CN106084661A - 一种应用于led植物生长灯芯片封装的增透防污改性环氧树脂胶 - Google Patents
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
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- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000032683 aging Effects 0.000 abstract description 2
- 230000035515 penetration Effects 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000004513 sizing Methods 0.000 abstract description 2
- 230000003667 anti-reflective effect Effects 0.000 abstract 1
- 229940053080 isosol Drugs 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- 235000009508 confectionery Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
本发明公开了一种应用于LED植物生长灯芯片封装的增透防污改性环氧树脂胶，这种封装胶与现有技术相比不仅具有良好的粘结性能，还具有自洁、耐光老化、疏水、增透等功效，在制备过程中加入的纳米二氧化硅可在胶层中形成自洁、疏水的防护层，加入的异丙醇铝、乙酰丙酮、钛酸四丁酯等溶胶不仅提升了胶料的导热性能，还能提高胶层的光学性能，提高光线透过率，达到增透效果，进一步加快固化速度，以本发明制备的环氧树脂胶封装的芯片使用寿命长，出光强度高，植物有效照射率高，其使用简单，高效节能，应用前景良好。
Description
技术领域
本发明涉及LED封装胶技术领域，尤其涉及一种应用于LED植物生长灯芯片封装的增透防污改性环氧树脂胶。
背景技术
植物生长过程中光照是一个至关重要的因素，在种植过程中，因为自然条件的变化，尤其是在晚秋和冬季，植物的光照明显不足，此时室内补充照明就显得尤为重要了。LED光源是近年来崛起的在农业领域较为理想的人工光源，较之传统光源，LED光源节能环保，光谱纯净，贴合植物生长的波长范围，拥有巨大的市场需求量。
LED植物生长灯多是由若干均匀分布的单灯组合而成，其中单灯是由若干个发光芯片封装而成，生产过程一般为固晶、焊线、灌封、切割、测试、包装这几个流程，其中灌封胶的性能将直接影响到芯片的出光效率和使用寿命，目前LED植物灯在应用过程中存在的问题主要是发光效率低，光分散度高，而大功率的芯片封装又存在散热性差、使用寿命短等问题。
发明内容
本发明目的就是为了弥补已有技术的缺陷，提供一种应用于LED植物生长灯芯片封装的增透防污改性环氧树脂胶。
本发明是通过以下技术方案实现的：
一种应用于LED植物生长灯芯片封装的增透防污改性环氧树脂胶，所述的改性环氧树脂胶由以下重量份的原料制得：双酚A环氧树脂50-60、间苯二胺20-30、乙酰丙酮3-5、钛酸四丁酯2-3、纳米二氧化硅5-8、硅烷偶联剂0.4-0.5、异丙醇铝0.5-1、丁基缩水甘油醚5-10。
所述的改性环氧树脂胶由以下步骤制得：
（1）将纳米二氧化硅与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝、乙酰丙酮、钛酸四丁酯投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶备用；
（3）将其它剩余物料搅拌混合均匀后依次加入步骤（1）、步骤（2）制备的物料，添加完毕后混合搅拌40-50min，所得物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全固化后即完成封装。
本发明制备了一种新型的改性环氧树脂封装胶，这种封装胶与现有技术相比不仅具有良好的粘结性能，还具有自洁、耐光老化、疏水、增透等功效，在制备过程中加入的纳米二氧化硅可在胶层中形成自洁、疏水的防护层，加入的异丙醇铝、乙酰丙酮、钛酸四丁酯等溶胶不仅提升了胶料的导热性能，还能提高胶层的光学性能，提高光线透过率，达到增透效果，进一步加快固化速度，以本发明制备的环氧树脂胶封装的芯片使用寿命长，出光强度高，植物有效照射率高，其使用简单，高效节能，应用前景良好。
具体实施方式
该实施例的改性环氧树脂胶由以下重量份的原料制得：双酚A环氧树脂50、间苯二胺20、乙酰丙酮3、钛酸四丁酯2、纳米二氧化硅5、硅烷偶联剂0.4、异丙醇铝0.5、丁基缩水甘油醚5。
该改性环氧树脂胶由以下步骤制得：
（1）将纳米二氧化硅与硅烷偶联剂混合研磨分散20min备用；
（2）将异丙醇铝、乙酰丙酮、钛酸四丁酯投入丁基缩水甘油醚中，密闭超声搅拌混合3h，制成透明溶胶备用；
（3）将其它剩余物料搅拌混合均匀后依次加入步骤（1）、步骤（2）制备的物料，添加完毕后混合搅拌40min，所得物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全固化后即完成封装。
产品性能测试结果如下：
拉伸强度：64.6MPa；吸水率%（25℃）：0.94；折射率：1.554；透光率：86.2%。
Claims (2)
1.一种应用于LED植物生长灯芯片封装的增透防污改性环氧树脂胶，其特征在于，所述的改性环氧树脂胶由以下重量份的原料制得：双酚A环氧树脂50-60、间苯二胺20-30、乙酰丙酮3-5、钛酸四丁酯2-3、纳米二氧化硅5-8、硅烷偶联剂0.4-0.5、异丙醇铝0.5-1、丁基缩水甘油醚5-10。
2.如权利要求1所述的一种应用于LED植物生长灯芯片封装的增透防污改性环氧树脂胶，其特征在于，所述的改性环氧树脂胶由以下步骤制得：
（1）将纳米二氧化硅与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝、乙酰丙酮、钛酸四丁酯投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶备用；
（3）将其它剩余物料搅拌混合均匀后依次加入步骤（1）、步骤（2）制备的物料，添加完毕后混合搅拌40-50min，所得物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全固化后即完成封装。
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106674895A (zh) * | 2016-12-13 | 2017-05-17 | 安徽兆利光电科技有限公司 | 一种led灯软胶封装树脂 |
| TWI724932B (zh) * | 2020-06-24 | 2021-04-11 | 朱宥豪 | Led模壓封裝膠及其使用方法(一) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102174306A (zh) * | 2011-01-26 | 2011-09-07 | 烟台德邦电子材料有限公司 | 一种用于led封装的导电胶及其制备方法 |
| CN103937159A (zh) * | 2014-03-25 | 2014-07-23 | 佛山市南海新丝路绝缘材料有限公司 | 一种led封装用高性能耐热环氧树脂复合物 |
| CN105513795A (zh) * | 2016-01-19 | 2016-04-20 | 同济大学 | 具有固态电解质功能的水合氧化铝电介质薄膜及其制备 |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102174306A (zh) * | 2011-01-26 | 2011-09-07 | 烟台德邦电子材料有限公司 | 一种用于led封装的导电胶及其制备方法 |
| CN103937159A (zh) * | 2014-03-25 | 2014-07-23 | 佛山市南海新丝路绝缘材料有限公司 | 一种led封装用高性能耐热环氧树脂复合物 |
| CN105513795A (zh) * | 2016-01-19 | 2016-04-20 | 同济大学 | 具有固态电解质功能的水合氧化铝电介质薄膜及其制备 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106674895A (zh) * | 2016-12-13 | 2017-05-17 | 安徽兆利光电科技有限公司 | 一种led灯软胶封装树脂 |
| TWI724932B (zh) * | 2020-06-24 | 2021-04-11 | 朱宥豪 | Led模壓封裝膠及其使用方法(一) |
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