CN106605299A - 半导体装置以及使用该半导体装置的交流发电机和电力转换装置 - Google Patents

半导体装置以及使用该半导体装置的交流发电机和电力转换装置 Download PDF

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Publication number
CN106605299A
CN106605299A CN201580047798.8A CN201580047798A CN106605299A CN 106605299 A CN106605299 A CN 106605299A CN 201580047798 A CN201580047798 A CN 201580047798A CN 106605299 A CN106605299 A CN 106605299A
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Prior art keywords
electrode
mosfet
chip
control circuit
semiconductor device
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Pending
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CN201580047798.8A
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Chinese (zh)
Inventor
石丸哲也
森睦宏
栗田信
栗田信一
菅山茂
坂野顺
坂野顺一
恩田航平
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Minebea Power Semiconductor Device Inc
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Hitachi Power Semiconductor Device Ltd
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Publication of CN106605299A publication Critical patent/CN106605299A/zh
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Rectifiers (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN201580047798.8A 2014-09-11 2015-08-19 半导体装置以及使用该半导体装置的交流发电机和电力转换装置 Pending CN106605299A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014184783A JP6263108B2 (ja) 2014-09-11 2014-09-11 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置
JP2014-184783 2014-09-11
PCT/JP2015/073182 WO2016039094A1 (ja) 2014-09-11 2015-08-19 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置

Publications (1)

Publication Number Publication Date
CN106605299A true CN106605299A (zh) 2017-04-26

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CN201580047798.8A Pending CN106605299A (zh) 2014-09-11 2015-08-19 半导体装置以及使用该半导体装置的交流发电机和电力转换装置

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US (1) US9831145B2 (https=)
JP (1) JP6263108B2 (https=)
CN (1) CN106605299A (https=)
DE (1) DE112015003757B4 (https=)
TW (1) TWI582942B (https=)
WO (1) WO2016039094A1 (https=)

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CN109390328A (zh) * 2017-08-07 2019-02-26 株式会社日立功率半导体 半导体装置以及使用了该半导体装置的交流发电机
CN110277882A (zh) * 2018-03-16 2019-09-24 株式会社电装 功率半导体器件、具有该功率半导体器件的旋转电机以及制造功率半导体器件的方法

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JP6263014B2 (ja) * 2013-12-12 2018-01-17 株式会社日立製作所 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置
JP6617002B2 (ja) * 2015-10-20 2019-12-04 株式会社 日立パワーデバイス 整流器、それを用いたオルタネータおよび電源
DE112017005289T5 (de) * 2017-02-02 2019-07-25 Borgwarner Inc. Elektrische Maschine mit eingepresstem Elektronikmodul
DE112018003873T5 (de) 2017-04-24 2020-04-23 Rohm Co., Ltd. Elektronische komponente und halbleitervorrichtung
JP2019122211A (ja) * 2018-01-11 2019-07-22 株式会社デンソー 回転電機
JP6988518B2 (ja) * 2018-01-26 2022-01-05 株式会社デンソー 整流装置及び回転電機
JP6996385B2 (ja) * 2018-03-28 2022-01-17 住友電気工業株式会社 増幅器
TWI710138B (zh) * 2018-06-21 2020-11-11 朋程科技股份有限公司 用於整流器的功率元件
CN108807305B (zh) * 2018-07-02 2024-02-13 山东晶导微电子股份有限公司 一种带输出保护的电源功率模块结构
JP7231407B2 (ja) * 2018-12-27 2023-03-01 株式会社 日立パワーデバイス 半導体装置およびそれを用いたオルタネータ
EP4235194A3 (en) * 2019-03-22 2023-09-13 Melexis Technologies SA Current sensor
JP7232743B2 (ja) * 2019-10-24 2023-03-03 株式会社 日立パワーデバイス 半導体装置及びそれを用いた整流素子、オルタネータ
DE112020007225B4 (de) * 2020-05-21 2025-07-10 Mitsubishi Electric Corporation Halbleitervorrichtung, Leistungsumwandlungseinrichtung, sich bewegender Körper und Verfahren zum Herstellen einer Halbleitervorrichtung
CN116686086A (zh) * 2021-02-03 2023-09-01 罗姆股份有限公司 半导体装置
JP7580352B2 (ja) * 2021-09-01 2024-11-11 三菱電機株式会社 半導体装置、半導体装置の製造方法、および電力変換装置
JP2024175486A (ja) * 2023-06-06 2024-12-18 ミネベアパワーデバイス株式会社 半導体装置及びそれを用いた電力変換装置

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US5726557A (en) * 1995-06-06 1998-03-10 Nippondenso Co., Ltd. Vehicular electric power system
US5886403A (en) * 1996-08-08 1999-03-23 Denso Corporation Sealed rectifier
US20040222484A1 (en) * 2000-02-08 2004-11-11 Vlt Corporation, A Texas Corporation Active rectifier
US6476480B1 (en) * 2000-07-10 2002-11-05 Delphi Technologies, Inc. Press-fit IC power package and method therefor
US20020141214A1 (en) * 2001-03-28 2002-10-03 Koninklijke Philips Electronics N.V. Synchronous rectifiers
CN1722418A (zh) * 2004-06-08 2006-01-18 富士电机电子设备技术株式会社 半导体装置
CN101542902A (zh) * 2006-11-16 2009-09-23 法雷奥电机设备公司 同步整流器电桥的部件、相关同步整流器电桥及其应用
TW200941914A (en) * 2007-12-14 2009-10-01 Bosch Gmbh Robert Rectifier circuit
JP2009194791A (ja) * 2008-02-18 2009-08-27 Mitsubishi Electric Corp 一方向導通装置
JP2010258135A (ja) * 2009-04-23 2010-11-11 Nippon Soken Inc 電力変換用半導体装置
JP2012142466A (ja) * 2011-01-04 2012-07-26 Mitsubishi Electric Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109390328A (zh) * 2017-08-07 2019-02-26 株式会社日立功率半导体 半导体装置以及使用了该半导体装置的交流发电机
CN109390328B (zh) * 2017-08-07 2022-02-08 株式会社日立功率半导体 半导体装置以及使用了该半导体装置的交流发电机
CN110277882A (zh) * 2018-03-16 2019-09-24 株式会社电装 功率半导体器件、具有该功率半导体器件的旋转电机以及制造功率半导体器件的方法

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US9831145B2 (en) 2017-11-28
DE112015003757T5 (de) 2017-06-29
US20170263516A1 (en) 2017-09-14
WO2016039094A1 (ja) 2016-03-17
JP2016058594A (ja) 2016-04-21
TW201622099A (zh) 2016-06-16
TWI582942B (zh) 2017-05-11
JP6263108B2 (ja) 2018-01-17
DE112015003757B4 (de) 2024-07-04

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