CN107039405A - 电子封装件 - Google Patents

电子封装件 Download PDF

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Publication number
CN107039405A
CN107039405A CN201610114900.8A CN201610114900A CN107039405A CN 107039405 A CN107039405 A CN 107039405A CN 201610114900 A CN201610114900 A CN 201610114900A CN 107039405 A CN107039405 A CN 107039405A
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Prior art keywords
substrate
packing piece
electronic
antenna structure
electronic packing
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邱志贤
陈嘉扬
卢盈维
张峻源
蔡明汎
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Siliconware Precision Industries Co Ltd
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Siliconware Precision Industries Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

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Abstract

一种电子封装件，包括：基板、设于该基板上的电子元件以及天线结构，该天线结构具有本体部与支撑部，且该本体部由多个孔洞与分隔该多个孔洞的框架所构成，并通过该支撑部架设于该基板上，使该基板的表面上无需增加布设区域，因而能使该电子封装件达到微小化的需求。

Description

电子封装件
技术领域
本发明有关一种电子封装件，尤指一种具天线结构的电子封装件。
背景技术
随着电子产业的蓬勃发展，目前无线通讯技术已广泛应用于各式各样的消费性电子产品以利接收或发送各种无线信号。为了满足消费性电子产品的外观设计需求，无线通讯模块的制造与设计朝着轻、薄、短、小的需求作开发，其中，平面天线(Patch Antenna)因具有体积小、重量轻与制造容易等特性而广泛利用在手机(cell phone)、个人数字助理(Personal Digital Assistant,PDA)等电子产品的无线通讯模块中。
图1为悉知无线通讯模块的立体示意图。如图1所示，该无线通讯模块1包括：一封装基板10、多个电子元件11、一天线结构12以及封装胶体13。该封装基板10为电路板并呈矩形状。该电子元件11设于该封装基板10上且电性连接该封装基板10。该天线结构12为平面型且具有一天线本体120与一导线121，该天线本体120通过该导线121电性连接该电子元件11。该封装胶体13覆盖该电子元件11与该部分导线121。
前述的悉知无线通讯模块1中，由于该天线结构12为平面型，故基于该天线结构12与该电子元件11之间的电磁辐射特性及该天线结构12的体积限制，因而于制程中，该天线本体120难以与该电子元件11整合制作，也就是该封装胶体13仅覆盖该电子元件11，并未覆盖该天线本体120，致使封装制程的模具需对应该多个电子元件11的布设区域，而非对应该封装基板10的尺寸，因而不利于封装制程。
此外，因该天线结构12为平面型，故需于该封装基板10的表面上增加布设区域(未形成封装胶体13的区域)以形成该天线本体120，致使该封装基板10的宽度难以缩减，因而难以缩小该无线通讯模块1的宽度，而使该无线通讯模块1无法达到微小化的需求。
因此，如何克服上述悉知技术的种种问题，实已成目前亟欲解决的课题。
发明内容
鉴于上述悉知技术的种种缺陷，本发明披露一种电子封装件，能使该电子封装件达到微小化的需求。
本发明的电子封装件，包括：一基板；至少一电子元件，其设于该基板上；以及至少一天线结构，其设于该基板上并具有一本体部与至少一支撑部，且该本体部包含多个孔洞与分隔该多个孔洞的框架，并通过该支撑部架设于该基板上。
前述的电子封装件中，该基板具有电性连接该电子元件的线路层。
前述的电子封装件中，该天线结构电性连接该基板。
前述的电子封装件中，该天线结构电性连接该电子元件。
前述的电子封装件中，该天线结构的材料为金属。
前述的电子封装件中，该多个孔洞呈阵列交错排列。
前述的电子封装件中，该孔洞的形状为圆形、封闭曲线形或多边形。
前述的电子封装件中，还包括形成于该基板上并覆盖该电子元件的封装层。其中，该框架外露于该封装层，例如，该框架凸出该封装层或未凸出该封装层。或者，该封装层完全覆盖该天线结构。
由上可知，本发明的电子封装件中，通过以立体式天线结构取代悉知平面式天线结构，故该天线结构能架设于该电子元件所布设的基板区域上，以使封装制程的模具对应该基板的尺寸，而有利于封装制程。
此外，因该天线结构架设于该电子元件所布设的区域(即形成封装层的区域)，因而无需于该基板的表面上增加布设区域，故相较于悉知技术，本发明的基板的宽度较短，因而有效缩减该电子封装件的宽度，致使该电子封装件达到微小化的需求。
附图说明
图1为悉知无线通讯模块的立体示意图；
图2A为本发明的电子封装件的剖面示意图；
图2B为图2A的局部立体图；
图2C及图2C’为图2A的天线结构的不同实施例的立体图；
图2D为图2A的立体示意图；
图2D’为图2D的另一实施例；
图3及图3’为图2A的其它实施例；以及
图4及图4’为图2D的其它实施例。
符号说明
1 无线通讯模块
10 封装基板
11,21,21’ 电子元件
12,22,22’ 天线结构
120 天线本体
121 导线
13 封装胶体
2,2’,3,3’,4,4’ 电子封装件
20 基板
200 线路层
220 本体部
220a 孔洞
220b,220b’,220b” 框架
221 支撑部
23 封装层
23a 第一表面
23b 第二表面
23c 侧面。
具体实施方式
以下通过特定的具体实施例说明本发明的实施方式，熟悉此技艺的人士可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
须知，本说明书所附附图所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供熟悉此技艺的人士的了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”、“第一”、“第二”、及“一”等用语，也仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2A至图2D为本发明的电子封装件2的示意图。如图2A至图2D所示，所述的电子封装件2至少由一基板20、设于该基板20上的电子元件21,21’以及一天线结构22所构成。
于本实施例中，该电子封装件2为系统级封装(System in package，简称SiP)的无线通讯模块。
所述的基板20为电路板或陶瓷板并呈矩形状，如图2B所示，且该基板20的表面设有线路层200，而该基板20内部也设有线路层(图略)。应可理解地，有关基板的种类繁多，并不限于图示者。
所述的电子元件21,21’电性连接该基板20的线路层200，如图2B所示。于本实施例中，该电子元件21,21’为主动元件、被动元件、或其二者的组合，其中，该主动元件为例如半导体芯片，该被动元件为例如电阻、电容及电感。例如，该电子元件21以覆晶方式电性连接该线路层200；或者，该电子元件21’以打线方式电性连接该线路层200。
所述的天线结构22包含有一本体部220与至少一支撑部221，该支撑部221为金属柱并立设于该基板20上，且该本体部220通过该多个支撑部221架设于该基板20上，其中，该本体部220由多个孔洞220a与分隔该多个孔洞220a的框架220b所构成。
于本实施例中，于制作该电子封装件2时，先用金属板或金属框方式制作出所需的天线结构22的预制件，再将该预制件直接黏贴于该基板20上。具体地，该天线结构22可为封闭型，如图2C所示；或者，该天线结构22’可为非封闭型，如图2C’所示。
此外，该多个孔洞220a为阵列交错排列，如图2C及图2C’所示，且该孔洞220a的形状可为圆形、封闭曲线形或多边形，并无特别限制。
又，该支撑部221可选择设于该本体部220的边缘的框架220b上(如图2C所示)或中间的框架220b上(如图2C’所示)，且可依需求形成一个支撑部221(如图2C所示)或多个支撑部221(如图2C’所示)。
另外，该天线结构22通过该支撑部221电性连接该基板20的线路层200，如图2A及图3所示；或者，该天线结构22通过该支撑部221电性连接该电子元件21’，如图3’所示。
另一方面，所述的电子封装件2可选择性包括一封装层23，如图2A及图2D所示。因此，该电子封装件2也可省略该封装层23的制作。
所述的封装层23形成于该基板20上并覆盖该电子元件21与该支撑部221，且其具有相对的第一表面23a与第二表面23b，使该封装层23以其第一表面23a结合该基板20。
于本实施例中，形成该封装层23的材料为绝缘材，例如，聚酰亚胺(polyimide，简称PI)、干膜(dry film)、环氧树脂(expoxy)或封装胶体(molding compound)。
此外，该框架220b可选择外露于该封装层23的第二表面23b，如图2A及图2D所示，也就是该框架220b凸出该封装层23的第二表面23b。
或者，该框架220b’,220b”也可未凸出该封装层23，如图3及图3’所示的电子封装件3,3’。具体地，如图3所示，该框架220b’的表面齐平该封装层23的第二表面23b；或如图3’所示，该框架220b”的表面低于该封装层23的第二表面23b。因此，于其它实施例中，于制作该天线结构22时，可先于该封装层23的第二表面23b上形成多个凹槽及通孔，再使用溅射涂覆(sputter coating)、镀覆(plating)、喷覆(spray)、印刷(printing)等涂布方式形成金属材于该凹槽与该通孔中，以令该凹槽的金属材作为该框架220b’,220b”，该通孔的金属材作为该支撑部221。应可理解地，也可将涂布方式与金属板或金属框方式结合制作该天线结构22。
又，于其它实施例中，如图4所示的电子封装件4，该框架220b也可以选择外露于该封装层23的侧面23c，其中，该侧面23c邻接该第一表面23a与第二表面23b。
另外，如图4’所示的电子封装件4’，该封装层23也可完全覆盖该天线结构22。
另一方面，应可理解地，于其它实施例中，该电子封装件2’可包括多个天线结构，如图2D’所示的两个本体部220外露于该封装层23。
综上所述，本发明的电子封装件2,2’,3,3’,4,4’中，是利用金属板或金属框折迭成立体化天线结构22,22’或利用涂布方式形成立体化天线结构22,22’，再将该框架220b,220b’,220b”设于该基板20与该多个电子元件21,21’上方，以于制程中，该天线结构22能与该多个电子元件21,21’整合制作，也就是一同进行封装，使该封装层23能覆盖该多个电子元件21,21’与该天线结构22,22’，故封装制程用的模具能对应该基板20的尺寸，因而有利于封装制程。
此外，该封装层23可用于固定该天线结构22,22’，使该框架220b,220b’,220b”位于固定高度而能确保天线稳定性，且利用该封装层23的介电系数能缩小天线所需的电气长度。
又，该框架220b,220b’,220b”设于该基板20上而呈立体式天线，因而可将该天线结构22布设于与该多个电子元件21,21’的相同的区域(即形成封装层23的区域)，而无需于该基板20的表面上增加布设区域，故相较于悉知技术，本发明的基板20的宽度较短，因而能缩小该电子封装件2,2’,3,3’,4,4’的宽度，而使该电子封装件2,2’,3,3’,4,4’达到微小化的需求。
另外，该框架220b,220b’,220b”迭设于该基板20上，将于该框架220b,220b’,220b”与该基板20之间形成容置空间，故能利用该容置空间布设其它电性结构或电子元件。
上述实施例仅用以例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟习此项技艺的人士均可在不违背本发明的精神及范畴下，对上述实施例进行修改。因此本发明的权利保护范围，应如权利要求书所列。

Claims (12)

1.一种电子封装件，其特征为，该电子封装件包括：
一基板；
至少一电子元件，其设于该基板上；以及
至少一天线结构，其设于该基板上并具有一本体部与至少一支撑部，且该本体部包含多个孔洞与分隔该多个孔洞的框架，并通过该支撑部架设于该基板上。
2.如权利要求1所述的电子封装件，其特征为，该基板具有电性连接该电子元件的线路层。
3.如权利要求1所述的电子封装件，其特征为，该天线结构电性连接该基板。
4.如权利要求1所述的电子封装件，其特征为，该天线结构电性连接该电子元件。
5.如权利要求1所述的电子封装件，其特征为，该天线结构的材料为金属。
6.如权利要求1所述的电子封装件，其特征为，该多个孔洞呈阵列交错排列。
7.如权利要求1所述的电子封装件，其特征为，该孔洞的形状为圆形、封闭曲线形或多边形。
8.如权利要求1所述的电子封装件，其特征为，该电子封装件还包括形成于该基板上并覆盖该电子元件的封装层。
9.如权利要求8所述的电子封装件，其特征为，该框架外露于该封装层。
10.如权利要求9所述的电子封装件，其特征为，该框架凸出该封装层。
11.如权利要求9所述的电子封装件，其特征为，该框架未凸出该封装层。
12.如权利要求8所述的电子封装件，其特征为，该封装层完全覆盖该天线结构。
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807297A (zh) * 2017-04-28 2018-11-13 矽品精密工业股份有限公司 电子封装件及其制法
CN109755202A (zh) * 2017-11-03 2019-05-14 矽品精密工业股份有限公司 电子封装件及其制法
CN111180422A (zh) * 2018-11-13 2020-05-19 欣兴电子股份有限公司 芯片封装结构及其制造方法
CN111540689A (zh) * 2020-03-26 2020-08-14 甬矽电子(宁波)股份有限公司 Ic射频天线结构、制作方法和半导体器件
US11348869B2 (en) 2018-11-07 2022-05-31 Unimicron Technology Corp. Method of manufacturing chip packaging structure
TWI766769B (zh) * 2021-07-21 2022-06-01 矽品精密工業股份有限公司 電子封裝件及其製法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202103284A (zh) * 2019-07-11 2021-01-16 矽品精密工業股份有限公司 電子封裝件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008219196A (ja) * 2007-02-28 2008-09-18 Hitachi Kokusai Electric Inc 円偏波グリッドアレーアンテナ
CN102292873A (zh) * 2008-12-12 2011-12-21 南洋理工大学 栅格阵列天线及其集成结构
US8199518B1 (en) * 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
CN103972636A (zh) * 2013-01-25 2014-08-06 矽品精密工业股份有限公司 电子封装件及其制法
CN104157618A (zh) * 2014-08-07 2014-11-19 华进半导体封装先导技术研发中心有限公司 射频模块封装结构和封装工艺
CN104851878A (zh) * 2014-02-14 2015-08-19 日月光半导体制造股份有限公司 具有天线的半导体封装结构及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1723587A (zh) * 2002-11-07 2006-01-18 碎云股份有限公司 含微型天线的集成电路封装
JP4833192B2 (ja) * 2007-12-27 2011-12-07 新光電気工業株式会社 電子装置
TW200933758A (en) * 2008-01-17 2009-08-01 En-Min Jow Semiconductor package with antenna and manufacture method thereof
US8587482B2 (en) * 2011-01-21 2013-11-19 International Business Machines Corporation Laminated antenna structures for package applications
KR101434003B1 (ko) * 2011-07-07 2014-08-27 삼성전기주식회사 반도체 패키지 및 그 제조 방법
US9153542B2 (en) * 2012-08-01 2015-10-06 Advanced Semiconductor Engineering, Inc. Semiconductor package having an antenna and manufacturing method thereof
US9129954B2 (en) * 2013-03-07 2015-09-08 Advanced Semiconductor Engineering, Inc. Semiconductor package including antenna layer and manufacturing method thereof
US9129981B2 (en) * 2013-11-26 2015-09-08 Freescale Semiconductor Inc. Methods for the production of microelectronic packages having radiofrequency stand-off layers
US9647329B2 (en) * 2014-04-09 2017-05-09 Texas Instruments Incorporated Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
US9472859B2 (en) * 2014-05-20 2016-10-18 International Business Machines Corporation Integration of area efficient antennas for phased array or wafer scale array antenna applications
US20160329299A1 (en) * 2015-05-05 2016-11-10 Mediatek Inc. Fan-out package structure including antenna

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008219196A (ja) * 2007-02-28 2008-09-18 Hitachi Kokusai Electric Inc 円偏波グリッドアレーアンテナ
CN102292873A (zh) * 2008-12-12 2011-12-21 南洋理工大学 栅格阵列天线及其集成结构
US8199518B1 (en) * 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
CN103972636A (zh) * 2013-01-25 2014-08-06 矽品精密工业股份有限公司 电子封装件及其制法
CN104851878A (zh) * 2014-02-14 2015-08-19 日月光半导体制造股份有限公司 具有天线的半导体封装结构及其制造方法
CN104157618A (zh) * 2014-08-07 2014-11-19 华进半导体封装先导技术研发中心有限公司 射频模块封装结构和封装工艺

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807297A (zh) * 2017-04-28 2018-11-13 矽品精密工业股份有限公司 电子封装件及其制法
CN108807297B (zh) * 2017-04-28 2020-09-01 矽品精密工业股份有限公司 电子封装件及其制法
CN109755202A (zh) * 2017-11-03 2019-05-14 矽品精密工业股份有限公司 电子封装件及其制法
US11348869B2 (en) 2018-11-07 2022-05-31 Unimicron Technology Corp. Method of manufacturing chip packaging structure
CN111180422A (zh) * 2018-11-13 2020-05-19 欣兴电子股份有限公司 芯片封装结构及其制造方法
CN111180422B (zh) * 2018-11-13 2022-03-11 欣兴电子股份有限公司 芯片封装结构及其制造方法
CN111540689A (zh) * 2020-03-26 2020-08-14 甬矽电子(宁波)股份有限公司 Ic射频天线结构、制作方法和半导体器件
TWI766769B (zh) * 2021-07-21 2022-06-01 矽品精密工業股份有限公司 電子封裝件及其製法

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