CN107256843A - 一种芯片压胶装置 - Google Patents

一种芯片压胶装置 Download PDF

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Publication number
CN107256843A
CN107256843A CN201710576274.9A CN201710576274A CN107256843A CN 107256843 A CN107256843 A CN 107256843A CN 201710576274 A CN201710576274 A CN 201710576274A CN 107256843 A CN107256843 A CN 107256843A
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moulding
chip
blanking
platform
groove
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周明
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NANTONG MINGXIN MICROELECTRONICS CO Ltd
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NANTONG MINGXIN MICROELECTRONICS CO Ltd
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

本发明公开了一种芯片压胶装置,包括压胶台,在压胶台上设置有弹性压座,在压胶台上设置凹槽,在凹槽底部设置有数个弹簧支撑件,弹性压座固定在弹簧支撑件上,在压胶太上设置有压胶结构,在压胶结构前侧的压胶台上设置有芯片放置台,芯片放置台包括支撑架,在支撑架前端设置有推动芯片的推动装置,支撑架与导向槽相连,导向槽端部设置在弹性压座上端,在弹性压座的另一侧设置有下料装置,下料装置包括下料台,在下料台上设置有旋转下料结构,下料台与传送带相连。本发明结构简单、设计合理,能够提高芯片加工速度,同时减少残次品的数量,降低生产成本。

Description

一种芯片压胶装置
技术领域
[0001] 本发明涉及芯片加工设备,具体的说是一种芯片压胶装置。
背景技术
[0002] 目前芯片压胶大多数采用人工手动控制压胶装置进行压胶,压胶速度慢,且工人 每天工作量大,压出的芯片容易出现质量问题,压胶后需要人工将芯片取出。
发明内容
[0003] 为了解决上述问题本发明提供了一种自动压胶和下料的芯片压胶装置。
[0004] 为了达到上述目的本发明是通过以下技术方案来实现的: 本发明是一种芯片压胶装置,包括压胶台,在压胶台上设置有弹性压座,在压胶台上设 置凹槽,在凹槽底部设置有数个弹簧支撑件,弹性压座固定在弹簧支撑件上,在压胶太上设 置有压胶结构,在压胶结构前侧的压胶台上设置有芯片放置台,芯片放置台包括支撑架,在 支撑架前端设置有推动芯片的推动装置,支撑架与导向槽相连,导向槽端部设置在弹性压 座上端,在弹性压座的另一侧设置有下料装置,下料装置包括下料台,在下料台上设置有旋 转下料结构,下料台与传送带相连。
[0005] 本发明的进一步改进在于:压胶结构包括设置在压胶台上的安装架,在安装架上 设置有压胶盘,压胶盘通过气缸连接在安装架下端。
[0006] 本发明的进一步改进在于:在弹性压座上设置有两个定位板,定位板与设置在凹 槽外侧的压胶台上设置有容纳定位板的定位槽,定位槽的深度与定位板的厚度相同。
[0007]本发明的进一步改进在于:旋转下料结构包括设置在下料台上的旋转座,旋转座 固定在旋转气缸上,在旋转台上设置有连接臂,在连接臂上设置有吸盘下料器。
[0008]本发明的进一步改进在于:在两个定位板端部的上表面设置有橡胶垫,两个定位 板分别处于下料台和导向槽下端。
[0009] 本发明的有益效果是:芯片在被传送带芯片放置台上后推动装置前端的红外线感 应器感应到芯片后,推动装置带动推动板带动将芯片推动到弹性压座上,弹性支撑件设置 在压胶结构的压胶盘正下方,弹性压座能够避免压胶盘直接作用在芯片上,避免芯片受到 的冲击力过大而损坏,下料装置的旋转台带动连接臂转动使吸盘处于弹性压座上方,连接 臂上的吸盘下料器吸住芯片旋转台再次转动,使吸盘处于传送带上方开始下料,在压胶和 下料的过程中不需要人工操作,同时能够确保芯片不会出现损坏。
[0010] 本发明结构简单、设计合理,能够提高芯片加工速度,同时减少残次品的数量,降 低生产成本。
附图说明
[0011]图1是本发明结构示意图。
[0012]其中:1-压胶台,2-弹性压座,3—压胶结构,4_支撑架,5-推动装置,6—导向槽,7一下 料台。
具体实施方式
[0013]为了加强对本发明的理解,下面将结合附图和实施例对本发明作进一步的详细描 述,该实施例仅用于解释本发明,并不对本发明的保护范围构成限定。
[0014]如图1所示,本发明是一种芯片压胶装置,包括压胶台i,在压胶台i上设置有弹性 压座2,在压胶台1上设置凹槽,在凹槽底部设置有数个弹簧支撑件,弹性压座2固定在弹簧 支撑件上,在压胶台1上设置有压胶结构3,在压胶结构3前侧的压胶台1上设置有芯片放置 台,芯片放置台包括支撑架4,在支撑架4前端设置有推动芯片的推动装置5,支撑架4与导向 槽6相连,导向槽6端部设置在弹性压座2上端,在弹性压座2的另一侧设置有下料装置,下料 装置包括下料台7,在下料台7上设置有旋转下料结构8,下料台7与传送带相连,压胶结构3 包括设置在压胶台1上的安装架,在安装架上设置有压胶盘,压胶盘通过气缸连接在安装架 下端,在弹性压座2上设置有两个定位板,定位板与设置在凹槽外侧的压胶台1上设置有容 纳定位板的定位槽,定位槽的深度与定位板的厚度相同,旋转下料结构8包括设置在下料台 7上的旋转座,旋转座固定在旋转气缸上,在旋转台上设置有连接臂,在连接臂上设置有吸 盘下料器,在两个定位板端部的上表面设置有橡胶垫,两个定位板分别处于下料台7和导向 槽6下端,推动装置5前端设置有推动板,推动装置5上的红外线感应器在感应到芯片后推动 板向前推动芯片,芯片在推动板的推动下从导向槽6端部落入弹性压座2上,导向槽6两侧设 置有防止芯片发生偏移的导向板,在安装架于弹性压座2相近的侧边且与弹性压座2的等高 处设置有红外线感应器,芯片落入弹性压座2上压胶盘在气缸的带动下向下压,弹性压座2 在弹性支撑件的支撑下向下收缩,弹性压座2在弹性支撑件的支撑作用下减缓了压胶盘对 芯片的冲力,压胶结束后吸盘下料器再旋转座的带动下进行下料,并由传送带直接将芯片 传送走。
[0015]本发明结构简单、设计合理,能够提高芯片加工速度,同时减少残次品的数量,降 低生产成本。

Claims (5)

1. 一种芯片压胶装置,包括压胶台(l),其特征在于:在所述压胶台a)上设置有弹性压 座(2),在所述压胶台a)上设置凹槽,在所述凹槽底部设置有数个弹簧支撑件,弹性压座 (2) 固定在所述弹簧支撑件上,在所述压胶台(1)上设置有压胶结构(3),在所述压胶结构 (3) 前侧的所述压胶台(1)上设置有芯片放置台,所述芯片放置台包括支撑架(4),在所述支 撑架(4)前端设置有推动芯片的推动装置(5),所述支撑架(4)与导向槽(6)相连,所述导向 槽(6)端部设置在所述弹性压座(2)上端,在所述弹性压座(2)的另一侧设置有下料装置,所 述下料装置包括下料台(7),在所述下料台(7)上设置有旋转下料结构(8),所述下料台(7) 与传送带相连。
2. 根据权利要求1所述一种芯片压胶装置,其特征在于:所述压胶结构(3)包括设置在 所述压胶台(1)上的安装架,在所述安装架上设置有压胶盘,所述压胶盘通过气缸连接在所 述安装架下端。
3. 根据权利要求1所述一种芯片压胶装置,其特征在于:在所述弹性压座(2)上设置有 两个定位板,所述定位板与设置在所述凹槽外侧的所述压胶台(1)上设置有容纳所述定位 板的定位槽,所述定位槽的深度与所述定位板的厚度相同。
4. 根据权利要求1所述一种芯片压胶装置,其特征在于:所述旋转下料结构(8)包括设 置在所述下料台(7)上的旋转座,所述旋转座固定在所述旋转气缸上,在所述旋转台上设置 有连接臂,在所述连接臂上设置有吸盘下料器。
5. 根据权利要求3所述一种芯片压胶装置,其特征在于:在两个定位板端部的上表面设 置有橡胶垫,两个所述定位板分别处于所述下料台(7)和所述导向槽(6)下端。
CN201710576274.9A 2017-07-14 2017-07-14 一种芯片压胶装置 Pending CN107256843A (zh)

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