CN101937886B - 薄型芯片封装结构及方法 - Google Patents
薄型芯片封装结构及方法 Download PDFInfo
- Publication number
- CN101937886B CN101937886B CN2009101085612A CN200910108561A CN101937886B CN 101937886 B CN101937886 B CN 101937886B CN 2009101085612 A CN2009101085612 A CN 2009101085612A CN 200910108561 A CN200910108561 A CN 200910108561A CN 101937886 B CN101937886 B CN 101937886B
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- chip
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 claims abstract description 61
- 239000000084 colloidal system Substances 0.000 claims abstract description 32
- 239000004033 plastic Substances 0.000 claims abstract description 32
- 241000218202 Coptis Species 0.000 claims abstract description 13
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 13
- 230000004888 barrier function Effects 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 8
- 239000010931 gold Substances 0.000 abstract 8
- 229910052737 gold Inorganic materials 0.000 abstract 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2224/481—Disposition
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48233—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a potential ring of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101085612A CN101937886B (zh) | 2009-06-30 | 2009-06-30 | 薄型芯片封装结构及方法 |
US12/577,251 US20100327425A1 (en) | 2009-06-30 | 2009-10-12 | Flat chip package and fabrication method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101085612A CN101937886B (zh) | 2009-06-30 | 2009-06-30 | 薄型芯片封装结构及方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101937886A CN101937886A (zh) | 2011-01-05 |
CN101937886B true CN101937886B (zh) | 2012-06-27 |
Family
ID=43379779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101085612A Active CN101937886B (zh) | 2009-06-30 | 2009-06-30 | 薄型芯片封装结构及方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100327425A1 (zh) |
CN (1) | CN101937886B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI600351B (zh) * | 2016-03-18 | 2017-09-21 | 慧榮科技股份有限公司 | 印刷電路板以及元件製造方法 |
CN108492919B (zh) * | 2018-03-01 | 2020-05-26 | 海信视像科技股份有限公司 | 电视机、柔性扁平线缆及其制作方法 |
WO2023272450A1 (zh) * | 2021-06-28 | 2023-01-05 | 欧菲光集团股份有限公司 | 芯片封装结构、摄像头模组及电子设备 |
CN113471164B (zh) * | 2021-06-28 | 2023-09-08 | 江西晶浩光学有限公司 | 芯片封装结构、摄像头模组及电子设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6477046B1 (en) * | 1997-05-09 | 2002-11-05 | Texas Instruments Incorporated | Ball grid array package and method using enhanced power and ground distribution circuitry |
US7122406B1 (en) * | 2004-01-02 | 2006-10-17 | Gem Services, Inc. | Semiconductor device package diepad having features formed by electroplating |
CN101192275A (zh) * | 2006-11-28 | 2008-06-04 | 卓恩民 | 记忆卡封装结构及其制作方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6084777A (en) * | 1997-04-23 | 2000-07-04 | Texas Instruments Incorporated | Ball grid array package |
US5895967A (en) * | 1997-07-07 | 1999-04-20 | Texas Instruments Incorporated | Ball grid array package having a deformable metal layer and method |
US7129572B2 (en) * | 2004-08-18 | 2006-10-31 | Chung-Cheng Wang | Submember mounted on a chip of electrical device for electrical connection |
TW200814249A (en) * | 2006-09-12 | 2008-03-16 | Chipmos Technologies Inc | Stacked chip package structure with lead-frame having bus bar |
US20080079150A1 (en) * | 2006-09-28 | 2008-04-03 | Juergen Simon | Die arrangement and method for producing a die arrangement |
CN100555592C (zh) * | 2007-02-08 | 2009-10-28 | 百慕达南茂科技股份有限公司 | 芯片封装结构及其制作方法 |
TWI406370B (zh) * | 2009-04-06 | 2013-08-21 | Phison Electronics Corp | 微型快閃記憶體儲存裝置 |
US8810015B2 (en) * | 2009-06-14 | 2014-08-19 | STAT ChipPAC Ltd. | Integrated circuit packaging system with high lead count and method of manufacture thereof |
-
2009
- 2009-06-30 CN CN2009101085612A patent/CN101937886B/zh active Active
- 2009-10-12 US US12/577,251 patent/US20100327425A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6477046B1 (en) * | 1997-05-09 | 2002-11-05 | Texas Instruments Incorporated | Ball grid array package and method using enhanced power and ground distribution circuitry |
US7122406B1 (en) * | 2004-01-02 | 2006-10-17 | Gem Services, Inc. | Semiconductor device package diepad having features formed by electroplating |
CN101192275A (zh) * | 2006-11-28 | 2008-06-04 | 卓恩民 | 记忆卡封装结构及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100327425A1 (en) | 2010-12-30 |
CN101937886A (zh) | 2011-01-05 |
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Effective date of registration: 20121130 Address after: 528437 export processing zone of Torch Development Zone, Guangdong, Zhongshan Patentee after: Ambit Electronics (Zhongshan) Co., Ltd. Address before: 528437 export processing zone of Torch Development Zone, Guangdong, Zhongshan Patentee before: Ambit Electronics (Zhongshan) Co., Ltd. Patentee before: Hon Hai Precision Industry Co., Ltd. |
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Owner name: XUNXIN ELECTRONIC TECHNOLOGY (ZHONGSHAN) CO., LTD. Free format text: FORMER NAME: AMBIT MICROSYSTEMS (ZHONGSHAN) CORPORATION |
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Address after: 528437 No. 9 Jianye East Road, Torch Development Zone, Guangdong, Zhongshan Patentee after: - the core of Electronic Science and Technology (Zhongshan) Co., Ltd. Address before: 528437 export processing zone of Torch Development Zone, Guangdong, Zhongshan Patentee before: Ambit Electronics (Zhongshan) Co., Ltd. |