CN106449636A - Esd保护器件及其制造方法 - Google Patents
Esd保护器件及其制造方法 Download PDFInfo
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- CN106449636A CN106449636A CN201610891006.1A CN201610891006A CN106449636A CN 106449636 A CN106449636 A CN 106449636A CN 201610891006 A CN201610891006 A CN 201610891006A CN 106449636 A CN106449636 A CN 106449636A
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- doped region
- protective device
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- esd protective
- epitaxial semiconductor
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- 230000001681 protective effect Effects 0.000 title claims abstract description 76
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 132
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 6
- 230000003071 parasitic effect Effects 0.000 abstract description 8
- 238000002955 isolation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/866—Zener diodes
Abstract
Description
Claims (17)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610891006.1A CN106449636B (zh) | 2016-10-12 | 2016-10-12 | Esd保护器件及其制造方法 |
TW106113138A TWI640079B (zh) | 2016-10-12 | 2017-04-19 | 靜電放電保護元件及其製造方法 |
US15/730,419 US10290624B2 (en) | 2016-10-12 | 2017-10-11 | ESD protection device and method for manufacturing the same |
US16/372,984 US10573636B2 (en) | 2016-10-12 | 2019-04-02 | ESD protection device and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610891006.1A CN106449636B (zh) | 2016-10-12 | 2016-10-12 | Esd保护器件及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN106449636A true CN106449636A (zh) | 2017-02-22 |
CN106449636B CN106449636B (zh) | 2019-12-10 |
Family
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CN201610891006.1A Active CN106449636B (zh) | 2016-10-12 | 2016-10-12 | Esd保护器件及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US10290624B2 (zh) |
CN (1) | CN106449636B (zh) |
TW (1) | TWI640079B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105789332B (zh) * | 2016-04-25 | 2019-02-26 | 矽力杰半导体技术(杭州)有限公司 | 整流器件、整流器件的制造方法及esd保护器件 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1062995A (zh) * | 1990-12-27 | 1992-07-22 | 三星电子株式会社 | 一种半导体器件静电放电特性的改进方法 |
US20050280092A1 (en) * | 2004-06-18 | 2005-12-22 | Chih-Nan Cheng | Electrostatic discharge (esd) protection mos device and esd circuitry thereof |
US20080079073A1 (en) * | 2006-09-29 | 2008-04-03 | Sanyo Electric Co., Ltd. | Semiconductor Device |
CN101714759A (zh) * | 2009-11-11 | 2010-05-26 | 上海长园维安微电子有限公司 | 低电容双向esd保护器件及其制备方法 |
CN101771042A (zh) * | 2009-12-31 | 2010-07-07 | 上海长园维安微电子有限公司 | 低电容电压可编程tvs器件 |
CN102983133A (zh) * | 2012-11-28 | 2013-03-20 | 江南大学 | 一种双向三路径导通的高压esd保护器件 |
CN103022030A (zh) * | 2011-09-27 | 2013-04-03 | 半导体元件工业有限责任公司 | 半导体装置 |
CN203659859U (zh) * | 2013-12-09 | 2014-06-18 | 江南大学 | 一种具有高维持电流的环形vdmos结构的esd保护器件 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011066246A (ja) * | 2009-09-17 | 2011-03-31 | Seiko Instruments Inc | 静電気保護用半導体装置 |
TWI437684B (zh) * | 2010-07-26 | 2014-05-11 | Richtek Technology Corp | 具有靜電防護之功率電晶體元件與使用該功率電晶體元件之低壓差穩壓器 |
US8390092B2 (en) * | 2010-11-12 | 2013-03-05 | Freescale Semiconductor, Inc. | Area-efficient high voltage bipolar-based ESD protection targeting narrow design windows |
US10199482B2 (en) * | 2010-11-29 | 2019-02-05 | Analog Devices, Inc. | Apparatus for electrostatic discharge protection |
US8698196B2 (en) * | 2011-06-28 | 2014-04-15 | Alpha And Omega Semiconductor Incorporated | Low capacitance transient voltage suppressor (TVS) with reduced clamping voltage |
US9666576B2 (en) * | 2014-11-13 | 2017-05-30 | Mediatek Inc. | Electrostatic discharge (ESD) protection device |
CN104851919B (zh) * | 2015-04-10 | 2017-12-19 | 矽力杰半导体技术(杭州)有限公司 | 双向穿通半导体器件及其制造方法 |
US10217733B2 (en) * | 2015-09-15 | 2019-02-26 | Semiconductor Components Industries, Llc | Fast SCR structure for ESD protection |
CN105789332B (zh) | 2016-04-25 | 2019-02-26 | 矽力杰半导体技术(杭州)有限公司 | 整流器件、整流器件的制造方法及esd保护器件 |
-
2016
- 2016-10-12 CN CN201610891006.1A patent/CN106449636B/zh active Active
-
2017
- 2017-04-19 TW TW106113138A patent/TWI640079B/zh active
- 2017-10-11 US US15/730,419 patent/US10290624B2/en active Active
-
2019
- 2019-04-02 US US16/372,984 patent/US10573636B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1062995A (zh) * | 1990-12-27 | 1992-07-22 | 三星电子株式会社 | 一种半导体器件静电放电特性的改进方法 |
US20050280092A1 (en) * | 2004-06-18 | 2005-12-22 | Chih-Nan Cheng | Electrostatic discharge (esd) protection mos device and esd circuitry thereof |
US20080079073A1 (en) * | 2006-09-29 | 2008-04-03 | Sanyo Electric Co., Ltd. | Semiconductor Device |
CN101714759A (zh) * | 2009-11-11 | 2010-05-26 | 上海长园维安微电子有限公司 | 低电容双向esd保护器件及其制备方法 |
CN101771042A (zh) * | 2009-12-31 | 2010-07-07 | 上海长园维安微电子有限公司 | 低电容电压可编程tvs器件 |
CN103022030A (zh) * | 2011-09-27 | 2013-04-03 | 半导体元件工业有限责任公司 | 半导体装置 |
CN102983133A (zh) * | 2012-11-28 | 2013-03-20 | 江南大学 | 一种双向三路径导通的高压esd保护器件 |
CN203659859U (zh) * | 2013-12-09 | 2014-06-18 | 江南大学 | 一种具有高维持电流的环形vdmos结构的esd保护器件 |
Also Published As
Publication number | Publication date |
---|---|
TWI640079B (zh) | 2018-11-01 |
US20190229108A1 (en) | 2019-07-25 |
CN106449636B (zh) | 2019-12-10 |
TW201814878A (zh) | 2018-04-16 |
US10290624B2 (en) | 2019-05-14 |
US20180102355A1 (en) | 2018-04-12 |
US10573636B2 (en) | 2020-02-25 |
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Effective date of registration: 20200306 Address after: 210042 302, Xuanwu Road, 7, Xuanwu Road, Xuanwu District, Nanjing, Jiangsu, China, 7 Patentee after: Silergy Semiconductor Technology (Hangzhou) Ltd. Address before: 310012 Wensanlu Road, Hangzhou Province, No. 90 East Software Park, science and technology building A1501 Patentee before: Silergy Semiconductor Technology (Hangzhou) Ltd. |
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Address after: 210042 302, Xuanwu Road, 7, Xuanwu Road, Xuanwu District, Nanjing, Jiangsu, China, 7 Patentee after: Nanjing Sili Microelectronics Technology Co., Ltd Address before: 210042 302, Xuanwu Road, 7, Xuanwu Road, Xuanwu District, Nanjing, Jiangsu, China, 7 Patentee before: Silergy Semiconductor Technology (Hangzhou) Ltd. |
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CP01 | Change in the name or title of a patent holder |