CN107275301B - 发光装置 - Google Patents

发光装置 Download PDF

Info

Publication number
CN107275301B
CN107275301B CN201710204609.4A CN201710204609A CN107275301B CN 107275301 B CN107275301 B CN 107275301B CN 201710204609 A CN201710204609 A CN 201710204609A CN 107275301 B CN107275301 B CN 107275301B
Authority
CN
China
Prior art keywords
light
lead
resin
resin frame
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710204609.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN107275301A (zh
Inventor
宇川宏明
市川晋一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of CN107275301A publication Critical patent/CN107275301A/zh
Application granted granted Critical
Publication of CN107275301B publication Critical patent/CN107275301B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201710204609.4A 2016-03-31 2017-03-30 发光装置 Active CN107275301B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-070432 2016-03-31
JP2016070432A JP6790416B2 (ja) 2016-03-31 2016-03-31 発光装置

Publications (2)

Publication Number Publication Date
CN107275301A CN107275301A (zh) 2017-10-20
CN107275301B true CN107275301B (zh) 2022-08-02

Family

ID=58464303

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710204609.4A Active CN107275301B (zh) 2016-03-31 2017-03-30 发光装置

Country Status (4)

Country Link
US (1) US10593847B2 (enExample)
EP (1) EP3226312B1 (enExample)
JP (1) JP6790416B2 (enExample)
CN (1) CN107275301B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7037046B2 (ja) 2018-01-31 2022-03-16 日亜化学工業株式会社 発光装置及びその製造方法
JP6777104B2 (ja) 2018-01-31 2020-10-28 日亜化学工業株式会社 発光装置及びその製造方法
JP6777105B2 (ja) 2018-01-31 2020-10-28 日亜化学工業株式会社 発光装置の製造方法
JP6822442B2 (ja) * 2018-03-01 2021-01-27 日亜化学工業株式会社 発光装置およびその製造方法
US10873015B2 (en) 2018-03-01 2020-12-22 Nichia Corporation Light emitting device and method of manufacturing the light emitting device
JP6760324B2 (ja) 2018-03-27 2020-09-23 日亜化学工業株式会社 発光装置
JP6879270B2 (ja) * 2018-07-20 2021-06-02 日亜化学工業株式会社 発光装置
JP6975916B2 (ja) * 2018-08-09 2021-12-01 日亜化学工業株式会社 発光装置
KR102646700B1 (ko) * 2018-08-16 2024-03-13 엘지이노텍 주식회사 조명 장치
JP7181489B2 (ja) * 2019-01-31 2022-12-01 日亜化学工業株式会社 発光装置及びその製造方法
JP7248887B2 (ja) * 2019-02-15 2023-03-30 日亜化学工業株式会社 樹脂パッケージ及び発光装置
JP6916450B2 (ja) * 2019-04-01 2021-08-11 日亜化学工業株式会社 発光装置及びその製造方法
JP7121312B2 (ja) * 2020-03-26 2022-08-18 日亜化学工業株式会社 発光装置
US11769862B2 (en) 2020-03-26 2023-09-26 Nichia Corporation Light emitting device
JP7137084B2 (ja) * 2020-09-02 2022-09-14 日亜化学工業株式会社 発光装置
JP7389363B2 (ja) * 2021-05-26 2023-11-30 日亜化学工業株式会社 発光装置
JP2023082632A (ja) * 2021-12-02 2023-06-14 スタンレー電気株式会社 半導体発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103718314A (zh) * 2011-08-12 2014-04-09 夏普株式会社 发光装置
CN104078551A (zh) * 2013-03-29 2014-10-01 日亚化学工业株式会社 发光装置及其制造方法
JP2015115407A (ja) * 2013-12-10 2015-06-22 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光素子用配線基板、半導体発光装置、および、それらの製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4307090B2 (ja) * 2003-01-27 2009-08-05 京セラ株式会社 発光素子収納用パッケージおよび発光装置
DE112006004259A5 (de) * 2005-11-21 2012-09-06 Seoul Semiconductor Co., Ltd. Lichtemittierendes Element
JP2008108836A (ja) * 2006-10-24 2008-05-08 Sharp Corp 半導体発光装置およびその製造方法
JP5236406B2 (ja) * 2008-03-28 2013-07-17 ローム株式会社 半導体発光モジュールおよびその製造方法
KR100888236B1 (ko) 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
JP2011100862A (ja) * 2009-11-06 2011-05-19 Sanyo Electric Co Ltd 発光装置およびその製造方法
TW201128812A (en) 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
KR101064084B1 (ko) * 2010-03-25 2011-09-08 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
KR101039994B1 (ko) * 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛
JP5481277B2 (ja) 2010-06-04 2014-04-23 シャープ株式会社 発光装置
WO2012117974A1 (ja) * 2011-02-28 2012-09-07 日亜化学工業株式会社 発光装置
KR101832306B1 (ko) * 2011-05-30 2018-02-26 엘지이노텍 주식회사 발광소자 패키지
JP2012256651A (ja) 2011-06-07 2012-12-27 Mitsubishi Chemicals Corp 半導体発光装置用樹脂パッケージ及びその製造方法並びに該樹脂パッケージを有してなる半導体発光装置
KR101830717B1 (ko) * 2011-06-30 2018-02-21 엘지이노텍 주식회사 발광 소자 패키지
JP2013058739A (ja) * 2011-08-17 2013-03-28 Dainippon Printing Co Ltd 光半導体装置用リードフレーム、樹脂付き光半導体装置用リードフレーム、光半導体装置、および、光半導体装置用リードフレームの製造方法
KR101905535B1 (ko) * 2011-11-16 2018-10-10 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 장치
CN104054189B (zh) * 2011-11-17 2018-06-26 株式会社流明斯 发光元件封装体以及包括该发光元件封装体的背光单元
JP2013206895A (ja) 2012-03-27 2013-10-07 Shin Etsu Chem Co Ltd 光学半導体装置用基板とその製造方法、及び光学半導体装置とその製造方法
KR101911047B1 (ko) * 2012-07-25 2018-10-24 삼성디스플레이 주식회사 케이스 및 표시 장치
US20140070235A1 (en) 2012-09-07 2014-03-13 Peter Scott Andrews Wire bonds and light emitter devices and related methods
KR102019499B1 (ko) * 2012-11-05 2019-09-06 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
JP2014120515A (ja) * 2012-12-13 2014-06-30 Shin Etsu Chem Co Ltd 光学半導体装置用基板とその製造方法、集合基板、及び光学半導体装置とその製造方法
KR102029802B1 (ko) * 2013-01-14 2019-10-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
JP6303457B2 (ja) 2013-12-04 2018-04-04 日亜化学工業株式会社 発光装置およびその製造方法
JP6487626B2 (ja) * 2014-03-24 2019-03-20 スタンレー電気株式会社 半導体装置
JP6274434B2 (ja) * 2014-07-30 2018-02-07 豊田合成株式会社 シリコーン樹脂組成物およびそれを用いた発光装置
JP2016070432A (ja) 2014-09-30 2016-05-09 アイシン・エィ・ダブリュ株式会社 摩擦係合装置及び駆動伝達装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103718314A (zh) * 2011-08-12 2014-04-09 夏普株式会社 发光装置
CN104078551A (zh) * 2013-03-29 2014-10-01 日亚化学工业株式会社 发光装置及其制造方法
JP2015115407A (ja) * 2013-12-10 2015-06-22 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光素子用配線基板、半導体発光装置、および、それらの製造方法

Also Published As

Publication number Publication date
US10593847B2 (en) 2020-03-17
EP3226312A1 (en) 2017-10-04
US20170288104A1 (en) 2017-10-05
CN107275301A (zh) 2017-10-20
EP3226312B1 (en) 2021-03-24
JP6790416B2 (ja) 2020-11-25
JP2017183578A (ja) 2017-10-05

Similar Documents

Publication Publication Date Title
CN107275301B (zh) 发光装置
US10361347B2 (en) Light emitting device
JP5707697B2 (ja) 発光装置
JP6524904B2 (ja) 発光装置
JP5515992B2 (ja) 発光装置
US8723409B2 (en) Light emitting device
US11233184B2 (en) Light-emitting device and method for manufacturing the same
KR20060107428A (ko) 발광장치
JP6891797B2 (ja) ディスプレイ装置
JP6606966B2 (ja) 発光装置及びその製造方法
US12471420B2 (en) Light emitting device
JP5786278B2 (ja) 発光装置
CN107026228A (zh) 发光装置
JP6658787B2 (ja) 発光装置
JP5899734B2 (ja) 発光装置
JP7137079B2 (ja) 発光装置及びその製造方法
US9564565B2 (en) Light emitting device, light emitting module, and method for manufacturing light emitting device
JP6985615B2 (ja) 発光装置
JP7181489B2 (ja) 発光装置及びその製造方法
JP7137084B2 (ja) 発光装置
JP6593062B2 (ja) 発光装置
JP6974746B2 (ja) 発光装置及びその製造方法
JP7121312B2 (ja) 発光装置
JP7177327B2 (ja) 発光装置
JP2025107436A (ja) 発光モジュール

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TG01 Patent term adjustment
TG01 Patent term adjustment