CN106470799A - 具有带有液体填充物的致孔剂的抛光垫 - Google Patents

具有带有液体填充物的致孔剂的抛光垫 Download PDF

Info

Publication number
CN106470799A
CN106470799A CN201580032943.5A CN201580032943A CN106470799A CN 106470799 A CN106470799 A CN 106470799A CN 201580032943 A CN201580032943 A CN 201580032943A CN 106470799 A CN106470799 A CN 106470799A
Authority
CN
China
Prior art keywords
polishing pad
porogen
polishing
pad
polymeric matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580032943.5A
Other languages
English (en)
Chinese (zh)
Inventor
P.A.勒费夫尔
W.C.阿利森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Priority to CN202110193495.4A priority Critical patent/CN113276016A/zh
Publication of CN106470799A publication Critical patent/CN106470799A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CN201580032943.5A 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫 Pending CN106470799A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110193495.4A CN113276016A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/307,846 US9238294B2 (en) 2014-06-18 2014-06-18 Polishing pad having porogens with liquid filler
US14/307,846 2014-06-18
PCT/US2015/035662 WO2015195488A1 (en) 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202110193495.4A Division CN113276016A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫

Publications (1)

Publication Number Publication Date
CN106470799A true CN106470799A (zh) 2017-03-01

Family

ID=53487453

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202110193495.4A Pending CN113276016A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫
CN201580032943.5A Pending CN106470799A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202110193495.4A Pending CN113276016A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫

Country Status (8)

Country Link
US (1) US9238294B2 (enExample)
EP (1) EP3157710B1 (enExample)
JP (2) JP6810992B2 (enExample)
KR (1) KR102391135B1 (enExample)
CN (2) CN113276016A (enExample)
SG (1) SG11201610140TA (enExample)
TW (1) TWI599448B (enExample)
WO (1) WO2015195488A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110625511A (zh) * 2018-06-21 2019-12-31 Skc株式会社 改善浆料流动性的抛光垫及其制备方法
CN116847948A (zh) * 2020-12-22 2023-10-03 Cmc材料有限责任公司 具有带有聚合物型外壳的成孔剂的化学-机械抛光副垫
CN117381658A (zh) * 2022-07-11 2024-01-12 罗门哈斯电子材料Cmp控股股份有限公司 具有带多裂片嵌入特征的抛光层的化学机械平坦化垫

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185815A (ja) * 2014-03-26 2015-10-22 株式会社東芝 研磨パッド、研磨方法、及び半導体装置の製造方法
JP2016087770A (ja) * 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
US11964920B2 (en) 2016-08-19 2024-04-23 University Of Massachusetts Nanoporous structures and assemblies incorporating the same
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN114589620B (zh) * 2020-12-03 2023-05-23 中国科学院微电子研究所 半导体研磨垫及制备方法
KR102518222B1 (ko) * 2020-12-24 2023-04-05 주식회사 에스엠티 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치
CN117999150A (zh) 2021-09-02 2024-05-07 Cmc材料有限责任公司 包含聚合物颗粒的纹理化cmp垫
KR102721631B1 (ko) * 2021-09-17 2024-10-23 에스케이엔펄스 주식회사 연마패드의 리프레쉬 방법, 이를 이용한 반도체 소자의 제조방법 및 반도체 소자의 제조 장치
KR102764254B1 (ko) * 2022-02-25 2025-02-05 서울대학교산학협력단 리튬 금속 전지용 비수계 전해액 및 이를 포함하는 리튬 금속 전지
CN120051356A (zh) * 2022-09-22 2025-05-27 Cmc材料有限责任公司 具有二硫键的化学机械抛光垫

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060125133A1 (en) * 2002-09-17 2006-06-15 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
WO2008013377A1 (en) * 2006-07-24 2008-01-31 Skc Co., Ltd. Chemical mechanical polishing pads comprising liquid organic material core encapsulated in polymer shell and methods for producing the same
US20080207100A1 (en) * 2003-03-25 2008-08-28 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
US20120094586A1 (en) * 2010-10-15 2012-04-19 Ping Huang Polishing pad with multi-modal distribution of pore diameters
WO2012102938A1 (en) * 2011-01-26 2012-08-02 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
CN102770239A (zh) * 2010-01-13 2012-11-07 内克斯普拉纳公司 具有局部区域透明部的化学机械抛光垫
CN103561907A (zh) * 2011-05-23 2014-02-05 内克斯普拉纳公司 具有其上包括离散突起的均质主体的抛光垫

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2375263A (en) * 1944-06-27 1945-05-08 Carborundum Co Method of making abrasive articles
US3962154A (en) * 1971-06-01 1976-06-08 Standard Oil Company Method for producing an improved molded thermoplastic article
US3922801A (en) * 1973-07-16 1975-12-02 Patrick Thomas Zente Liquid filled orthopedic apparatus
US5147937A (en) * 1990-03-22 1992-09-15 Rohm And Haas Company Process for making controlled, uniform-sized particles in the 1 to 50 micrometer range
US5534023A (en) * 1992-12-29 1996-07-09 Henley; Julian L. Fluid filled prosthesis excluding gas-filled beads
US5976000A (en) * 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US6231942B1 (en) * 1998-01-21 2001-05-15 Trexel, Inc. Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby
JPH11322877A (ja) 1998-05-12 1999-11-26 Dainippon Ink & Chem Inc 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
JP2000344902A (ja) 1999-06-04 2000-12-12 Fuji Spinning Co Ltd 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物
US6718703B2 (en) * 2000-10-03 2004-04-13 Lukley Holdings Pty Ltd. Roofing tile assembly
AU2001291143A1 (en) * 2000-10-06 2002-04-22 Cabot Microelectronics Corporation Polishing pad comprising a filled translucent region
US6531523B1 (en) * 2000-10-10 2003-03-11 Renal Tech International, Llc Method of making biocompatible polymeric adsorbing material for purification of physiological fluids of organism
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US20050042976A1 (en) * 2003-08-22 2005-02-24 International Business Machines Corporation Low friction planarizing/polishing pads and use thereof
DE10348876B4 (de) * 2003-10-21 2014-04-03 Jnc Corporation Poröse Polyolefinmembran
JP4555559B2 (ja) * 2003-11-25 2010-10-06 富士紡ホールディングス株式会社 研磨布及び研磨布の製造方法
US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7435364B2 (en) 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TWI378844B (en) 2005-08-18 2012-12-11 Rohm & Haas Elect Mat Polishing pad and method of manufacture
US20080057844A1 (en) * 2006-02-01 2008-03-06 Fred Miekka Discontinuous Abrasive Surfaces Having Controlled Wear Properties
US20070212985A1 (en) * 2006-03-07 2007-09-13 Boler Lewyn B Jr Wet sanding sponge; system and method for storing and using same
US8257153B2 (en) 2007-01-15 2012-09-04 Toyo Tire & Rubber Co., Ltd. Polishing pad and a method for manufacturing the same
JP4986129B2 (ja) 2007-01-15 2012-07-25 東洋ゴム工業株式会社 研磨パッド
KR101186531B1 (ko) * 2009-03-24 2012-10-08 차윤종 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드
JP2013526932A (ja) * 2010-05-10 2013-06-27 アラーガン、インコーポレイテッド 多孔質材料、作製方法および使用
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
WO2012044683A2 (en) 2010-09-30 2012-04-05 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
JP5945874B2 (ja) * 2011-10-18 2016-07-05 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US9067298B2 (en) * 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060125133A1 (en) * 2002-09-17 2006-06-15 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
US20080207100A1 (en) * 2003-03-25 2008-08-28 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
WO2008013377A1 (en) * 2006-07-24 2008-01-31 Skc Co., Ltd. Chemical mechanical polishing pads comprising liquid organic material core encapsulated in polymer shell and methods for producing the same
CN102770239A (zh) * 2010-01-13 2012-11-07 内克斯普拉纳公司 具有局部区域透明部的化学机械抛光垫
US20120094586A1 (en) * 2010-10-15 2012-04-19 Ping Huang Polishing pad with multi-modal distribution of pore diameters
WO2012102938A1 (en) * 2011-01-26 2012-08-02 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
CN103429389A (zh) * 2011-01-26 2013-12-04 内克斯普拉纳公司 具有同心或大致同心多边形槽图案的抛光垫
CN103561907A (zh) * 2011-05-23 2014-02-05 内克斯普拉纳公司 具有其上包括离散突起的均质主体的抛光垫

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110625511A (zh) * 2018-06-21 2019-12-31 Skc株式会社 改善浆料流动性的抛光垫及其制备方法
CN116847948A (zh) * 2020-12-22 2023-10-03 Cmc材料有限责任公司 具有带有聚合物型外壳的成孔剂的化学-机械抛光副垫
TWI825534B (zh) * 2020-12-22 2023-12-11 美商Ｃｍｃ材料股份有限公司 具有具聚合外殼的成孔劑之化學-機械拋光下墊
CN117381658A (zh) * 2022-07-11 2024-01-12 罗门哈斯电子材料Cmp控股股份有限公司 具有带多裂片嵌入特征的抛光层的化学机械平坦化垫

Also Published As

Publication number Publication date
US9238294B2 (en) 2016-01-19
SG11201610140TA (en) 2017-01-27
CN113276016A (zh) 2021-08-20
KR102391135B1 (ko) 2022-04-28
JP2020055103A (ja) 2020-04-09
US20150367478A1 (en) 2015-12-24
JP2017520422A (ja) 2017-07-27
JP6810992B2 (ja) 2021-01-13
TW201609315A (zh) 2016-03-16
TWI599448B (zh) 2017-09-21
EP3157710A1 (en) 2017-04-26
KR20170020446A (ko) 2017-02-22
EP3157710B1 (en) 2021-11-10
WO2015195488A1 (en) 2015-12-23

Similar Documents

Publication Publication Date Title
CN106470799A (zh) 具有带有液体填充物的致孔剂的抛光垫
JP6415521B2 (ja) 低密度研磨パッド
US10946495B2 (en) Low density polishing pad
JP6033358B2 (ja) 気孔直径の多峰性分布をもつ研磨パッド
JP5965453B2 (ja) 上に別個の突起を有する均一な本体を有する研磨パッド
JP2017035781A (ja) 連続的突出部を備えた研磨表面を有する研磨パッド

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20170707

Address after: Illinois, USA

Applicant after: Cabot Microelectronics Corp.

Address before: oregon

Applicant before: Nexplanar Corporation

TA01 Transfer of patent application right
RJ01 Rejection of invention patent application after publication

Application publication date: 20170301

RJ01 Rejection of invention patent application after publication