CN106531868A - LED packaging bracket - Google Patents
LED packaging bracket Download PDFInfo
- Publication number
- CN106531868A CN106531868A CN201611238156.9A CN201611238156A CN106531868A CN 106531868 A CN106531868 A CN 106531868A CN 201611238156 A CN201611238156 A CN 201611238156A CN 106531868 A CN106531868 A CN 106531868A
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting substrate
- conductive
- positive
- negative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
The invention provides an LED packaging bracket. A plastic coffer surrounds a positive electrode conductive/heat-conducting substrate, a negative electrode conductive/heat-conducting substrate and the upper surface of an insulating plastic interval to form a concave-shaped groove; the positive electrode conductive/heat-conducting substrate and the negative electrode conductive/heat-conducting substrate are isolated by the insulating plastic interval; the negative electrode conductive/heat-conducting substrate is attached with an led wafer; the positive electrode of the led wafer is led to the positive electrode conductive/heat-conducting substrate to be used as a positive electrode connecting circuit; the negative electrode of the led wafer is led to the negative electrode conductive/heat-conducting substrate to be used as a negative electrode connecting circuit; and packaging adhesive mixed with fluorescent powder is poured in the concave-shaped groove, and baked to be cured. Through light emitting on the top, a large angle, and large light-outlet are realized, so that efficient light output is achieved; and meanwhile, the conductive/heat-conducting substrates at the bottom are in full contact with the wafers, so that the heat generated in working of the wafers is directly transferred to a printed circuit board through the conductive/heat-conducting substrates in smt welding, so that the heat can be dissipated outwards.
Description
Technical field
The present invention relates to LED encapsulation technologies field, particularly a kind of LED package supports.
Background technology
As LED has low-power consumption, high brightness, it is widely used at present illuminating, instruction and display backlight industry.
As the progressive product of technology is intended to miniaturization, compact development, while to brightness requirement also more and more higher.
There is the lamp bead of 3806,3808 specifications on the market, all side emittings, power are little, typically in below 0.1W, can only
For mobile phone and be smaller in size than 10 cun of pad and light above with side and backlight is provided to screen.
The content of the invention
For solving above-mentioned technical problem, the invention provides a kind of LED package supports, which includes plastic cement cofferdam (3), positive pole
Conduction/heat-conducting substrate (1), negative conductive/heat-conducting substrate (4) and ambroin interval (2)；Plastic cement cofferdam (3) are around institute
The upper surface for stating positive conductive/heat-conducting substrate (1), negative conductive/heat-conducting substrate (4) and ambroin interval (2) forms one
Baltimore groove；
Ambroin interval (2) by positive conductive/heat-conducting substrate (1) and negative conductive/heat-conducting substrate (4) every
Open, on negative conductive/heat-conducting substrate (4), be pasted with l ed chips (7), l ed chips (7) positive wire to positive conductive/
On heat-conducting substrate (3), as positive lead road, on l ed chips (7) negative wire to negative conductive/heat-conducting substrate (4), make
For negative lead road, the packaging plastic embedding for being blended with fluorescent material solidifies which by toasted in the Baltimore groove.
It is preferred that stent length way plastic cofferdam (3) and positive conductive/heat-conducting substrate (1), negative conductive/heat conduction base
The angle (5) that plate (4) is constituted is less than 130 degree more than 90 degree, support width way plastic cofferdam (3) and positive conductive/heat conduction base
The angle (6) that plate (1), negative conductive/heat-conducting substrate (4) are constituted is less than 160 degree more than 90 degree.
It is preferred that positive conductive/heat-conducting substrate (1), the material of negative conductive/heat-conducting substrate (4) are metal, graphite
Thermal conductivity material.
It is preferred that plastic cement cofferdam is PPA, PCT, EMC or SMC material.
The invention has the advantages that：
The present invention realizes wide-angle, big light-emitting window, realizes that light is effectively exported by top light emitting；While bottom electrode/lead
Hot substrate is completely attached to chip, and when smt is welded, the heat that chip is produced when working directly is passed by electrode/heat-conducting substrate
It is directed on printed substrate, heat is distributed.
Certainly, the arbitrary product for implementing the present invention is it is not absolutely required to while reaching all the above advantage.
Description of the drawings
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, use required for describing to embodiment below
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, can be attached to obtain others according to these accompanying drawings
Figure.
Fig. 1 is LED package supports schematic diagram provided in an embodiment of the present invention；
Fig. 2 is the B-B direction sectional view of LED package supports provided in an embodiment of the present invention；
The A-A of the LED package supports that Fig. 3 is provided for inventive embodiments is to sectional view.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.It is based on
Embodiment in the present invention, it is all other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
As shown in figure 1, embodiments provide a kind of LED package supports, it include plastic cement cofferdam 3, positive conductive/
Heat-conducting substrate 1, negative conductive/heat-conducting substrate 4 and ambroin interval 2；The plastic cement cofferdam 3 is around the positive conductive/lead
The upper surface at hot substrate 1, negative conductive/heat-conducting substrate 4 and ambroin interval 2 forms a Baltimore groove；
Positive conductive/the heat-conducting substrate 1 and negative conductive/heat-conducting substrate 4 are separated by the ambroin interval 2, institute
State and on negative conductive/heat-conducting substrate 4, be pasted with l ed chips 7,7 positive wire of l ed chips is to positive conductive/heat-conducting substrate 3
On, as positive lead road, 7 negative wire of l ed chips to negative conductive/heat-conducting substrate 4, as negative lead road,
The packaging plastic embedding for being blended with fluorescent material solidifies which by toasted in the Baltimore groove.
The present embodiment medium-height trestle length direction plastic cement cofferdam 3 and positive conductive/heat-conducting substrate 1, negative conductive/heat-conducting substrate
The angles 5 of 4 compositions are less than 130 degree more than 90 degree, support width way plastic cofferdam 3 and positive conductive/heat-conducting substrate 1, negative pole
The angle 6 of the composition of conduction/heat-conducting substrate 4 is less than 160 more than 90 degree.
Positive conductive/heat-conducting substrate 1 described in the embodiment of the present invention, negative conductive/heat-conducting substrate 4 material be metal,
Graphite heat conducting conductive material, positive conductive/heat-conducting substrate 1 that certainly present invention is provided, negative conductive/heat-conducting substrate 4 can also
Using other thermal conductivity materials, the present embodiment is only illustrated.
Wherein plastic cement cofferdam is PPA, PCT, EMC or SMC material, it would however also be possible to employ other materials replace, and the present embodiment is only
Citing is illustrated.
The present invention realizes wide-angle, big light-emitting window, realizes that light is effectively exported by top light emitting；While bottom electrode/lead
Hot substrate is completely attached to chip, and when smt is welded, the heat that chip is produced when working directly is passed by electrode/heat-conducting substrate
It is directed on printed substrate, heat is distributed.
Present invention disclosed above preferred embodiment is only intended to help and illustrates the present invention.Preferred embodiment is not detailed
All of details is described, it is only described specific embodiment also not limit the invention.Obviously, the content according to this specification,
Can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is to preferably explain the present invention
Principle and practical application so that skilled artisan can be best understood by and utilize the present invention.The present invention is only
Limited by claims and its four corner and equivalent.
Claims (5)
1. a kind of LED package supports, it is characterised in that lead including plastic cement cofferdam (3), positive conductive/heat-conducting substrate (1), negative pole
Electricity/heat-conducting substrate (4) and ambroin interval (2)；Plastic cement cofferdam (3) around positive conductive/heat-conducting substrate (1),
The upper surface of negative conductive/heat-conducting substrate (4) and ambroin interval (2) forms a Baltimore groove；Outside Dimensions：Long 3.8mm,
Wide 1.0mm, highly in 0.4-2mm；
Positive conductive/heat-conducting substrate (1) is separated by ambroin interval (2) with negative conductive/heat-conducting substrate (4),
Led chips (7) are pasted with negative conductive/heat-conducting substrate (4), and led chips (7) positive wire is to positive conductive/heat conduction
On substrate (3), as positive lead road, on led chips (7) negative wire to negative conductive/heat-conducting substrate (4), as negative
Pole connection line, the packaging plastic embedding for being blended with fluorescent material solidify which by toasted in the Baltimore groove.
2. LED package supports as claimed in claim 1, it is characterised in that lead with positive pole in stent length way plastic cofferdam (3)
The angle (5) that electricity/heat-conducting substrate (1), negative conductive/heat-conducting substrate (4) are constituted is more than 90 degree, less than 130 degree, support width side
It is more than 90 degree to the angle (6) that plastic cement cofferdam (3) and positive conductive/heat-conducting substrate (1), negative conductive/heat-conducting substrate (4) are constituted
Less than 160 degree.
3. LED package supports as claimed in claim 1, it is characterised in that positive conductive/heat-conducting substrate (1), negative pole are led
The material of electricity/heat-conducting substrate (4) is metal or graphite heat conducting conductive material.
4. LED package supports as claimed in claim 1, it is characterised in that plastic cement cofferdam is PPA, PCT, EMC or SMC material.
5. LED package supports as claimed in claim 1, it is characterised in that Outside Dimensions：Long 3.8mm, wide 1.0mm, highly exists
0.4-2mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611238156.9A CN106531868A (en) | 2016-12-28 | 2016-12-28 | LED packaging bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611238156.9A CN106531868A (en) | 2016-12-28 | 2016-12-28 | LED packaging bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106531868A true CN106531868A (en) | 2017-03-22 |
Family
ID=58338061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611238156.9A Pending CN106531868A (en) | 2016-12-28 | 2016-12-28 | LED packaging bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106531868A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108730928A (en) * | 2018-07-16 | 2018-11-02 | 安徽芯瑞达科技股份有限公司 | A kind of LED support and its manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203179940U (en) * | 2012-12-13 | 2013-09-04 | 深圳市斯迈得光电子有限公司 | High-reliability LED device |
| CN203721757U (en) * | 2013-12-18 | 2014-07-16 | 深圳市斯迈得光电子有限公司 | LED packaging structure with good cooling property |
| CN204651350U (en) * | 2015-05-22 | 2015-09-16 | 东莞市驰明电子科技有限公司 | LED support and there is the LED lamp bead of this LED support |
| CN206460971U (en) * | 2016-12-28 | 2017-09-01 | 安徽连达光电科技有限公司 | A kind of LED package supports |
-
2016
- 2016-12-28 CN CN201611238156.9A patent/CN106531868A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203179940U (en) * | 2012-12-13 | 2013-09-04 | 深圳市斯迈得光电子有限公司 | High-reliability LED device |
| CN203721757U (en) * | 2013-12-18 | 2014-07-16 | 深圳市斯迈得光电子有限公司 | LED packaging structure with good cooling property |
| CN204651350U (en) * | 2015-05-22 | 2015-09-16 | 东莞市驰明电子科技有限公司 | LED support and there is the LED lamp bead of this LED support |
| CN206460971U (en) * | 2016-12-28 | 2017-09-01 | 安徽连达光电科技有限公司 | A kind of LED package supports |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108730928A (en) * | 2018-07-16 | 2018-11-02 | 安徽芯瑞达科技股份有限公司 | A kind of LED support and its manufacturing method |
| CN108730928B (en) * | 2018-07-16 | 2024-03-26 | 安徽芯瑞达科技股份有限公司 | LED bracket and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170322 |