CN107275301B - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN107275301B
CN107275301B CN201710204609.4A CN201710204609A CN107275301B CN 107275301 B CN107275301 B CN 107275301B CN 201710204609 A CN201710204609 A CN 201710204609A CN 107275301 B CN107275301 B CN 107275301B
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China
Prior art keywords
light
lead
resin
resin frame
emitting element
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CN201710204609.4A
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Chinese (zh)
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CN107275301A (zh
Inventor
宇川宏明
市川晋一
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201710204609.4A 2016-03-31 2017-03-30 发光装置 Active CN107275301B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016070432A JP6790416B2 (ja) 2016-03-31 2016-03-31 発光装置
JP2016-070432 2016-03-31

Publications (2)

Publication Number Publication Date
CN107275301A CN107275301A (zh) 2017-10-20
CN107275301B true CN107275301B (zh) 2022-08-02

Family

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Family Applications (1)

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CN201710204609.4A Active CN107275301B (zh) 2016-03-31 2017-03-30 发光装置

Country Status (4)

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US (1) US10593847B2 (enExample)
EP (1) EP3226312B1 (enExample)
JP (1) JP6790416B2 (enExample)
CN (1) CN107275301B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6777105B2 (ja) 2018-01-31 2020-10-28 日亜化学工業株式会社 発光装置の製造方法
JP7037046B2 (ja) * 2018-01-31 2022-03-16 日亜化学工業株式会社 発光装置及びその製造方法
JP6777104B2 (ja) * 2018-01-31 2020-10-28 日亜化学工業株式会社 発光装置及びその製造方法
JP6822442B2 (ja) * 2018-03-01 2021-01-27 日亜化学工業株式会社 発光装置およびその製造方法
US10873015B2 (en) 2018-03-01 2020-12-22 Nichia Corporation Light emitting device and method of manufacturing the light emitting device
JP6760324B2 (ja) 2018-03-27 2020-09-23 日亜化学工業株式会社 発光装置
JP6879270B2 (ja) * 2018-07-20 2021-06-02 日亜化学工業株式会社 発光装置
JP6975916B2 (ja) * 2018-08-09 2021-12-01 日亜化学工業株式会社 発光装置
KR102646700B1 (ko) * 2018-08-16 2024-03-13 엘지이노텍 주식회사 조명 장치
JP7181489B2 (ja) * 2019-01-31 2022-12-01 日亜化学工業株式会社 発光装置及びその製造方法
JP7248887B2 (ja) * 2019-02-15 2023-03-30 日亜化学工業株式会社 樹脂パッケージ及び発光装置
JP6916450B2 (ja) * 2019-04-01 2021-08-11 日亜化学工業株式会社 発光装置及びその製造方法
JP7121312B2 (ja) * 2020-03-26 2022-08-18 日亜化学工業株式会社 発光装置
US11769862B2 (en) 2020-03-26 2023-09-26 Nichia Corporation Light emitting device
JP7137084B2 (ja) * 2020-09-02 2022-09-14 日亜化学工業株式会社 発光装置
JP7389363B2 (ja) * 2021-05-26 2023-11-30 日亜化学工業株式会社 発光装置
JP2023082632A (ja) * 2021-12-02 2023-06-14 スタンレー電気株式会社 半導体発光装置

Citations (3)

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CN103718314A (zh) * 2011-08-12 2014-04-09 夏普株式会社 发光装置
CN104078551A (zh) * 2013-03-29 2014-10-01 日亚化学工业株式会社 发光装置及其制造方法
JP2015115407A (ja) * 2013-12-10 2015-06-22 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光素子用配線基板、半導体発光装置、および、それらの製造方法

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JP5481277B2 (ja) 2010-06-04 2014-04-23 シャープ株式会社 発光装置
CN103392242B (zh) * 2011-02-28 2017-02-22 日亚化学工业株式会社 发光装置
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CN103718314A (zh) * 2011-08-12 2014-04-09 夏普株式会社 发光装置
CN104078551A (zh) * 2013-03-29 2014-10-01 日亚化学工业株式会社 发光装置及其制造方法
JP2015115407A (ja) * 2013-12-10 2015-06-22 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光素子用配線基板、半導体発光装置、および、それらの製造方法

Also Published As

Publication number Publication date
JP6790416B2 (ja) 2020-11-25
US10593847B2 (en) 2020-03-17
US20170288104A1 (en) 2017-10-05
JP2017183578A (ja) 2017-10-05
CN107275301A (zh) 2017-10-20
EP3226312A1 (en) 2017-10-04
EP3226312B1 (en) 2021-03-24

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