CN107001898B - 粘合剂组合物和使用该粘合剂组合物的粘合片材 - Google Patents

粘合剂组合物和使用该粘合剂组合物的粘合片材 Download PDF

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Publication number
CN107001898B
CN107001898B CN201580063762.9A CN201580063762A CN107001898B CN 107001898 B CN107001898 B CN 107001898B CN 201580063762 A CN201580063762 A CN 201580063762A CN 107001898 B CN107001898 B CN 107001898B
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Prior art keywords
epoxy
acrylic particles
adhesive
adhesive composition
epoxy resin
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CN201580063762.9A
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English (en)
Chinese (zh)
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CN107001898A (zh
Inventor
星健太郎
筑山一树
田中将史
西雅章
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Dai Nippon Printing Co Ltd
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Honda Motor Co Ltd
Dai Nippon Printing Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
CN201580063762.9A 2014-11-28 2015-11-27 粘合剂组合物和使用该粘合剂组合物的粘合片材 Active CN107001898B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014242550 2014-11-28
JP2014-242550 2014-11-28
PCT/JP2015/083487 WO2016084960A1 (ja) 2014-11-28 2015-11-27 粘着剤組成物及びそれを用いた粘着シート

Publications (2)

Publication Number Publication Date
CN107001898A CN107001898A (zh) 2017-08-01
CN107001898B true CN107001898B (zh) 2020-10-27

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CN201580063762.9A Active CN107001898B (zh) 2014-11-28 2015-11-27 粘合剂组合物和使用该粘合剂组合物的粘合片材

Country Status (6)

Country Link
US (1) US10808152B2 (OSRAM)
EP (1) EP3225673B1 (OSRAM)
JP (1) JP6067828B2 (OSRAM)
KR (1) KR102472818B1 (OSRAM)
CN (1) CN107001898B (OSRAM)
WO (1) WO2016084960A1 (OSRAM)

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MX2019009265A (es) * 2017-02-07 2019-09-19 Ppg Ind Ohio Inc Composiciones adhesivas de curado a baja temperatura.
WO2019087116A2 (en) * 2017-11-01 2019-05-09 3M Innovative Properties Company Low combustibility adhesive composition with layered construction
CN109837032B (zh) * 2017-11-27 2024-02-13 中国科学院大连化学物理研究所 一种金属表面用高拉伸强度快速固化胶黏剂的结构及应用
EP3749703B1 (en) 2018-02-09 2025-09-03 PPG Industries Ohio Inc. Coating compositions
KR102183705B1 (ko) 2018-07-25 2020-11-27 주식회사 엘지화학 접착제 조성물
CN112469797B (zh) 2018-07-25 2022-12-27 株式会社Lg化学 粘合剂组合物
JP7154378B2 (ja) 2018-07-25 2022-10-17 エルジー・ケム・リミテッド 接着剤組成物
WO2020022799A1 (ko) 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
US12146079B2 (en) 2018-07-25 2024-11-19 Lg Chem, Ltd. Adhesive composition
CN112534018B (zh) 2018-07-25 2023-06-23 株式会社Lg化学 粘合剂组合物
US12173195B2 (en) 2018-07-25 2024-12-24 Lg Chem, Ltd. Adhesive composition
JP2020105268A (ja) * 2018-12-26 2020-07-09 スリーエム イノベイティブ プロパティズ カンパニー 帯電防止性積層体及び帯電防止性接着剤
JP2020105280A (ja) * 2018-12-26 2020-07-09 スリーエム イノベイティブ プロパティズ カンパニー 耐熱性積層体及び耐熱性接着剤
EP3931279A4 (en) * 2019-02-26 2022-10-05 Avery Dennison Corporation PSA COMPOSITION WITH HIGH SHEAR AND PEEL PROPERTIES
CN111668122B (zh) * 2019-03-08 2022-03-25 矽磐微电子(重庆)有限公司 半导体封装方法
US20220186083A1 (en) * 2019-03-28 2022-06-16 Nitto Denko Corporation Curable Adhesive Sheet and Production Method of Curable Adhesive Sheet
PH12021552721A1 (en) * 2019-04-26 2022-11-14 Mitsui Chemicals Tohcello Inc Adhesive film and method for manufacturing electronic device
EP4253039A4 (en) * 2020-11-27 2024-10-23 Toray Industries, Inc. PREPREG AND PREPREG PRODUCTION METHOD
KR20250065598A (ko) 2022-09-05 2025-05-13 다이니폰 인사츠 가부시키가이샤 접착 시트, 접착제 조성물 및 구조물
KR102879361B1 (ko) * 2023-12-07 2025-10-31 주식회사 케이씨씨 접착제 조성물

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CN101287794A (zh) * 2005-08-24 2008-10-15 亨克尔两合股份公司 具有改进的耐冲击性的环氧组合物
CN101578346A (zh) * 2007-01-18 2009-11-11 3M创新有限公司 高强度环氧树脂粘结剂及其用途
JP2010084083A (ja) * 2008-10-02 2010-04-15 Yokohama Rubber Co Ltd:The エポキシ樹脂組成物
CN102057010A (zh) * 2008-04-11 2011-05-11 3M创新有限公司 单组分环氧基结构粘合剂
CN102159615A (zh) * 2008-07-23 2011-08-17 3M创新有限公司 两部分的环氧基结构粘合剂
JP2011202043A (ja) * 2010-03-26 2011-10-13 Dainippon Printing Co Ltd 粘接着シート
CN103131374A (zh) * 2013-03-21 2013-06-05 黑龙江省科学院石油化学研究院 无机有机纳米粒子复合改性环氧树脂胶粘剂及其制备方法

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Publication number Priority date Publication date Assignee Title
JP2004018803A (ja) * 2002-06-20 2004-01-22 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN101006135A (zh) * 2004-08-18 2007-07-25 株式会社钟化 半导体密封剂用环氧树脂组合物以及环氧树脂成型材料
CN101287794A (zh) * 2005-08-24 2008-10-15 亨克尔两合股份公司 具有改进的耐冲击性的环氧组合物
CN101578346A (zh) * 2007-01-18 2009-11-11 3M创新有限公司 高强度环氧树脂粘结剂及其用途
CN102057010A (zh) * 2008-04-11 2011-05-11 3M创新有限公司 单组分环氧基结构粘合剂
CN102159615A (zh) * 2008-07-23 2011-08-17 3M创新有限公司 两部分的环氧基结构粘合剂
JP2010084083A (ja) * 2008-10-02 2010-04-15 Yokohama Rubber Co Ltd:The エポキシ樹脂組成物
JP2011202043A (ja) * 2010-03-26 2011-10-13 Dainippon Printing Co Ltd 粘接着シート
CN103131374A (zh) * 2013-03-21 2013-06-05 黑龙江省科学院石油化学研究院 无机有机纳米粒子复合改性环氧树脂胶粘剂及其制备方法

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Publication number Publication date
KR20170089849A (ko) 2017-08-04
US20170327719A1 (en) 2017-11-16
JP6067828B2 (ja) 2017-01-25
EP3225673B1 (en) 2020-07-22
EP3225673A1 (en) 2017-10-04
WO2016084960A1 (ja) 2016-06-02
US10808152B2 (en) 2020-10-20
JP2016108556A (ja) 2016-06-20
CN107001898A (zh) 2017-08-01
KR102472818B1 (ko) 2022-12-02
EP3225673A4 (en) 2018-06-20

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