CN104157618A - 射频模块封装结构和封装工艺 - Google Patents

射频模块封装结构和封装工艺 Download PDF

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CN104157618A
CN104157618A CN201410388111.4A CN201410388111A CN104157618A CN 104157618 A CN104157618 A CN 104157618A CN 201410388111 A CN201410388111 A CN 201410388111A CN 104157618 A CN104157618 A CN 104157618A
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circuit board
printed circuit
pcb
chip
hole
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CN104157618B (zh
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孙鹏
何洪文
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National Center for Advanced Packaging Co Ltd
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Abstract

本发明涉及一种射频模块封装结构和封装工艺，包括印刷电路板，印刷电路板一面分布芯片，印刷电路板另一面设置焊锡球；在具有电磁辐射的芯片上罩设金属屏蔽罩，金属屏蔽罩和芯片塑封在塑封层中；其特征是：塑封层表面设置螺旋形天线，天线中心位置的塑封层中设置连接天线与印刷电路板的通孔，通孔中填充金属。所述封装工艺，包括以下步骤：（1）印刷电路板上安装芯片；（2）金属屏蔽罩扣在具有电磁辐射的芯片上；（3）将芯片和金属屏蔽罩进行塑封；（4）塑封层的表面刻蚀螺旋形沟槽，在沟槽中心位置的塑封层中刻蚀通孔；（5）沟槽和通孔中填充金属；（6）在印刷电路板另一面植球，得到焊锡球。本发明能够实现紧凑的含天线的射频模块制作。

Description

射频模块封装结构和封装工艺
技术领域
本发明涉及一种射频模块封装结构和封装工艺，属于半导体封装技术领域。
背景技术
多芯片射频模块是手机和便携式电子产品中常见的部件，其元器件封装密度高，且需要考虑不同元器件之间的电磁辐射，防止干扰性电磁场向外扩散造成近邻的元器件、电路、组合件或整个系统的工作不正常。
现有技术中，常见的射频芯片大多采用独立器件封装结构，再通过SMT（表面贴装）的组装方式在PCB上实现模块化功能，其电磁屏蔽的功能也是通过SMT工序上贴装金属屏蔽罩的方式实现。伴随着电子产品的发展，采用这一方式并不能很好的满足系统集成度提升的要求。
发明内容
本发明的目的是克服现有技术中存在的不足，提供一种射频模块封装结构和封装工艺，得到小体积、多功能的多芯片封装模块，实现紧凑的含天线的射频模块制作。
按照本发明提供的技术方案，所述射频模块封装结构，包括印刷电路板，在印刷电路板的一面上分布若干芯片，在印刷电路板的另一面上设置焊锡球；在具有电磁辐射的芯片上罩设金属屏蔽罩，金属屏蔽罩与印刷电路板上的接地焊盘连接，金属屏蔽罩和芯片塑封在塑封层中；其特征是：在所述塑封层的表面设置螺旋形沟槽，在该沟槽中填充金属，形成螺旋形天线；在所述螺旋形天线中心位置的塑封层中设置通孔，通孔连接天线与印刷电路板的上表面，在通孔中填充金属。
所述射频模块的封装工艺，其特征是，包括以下步骤：
（1）在印刷电路板上进行芯片的安装；
（2）将金属屏蔽罩倒扣在具有电磁辐射的芯片上，金属屏蔽罩与印刷电路板上的接地焊盘相连；
（3）采用塑封材料将芯片和金属屏蔽罩进行塑封，得到位于印刷电路板表面的塑封层；
（4）在塑封层的表面刻蚀出螺旋形的沟槽，在螺旋形沟槽中心位置的塑封层中刻蚀通孔，通孔连接沟槽和印刷电路板的上表面；
（5）在步骤（4）得到的沟槽和通孔中填充金属，从而得到螺旋形的天线，并由填充在通孔中的金属连接天线和印刷电路板； 
（6）在印刷电路板上相对于芯片安装面的另一面进行植球，得到焊锡球。
所述步骤（4）中，沟槽的深度为25～200微米。
所述金属屏蔽罩的材质采用不锈钢、洋白铜或镀锡钢。
所述步骤（5）中，填充金属采用金、银、铜、镍或锡。
本发明所述射频模块封装结构和封装工艺，通过在射频模块中对具有电磁辐射的元器件进行整体屏蔽，再通过在模块中植入整体式收发天线或者填充金属制作天线等方式，实现紧凑的含天线的射频模块制作，实现了小体积、多功能的多芯片封装模块，符合消费类电子产品，特别是便携式电子产品，如手机的发展趋势，即短小轻薄的封装模式。
附图说明
图1～图7为所述射频模块封装结构的制备流程图。其中：
图1为在印刷电路板上安装芯片的示意图。
图2为在具有电磁辐射的芯片上设置金属屏蔽罩的示意图。
图3为将芯片和金属屏蔽罩塑封于塑封层中的示意图。
图4为在塑封层上制作沟槽和通孔的示意图。
图5为在沟槽和通孔中填充金属的示意图。
图6为所述射频模块封装结构的剖视图。
图7为图6的俯视图。
图中序号：印刷电路板1、芯片2、焊锡球3、金属屏蔽罩4、塑封层5、天线6、通孔7。
具体实施方式
下面结合具体附图对本发明作进一步说明。
如图6、图7所示：所述射频模块封装结构包括印刷电路板1，在印刷电路板1的一面上分布若干芯片2，在印刷电路板1的另一面上设置焊锡球3；所述芯片2包括具有电磁辐射的芯片和不具有电磁辐射的芯片（芯片2一般涵盖两类产品，第一类芯片由于自身输入/输出电流、负载等原因具体有较高电磁辐射强度，如电源芯片、射频功放芯片、射频传输芯片等；第二类芯片为一般性或对电磁波较敏感的产品），在具有电磁辐射的芯片2上罩设金属屏蔽罩4，金属屏蔽罩4与印刷电路板1上的接地焊盘连接；所述金属屏蔽罩4和芯片2塑封在塑封层5中，在塑封层5的表面设置螺旋形沟槽，在该沟槽中填充金属，形成螺旋形天线6；在所述螺旋形天线6中心位置的塑封层5中设置通孔7，通孔7连接天线6与印刷电路板1的上表面，在通孔7中填充金属。
上述射频模块的封装工艺，包括以下步骤：
（1）如图1所示，在印刷电路板1上进行芯片2的安装，此处芯片2的安装可以采用现有常用的工艺，没有具体限制，具体如采用芯片键合、引线键合工艺或者芯片倒装工艺等实现芯片2与印刷电路板1之间的电学连接；
如采用芯片键合、引线键合工艺时，芯片2通过固晶胶8粘接在印刷电路板1上，引线与印刷电路板1上的焊盘进行连接，芯片通过打线（也称为绑定、丝焊）方式完成芯片上的焊盘和印刷电路板上焊盘之间的连接，使芯片电路内引脚和封装体外引脚连接，使芯片的功能可以正确的输出；
采用芯片倒装工艺时，倒装芯片的I/O端锡球方向朝下，通过加热使熔融的锡球焊接到印刷电路板上预先分布有镀Au或Sn的焊盘上，实现芯片电路内引脚夫和封装体外引脚连接，芯片设计的功能可以正确的输出，实现信号的联通；
（2）对具有电磁辐射的芯片进行整体屏蔽，具体方式是：如图2所示，将金属屏蔽罩4倒扣在具有电磁辐射的芯片2上，金属屏蔽罩4与印刷电路板1上的接地焊盘相连；所述金属屏蔽罩4的材质可以采用不锈钢、洋白铜、镀锡钢等；
（3）如图3所示，采用塑封材料将芯片2和金属屏蔽罩4进行塑封，得到位于印刷电路板1表面的塑封层5，从而实现对元器件的保护；所述塑封材料可以采用环氧树脂塑封料、电子灌封胶、硅橡胶等；
（4）如图4所示，在塑封层5的表面刻蚀出螺旋形的沟槽，沟槽的深度为25～200微米，在螺旋形沟槽中心位置的塑封层5中刻蚀通孔7，通孔7连接沟槽和印刷电路板1的上表面；
（5）如图5所示，在步骤（4）得到的沟槽和通孔7中填充金属，从而得到螺旋形的天线6（如图7所示），并由填充在通孔7中的金属连接天线6和印刷电路板1；所述填充金属可以采用金、银、铜、镍、锡等；
（6）如图6所示，在印刷电路板1上相对于芯片2安装面的另一面进行植球，得到焊锡球3，实现射频模块与外部的电学连接。
本发明为多芯片射频模块封装提供了一套紧凑的小型化解决方案，在射频模块中将具有电磁辐射的元器件进行整体屏蔽，再通过在模块中植入整体式收发天线或者填充金属制作天线等方式，实现紧凑的内置天线的射频模块制作，不再需要在射频模块之外连接其他收发装置，满足了小体积、多功能的模块封装需要。

Claims (5)

1.一种射频模块封装结构，包括印刷电路板（1），在印刷电路板（1）的一面上分布若干芯片（2），在印刷电路板（1）的另一面上设置焊锡球（3）；在具有电磁辐射的芯片（2）上罩设金属屏蔽罩（4），金属屏蔽罩（4）与印刷电路板（1）上的接地焊盘连接，金属屏蔽罩（4）和芯片（2）塑封在塑封层（5）中；其特征是：在所述塑封层（5）的表面设置螺旋形沟槽，在该沟槽中填充金属，形成螺旋形天线（6）；在所述螺旋形天线（6）中心位置的塑封层（5）中设置通孔（7），通孔（7）连接天线（6）与印刷电路板（1）的上表面，在通孔（7）中填充金属。
2.一种射频模块的封装工艺，其特征是，包括以下步骤：
（1）在印刷电路板（1）上进行芯片（2）的安装；
（2）将金属屏蔽罩（4）倒扣在具有电磁辐射的芯片（2）上，金属屏蔽罩（4）与印刷电路板（1）上的接地焊盘相连；
（3）采用塑封材料将芯片（2）和金属屏蔽罩（4）进行塑封，得到位于印刷电路板（1）表面的塑封层（5）；
（4）在塑封层（5）的表面刻蚀出螺旋形的沟槽，在螺旋形沟槽中心位置的塑封层（5）中刻蚀通孔（7），通孔（7）连接沟槽和印刷电路板（1）的上表面；
（5）在步骤（4）得到的沟槽和通孔（7）中填充金属，从而得到螺旋形的天线（6），并由填充在通孔（7）中的金属连接天线（6）和印刷电路板（1）； 
（6）在印刷电路板（1）上相对于芯片（2）安装面的另一面进行植球，得到焊锡球（3）。
3.如权利要求2所述的射频模块的封装工艺，其特征是：所述步骤（4）中，沟槽的深度为25～200微米。
4.如权利要求2所述的射频模块的封装工艺，其特征是：所述金属屏蔽罩（4）的材质采用不锈钢、洋白铜或镀锡钢。
5.如权利要求2所述的射频模块的封装工艺，其特征是：所述步骤（5）中，填充金属采用金、银、铜、镍或锡。
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