CN106935596A - 一种柔性基板的制备方法 - Google Patents
一种柔性基板的制备方法 Download PDFInfo
- Publication number
- CN106935596A CN106935596A CN201710098365.6A CN201710098365A CN106935596A CN 106935596 A CN106935596 A CN 106935596A CN 201710098365 A CN201710098365 A CN 201710098365A CN 106935596 A CN106935596 A CN 106935596A
- Authority
- CN
- China
- Prior art keywords
- flexible substrates
- glass substrate
- flexible
- edge
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 188
- 239000011521 glass Substances 0.000 claims abstract description 76
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims description 67
- 239000004642 Polyimide Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 8
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 claims 1
- 239000012528 membrane Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000035882 stress Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229920001621 AMOLED Polymers 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- -1 formic acid glycol ester Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710098365.6A CN106935596A (zh) | 2017-02-22 | 2017-02-22 | 一种柔性基板的制备方法 |
| PCT/CN2017/076599 WO2018152889A1 (fr) | 2017-02-22 | 2017-03-14 | Procédé de préparation d'un substrat flexible |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710098365.6A CN106935596A (zh) | 2017-02-22 | 2017-02-22 | 一种柔性基板的制备方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106935596A true CN106935596A (zh) | 2017-07-07 |
Family
ID=59423121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710098365.6A Pending CN106935596A (zh) | 2017-02-22 | 2017-02-22 | 一种柔性基板的制备方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106935596A (fr) |
| WO (1) | WO2018152889A1 (fr) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107464895A (zh) * | 2017-09-19 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | 柔性显示屏的制作方法 |
| CN109389903A (zh) * | 2017-08-04 | 2019-02-26 | 京东方科技集团股份有限公司 | 柔性基板及其加工方法、加工系统 |
| WO2019080241A1 (fr) * | 2017-10-27 | 2019-05-02 | 武汉华星光电半导体显示技术有限公司 | Carte mère de panneau d'affichage, et procédé permettant de découper une carte mère de panneau d'affichage |
| CN110473985A (zh) * | 2019-08-27 | 2019-11-19 | 云谷（固安）科技有限公司 | 一种柔性基板、柔性显示面板及柔性基板的制作方法 |
| CN110828505A (zh) * | 2018-07-23 | 2020-02-21 | 京东方科技集团股份有限公司 | 柔性面板的制作方法及制作装置 |
| CN111613580A (zh) * | 2020-05-21 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | 柔性基板的制备方法及柔性基板 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545463A (zh) * | 2013-09-27 | 2014-01-29 | Tcl集团股份有限公司 | 一种柔性显示器件及其制作方法 |
| CN103996698A (zh) * | 2014-05-29 | 2014-08-20 | 友达光电股份有限公司 | 一种软性面板的制作方法 |
| CN105493287A (zh) * | 2015-09-18 | 2016-04-13 | 京东方科技集团股份有限公司 | 一种柔性显示装置的制备方法 |
| CN106098940A (zh) * | 2016-08-26 | 2016-11-09 | 武汉华星光电技术有限公司 | 无损剥离柔性基板的方法 |
| CN106328683A (zh) * | 2016-10-11 | 2017-01-11 | 武汉华星光电技术有限公司 | 柔性oled显示器及其制作方法 |
-
2017
- 2017-02-22 CN CN201710098365.6A patent/CN106935596A/zh active Pending
- 2017-03-14 WO PCT/CN2017/076599 patent/WO2018152889A1/fr active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545463A (zh) * | 2013-09-27 | 2014-01-29 | Tcl集团股份有限公司 | 一种柔性显示器件及其制作方法 |
| CN103996698A (zh) * | 2014-05-29 | 2014-08-20 | 友达光电股份有限公司 | 一种软性面板的制作方法 |
| CN105493287A (zh) * | 2015-09-18 | 2016-04-13 | 京东方科技集团股份有限公司 | 一种柔性显示装置的制备方法 |
| CN106098940A (zh) * | 2016-08-26 | 2016-11-09 | 武汉华星光电技术有限公司 | 无损剥离柔性基板的方法 |
| CN106328683A (zh) * | 2016-10-11 | 2017-01-11 | 武汉华星光电技术有限公司 | 柔性oled显示器及其制作方法 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109389903A (zh) * | 2017-08-04 | 2019-02-26 | 京东方科技集团股份有限公司 | 柔性基板及其加工方法、加工系统 |
| JP2020529118A (ja) * | 2017-08-04 | 2020-10-01 | 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． | フレキシブル基板及びその加工方法、加工システム |
| EP3664066A4 (fr) * | 2017-08-04 | 2021-05-05 | BOE Technology Group Co., Ltd. | Substrat souple, procédé de traitement et système de traitement associés |
| US11430351B2 (en) * | 2017-08-04 | 2022-08-30 | Boe Technology Group Co., Ltd. | Processing method and processing system of a flexible substrate |
| JP7340931B2 (ja) | 2017-08-04 | 2023-09-08 | 京東方科技集團股▲ふん▼有限公司 | フレキシブル基板及びその加工方法、加工システム |
| CN107464895A (zh) * | 2017-09-19 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | 柔性显示屏的制作方法 |
| WO2019080241A1 (fr) * | 2017-10-27 | 2019-05-02 | 武汉华星光电半导体显示技术有限公司 | Carte mère de panneau d'affichage, et procédé permettant de découper une carte mère de panneau d'affichage |
| CN110828505A (zh) * | 2018-07-23 | 2020-02-21 | 京东方科技集团股份有限公司 | 柔性面板的制作方法及制作装置 |
| CN110828505B (zh) * | 2018-07-23 | 2022-06-07 | 京东方科技集团股份有限公司 | 柔性面板的制作方法及制作装置 |
| CN110473985A (zh) * | 2019-08-27 | 2019-11-19 | 云谷（固安）科技有限公司 | 一种柔性基板、柔性显示面板及柔性基板的制作方法 |
| CN111613580A (zh) * | 2020-05-21 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | 柔性基板的制备方法及柔性基板 |
| CN111613580B (zh) * | 2020-05-21 | 2023-04-18 | 深圳市华星光电半导体显示技术有限公司 | 柔性基板的制备方法及柔性基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018152889A1 (fr) | 2018-08-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |
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| RJ01 | Rejection of invention patent application after publication |