CN106661272A - 用作光电组件中的涂覆试剂的杂化材料 - Google Patents
用作光电组件中的涂覆试剂的杂化材料 Download PDFInfo
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- CN106661272A CN106661272A CN201580038543.5A CN201580038543A CN106661272A CN 106661272 A CN106661272 A CN 106661272A CN 201580038543 A CN201580038543 A CN 201580038543A CN 106661272 A CN106661272 A CN 106661272A
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- methyl
- purposes according
- formula
- ethyl
- organopolysilazane
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/62—Nitrogen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/16—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/22—Luminous paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/67—Particle size smaller than 100 nm
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Paints Or Removers (AREA)
- Silicon Polymers (AREA)
- Optical Filters (AREA)
- Surface Treatment Of Optical Elements (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14178994.1 | 2014-07-29 | ||
EP14178994 | 2014-07-29 | ||
PCT/EP2015/067304 WO2016016260A1 (de) | 2014-07-29 | 2015-07-28 | Hybridmaterial zur verwendung als beschichtungsmittel in optoelektronischen bauteilen |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106661272A true CN106661272A (zh) | 2017-05-10 |
CN106661272B CN106661272B (zh) | 2020-01-10 |
Family
ID=51260631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580038543.5A Active CN106661272B (zh) | 2014-07-29 | 2015-07-28 | 用作光电组件中的涂覆试剂的杂化材料 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10385234B2 (zh) |
EP (1) | EP3174948B1 (zh) |
JP (1) | JP6777625B2 (zh) |
KR (1) | KR102487423B1 (zh) |
CN (1) | CN106661272B (zh) |
TW (1) | TWI671362B (zh) |
WO (1) | WO2016016260A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109686871A (zh) * | 2017-10-18 | 2019-04-26 | Tcl集团股份有限公司 | 一种墨水的制备方法与应用、及顶发射器件的封装方法 |
CN112513196A (zh) * | 2018-07-30 | 2021-03-16 | 3M创新有限公司 | 透明的弹性体纳米复合材料共混物 |
Families Citing this family (10)
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KR102400691B1 (ko) * | 2016-07-18 | 2022-05-23 | 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. | Led 밀봉 물질용 제형 |
CN109564961A (zh) * | 2016-07-18 | 2019-04-02 | Az电子材料(卢森堡)有限公司 | 用于led封装材料的制剂 |
EP3450516A1 (de) | 2017-09-04 | 2019-03-06 | EBC-Consulting AG | Zusammensetzung zur veredelung eines substrats, insbesondere von glas |
EP3553121B1 (en) * | 2018-04-11 | 2021-06-09 | Shin-Etsu Chemical Co., Ltd. | Water repellent film-forming composition and water repellent film |
JP7135851B2 (ja) * | 2018-04-11 | 2022-09-13 | 信越化学工業株式会社 | 撥水性被膜形成用組成物及び撥水性被膜 |
JP2022512242A (ja) * | 2018-12-14 | 2022-02-02 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 表面コーティング組成物 |
US11279848B2 (en) * | 2019-08-29 | 2022-03-22 | Shin-Etsu Chemical Co., Ltd. | Polysilazane composition, coated substrate, and multilayer construction |
US20240050932A1 (en) * | 2020-11-30 | 2024-02-15 | Jk Research & Engineering Pte. Ltd. | A coating composition, coating and methods of forming the same |
CN115772268B (zh) * | 2021-09-08 | 2023-09-15 | 涂创时代(苏州)科技开发有限公司 | 一种改性聚硅氮烷纳米复合材料及其制备方法与应用 |
GB202201257D0 (en) | 2022-02-01 | 2022-03-16 | Qinetiq Ltd | Method for preparing precursors |
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CN101654778A (zh) * | 2008-08-21 | 2010-02-24 | 北京盘天新技术有限公司 | 一种由聚合物先驱体制备绝缘导热陶瓷涂层的方法 |
CN103380487A (zh) * | 2011-02-18 | 2013-10-30 | Az电子材料Ip(日本)株式会社 | 绝缘膜的形成方法 |
WO2014032817A1 (de) * | 2012-08-30 | 2014-03-06 | Clariant International Ltd | Verfahren zur herstellung von thermoplastischen präkeramischen polymeren |
KR20140068547A (ko) * | 2012-11-28 | 2014-06-09 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
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2015
- 2015-07-28 EP EP15742296.5A patent/EP3174948B1/de active Active
- 2015-07-28 WO PCT/EP2015/067304 patent/WO2016016260A1/de active Application Filing
- 2015-07-28 KR KR1020177002604A patent/KR102487423B1/ko active IP Right Grant
- 2015-07-28 US US15/329,311 patent/US10385234B2/en active Active
- 2015-07-28 CN CN201580038543.5A patent/CN106661272B/zh active Active
- 2015-07-28 JP JP2017504821A patent/JP6777625B2/ja active Active
- 2015-07-29 TW TW104124526A patent/TWI671362B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101654778A (zh) * | 2008-08-21 | 2010-02-24 | 北京盘天新技术有限公司 | 一种由聚合物先驱体制备绝缘导热陶瓷涂层的方法 |
CN103380487A (zh) * | 2011-02-18 | 2013-10-30 | Az电子材料Ip(日本)株式会社 | 绝缘膜的形成方法 |
WO2014032817A1 (de) * | 2012-08-30 | 2014-03-06 | Clariant International Ltd | Verfahren zur herstellung von thermoplastischen präkeramischen polymeren |
KR20140068547A (ko) * | 2012-11-28 | 2014-06-09 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
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CN109686871A (zh) * | 2017-10-18 | 2019-04-26 | Tcl集团股份有限公司 | 一种墨水的制备方法与应用、及顶发射器件的封装方法 |
CN112513196A (zh) * | 2018-07-30 | 2021-03-16 | 3M创新有限公司 | 透明的弹性体纳米复合材料共混物 |
CN112513196B (zh) * | 2018-07-30 | 2023-01-10 | 3M创新有限公司 | 透明的弹性体纳米复合材料共混物 |
Also Published As
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EP3174948B1 (de) | 2021-06-09 |
US10385234B2 (en) | 2019-08-20 |
TWI671362B (zh) | 2019-09-11 |
EP3174948A1 (de) | 2017-06-07 |
KR102487423B1 (ko) | 2023-01-10 |
WO2016016260A1 (de) | 2016-02-04 |
KR20170066309A (ko) | 2017-06-14 |
JP6777625B2 (ja) | 2020-10-28 |
CN106661272B (zh) | 2020-01-10 |
US20170210944A1 (en) | 2017-07-27 |
JP2017524158A (ja) | 2017-08-24 |
TW201609981A (zh) | 2016-03-16 |
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