CN107075309B - 浆料组合物、漂洗组合物、基板抛光方法以及漂洗方法 - Google Patents

浆料组合物、漂洗组合物、基板抛光方法以及漂洗方法 Download PDF

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Publication number
CN107075309B
CN107075309B CN201580047704.7A CN201580047704A CN107075309B CN 107075309 B CN107075309 B CN 107075309B CN 201580047704 A CN201580047704 A CN 201580047704A CN 107075309 B CN107075309 B CN 107075309B
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China
Prior art keywords
water
polyvinyl alcohol
composition
polishing
slurry composition
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CN201580047704.7A
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Chinese (zh)
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CN107075309A (zh
Inventor
增田刚
北村启
松村义之
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CMC Materials LLC
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Nihon Cabot Microelectronics KK
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3753—Polyvinylalcohol; Ethers or esters thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Materials Engineering (AREA)
CN201580047704.7A 2014-09-05 2015-09-04 浆料组合物、漂洗组合物、基板抛光方法以及漂洗方法 Active CN107075309B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014181015A JP6559936B2 (ja) 2014-09-05 2014-09-05 スラリー組成物、リンス組成物、基板研磨方法およびリンス方法
JP2014-181015 2014-09-05
PCT/JP2015/004504 WO2016035346A1 (en) 2014-09-05 2015-09-04 Slurry composition, rinse composition, substrate polishing method and rinsing method

Publications (2)

Publication Number Publication Date
CN107075309A CN107075309A (zh) 2017-08-18
CN107075309B true CN107075309B (zh) 2020-09-01

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CN201580047704.7A Active CN107075309B (zh) 2014-09-05 2015-09-04 浆料组合物、漂洗组合物、基板抛光方法以及漂洗方法

Country Status (5)

Country Link
JP (1) JP6559936B2 (https=)
KR (1) KR102524838B1 (https=)
CN (1) CN107075309B (https=)
TW (1) TWI633178B (https=)
WO (1) WO2016035346A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6801964B2 (ja) * 2016-01-19 2020-12-16 株式会社フジミインコーポレーテッド 研磨用組成物及びシリコン基板の研磨方法
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
KR20190045249A (ko) 2016-08-31 2019-05-02 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마용 조성물 세트
JP6495230B2 (ja) * 2016-12-22 2019-04-03 花王株式会社 シリコンウェーハ用リンス剤組成物
WO2018124226A1 (ja) * 2016-12-28 2018-07-05 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
JP7077236B2 (ja) * 2016-12-28 2022-05-30 ニッタ・デュポン株式会社 研磨用組成物
WO2019187969A1 (ja) * 2018-03-30 2019-10-03 株式会社フジミインコーポレーテッド 研磨用組成物
JP7361467B2 (ja) * 2018-12-25 2023-10-16 ニッタ・デュポン株式会社 研磨用組成物
JP2020203980A (ja) * 2019-06-17 2020-12-24 日本キャボット・マイクロエレクトロニクス株式会社 化学機械研磨組成物、リンス組成物、化学機械研磨方法及びリンス方法
JP7495283B2 (ja) * 2019-09-06 2024-06-04 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の製造方法、表面処理方法、および半導体基板の製造方法
CN112457930A (zh) * 2019-09-06 2021-03-09 福吉米株式会社 表面处理组合物、表面处理组合物的制造方法、表面处理方法和半导体基板的制造方法
JP7477964B2 (ja) * 2019-12-13 2024-05-02 インテグリス・インコーポレーテッド 化学機械研磨組成物及びそれを用いた化学機械研磨方法
JP6884898B1 (ja) * 2020-01-22 2021-06-09 日本酢ビ・ポバール株式会社 研磨用組成物
JP7495317B2 (ja) * 2020-09-25 2024-06-04 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の製造方法、表面処理方法、および半導体基板の製造方法
JP7645682B2 (ja) * 2021-03-31 2025-03-14 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の製造方法、表面処理方法、及び半導体基板の製造方法
KR102728251B1 (ko) * 2021-12-31 2024-11-11 주식회사 케이씨텍 컨택 공정용 금속막 슬러리 조성물
KR20230106938A (ko) * 2022-01-07 2023-07-14 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
CN115873508A (zh) * 2022-12-26 2023-03-31 博力思(天津)电子科技有限公司 去除速率高且表面粗糙度低的SiC衬底抛光液及抛光工艺

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140427A (ja) * 1997-11-13 1999-05-25 Kobe Steel Ltd 研磨液および研磨方法
CN1384860A (zh) * 1999-11-04 2002-12-11 先进微装置公司 含有机添加剂的钽障壁浆液
CN1613941A (zh) * 2003-09-05 2005-05-11 福吉米株式会社 抛光组合物
CN1721515A (zh) * 2004-06-18 2006-01-18 福吉米株式会社 清洗组合物及清洗和制造硅片的方法
TW201350563A (zh) * 2012-03-14 2013-12-16 福吉米股份有限公司 研磨用組成物及半導體基板之製造方法
TW201412960A (zh) * 2012-05-25 2014-04-01 日產化學工業股份有限公司 晶圓用研磨液組成物
TW201527506A (zh) * 2013-10-25 2015-07-16 花王股份有限公司 矽晶圓用研磨液組合物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130041084A (ko) * 2010-06-18 2013-04-24 히타치가세이가부시끼가이샤 반도체 기판용 연마액 및 반도체 웨이퍼의 제조 방법
JP2014038906A (ja) * 2012-08-13 2014-02-27 Fujimi Inc 研磨用組成物、当該研磨用組成物の製造方法、及び当該研磨用組成物を用いた半導体基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140427A (ja) * 1997-11-13 1999-05-25 Kobe Steel Ltd 研磨液および研磨方法
CN1384860A (zh) * 1999-11-04 2002-12-11 先进微装置公司 含有机添加剂的钽障壁浆液
CN1613941A (zh) * 2003-09-05 2005-05-11 福吉米株式会社 抛光组合物
CN1721515A (zh) * 2004-06-18 2006-01-18 福吉米株式会社 清洗组合物及清洗和制造硅片的方法
TW201350563A (zh) * 2012-03-14 2013-12-16 福吉米股份有限公司 研磨用組成物及半導體基板之製造方法
TW201412960A (zh) * 2012-05-25 2014-04-01 日產化學工業股份有限公司 晶圓用研磨液組成物
TW201527506A (zh) * 2013-10-25 2015-07-16 花王股份有限公司 矽晶圓用研磨液組合物

Also Published As

Publication number Publication date
KR20170048513A (ko) 2017-05-08
WO2016035346A1 (en) 2016-03-10
JP6559936B2 (ja) 2019-08-14
TW201615797A (zh) 2016-05-01
KR102524838B1 (ko) 2023-04-24
TWI633178B (zh) 2018-08-21
JP2016056220A (ja) 2016-04-21
CN107075309A (zh) 2017-08-18

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Patentee before: NIHON CABOT MICROELECTRONICS Kabushiki Kaisha

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