CN107000418B - Laminated board for bonding sheet and multilayer flexible printed circuit board comprising same - Google Patents
Laminated board for bonding sheet and multilayer flexible printed circuit board comprising same Download PDFInfo
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- CN107000418B CN107000418B CN201580066414.7A CN201580066414A CN107000418B CN 107000418 B CN107000418 B CN 107000418B CN 201580066414 A CN201580066414 A CN 201580066414A CN 107000418 B CN107000418 B CN 107000418B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a multilayer flexible printed circuit board including a laminate for an adhesive sheet and the laminate for an adhesive sheet.
Description
Technical Field
The present invention relates to a laminate for adhesive sheets which fulfills the function of an adhesive sheet and also fulfills the function of a cover film, and a multilayer flexible printed circuit board including the same.
Background
Currently, with the emphasis on miniaturization and ultra-thinning of electronic devices such as notebook computers and mobile phones, there is an increasing demand for integration and thinning of printed circuit boards included in the electronic devices. The printed circuit board may be classified into a rigid (rigid) printed circuit board, a flexible (flex) printed circuit board, a rigid-flex printed circuit board combining the two, and the like according to its physical properties.
With the demand for circuit integration of flexible printed circuit boards, the flexible printed circuit boards are formed of a multi-layer structure in which a double-sided printed circuit board is combined with a double-sided printed circuit board or a double-sided printed circuit board is combined with a single-sided printed circuit board. That is, as shown in fig. 1, the multi-layer flexible printed circuit board has a structure in which a single-sided printed circuit board composed of a circuit layer 14 and an insulating layer 15 is bonded to the upper and lower sides of a double-sided printed circuit board including a circuit layer 11 and an insulating layer 12, respectively, through adhesive sheets 16, in which case a coverlay film 13 for protecting the circuit layer 11 is included in the double-sided printed circuit board.
Although circuit integration is achieved by such a multi-layer flexible printed circuit board, there is a limitation in satisfying the lightness and thinness of the multi-layer flexible printed circuit board due to the use of the adhesive sheet 16 for bonding the printed circuit boards and the presence of the plurality of cover films 13.
Furthermore, a prepreg is mainly used as the adhesive sheet 16, but since this prepreg includes a fibrous base material, there is also a problem that the hole workability of the printed wiring board is lowered.
Disclosure of Invention
Technical problem
In order to solve the above problems, an object of the present invention is to provide a laminate for an adhesive sheet having a function of an adhesive sheet and a function of a cover film.
Further, another object of the present invention is to provide a multilayer flexible printed circuit board including the laminate for an adhesive sheet.
Technical scheme
To achieve the above object, the present invention provides a laminate for an adhesive sheet, comprising: a substrate layer; a first resin layer laminated on one surface of the base material layer and formed of a first resin composition; and a second resin layer laminated on the other surface of the base material layer and formed of a second resin composition, wherein the first resin layer and the second resin layer have adhesiveness.
Further, the present invention provides a multilayer flexible printed circuit board comprising: a first printed circuit board including an insulating layer, a first circuit layer bonded to an upper surface of the insulating layer, and a second circuit layer bonded to a lower surface of the insulating layer; a second printed circuit board disposed on the first circuit layer; and a third printed circuit board disposed on the second circuit layer, the adhesive sheet laminate being provided between the first circuit layer and the second printed circuit board, and the adhesive sheet laminate being also provided between the second circuit layer and the third printed circuit board.
ADVANTAGEOUS EFFECTS OF INVENTION
Since the laminated board for bonding sheet of the present invention includes the first and second resin layers having adhesive property, it is possible to bond a plurality of printed circuit boards instead of the conventional prepreg (preprg). In addition, since the first and second resin layers can also perform the function of a cover film, an additional cover film for protecting the circuit layer of the printed circuit board is not required. Accordingly, the present invention can provide a multi-layer flexible printed circuit board having a minimized thickness.
Drawings
Fig. 1 is a sectional view showing a conventional multi-layer flexible printed circuit board.
Fig. 2 is a sectional view showing a pressure-sensitive adhesive sheet laminate according to an example of the present invention.
Detailed Description
The present invention will be explained below.
1. Laminated board for bonding sheet
The present invention relates to a laminate for an adhesive sheet (hereinafter referred to as "laminate") having a coverlay function while bonding a plurality of printed circuit boards, and will be described in detail with reference to fig. 2.
The laminate of the present invention includes a first resin layer 22 and a second resin layer 23 on both sides of a base material layer 21.
The base material layer 21 included in the laminate of the present invention functions to support the laminate. The material constituting the base layer 21 is not particularly limited, and may be, for example, Polyimide (PI), polyethylene terephthalate (PET), Polyethylene (PE), or the like, and particularly preferably, Polyimide (PI). The thickness of the base material layer 21 is not particularly limited, but is preferably 5 to 25 μm, and more preferably 5 to 12 μm when the thinness of the multilayer flexible printed circuit board is taken into consideration.
The first resin layer 22 included in the laminate of the present invention is a layer laminated on one surface of the base material layer 21, and is formed of the first resin composition, and thus has adhesiveness. In addition, since the second resin layer 23 included in the laminate of the present invention is a layer laminated on the other surface of the base material layer 21 and is formed of the second resin composition, the second resin layer 23 also has adhesiveness.
The first resin composition and the second resin composition for forming the first resin layer 22 and the second resin layer 23 are not particularly limited herein, but are preferably epoxy resin compositions. Specifically, the first resin layer 22 and the second resin layer 23 include a first epoxy resin, a second epoxy resin, a rubber-modified epoxy resin, and a hardener, and one or more of the first epoxy resin and the second epoxy resin may be respectively formed of an epoxy resin composition having a polydispersity index (PDI) of 2 or less.
The first epoxy resin included in the epoxy resin composition is an epoxy resin including two or more epoxy groups in a molecule, and is a high equivalent weight epoxy resin having an Epoxy Equivalent Weight (EEW) in the range of 400-1,000 g/eq. The weight average molecular weight (Mw) of such a first epoxy resin is not particularly limited herein, but is preferably in the range of 1,000 to 3,000.
The second epoxy resin included in the epoxy resin composition is also an epoxy resin including two or more epoxy groups in the molecule, and is a low equivalent weight epoxy resin having an Epoxy Equivalent Weight (EEW) in the range of 100-300 g/eq. The weight average molecular weight (Mw) of such a second epoxy resin is not particularly limited herein, but is preferably in the range of 500 to 2,000.
The low equivalent weight (EEW) epoxy resin has a low melt viscosity and good wettability in terms of adhesion, while the high equivalent weight (EEW) epoxy resin itself has plasticity, and thus can improve the molding characteristics such as bendability (bending workability) and punching formability of the laminate. The laminate of the present invention includes such a first resin layer 22 and a second resin layer 23 formed of an epoxy resin composition including two epoxy resins having a difference in polymerization degree (n) or equivalent, and thus can exhibit high adhesion, excellent moisture-resistant reliability, excellent moldability, and the like.
Wherein one or more of the first epoxy resin and the second epoxy resin is an nd (narrow dispersion) epoxy resin having a narrow molecular weight distribution with a polydispersity index (PDI) of 2.0 or less (preferably 1 to 1.7, more preferably 1.1 to 1.5). That is, relatively speaking, the ND epoxy resin having a narrow molecular weight distribution contains a small amount of a High polymer having a High molecular weight (e.g., High Mw species) and a High polymer having a low molecular weight (e.g., Oligomer), and has a uniform molecular weight distribution. Since such ND epoxy resin having a uniform molecular weight distribution has a small side reaction (side reaction) and a higher degree of hardening than general epoxy resins, when a resin layer is formed from an epoxy resin composition containing such ND epoxy resin, a resin layer having a minimized free volume (free volume) is obtained, and finally a resin layer having high adhesiveness and low absorption is obtained. In addition, since impurities such as ions and side reaction products generated during the epoxy resin synthesis process of the ND epoxy resin are low and high purity can be expressed, when a resin layer is formed using an epoxy resin composition including such an ND epoxy resin, a resin layer having a minimized migration amount will be obtained, which will be described later in detail.
The Polydispersity Index (PDI) is a standard (scale) indicating the width (breadth) of the molecular weight distribution of a polymer, and is defined by the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn). Specifically, the larger the Polydispersity Index (PDI), the broader the molecular weight distribution, and the closer to 1, the higher the molecular weight distribution, and the more the polymer is interpreted as a single molecular weight polymer having good physical properties.
Since nd (narrow dispersion) epoxy resin having a polydispersity index of 2.0 or less is used for either or both of the first epoxy resin and the second epoxy resin of the present invention, the viscosity of the epoxy resin composition becomes low, and finally the effect of improving the Wetting (Wetting) property and the adhesiveness of the first resin layer 22 and the second resin layer 23 formed of the epoxy resin composition can be obtained.
When both the first epoxy resin and the second epoxy resin are included in the epoxy resin composition, the mixing ratio thereof is not particularly limited herein, but considering curability, processability, adhesiveness, and the like, the first epoxy resin and the second epoxy resin are preferably mixed in a weight ratio of 10 to 50:50 to 90, more preferably 30 to 50:50 to 70.
The first epoxy resin and the second epoxy resin are not particularly limited as long as they are epoxy resins having the equivalent weight range, and include, as non-limiting examples, bisphenol a type epoxy resins, bisphenol F type epoxy resins, cresol novolac type epoxy resins, dicyclopentadiene type epoxy resins, triphenylmethane type epoxy resins, naphthalene type epoxy resins, biphenyl type epoxy resins, hydrogenated epoxy resins, and the like.
The rubber-modified epoxy resin included in the epoxy resin composition plays a role in improving the adhesiveness, heat resistance and insulation of the epoxy resin composition. Such rubber-modified epoxy resin is not particularly limited, and may be, for example, Nitrile Butadiene Rubber (NBR), carboxyl terminated nitrile butadiene (CTBN) rubber, epoxy terminated nitrile (ETBN) rubber, amino terminated nitrile (ATBN) rubber, or the like.
The content of the rubber-modified epoxy resin included in the epoxy resin composition is not particularly limited herein, but when considering hardenability, processability, adhesiveness, and the like, the content of the rubber-modified epoxy resin is preferably 5 to 50 parts by weight, more preferably 10 to 40 parts by weight, based on 100 parts by weight of the sum of the first epoxy resin, the second epoxy resin, and the hardener.
The hardener included in the epoxy resin composition functions to generate a hardening reaction of the epoxy resin composition. Such a hardener is not particularly limited, and any one known in the art may be used, but two or more hardeners are preferably used, and at least one of them is nd (narrow dispersion) hardener having a Polydispersity Index (PDI) of 2.0 or less (preferably 1 to 1.7, more preferably 1.1 to 1.5).
Specifically, when the first hardener and the second hardener are used as a mixture as a hardener, non-limiting examples of the first hardener include phenol novolac type hardeners, imidazole type hardeners, amine type hardeners, and the like; as a non-limiting example of the second hardener, cresol novolac type hardener, bisphenol a novolac type hardener, naphthalene type hardener, amine type hardener, aminotriazine novolac type hardener, and the like may be mentioned, and the polydispersity index (PDI) of either the first hardener or the second hardener is preferably 2 or less, or the polydispersity index (PDI) of both the first hardener and the second hardener is preferably 2 or less.
The content of the curing agent contained in the epoxy resin composition is not particularly limited, but in view of hardening properties, heat resistance, adhesion properties, and the like, it is preferable to mix the curing agent and the epoxy resin (first epoxy resin + second epoxy resin) in a weight ratio of 20 to 50:50 to 80 in order to prevent deterioration of molding properties such as bending properties and punching properties due to hardening of the insulating layer.
In one aspect, the epoxy resin composition of the present invention may further include an inorganic filler in order to improve viscosity and thermal conductivity. The inorganic filler is not particularly limited as long as it is known in the art, and may be, for example, silica, alumina, zinc oxide, aluminum nitride, silicon nitride, boron nitride, silica, talc, calcium carbonate, magnesium carbonate, or the like.
The content of the inorganic filler included in the epoxy resin composition is not particularly limited herein, but when considering viscosity, thermal conductivity, processability, and the like, the content of the inorganic filler is preferably 5 to 90 parts by weight, more preferably 10 to 40 parts by weight, based on 100 parts by weight of the sum of the first epoxy resin, the second epoxy resin, and the curing agent.
In addition, in order to increase the hardening reaction speed, the epoxy resin composition of the present invention may further include a hardening accelerator. Such a hardening accelerator is not particularly limited as long as it is known in the art, and includes, as non-limiting examples, tertiary amine series such as benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, and the like; imidazole series such as 2-methylimidazole and 2-phenylimidazole; organic phosphines such as triphenylphosphine, diphenylphosphine, phenylphosphine, etc.; tetraphenylborate salts such as tetraphenylboron tetraphenylphosphine and tetraphenylboron triphenylphosphine.
The content of the curing accelerator included in the epoxy resin composition is not particularly limited herein, but the content of the curing accelerator is preferably 0.001 to 0.5 parts by weight based on 100 parts by weight of the sum of the first epoxy resin, the second epoxy resin, and the curing agent in consideration of curing properties and the like.
In addition, the epoxy resin composition of the present invention may further include, within a range not to impair the inherent physical properties of the epoxy resin composition: a flame retardant; a thermosetting resin or a thermoplastic resin and an oligomer thereof not described above; an epoxy resin different from the first and second epoxy resins; ultraviolet absorbers, antioxidants, polymerization initiators, dyes, pigments, dispersants, tackifiers, leveling agents, and the like.
The epoxy resin composition comprises a first epoxy resin and/or a second epoxy resin, K of which is ND epoxy resin+、NH4+Na+、Cl-Since plasma has a small ion content and high purity, the first resin layer 22 and the second resin layer 23 each have an extremely low absorption rate.
Specifically, the first resin layer 22 and the second resin layer 23 of the present invention have an ion content of 10 to 500ppm and a moisture absorption of 0.01 to 0.4%, respectively.
When the first resin layer 22 and the second resin layer 23 having a low ion content are provided as the adhesive layer of the laminate in this manner, conductive ions (for example, Cu) passing through the first resin layer 22 and/or the second resin layer 23 are caused to pass through2+) Thus minimizing the migration of conductive ions to the circuit layer of the printed circuit board bonded to the first resin layer 22 and/or the second resin layer 23 when the laminate of the present invention fulfills the coverlay function, so that a highly reliable multilayer flexible printed circuit board can be provided.
That is, in general, a multilayer flexible circuit board is manufactured by bonding a plurality of printed circuit boards, and in this case, in addition to adhesiveness, an adhesive sheet for bonding between a first printed circuit board and a second printed circuit board or a cover film for protecting the circuit layer is required to have migration resistance for preventing migration of conductive ions present in the circuit layer. This is because the free migration of conductive ions present in the circuit layer induces a short circuit (short circuit), which results in a decrease in the reliability of the first printed circuit board, the second printed circuit board, or the multi-layer flexible printed circuit board including the same.
However, the laminate of the present invention employs the first resin layer 22 and the second resin layer 23 having a moisture absorption rate as low as 0.01 to 0.4% as the adhesive layer, and thus high adhesiveness can be obtained. In addition, the ion content of the first resin layer 22 and the second resin layer 23 is as low as 10 to 500ppm, so that the migration amount of conductive ions is also minimized, and thus excellent migration resistance can also be obtained.
On the one hand, as the first resin composition and the second resin composition for forming the first resin layer 22 and the second resin layer 23, other resin compositions are used in addition to the epoxy resin composition, and thus the present invention can also provide a laminate having a low dielectric constant or excellent heat release property.
The thickness of each of the first resin layer 22 and the second resin layer 23 is not particularly limited herein, but is preferably 10 to 25 μm when considering adhesiveness and ultra-thinning of the multilayer flexible printed circuit board.
The laminate of the present invention may further include release layers respectively protecting the first resin layer 22 and the second resin layer 23. The release layer is not particularly limited, and may be formed of, for example, polyester, polyethylene terephthalate, polyethylene, polypropylene, polyester, silicon, or the like.
The overall thickness of the laminate of the present invention is not particularly limited, but is preferably 25 to 62 μm when considering the ultra-thinning of a multilayer flexible printed circuit board.
2. Multilayer flexible printed circuit board
The present invention includes the laminate, thereby providing a multi-layer flexible printed circuit board that does not include a coverlay film. Specifically, the multilayer flexible printed circuit board of the present invention includes: the first printed circuit board, the second printed circuit board, and the third printed circuit board are provided with the laminate between the first printed circuit board and the second printed circuit board, and the laminate is also provided between the first printed circuit board and the third printed circuit board.
The first printed circuit board included in the multilayer flexible printed circuit board of the present invention includes: the circuit board includes an insulating layer, a first circuit layer bonded to an upper surface of the insulating layer, and a second circuit layer bonded to a lower surface of the insulating layer. The insulating layer and the materials constituting the first and second circuit layers included in the first printed circuit board are not particularly limited and may be those known in the art.
The second printed circuit board included in the multi-layer flexible printed circuit board is configured on the first circuit layer of the first printed circuit board. Such a second printed wiring board may be a single-sided printed wiring board having a circuit layer on one side of an insulating layer or a double-sided printed wiring board having circuit layers on both sides of an insulating layer as in the first printed wiring board.
The third printed circuit board included in the multi-layer flexible printed circuit board of the invention is configured on the second circuit layer of the first printed circuit board. The third printed wiring board may be a single-sided printed wiring board having a circuit layer on one side of an insulating layer or a double-sided printed wiring board having circuit layers on both sides of an insulating layer as in the first printed wiring board.
The multi-layer flexible printed circuit board of the present invention is provided with the laminate between the first circuit layer of the first printed circuit board and the second printed circuit board to combine the first printed circuit board with the second printed circuit board, and is provided with the laminate between the second circuit layer of the first printed circuit board and the third printed circuit board to combine the first printed circuit board with the third printed circuit board. At this time, the first resin layer or the second resin layer included in the laminate performs a function of a cover film while performing a function of a bonding sheet (adhesive layer). Therefore, the multi-layer flexible printed circuit board of the present invention does not need to additionally have cover films for respectively protecting the first circuit layer and the second circuit layer of the first printed circuit board, and thus the present invention can provide an ultra-thin multi-layer flexible printed circuit board.
The present invention will be described in detail below with reference to examples. However, the following examples are only for illustrating the present invention, and the present invention is not limited to the following examples.
[ preparation examples 1 to 6] preparation of epoxy resin compositions
The components were mixed according to the composition of table 1 below to produce an epoxy resin composition. In this case, the content unit of table 1 below is parts by weight, and the content of the remaining components is relatively determined based on 100 parts by weight of the sum of the first epoxy resin, the second epoxy resin, and the curing agent.
[ Table 1]
Comparative preparation examples 1 and 2
An epoxy resin composition was produced in the same manner as in preparation example 1 above, except that the epoxy resin composition was produced by mixing the ingredients according to the composition of table 2 below.
[ Table 2]
EXAMPLES 1 to 6 production of laminate
The epoxy resin compositions prepared in preparation examples 1 to 6 were applied to one surface and the other surface of a base material layer made of Polyimide (PI) having a thickness of 12 μm, respectively, and dried at 160 ℃ for 3 minutes, to prepare a laminate (having an overall thickness of 52 μm) in which a first resin layer and a second resin layer having a thickness of 20 μm were formed, respectively.
EXAMPLE 7 production of laminate
The epoxy resin composition prepared in preparation example 1 was applied to one surface and the other surface of a base layer made of Polyimide (PI) having a thickness of 5 μm, respectively, and dried at 160 ℃ for 3 minutes, thereby producing a laminate (having an overall thickness of 25 μm) in which a first resin layer and a second resin layer having a thickness of 10 μm were formed, respectively.
Comparative examples 1 and 2 production of laminate
A laminate (having an overall thickness of 52 μm) was produced in the same manner as in example 1, except that the first resin layer and the second resin layer were formed from the epoxy resin compositions produced in comparative preparation examples 1 and 2, respectively.
Experimental example 1 evaluation of physical Properties of laminate
Physical properties of the laminates respectively manufactured in the examples 1 to 7 and comparative examples 1 and 2 were evaluated by the following methods, and the results thereof are shown in table 3 below.
1) Coating property: the degree of coating the first resin layer and the second resin layer on the base material layer was evaluated with naked eyes (very good:. circinatus: good:. DELTA.: general/X: no good).
2) Adhesion (Peel Strength, P/S): the adhesiveness of the first resin layer and the second resin layer was evaluated in accordance with the evaluation standard IPC-TM-6502.4.8.
3) Heat resistance: the heat resistance of the first resin layer and the second resin layer was evaluated in accordance with the evaluation standard of IPC (TM) -6502.4.13.
4) Absorption rate (%): the absorptance of the first resin layer and the second resin layer was evaluated in accordance with the evaluation standard of IPC-TM-6502.6.2.1.
5) Ion content (ppm): the ion contents of the first resin layer and the second resin layer were evaluated by ion chromatography.
6) Ion migration assay (Ion-migration Test): the degree of Ion migration of the first resin layer and the second resin layer was evaluated under the conditions of Pattern (Line/Space) of 75/75 μm, temperature of 85 ℃, humidity of 85% RH, and DC of 100V.
[ Table 3]
Referring to table 3 above, it was confirmed that the laminate according to the present invention has excellent physical properties.
Claims (3)
1. A laminate for bonding sheets, comprising:
a substrate layer;
a first resin layer laminated on one surface of the base material layer and formed of a first resin composition; and
a second resin layer laminated on the other surface of the base layer and formed of a second resin composition,
the resin compositions forming the first resin layer and the second resin layer respectively include a first epoxy resin, a second epoxy resin, a rubber-modified epoxy resin, and a hardener,
the first epoxy resin, the second epoxy resin, and the hardener each have a polydispersity index of 2 or less,
the rubber modified epoxy resin is nitrile rubber modified epoxy resin,
the rubber-modified epoxy resin is contained in an amount of 20 to 30 parts by weight, based on 100 parts by weight of the sum of the first epoxy resin, the second epoxy resin and the hardener,
the first resin layer and the second resin layer have adhesiveness,
the absorbances of the first resin layer and the second resin layer are respectively 0.01 to 0.25% and the ion content is 10 to 500ppm as measured according to the evaluation specification of IPC-TM-6502.6.2.1,
the degree of ion migration of the first resin layer and the second resin layer evaluated under the conditions of 85 ℃ temperature, 85% RH humidity and 100V DC is 800 hours or more.
2. The laminate for bonding sheet according to claim 1,
the thickness is 25 to 62 μm.
3. A multilayer flexible printed circuit board, comprising:
a first printed circuit board including an insulating layer, a first circuit layer bonded to an upper surface of the insulating layer, and a second circuit layer bonded to a lower surface of the insulating layer;
a second printed circuit board disposed on the first circuit layer; and
a third printed circuit board disposed on the second circuit layer,
the laminate for bonding sheet according to claim 1 or 2 is provided between the first circuit layer and the second printed wiring board,
the adhesive sheet laminate is provided between the second circuit layer and the third printed wiring board.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0188074 | 2014-12-24 | ||
| KR1020140188074A KR101780461B1 (en) | 2014-12-24 | 2014-12-24 | Laminate for bonding sheet and multilayered flexible printed circuit board comprising the same |
| PCT/KR2015/014075 WO2016105071A1 (en) | 2014-12-24 | 2015-12-22 | Laminate for bonding sheet and multilayer flexible printed circuit board including same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107000418A CN107000418A (en) | 2017-08-01 |
| CN107000418B true CN107000418B (en) | 2021-01-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580066414.7A Active CN107000418B (en) | 2014-12-24 | 2015-12-22 | Laminated board for bonding sheet and multilayer flexible printed circuit board comprising same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101780461B1 (en) |
| CN (1) | CN107000418B (en) |
| WO (1) | WO2016105071A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102465243B1 (en) * | 2017-12-14 | 2022-11-09 | 주식회사 아모센스 | Method for manufacturing circuit board and circuit board manufactured by the method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006183061A (en) * | 2002-04-04 | 2006-07-13 | Kaneka Corp | Composition for electronic material, and electronic material |
| JP2006261383A (en) * | 2005-03-17 | 2006-09-28 | Sumitomo Bakelite Co Ltd | Coverlay film and flexible wiring board |
| CN101314705A (en) * | 2007-05-28 | 2008-12-03 | 信越化学工业株式会社 | Fire retardant adhesive composition and covering layer film using the same |
| CN102732029A (en) * | 2012-06-21 | 2012-10-17 | 广东生益科技股份有限公司 | Halogen-free resin composition, bonding sheet and copper-clad laminate |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4672505B2 (en) * | 2005-04-13 | 2011-04-20 | 信越化学工業株式会社 | Flame-retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using the same |
| KR100731317B1 (en) | 2005-08-11 | 2007-06-21 | (주)인터플렉스 | Manufacturing method of flexible printed circuit board |
| US8541107B2 (en) * | 2009-08-13 | 2013-09-24 | E. I. Du Pont De Nemours And Company | Pigmented polyimide films and methods relating thereto |
| CN102405259B (en) * | 2010-05-31 | 2013-03-13 | 株式会社有泽制作所 | Composition for polyimide resin and polyimide resin comprising same |
| KR20120033670A (en) * | 2010-09-30 | 2012-04-09 | 도레이첨단소재 주식회사 | Adhesive composition for halogen-free coverlay film and coverlay film using the same |
| KR101477353B1 (en) * | 2012-11-09 | 2014-12-29 | 주식회사 두산 | Resin composition and laminate for printed circuit board comprising the same |
| KR101377356B1 (en) * | 2012-12-26 | 2014-03-25 | 주식회사 두산 | Epoxy resin composition having an excellent adhesive property and copper foil with resin |
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2014
- 2014-12-24 KR KR1020140188074A patent/KR101780461B1/en not_active Application Discontinuation
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2015
- 2015-12-22 CN CN201580066414.7A patent/CN107000418B/en active Active
- 2015-12-22 WO PCT/KR2015/014075 patent/WO2016105071A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006183061A (en) * | 2002-04-04 | 2006-07-13 | Kaneka Corp | Composition for electronic material, and electronic material |
| JP2006261383A (en) * | 2005-03-17 | 2006-09-28 | Sumitomo Bakelite Co Ltd | Coverlay film and flexible wiring board |
| CN101314705A (en) * | 2007-05-28 | 2008-12-03 | 信越化学工业株式会社 | Fire retardant adhesive composition and covering layer film using the same |
| CN102732029A (en) * | 2012-06-21 | 2012-10-17 | 广东生益科技股份有限公司 | Halogen-free resin composition, bonding sheet and copper-clad laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016105071A1 (en) | 2016-06-30 |
| KR20160077763A (en) | 2016-07-04 |
| CN107000418A (en) | 2017-08-01 |
| KR101780461B1 (en) | 2017-09-21 |
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