CN 201710509770 A CN201710509770 A CN 201710509770A CN 107293500 A CN107293500 A CN 107293500A
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metal ball
lead
ball
routing
pad
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陈伯昌
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National Center for Advanced Packaging Co Ltd
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    • HELECTRICITY
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/48477Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48478Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/48479Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball on the semiconductor or solid-state body
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    • H01L2224/484Connecting portions
    • H01L2224/48475Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
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    • H01L2224/4848Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本发明提供了一种系统级封装打线方法及装置,该方法包括通过电火花放电在引线末端形成第一金属球,在基板金手指上进行球形焊接,焊接第一金属球,控制焊线工具运动,切断引线,通过电火花放电在引线末端形成第二金属球,在芯片的焊盘上进行球形焊接,焊接第二金属球,控制焊线工具从第二金属球上移动升高到预设线弧顶端位置,再移动至第一金属球,形成预设线弧形状的指定引线,将指定引线楔形焊接至第一金属球。通过本发明解决了现有技术中的正向打线技术引线直接接触基板会造成打线过程频繁出现报警,而反向打线技术虽然避免了引线直接接触基板,但是线弧模式限制会造成在叠层焊盘上打线上容易出现碰线的问题。

Description

一种系统级封装打线方法及装置
技术领域
本发明涉及半导体技术领域,具体涉及一种系统级封装打线方法及装置。
背景技术
系统级封装(SIP,system in package)是指将多个具有不同功能的有源与无源元件,以及诸如微机电系统(MEMS)、光学(Optics)元件等其他元件组合在同一封装中,成为可提供多种功能的单颗标准封装的组件,形成一个系统或子系统。
目前大多数SIP封装主要通过表面贴装技术SMT结合贴片打线的形式完成整个内部组装,SMT之后会通过回流焊固定成型,通过水洗来清洗基板表面的助焊剂残留,这些制程会造成打线过程中频繁出现NSOL(2焊点翘起)、short tail(缩线)、EFO open(打火线路断开)等诸多报警,对打线作业影响很大,无法保证打线的高良率,同时也会相应提高打线的成本,后期亦无法保证产品的可靠性。
常见的打线线弧方式有两种:正向打线(forward loop)和反向打线(reverseloop)两种,打线过程如下。
a.正向打线如图1所示:1焊点在打线焊盘pad上,2焊点在基板金手指(finger)上。作业顺序是先在焊针末端烧球,然后球焊(ball bond)将金球打在打线pad上,后将线弧扯出,楔形焊(wedge bond)打在基板金手指上;
b.反向打线如图2所示:1焊点在打线焊盘(pad)上,2焊点在基板金手指(finger)上。作业顺序是先在焊针末端烧球,然后将球焊(ball bond)打在打线pad上,完成后在金球上端通过机器焊针运动将线切断,重新在焊针末端烧球,然后将ball bond打在基板finger上,将线弧扯出,楔形焊(wedge bond)打在打线pad的金球上。
如图3所示,正向打线速度较快,适用叠层pad打线,对基板finger金手指表面清洁度要求较高,类似SIP类封装在经过回流清洗后基板表面清洁度难以保证,使用正向打线会造成很多报警;而反向打线速度稍慢,作业制程稳定报警较少,但因线弧模式限制,无法较好的应用在叠层pad打线上面,如图4所示,碰线的概率非常高。
发明内容
有鉴于此,本发明实施例提供了一种系统级封装打线方法及装置,以解决现有SIP封装中的打线方式,正向打线过程稳定性差、作业过程报警多,反向打线但因线弧模式限制,碰线的概率高的问题。
为此,本发明实施例提供了如下技术方案:
本发明实施例提供了一种系统级封装打线方法,包括:通过电火花放电在引线末端形成第一金属球;在基板金手指上进行球形焊接,焊接所述第一金属球;控制焊线工具运动,切断引线;通过电火花放电在引线末端形成第二金属球;在芯片的焊盘上进行球形焊接,焊接所述第二金属球;控制焊线工具从所述第二金属球上移动升高到预设线弧顶端位置,再移动至所述第一金属球,形成所述预设线弧形状的指定引线;将所述指定引线楔形焊接至所述第一金属球。
可选地,在基板金手指上进行球形焊接,焊接所述第一金属球的方式包括以下至少之一:热压焊、热超声焊。
可选地,在芯片的焊盘上进行球形焊接,焊接所述第二金属球的方式包括以下至少之一:热压焊、热超声焊。
可选地,控制焊线工具从所述第二金属球上移动升高到预设线弧顶端位置,再移动至所述第一金属球,形成所述预设线弧形状的指定引线,包括:将所述预设线弧选择为反向线弧。
本发明实施例还提供了一种系统级封装打线装置,包括打线设备,还包括:焊线工具,安装在所述打线设备上,用于在基板金手指上进行球形焊接,焊接第一金属球之后,所述打线设备控制焊线工具运动,切断引线,其中,通过电火花放电在引线末端形成所述第一金属球;芯片和焊盘,所述焊盘在所述芯片上,所述打线设备控制所述焊线工具在所述焊盘上进行球形焊接,焊接第二金属球,其中,通过电火花放电在引线末端形成所述第二金属球;所述打线设备还用于控制所述焊线工具从所述第二金属球上移动升高到预设线弧顶端位置,再移动至所述第一金属球,形成所述预设线弧形状的指定引线,并将所述指定引线楔形焊接至所述第一金属球。
可选地,所述打线设备焊接所述第一金属球的方式包括以下至少之一:热压焊、热超声焊。
可选地,所述打线设备焊接所述第二金属球的方式包括以下至少之一:热压焊、热超声焊。
可选地,在所述打线设备上将所述预设线弧选择为反向线弧。
本发明实施例技术方案,具有如下优点:
本发明实施例提供了一种系统级封装打线方法及装置,该方法包括通过电火花放电在引线末端形成第一金属球,在基板金手指上进行球形焊接,焊接第一金属球,控制焊线工具运动,切断引线,通过电火花放电在引线末端形成第二金属球,在芯片的焊盘上进行球形焊接,焊接第二金属球,控制焊线工具从第二金属球上移动升高到预设线弧顶端位置,再移动至第一金属球,形成预设线弧形状的指定引线,将指定引线楔形焊接至第一金属球。通过本发明实施例中先在基板上球形焊接第一金属球,切断引线,再在芯片的焊盘上球形焊接第二金属球,然后将引线焊接至基板的第一金属球上,解决了现有技术中的正向打线技术引线直接接触基板会造成打线过程频繁出现报警,而反向打线技术虽然避免了引线直接接触基板,但是线弧模式限制会造成在叠层焊盘上打线上容易出现碰线的问题。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案,下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是SIP封装中正向打线示意图;
图2是SIP封装中反向打线示意图;
图3是SIP封装中叠层焊盘正向打线示意图;
图4是SIP封装中叠层焊盘反向打线示意图;
图5是根据本发明实施例的系统级封装打线方法的流程图;
图6是根据本发明实施的系统级封装打线装置的示意图;
图7是根据本发明实施例的系统级封装打线装置的一个打线示意图。
具体实施方式
下面将结合附图对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在本发明的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,还可以是两个元件内部的连通,可以是无线连接,也可以是有线连接。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。
此外,下面所描述的本发明不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
实施例1
在本实施例中提供了一种系统级封装打线方法,图5是根据本发明实施例的系统级封装打线方法的流程图,如图5所示,该流程包括如下步骤:
S101:通过电火花放电在引线末端形成第一金属球;具体地,采用电火花放电在引线末端形成金属球是球形焊区别于楔形焊的一个特点,这种键合方式可以避免在基板或者焊盘表面形成凹槽;
S102:在基板金手指上进行球形焊接,焊接第一金属球;在打线设备上将第一焊点设置在基板金手指上,使打线设备在工作时先对基板金手指进行球形焊;
S103:控制焊线工具运动,切断引线;在给基板金手指上焊接金属球之后,打线设备控制焊线工具运动,通过机器运动切断引线,然后打线设备运动到第二焊点的上方;
S104:通过电火花放电在引线末端形成第二金属球;焊线工具移动到第二焊点上方后,通过电火花放电在引线末端烧球,是为了在芯片的焊盘上进行球形焊做准备;
S105:在芯片的焊盘上进行球形焊接,焊接第二金属球;在打线设备上将第二焊点设置在芯片的焊盘上,打线设备控制焊线工具将引线末端形成的第二金属球焊接到焊盘上;
S106:控制焊线工具从第二金属球上移动升高到预设线弧顶端位置,再移动至第一金属球,形成预设线弧形状的指定引线;在打线设备上选择引线的线弧形式,焊线工具焊接好第二金属球之后,牵引引线运动到预设线弧的顶端位置,然后移动至第一金属球,这样就形成了预设线弧形状的指定引线;
S107:将所述指定引线楔形焊接至第一金属球;在引线移动到基板上预植的第一金属球上之后,焊线工具采用楔形焊将引线焊接至第一金属球,这样就使基板与芯片连接起来,形成电路,但是引线不直接接触基板,而是焊接在基板金手指上的金属球上,这样就减少了因为引线直接楔形焊接在基板上而造成的报警,使打线制程更为稳定。
通过上述步骤,通过电火花放电在引线末端形成第一金属球,在基板金手指上进行球形焊接,焊接第一金属球,控制焊线工具运动,切断引线;通过电火花放电在引线末端形成第二金属球,在芯片的焊盘上进行球形焊接,焊接第二金属球,控制焊线工具从第二金属球上移动升高到预设线弧顶端位置,再移动至第一金属球,形成预设线弧形状的指定引线,将指定引线楔形焊接至第一金属球。先在基板上球形焊接第一金属球,切断引线,再在芯片的焊盘上球形焊接第二金属球,然后将引线焊接至基板的第二金属球上,解决了现有技术中的正向打线技术引线直接接触基板会造成打线过程频繁出现报警,而反向打线技术虽然避免了引线直接接触基板,但是线弧模式限制会造成在叠层焊盘上打线上容易出现碰线的问题。
上述步骤S102涉及到在基板金手指上进行球形焊接,焊接第一金属球,在一个可选实施方式中,焊接第一金属球的方式包括以下至少之一:热压焊、热超声焊。热压焊是将键合引线与器件同时加热加压,使二者的接触面产生塑性变形,两种金属原子产生相互扩散,由于接触面的不平整,在一定压力作用下,高低不平的接触面相互填充,而产生弹性嵌合作用,最后使两者紧密结合,形成牢固的键接。热超声焊是在键合引线与器件之间施加压力的同时,在被焊件之间产生超声频率的弹性振动,破坏被焊件之间的界面上的氧化层,并产生热量,使两固态金属牢固键合。
上述步骤S105涉及到在芯片的焊盘上进行球形焊接,焊接第二金属球,在具体实施过程中,第二金属球的焊接方式包括以下至少之一:热压焊和热超声焊。热压焊和热超声焊的原理同上述步骤S102中第一金属球的焊接方式。
上述步骤S106涉及到控制焊线工具从第二金属球上移动升高到预设线弧顶端位置,再移动至第一金属球,形成预设线弧形状的指定引线,在具体实施过程中,在打线设备上将打线线弧的形式选择为反向线弧,即从第二焊点将引线拉至第一焊点进行焊接,这种方式为反向拱丝工艺。在其他实施方式中,可以根据需要选择不同的线弧弧形。
实施例2
在本实施例中还提供了一种系统级封装打线装置,该装置用于实现上述实施例及优选实施方式,已经进行过说明的不再赘述。
本实施例提供一种系统级封装打线装置,包括打线设备,还包括安装在打线设备上的焊线工具,如图6所示,该焊线工具用于在基板金手指61上进行球形焊接,焊接第一金属球之后,打线设备控制焊线工具运动,切断引线,其中,通过电火花放电在引线末端形成第一金属球;芯片62和焊盘63,焊盘63在芯片62上,打线设备控制焊线工具在焊盘63上进行球形焊接,焊接第二金属球,其中,通过电火花放电在引线末端形成第二金属球;打线设备还用于控制焊线工具从第二金属球上移动升高到预设线弧顶端位置,再移动至第一金属球,形成预设线弧形状的指定引线,并将该指定引线楔形焊接至第一金属球。具体地,在打线设备上将第一焊点设置在基板金手指61上,第二焊点设置在焊盘63上,先在基板金手指61上球形焊接第一金属球,然后切断引线,再在焊盘63上球形焊接第二金属球,从第二金属球上拉引线至第二金属球,再将引线楔形焊接至第二金属球,从而将基板金手指61与芯片62通过引线连接起来,解决了现有技术中的正向打线技术引线直接接触基板会造成打线过程频繁出现报警,而反向打线技术虽然避免了引线直接接触基板,但是线弧模式限制会造成在叠层焊盘上打线上容易出现碰线的问题。
具体地,上述打线设备焊接第一金属球至基板金手指61上的方式包括以下至少之一:热压焊、热超声焊,其中在焊接第一金属球至基板金手指61上时可以选择热压焊,也可以选择热超声焊,热压焊与热超声焊的具体原理同上述方法步骤的陈述。
上述打线设备焊接第二金属球至焊盘63上的方式包括以下至少之一:热压焊、热超声焊,其中在焊接第二金属球至焊盘63上时可以选择热压焊,也可以选择热超声焊,热压焊与热超声焊的具体原理同上述方法步骤的陈述。
在本实施例中,在打线设备上将打线线弧的形式选择为反向线弧,即从第二焊点将引线拉至第一焊点进行焊接,这种方式为反向拱丝工艺。在其他实施方式中,可以根据需要选择不同的线弧弧形。
图7是根据本发明实施例的系统级封装打线装置的一个打线示意图,如图7所示,在一个可选实施例中,在焊盘631和焊盘632上打线,先在打线设备上将第一焊点设置在基板金手指61上,第二焊点设置在焊盘631上,打线设备上的线弧形式选择为反向线弧,在第一焊点球形焊第一金属球之后,切断引线,在焊盘631上球形焊第二金属球,然后打线设备控制焊线工具拉出引线为设定线弧的形式至基板金手指上预植的第一金属球上,然后将引线楔形焊接至第一金属球,至此完成焊盘631与基板金手指61的连接,用此方式完成焊盘632与基板金手指61的连接,因为基板金手指61上有金属球的支撑,可以有效避免引线直接接触基板金手指61,避免了打线作业过程中频繁报警的状况,同时引线从芯片62上的金属球连接基板金手指61,可选的线弧弧形多,避免了由于传统反向打线线弧模式的限制,在叠层焊盘上打线时容易出现碰线的问题。
上述各个结构的更进一步的功能描述与上述对应实施例相同,在此不再赘述。
显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。

Claims (8)

1.一种系统级封装打线方法,其特征在于,包括:
通过电火花放电在引线末端形成第一金属球;
在基板金手指上进行球形焊接,焊接所述第一金属球;
控制焊线工具运动,切断引线;
通过电火花放电在引线末端形成第二金属球;
在芯片的焊盘上进行球形焊接,焊接所述第二金属球;
控制焊线工具从所述第二金属球上移动升高到预设线弧顶端位置,再移动至所述第一金属球,形成所述预设线弧形状的指定引线;
将所述指定引线楔形焊接至所述第一金属球。
2.根据权利要求1所述的系统级封装打线方法,其特征在于,在基板金手指上进行球形焊接,焊接所述第一金属球的方式包括以下至少之一:热压焊、热超声焊。
3.根据权利要求1所述的系统级封装打线方法,其特征在于,在芯片的焊盘上进行球形焊接,焊接所述第二金属球的方式包括以下至少之一:热压焊、热超声焊。
4.根据权利要求1至3中任一所述的系统级封装打线方法,其特征在于,控制焊线工具从所述第二金属球上移动升高到预设线弧顶端位置,再移动至所述第一金属球,形成所述预设线弧形状的指定引线,包括:
将所述预设线弧选择为反向线弧。
5.一种系统级封装打线装置,包括打线设备,其特征在于,还包括:
焊线工具,安装在所述打线设备上,用于在基板金手指上进行球形焊接,焊接第一金属球之后,所述打线设备控制焊线工具运动,切断引线,其中,通过电火花放电在引线末端形成所述第一金属球;
芯片和焊盘,所述焊盘在所述芯片上,所述打线设备控制所述焊线工具在所述焊盘上进行球形焊接,焊接第二金属球,其中,通过电火花放电在引线末端形成所述第二金属球;
所述打线设备还用于控制所述焊线工具从所述第二金属球上移动升高到预设线弧顶端位置,再移动至所述第一金属球,形成所述预设线弧形状的指定引线,并将所述指定引线楔形焊接至所述第一金属球。
6.根据权利要求5所述的系统级封装打线装置,其特征在于,所述打线设备焊接所述第一金属球的方式包括以下至少之一:热压焊、热超声焊。
7.根据权利要求5所述的系统级封装打线装置,其特征在于,所述打线设备焊接所述第二金属球的方式包括以下至少之一:热压焊、热超声焊。
8.根据权利要求5至7中任一所述的系统级封装打线装置,其特征在于,在所述打线设备上将所述预设线弧选择为反向线弧。
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