TWI582942B - A semiconductor device, and a generator and a power conversion device using the same - Google Patents

A semiconductor device, and a generator and a power conversion device using the same Download PDF

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Publication number
TWI582942B
TWI582942B TW104129982A TW104129982A TWI582942B TW I582942 B TWI582942 B TW I582942B TW 104129982 A TW104129982 A TW 104129982A TW 104129982 A TW104129982 A TW 104129982A TW I582942 B TWI582942 B TW I582942B
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TW
Taiwan
Prior art keywords
electrode
mosfet
wafer
control circuit
semiconductor device
Prior art date
Application number
TW104129982A
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English (en)
Chinese (zh)
Other versions
TW201622099A (zh
Inventor
石丸哲也
森睦宏
栗田信一
菅山茂
坂野順一
恩田航平
Original Assignee
日立功率半導體股份有限公司
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Publication of TW201622099A publication Critical patent/TW201622099A/zh
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Publication of TWI582942B publication Critical patent/TWI582942B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Rectifiers (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW104129982A 2014-09-11 2015-09-10 A semiconductor device, and a generator and a power conversion device using the same TWI582942B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014184783A JP6263108B2 (ja) 2014-09-11 2014-09-11 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置

Publications (2)

Publication Number Publication Date
TW201622099A TW201622099A (zh) 2016-06-16
TWI582942B true TWI582942B (zh) 2017-05-11

Family

ID=55458852

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104129982A TWI582942B (zh) 2014-09-11 2015-09-10 A semiconductor device, and a generator and a power conversion device using the same

Country Status (6)

Country Link
US (1) US9831145B2 (https=)
JP (1) JP6263108B2 (https=)
CN (1) CN106605299A (https=)
DE (1) DE112015003757B4 (https=)
TW (1) TWI582942B (https=)
WO (1) WO2016039094A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI771771B (zh) * 2019-10-24 2022-07-21 日商日立功率半導體股份有限公司 半導體裝置及使用其之整流元件及交流發電機

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6263014B2 (ja) * 2013-12-12 2018-01-17 株式会社日立製作所 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置
JP6617002B2 (ja) * 2015-10-20 2019-12-04 株式会社 日立パワーデバイス 整流器、それを用いたオルタネータおよび電源
DE112017005289T5 (de) * 2017-02-02 2019-07-25 Borgwarner Inc. Elektrische Maschine mit eingepresstem Elektronikmodul
DE112018003873T5 (de) 2017-04-24 2020-04-23 Rohm Co., Ltd. Elektronische komponente und halbleitervorrichtung
JP6869140B2 (ja) * 2017-08-07 2021-05-12 株式会社 日立パワーデバイス 半導体装置及びそれを用いたオルタネータ
JP2019122211A (ja) * 2018-01-11 2019-07-22 株式会社デンソー 回転電機
JP6988518B2 (ja) * 2018-01-26 2022-01-05 株式会社デンソー 整流装置及び回転電機
JP7087495B2 (ja) 2018-03-16 2022-06-21 株式会社デンソー パワー半導体装置、それを備える回転電機、及び、パワー半導体装置の製造方法
JP6996385B2 (ja) * 2018-03-28 2022-01-17 住友電気工業株式会社 増幅器
TWI710138B (zh) * 2018-06-21 2020-11-11 朋程科技股份有限公司 用於整流器的功率元件
CN108807305B (zh) * 2018-07-02 2024-02-13 山东晶导微电子股份有限公司 一种带输出保护的电源功率模块结构
JP7231407B2 (ja) * 2018-12-27 2023-03-01 株式会社 日立パワーデバイス 半導体装置およびそれを用いたオルタネータ
EP4235194A3 (en) * 2019-03-22 2023-09-13 Melexis Technologies SA Current sensor
DE112020007225B4 (de) * 2020-05-21 2025-07-10 Mitsubishi Electric Corporation Halbleitervorrichtung, Leistungsumwandlungseinrichtung, sich bewegender Körper und Verfahren zum Herstellen einer Halbleitervorrichtung
CN116686086A (zh) * 2021-02-03 2023-09-01 罗姆股份有限公司 半导体装置
JP7580352B2 (ja) * 2021-09-01 2024-11-11 三菱電機株式会社 半導体装置、半導体装置の製造方法、および電力変換装置
JP2024175486A (ja) * 2023-06-06 2024-12-18 ミネベアパワーデバイス株式会社 半導体装置及びそれを用いた電力変換装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040222484A1 (en) * 2000-02-08 2004-11-11 Vlt Corporation, A Texas Corporation Active rectifier
TW201011889A (en) * 2008-09-10 2010-03-16 Renesas Tech Corp Semiconductor device
US20100091533A1 (en) * 2006-11-16 2010-04-15 Philippe Masson Member for a synchronous rectifier bridge, related synchronous rectifier bridge and use thereof
TW201145477A (en) * 2003-05-14 2011-12-16 Renesas Electronics Corp Semiconductor device and power supply system

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08336238A (ja) 1995-06-06 1996-12-17 Nippondenso Co Ltd 車両用電源システム
JPH10215552A (ja) * 1996-08-08 1998-08-11 Denso Corp 交流発電機の整流装置とその製造方法
US6160309A (en) * 1999-03-25 2000-12-12 Le; Hiep Press-fit semiconductor package
US6476480B1 (en) 2000-07-10 2002-11-05 Delphi Technologies, Inc. Press-fit IC power package and method therefor
DE60217478D1 (en) * 2001-03-28 2007-02-22 Koninkl Philips Electronics Nv Sychrongleichrichter
JP2003033038A (ja) 2001-07-13 2003-01-31 Mitsubishi Electric Corp 車両用発電機の整流装置
KR100441260B1 (ko) * 2003-10-20 2004-07-21 주식회사 케이이씨 정류 다이오드 패키지
TW200527618A (en) 2003-11-10 2005-08-16 Bosch Gmbh Robert Diode
JP4764979B2 (ja) * 2004-06-08 2011-09-07 富士電機株式会社 半導体装置
DE102005024900B4 (de) 2004-06-08 2012-08-16 Fuji Electric Co., Ltd. Leistungsmodul
CN100517669C (zh) * 2004-06-08 2009-07-22 富士电机电子技术株式会社 半导体装置
US7009223B1 (en) * 2004-08-31 2006-03-07 Sung Jung Minute Industry Co., Ltd. Rectification chip terminal structure
US6958530B1 (en) * 2004-08-31 2005-10-25 Sung Jung Minute Industry Co., Ltd. Rectification chip terminal structure
US20060220218A1 (en) * 2005-03-11 2006-10-05 Charng-Geng Sheen Embedded-type power semiconductor package device
DE102007060219A1 (de) * 2007-12-14 2009-06-18 Robert Bosch Gmbh Gleichrichterschaltung
JP4846744B2 (ja) * 2008-02-18 2011-12-28 三菱電機株式会社 一方向導通装置
JP5286150B2 (ja) * 2009-04-23 2013-09-11 株式会社日本自動車部品総合研究所 電力変換用半導体装置
JP2012142466A (ja) * 2011-01-04 2012-07-26 Mitsubishi Electric Corp 半導体装置
JP6006628B2 (ja) * 2012-12-11 2016-10-12 株式会社 日立パワーデバイス パワー半導体装置、整流装置および電源装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040222484A1 (en) * 2000-02-08 2004-11-11 Vlt Corporation, A Texas Corporation Active rectifier
TW201145477A (en) * 2003-05-14 2011-12-16 Renesas Electronics Corp Semiconductor device and power supply system
US20100091533A1 (en) * 2006-11-16 2010-04-15 Philippe Masson Member for a synchronous rectifier bridge, related synchronous rectifier bridge and use thereof
TW201011889A (en) * 2008-09-10 2010-03-16 Renesas Tech Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI771771B (zh) * 2019-10-24 2022-07-21 日商日立功率半導體股份有限公司 半導體裝置及使用其之整流元件及交流發電機

Also Published As

Publication number Publication date
US9831145B2 (en) 2017-11-28
CN106605299A (zh) 2017-04-26
DE112015003757T5 (de) 2017-06-29
US20170263516A1 (en) 2017-09-14
WO2016039094A1 (ja) 2016-03-17
JP2016058594A (ja) 2016-04-21
TW201622099A (zh) 2016-06-16
JP6263108B2 (ja) 2018-01-17
DE112015003757B4 (de) 2024-07-04

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