CN106255714A - 抗蚀剂树脂及其制造方法 - Google Patents

抗蚀剂树脂及其制造方法 Download PDF

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Publication number
CN106255714A
CN106255714A CN201580020255.7A CN201580020255A CN106255714A CN 106255714 A CN106255714 A CN 106255714A CN 201580020255 A CN201580020255 A CN 201580020255A CN 106255714 A CN106255714 A CN 106255714A
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CN
China
Prior art keywords
acid
anhydride
carbon number
group
polyimides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580020255.7A
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English (en)
Chinese (zh)
Inventor
青木畅章
六人部壮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagase Chemtex Corp
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Nagase Chemtex Corp
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Filing date
Publication date
Application filed by Nagase Chemtex Corp filed Critical Nagase Chemtex Corp
Publication of CN106255714A publication Critical patent/CN106255714A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Spectroscopy & Molecular Physics (AREA)
CN201580020255.7A 2014-04-18 2015-04-15 抗蚀剂树脂及其制造方法 Pending CN106255714A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-086152 2014-04-18
JP2014086152 2014-04-18
PCT/JP2015/061557 WO2015159911A1 (ja) 2014-04-18 2015-04-15 レジスト樹脂及びその製造方法

Publications (1)

Publication Number Publication Date
CN106255714A true CN106255714A (zh) 2016-12-21

Family

ID=54324115

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580020255.7A Pending CN106255714A (zh) 2014-04-18 2015-04-15 抗蚀剂树脂及其制造方法

Country Status (5)

Country Link
JP (1) JPWO2015159911A1 (ja)
KR (1) KR20160147712A (ja)
CN (1) CN106255714A (ja)
TW (1) TWI649350B (ja)
WO (1) WO2015159911A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI710585B (zh) * 2017-06-30 2020-11-21 奇美實業股份有限公司 液晶配向劑、液晶配向膜及液晶顯示元件

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3453732A4 (en) * 2016-05-06 2019-06-05 Mitsubishi Gas Chemical Company, Inc. POLYIMIDE RESIN
JP6755007B2 (ja) * 2018-01-23 2020-09-16 ナガセケムテックス株式会社 不飽和基含有アルカリ可溶性樹脂
WO2020080206A1 (ja) * 2018-10-15 2020-04-23 日産化学株式会社 ポリアミック酸エステル樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1954015A (zh) * 2004-05-20 2007-04-25 东丽株式会社 聚酰亚胺树脂、层压薄膜、带金属层的层压薄膜及半导体装置
JP2008239820A (ja) * 2007-03-27 2008-10-09 Jsr Corp ポリアミック酸のイミド化重合体絶縁膜および膜形成組成物とその製造方法
JP2009051891A (ja) * 2007-08-24 2009-03-12 Toray Ind Inc 着色樹脂組成物およびカラーフィルター
CN102143989A (zh) * 2008-09-03 2011-08-03 株式会社钟化 使用2-苯基-4,4’-二氨基二苯基醚类的可溶性末端改性酰亚胺低聚物、清漆、其固化物、及其酰亚胺预浸料、以及耐热性优异的纤维增强层合板
JP2013137334A (ja) * 2010-04-21 2013-07-11 Nissan Chem Ind Ltd ポリイミド構造を含有する樹脂を含むリソグラフィー用レジスト下層膜形成組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2721445B2 (ja) 1991-10-21 1998-03-04 住友ベークライト株式会社 エレクトロニクス用フィルム接着剤
JP4787552B2 (ja) * 2004-09-08 2011-10-05 独立行政法人 宇宙航空研究開発機構 可溶性末端変性イミドオリゴマーおよびワニス並びにその硬化物
CN104885009B (zh) * 2012-12-28 2020-04-28 东京应化工业株式会社 能量敏感树脂组合物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1954015A (zh) * 2004-05-20 2007-04-25 东丽株式会社 聚酰亚胺树脂、层压薄膜、带金属层的层压薄膜及半导体装置
JP2008239820A (ja) * 2007-03-27 2008-10-09 Jsr Corp ポリアミック酸のイミド化重合体絶縁膜および膜形成組成物とその製造方法
JP2009051891A (ja) * 2007-08-24 2009-03-12 Toray Ind Inc 着色樹脂組成物およびカラーフィルター
CN102143989A (zh) * 2008-09-03 2011-08-03 株式会社钟化 使用2-苯基-4,4’-二氨基二苯基醚类的可溶性末端改性酰亚胺低聚物、清漆、其固化物、及其酰亚胺预浸料、以及耐热性优异的纤维增强层合板
JP2013137334A (ja) * 2010-04-21 2013-07-11 Nissan Chem Ind Ltd ポリイミド構造を含有する樹脂を含むリソグラフィー用レジスト下層膜形成組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI710585B (zh) * 2017-06-30 2020-11-21 奇美實業股份有限公司 液晶配向劑、液晶配向膜及液晶顯示元件

Also Published As

Publication number Publication date
WO2015159911A1 (ja) 2015-10-22
TWI649350B (zh) 2019-02-01
TW201602167A (zh) 2016-01-16
JPWO2015159911A1 (ja) 2017-04-13
KR20160147712A (ko) 2016-12-23

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