CN106455312A - 布线基板以及其制造方法 - Google Patents

布线基板以及其制造方法 Download PDF

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Publication number
CN106455312A
CN106455312A CN201610462783.4A CN201610462783A CN106455312A CN 106455312 A CN106455312 A CN 106455312A CN 201610462783 A CN201610462783 A CN 201610462783A CN 106455312 A CN106455312 A CN 106455312A
Authority
CN
China
Prior art keywords
wiring
layer
insulating barrier
circuit board
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610462783.4A
Other languages
English (en)
Chinese (zh)
Inventor
安田正治
长谷川芳弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN106455312A publication Critical patent/CN106455312A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
CN201610462783.4A 2015-06-24 2016-06-23 布线基板以及其制造方法 Pending CN106455312A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015126539 2015-06-24
JP2015-126539 2015-06-24
JP2015-147375 2015-07-27
JP2015147375A JP2017011251A (ja) 2015-06-24 2015-07-27 配線基板およびその製造方法

Publications (1)

Publication Number Publication Date
CN106455312A true CN106455312A (zh) 2017-02-22

Family

ID=57761789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610462783.4A Pending CN106455312A (zh) 2015-06-24 2016-06-23 布线基板以及其制造方法

Country Status (3)

Country Link
JP (1) JP2017011251A (ko)
KR (1) KR20170000795A (ko)
CN (1) CN106455312A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI763052B (zh) * 2019-09-30 2022-05-01 日商京瓷股份有限公司 配線基板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021140971A1 (ko) * 2020-01-08 2021-07-15

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058986A (ja) * 1998-08-04 2000-02-25 Matsushita Electric Ind Co Ltd 配線基板およびその製造方法
JP2008047655A (ja) * 2006-08-11 2008-02-28 Mitsui Mining & Smelting Co Ltd 配線基板およびその製造方法
JP5032187B2 (ja) * 2007-04-17 2012-09-26 新光電気工業株式会社 配線基板の製造方法及び半導体装置の製造方法及び配線基板
JP6161437B2 (ja) * 2013-07-03 2017-07-12 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI763052B (zh) * 2019-09-30 2022-05-01 日商京瓷股份有限公司 配線基板

Also Published As

Publication number Publication date
JP2017011251A (ja) 2017-01-12
KR20170000795A (ko) 2017-01-03

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170222

WD01 Invention patent application deemed withdrawn after publication