CN107256843A - 一种芯片压胶装置 - Google Patents
一种芯片压胶装置 Download PDFInfo
- Publication number
- CN107256843A CN107256843A CN201710576274.9A CN201710576274A CN107256843A CN 107256843 A CN107256843 A CN 107256843A CN 201710576274 A CN201710576274 A CN 201710576274A CN 107256843 A CN107256843 A CN 107256843A
- Authority
- CN
- China
- Prior art keywords
- moulding
- chip
- blanking
- platform
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
本发明公开了一种芯片压胶装置,包括压胶台,在压胶台上设置有弹性压座,在压胶台上设置凹槽,在凹槽底部设置有数个弹簧支撑件,弹性压座固定在弹簧支撑件上,在压胶太上设置有压胶结构,在压胶结构前侧的压胶台上设置有芯片放置台,芯片放置台包括支撑架,在支撑架前端设置有推动芯片的推动装置,支撑架与导向槽相连,导向槽端部设置在弹性压座上端,在弹性压座的另一侧设置有下料装置,下料装置包括下料台,在下料台上设置有旋转下料结构,下料台与传送带相连。本发明结构简单、设计合理,能够提高芯片加工速度,同时减少残次品的数量,降低生产成本。
Description
技术领域
本发明涉及芯片加工设备,具体的说是一种芯片压胶装置。
背景技术
目前芯片压胶大多数采用人工手动控制压胶装置进行压胶,压胶速度慢,且工人每天工作量大,压出的芯片容易出现质量问题,压胶后需要人工将芯片取出。
发明内容
为了解决上述问题本发明提供了一种自动压胶和下料的芯片压胶装置。
为了达到上述目的本发明是通过以下技术方案来实现的:
本发明是一种芯片压胶装置,包括压胶台,在压胶台上设置有弹性压座,在压胶台上设置凹槽,在凹槽底部设置有数个弹簧支撑件,弹性压座固定在弹簧支撑件上,在压胶太上设置有压胶结构,在压胶结构前侧的压胶台上设置有芯片放置台,芯片放置台包括支撑架,在支撑架前端设置有推动芯片的推动装置,支撑架与导向槽相连,导向槽端部设置在弹性压座上端,在弹性压座的另一侧设置有下料装置,下料装置包括下料台,在下料台上设置有旋转下料结构,下料台与传送带相连。
本发明的进一步改进在于:压胶结构包括设置在压胶台上的安装架,在安装架上设置有压胶盘,压胶盘通过气缸连接在安装架下端。
本发明的进一步改进在于:在弹性压座上设置有两个定位板,定位板与设置在凹槽外侧的压胶台上设置有容纳定位板的定位槽,定位槽的深度与定位板的厚度相同。
本发明的进一步改进在于:旋转下料结构包括设置在下料台上的旋转座,旋转座固定在旋转气缸上,在旋转台上设置有连接臂,在连接臂上设置有吸盘下料器。
本发明的进一步改进在于:在两个定位板端部的上表面设置有橡胶垫,两个定位板分别处于下料台和导向槽下端。
本发明的有益效果是:芯片在被传送带芯片放置台上后推动装置前端的红外线感应器感应到芯片后,推动装置带动推动板带动将芯片推动到弹性压座上,弹性支撑件设置在压胶结构的压胶盘正下方,弹性压座能够避免压胶盘直接作用在芯片上,避免芯片受到的冲击力过大而损坏,下料装置的旋转台带动连接臂转动使吸盘处于弹性压座上方,连接臂上的吸盘下料器吸住芯片旋转台再次转动,使吸盘处于传送带上方开始下料,在压胶和下料的过程中不需要人工操作,同时能够确保芯片不会出现损坏。
本发明结构简单、设计合理,能够提高芯片加工速度,同时减少残次品的数量,降低生产成本。
附图说明
图1是本发明结构示意图。
其中:1-压胶台,2-弹性压座,3-压胶结构,4-支撑架,5-推动装置,6-导向槽,7-下料台。
具体实施方式
为了加强对本发明的理解,下面将结合附图和实施例对本发明作进一步的详细描述,该实施例仅用于解释本发明,并不对本发明的保护范围构成限定。
如图1所示,本发明是一种芯片压胶装置,包括压胶台1,在压胶台1上设置有弹性压座2,在压胶台1上设置凹槽,在凹槽底部设置有数个弹簧支撑件,弹性压座2固定在弹簧支撑件上,在压胶台1上设置有压胶结构3,在压胶结构3前侧的压胶台1上设置有芯片放置台,芯片放置台包括支撑架4,在支撑架4前端设置有推动芯片的推动装置5,支撑架4与导向槽6相连,导向槽6端部设置在弹性压座2上端,在弹性压座2的另一侧设置有下料装置,下料装置包括下料台7,在下料台7上设置有旋转下料结构8,下料台7与传送带相连,压胶结构3包括设置在压胶台1上的安装架,在安装架上设置有压胶盘,压胶盘通过气缸连接在安装架下端,在弹性压座2上设置有两个定位板,定位板与设置在凹槽外侧的压胶台1上设置有容纳定位板的定位槽,定位槽的深度与定位板的厚度相同,旋转下料结构8包括设置在下料台7上的旋转座,旋转座固定在旋转气缸上,在旋转台上设置有连接臂,在连接臂上设置有吸盘下料器,在两个定位板端部的上表面设置有橡胶垫,两个定位板分别处于下料台7和导向槽6下端,推动装置5前端设置有推动板,推动装置5上的红外线感应器在感应到芯片后推动板向前推动芯片,芯片在推动板的推动下从导向槽6端部落入弹性压座2上,导向槽6两侧设置有防止芯片发生偏移的导向板,在安装架于弹性压座2相近的侧边且与弹性压座2的等高处设置有红外线感应器,芯片落入弹性压座2上压胶盘在气缸的带动下向下压,弹性压座2在弹性支撑件的支撑下向下收缩,弹性压座2在弹性支撑件的支撑作用下减缓了压胶盘对芯片的冲力,压胶结束后吸盘下料器再旋转座的带动下进行下料,并由传送带直接将芯片传送走。
本发明结构简单、设计合理,能够提高芯片加工速度,同时减少残次品的数量,降低生产成本。
Claims (5)
1.一种芯片压胶装置,包括压胶台(1),其特征在于:在所述压胶台(1)上设置有弹性压座(2),在所述压胶台(1)上设置凹槽,在所述凹槽底部设置有数个弹簧支撑件,弹性压座(2)固定在所述弹簧支撑件上,在所述压胶台(1)上设置有压胶结构(3),在所述压胶结构(3)前侧的所述压胶台(1)上设置有芯片放置台,所述芯片放置台包括支撑架(4),在所述支撑架(4)前端设置有推动芯片的推动装置(5),所述支撑架(4)与导向槽(6)相连,所述导向槽(6)端部设置在所述弹性压座(2)上端,在所述弹性压座(2)的另一侧设置有下料装置,所述下料装置包括下料台(7),在所述下料台(7)上设置有旋转下料结构(8),所述下料台(7)与传送带相连。
2.根据权利要求1所述一种芯片压胶装置,其特征在于:所述压胶结构(3)包括设置在所述压胶台(1)上的安装架,在所述安装架上设置有压胶盘,所述压胶盘通过气缸连接在所述安装架下端。
3.根据权利要求1所述一种芯片压胶装置,其特征在于:在所述弹性压座(2)上设置有两个定位板,所述定位板与设置在所述凹槽外侧的所述压胶台(1)上设置有容纳所述定位板的定位槽,所述定位槽的深度与所述定位板的厚度相同。
4.根据权利要求1所述一种芯片压胶装置,其特征在于:所述旋转下料结构(8)包括设置在所述下料台(7)上的旋转座,所述旋转座固定在所述旋转气缸上,在所述旋转台上设置有连接臂,在所述连接臂上设置有吸盘下料器。
5.根据权利要求3所述一种芯片压胶装置,其特征在于:在两个定位板端部的上表面设置有橡胶垫,两个所述定位板分别处于所述下料台(7)和所述导向槽(6)下端。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710576274.9A CN107256843A (zh) | 2017-07-14 | 2017-07-14 | 一种芯片压胶装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710576274.9A CN107256843A (zh) | 2017-07-14 | 2017-07-14 | 一种芯片压胶装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107256843A true CN107256843A (zh) | 2017-10-17 |
Family
ID=60025627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710576274.9A Pending CN107256843A (zh) | 2017-07-14 | 2017-07-14 | 一种芯片压胶装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107256843A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108417983A (zh) * | 2018-05-10 | 2018-08-17 | 摩比天线技术(深圳)有限公司 | 用于天线外罩的自动压胶设备 |
CN109130324A (zh) * | 2018-08-27 | 2019-01-04 | 巫向东 | 一种无缝拉链袋压布粘胶一体机 |
CN114012918A (zh) * | 2022-01-05 | 2022-02-08 | 江苏明芯微电子股份有限公司 | 一种带有夹持结构的电子芯片的冲切工具 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201262967Y (zh) * | 2008-08-27 | 2009-06-24 | 东莞市鸿宝精密机械制造厂 | 圆柱电池自动点底焊接机 |
CN201777403U (zh) * | 2010-09-17 | 2011-03-30 | 深圳市金动力包装设备有限公司 | 电器元件包装设备 |
CN202473881U (zh) * | 2012-02-23 | 2012-10-03 | 常州天合光能有限公司 | 硅片自动上下料机的自动定位装置 |
CN102873034A (zh) * | 2012-10-12 | 2013-01-16 | 四川大学 | 一种滑片自动分选装置 |
CN103359482A (zh) * | 2013-07-30 | 2013-10-23 | 合肥凯邦电机有限公司 | 轴承自动上料装置 |
CN204377323U (zh) * | 2014-12-25 | 2015-06-03 | 昆山诚业德通讯科技有限公司 | 贴胶装置 |
CN104716076A (zh) * | 2015-03-20 | 2015-06-17 | 上海华力微电子有限公司 | 芯片压胶装置及芯片压胶方法 |
CN104860111A (zh) * | 2015-05-26 | 2015-08-26 | 山东精典机电工程有限公司 | 一种超宽幅土工格室焊接自动上料装置 |
CN204711203U (zh) * | 2015-05-11 | 2015-10-21 | 宁波津一油泵有限公司 | 一种针阀体加工车床 |
CN205165719U (zh) * | 2015-10-26 | 2016-04-20 | 杭州盈发炉窑科技有限公司 | 一种生物质颗粒锻造炉用自动上料装置 |
-
2017
- 2017-07-14 CN CN201710576274.9A patent/CN107256843A/zh active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201262967Y (zh) * | 2008-08-27 | 2009-06-24 | 东莞市鸿宝精密机械制造厂 | 圆柱电池自动点底焊接机 |
CN201777403U (zh) * | 2010-09-17 | 2011-03-30 | 深圳市金动力包装设备有限公司 | 电器元件包装设备 |
CN202473881U (zh) * | 2012-02-23 | 2012-10-03 | 常州天合光能有限公司 | 硅片自动上下料机的自动定位装置 |
CN102873034A (zh) * | 2012-10-12 | 2013-01-16 | 四川大学 | 一种滑片自动分选装置 |
CN103359482A (zh) * | 2013-07-30 | 2013-10-23 | 合肥凯邦电机有限公司 | 轴承自动上料装置 |
CN204377323U (zh) * | 2014-12-25 | 2015-06-03 | 昆山诚业德通讯科技有限公司 | 贴胶装置 |
CN104716076A (zh) * | 2015-03-20 | 2015-06-17 | 上海华力微电子有限公司 | 芯片压胶装置及芯片压胶方法 |
CN204711203U (zh) * | 2015-05-11 | 2015-10-21 | 宁波津一油泵有限公司 | 一种针阀体加工车床 |
CN104860111A (zh) * | 2015-05-26 | 2015-08-26 | 山东精典机电工程有限公司 | 一种超宽幅土工格室焊接自动上料装置 |
CN205165719U (zh) * | 2015-10-26 | 2016-04-20 | 杭州盈发炉窑科技有限公司 | 一种生物质颗粒锻造炉用自动上料装置 |
Non-Patent Citations (1)
Title |
---|
彭海兰: "《自动化生产线安装与调试》", 30 June 2014, 武汉大学出版社 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108417983A (zh) * | 2018-05-10 | 2018-08-17 | 摩比天线技术(深圳)有限公司 | 用于天线外罩的自动压胶设备 |
CN108417983B (zh) * | 2018-05-10 | 2024-02-02 | 摩比天线技术(深圳)有限公司 | 用于天线外罩的自动压胶设备 |
CN109130324A (zh) * | 2018-08-27 | 2019-01-04 | 巫向东 | 一种无缝拉链袋压布粘胶一体机 |
CN109130324B (zh) * | 2018-08-27 | 2023-12-05 | 江苏金鼎建设集团有限公司 | 一种无缝拉链袋压布粘胶一体机 |
CN114012918A (zh) * | 2022-01-05 | 2022-02-08 | 江苏明芯微电子股份有限公司 | 一种带有夹持结构的电子芯片的冲切工具 |
CN114012918B (zh) * | 2022-01-05 | 2022-03-15 | 江苏明芯微电子股份有限公司 | 一种带有夹持结构的电子芯片的冲切工具 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107256843A (zh) | 一种芯片压胶装置 | |
CN209635403U (zh) | 一种具有托底功能的pcb板夹具 | |
CN101712850A (zh) | 汽车前挡风玻璃自动贴胶条及附件装置 | |
CN109037747B (zh) | 蓄电池自动盖盖片装置 | |
CN111029279A (zh) | 一种固晶机的连续取晶机构及其工作方法 | |
CN216471379U (zh) | 一种泡棉下料机构 | |
CN213752664U (zh) | 一种用于丝网印刷的硅片分选机上料装置 | |
CN211104062U (zh) | 一种柔性物料吸取搭建装置 | |
CN210557937U (zh) | 一种板材送料机构 | |
CN211240686U (zh) | 一种软性线路板smt贴装用治具 | |
CN211075051U (zh) | 一种全自动锡膏印刷机的进料机构 | |
CN210682454U (zh) | 一种用于玻璃上片台的防止吸盘提升带片装置 | |
CN210974414U (zh) | 一种用于玻璃切割的装夹装置 | |
CN220244708U (zh) | 一种光模块加工用摆放架 | |
CN215094295U (zh) | 一种鞋楦自动摆料机 | |
CN211003526U (zh) | 一种双重紧固夹持装置 | |
CN216709762U (zh) | 一种电视机自动入箱流水线 | |
CN218808963U (zh) | 一种具有防掉落功能的上料机构 | |
CN221435441U (zh) | 一种芯片焊接专用夹具 | |
CN217516081U (zh) | Pcb自动上板机 | |
CN221283282U (zh) | 一种带有辅助结构的音响支架 | |
CN216707496U (zh) | 自动上下料机器人 | |
CN218388142U (zh) | 一种贴合装置 | |
CN216229484U (zh) | 一种自动对胶机的抓取机械臂结构 | |
CN214692097U (zh) | 一种整板抓料机构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 226600, Jiangsu province Nantong city Haian county old dam Town Industrial Park Applicant after: Jiangsu Ming core microelectronic Limited by Share Ltd Address before: 226600 Jiangsu city of Nantong province Haian County Binhai port old dam old dam District Town Industrial Park Applicant before: Nantong Mingxin Microelectronics Co., Ltd. |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171017 |