CN107000418B - 粘结片用层压板及包括其的多层柔性印刷电路板 - Google Patents

粘结片用层压板及包括其的多层柔性印刷电路板 Download PDF

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Publication number
CN107000418B
CN107000418B CN201580066414.7A CN201580066414A CN107000418B CN 107000418 B CN107000418 B CN 107000418B CN 201580066414 A CN201580066414 A CN 201580066414A CN 107000418 B CN107000418 B CN 107000418B
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CN
China
Prior art keywords
layer
epoxy resin
resin
printed circuit
circuit board
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Active
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CN201580066414.7A
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English (en)
Chinese (zh)
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CN107000418A (zh
Inventor
金滢完
朴硄锡
郑印起
郑大炫
金承允
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Doosan Corp
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Doosan Corp
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Publication of CN107000418A publication Critical patent/CN107000418A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
CN201580066414.7A 2014-12-24 2015-12-22 粘结片用层压板及包括其的多层柔性印刷电路板 Active CN107000418B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020140188074A KR101780461B1 (ko) 2014-12-24 2014-12-24 본딩 시트용 적층체 및 이를 포함하는 다층 연성 인쇄회로기판
KR10-2014-0188074 2014-12-24
PCT/KR2015/014075 WO2016105071A1 (ko) 2014-12-24 2015-12-22 본딩 시트용 적층체 및 이를 포함하는 다층 연성 인쇄회로기판

Publications (2)

Publication Number Publication Date
CN107000418A CN107000418A (zh) 2017-08-01
CN107000418B true CN107000418B (zh) 2021-01-26

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CN201580066414.7A Active CN107000418B (zh) 2014-12-24 2015-12-22 粘结片用层压板及包括其的多层柔性印刷电路板

Country Status (3)

Country Link
KR (1) KR101780461B1 (ko)
CN (1) CN107000418B (ko)
WO (1) WO2016105071A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102465243B1 (ko) * 2017-12-14 2022-11-09 주식회사 아모센스 인쇄회로기판 제조 방법 및 이에 의해 제조된 인쇄회로기판

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006183061A (ja) * 2002-04-04 2006-07-13 Kaneka Corp 電子材料用組成物及び電子材料
JP2006261383A (ja) * 2005-03-17 2006-09-28 Sumitomo Bakelite Co Ltd カバーレイフィルムおよびフレキシブル配線板
CN101314705A (zh) * 2007-05-28 2008-12-03 信越化学工业株式会社 阻燃粘合剂组合物和使用其的覆盖层膜
CN102732029A (zh) * 2012-06-21 2012-10-17 广东生益科技股份有限公司 无卤树脂组合物及粘结片与覆铜箔层压板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672505B2 (ja) * 2005-04-13 2011-04-20 信越化学工業株式会社 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
KR100731317B1 (ko) 2005-08-11 2007-06-21 (주)인터플렉스 연성인쇄회로기판의 제조방법
US8541107B2 (en) * 2009-08-13 2013-09-24 E. I. Du Pont De Nemours And Company Pigmented polyimide films and methods relating thereto
JP4709326B1 (ja) * 2010-05-31 2011-06-22 株式会社有沢製作所 ポリイミド樹脂用組成物、及び該ポリイミド樹脂用組成物からなるポリイミド樹脂
KR20120033670A (ko) * 2010-09-30 2012-04-09 도레이첨단소재 주식회사 할로겐 프리 커버레이 필름용 접착제 조성물 및 이를 이용한 할로겐프리 커버레이 필름
KR101477353B1 (ko) * 2012-11-09 2014-12-29 주식회사 두산 수지 조성물 및 이를 포함하는 인쇄 회로 기판용 적층체
KR101377356B1 (ko) * 2012-12-26 2014-03-25 주식회사 두산 접착성이 우수한 에폭시 수지 조성물 및 이를 이용한 수지 복합 동박

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006183061A (ja) * 2002-04-04 2006-07-13 Kaneka Corp 電子材料用組成物及び電子材料
JP2006261383A (ja) * 2005-03-17 2006-09-28 Sumitomo Bakelite Co Ltd カバーレイフィルムおよびフレキシブル配線板
CN101314705A (zh) * 2007-05-28 2008-12-03 信越化学工业株式会社 阻燃粘合剂组合物和使用其的覆盖层膜
CN102732029A (zh) * 2012-06-21 2012-10-17 广东生益科技股份有限公司 无卤树脂组合物及粘结片与覆铜箔层压板

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Publication number Publication date
KR101780461B1 (ko) 2017-09-21
WO2016105071A1 (ko) 2016-06-30
KR20160077763A (ko) 2016-07-04
CN107000418A (zh) 2017-08-01

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