CN105936739A - 一种应用于led植物生长灯芯片封装的导热聚光室温固化改性环氧树脂胶 - Google Patents
一种应用于led植物生长灯芯片封装的导热聚光室温固化改性环氧树脂胶 Download PDFInfo
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Abstract
本发明公开了一种应用于LED植物生长灯芯片封装的导热聚光室温固化改性环氧树脂胶，这种改性环氧胶以间苯二胺与氧化石墨烯混合作为固化剂，极大的降低了环氧胶的固化温度，在室温条件即可固化，并加入纳米氧化锆、碳纳米管以及异丙醇铝作为导热填料，获得了具有高导热性和高电磁屏蔽的胶层，有效的改善了LED芯片的使用效率，获得更高的出光效率和有效照射率，延长了灯具的使用寿命，高效节能，且使用简单，使用时直接将其涂覆在芯片或者荧光粉层上室温固化即可。
Description
技术领域
本发明涉及LED封装胶技术领域，尤其涉及一种应用于LED植物生长灯芯片封装的导热聚光室温固化改性环氧树脂胶。
背景技术
植物生长过程中光照是一个至关重要的因素，在种植过程中，因为自然条件的变化，尤其是在晚秋和冬季，植物的光照明显不足，此时室内补充照明就显得尤为重要了。LED光源是近年来崛起的在农业领域较为理想的人工光源，较之传统光源，LED光源节能环保，光谱纯净，贴合植物生长的波长范围，拥有巨大的市场需求量。
LED植物生长灯多是由若干均匀分布的单灯组合而成，其中单灯是由若干个发光芯片封装而成，生产过程一般为固晶、焊线、灌封、切割、测试、包装这几个流程，其中灌封胶的性能将直接影响到芯片的出光效率和使用寿命，目前LED植物灯在应用过程中存在的问题主要是发光效率低，光分散度高，而大功率的芯片封装又存在散热性差、使用寿命短等问题。
发明内容
本发明目的就是为了弥补已有技术的缺陷，提供一种应用于LED植物生长灯芯片封装的导热聚光室温固化改性环氧树脂胶。
本发明是通过以下技术方案实现的：
一种应用于LED植物生长灯芯片封装的导热聚光室温固化改性环氧树脂胶，所述的改性环氧树脂胶由以下重量份的原料制得：双酚A环氧树脂50-80、间苯二胺10-20、氧化石墨烯1-2、纳米氧化锆5-8、碳纳米管0.4-0.5、硅烷偶联剂0.4-0.5、异丙醇铝0.4-0.5、丁基缩水甘油醚5-10。
所述的改性环氧树脂胶由以下步骤制得：
（1）将纳米氧化锆与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝、碳纳米管投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶备用；
（3）将氧化石墨烯与间苯二胺搅拌混合均匀，再加入双酚A环氧树脂，搅拌混合均匀后投入步骤（1）、步骤（2）制备的物料，搅拌混合均匀，所得物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全干燥后即完成封装。
本发明利用改性的环氧树脂胶对LED芯片进行封装处理，这种改性环氧胶以间苯二胺与氧化石墨烯混合作为固化剂，极大的降低了环氧胶的固化温度，在室温条件即可固化，并加入纳米氧化锆、碳纳米管以及异丙醇铝作为导热填料，获得了具有高导热性和高电磁屏蔽的胶层，有效的改善了LED芯片的使用效率，获得更高的出光效率和有效照射率，延长了灯具的使用寿命，高效节能，且使用简单，使用时直接将其涂覆在芯片或者荧光粉层上室温固化即可。
具体实施方式
本实施例的改性环氧树脂胶由以下重量份的原料制得：双酚A环氧树脂50、间苯二胺10、氧化石墨烯1、纳米氧化锆5、碳纳米管0.4、硅烷偶联剂0.4、异丙醇铝0.4、丁基缩水甘油醚5。
这种改性环氧树脂胶由以下步骤制得：
（1）将纳米氧化锆与硅烷偶联剂混合研磨分散20min备用；
（2）将异丙醇铝、碳纳米管投入丁基缩水甘油醚中，密闭超声搅拌混合3h，制成透明溶胶备用；
（3）将氧化石墨烯与间苯二胺搅拌混合均匀，再加入双酚A环氧树脂，搅拌混合均匀后投入步骤（1）、步骤（2）制备的物料，搅拌混合均匀，所得物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全干燥后即完成封装。
产品性能测试结果如下：
拉伸强度：65.2MPa；吸水率%（25℃）：0.82；折射率：1.535；透光率：84.6%；热导率：1.58W/(m.k)。
Claims (2)
1.一种应用于LED植物生长灯芯片封装的导热聚光室温固化改性环氧树脂胶，其特征在于，所述的改性环氧树脂胶由以下重量份的原料制得：双酚A环氧树脂50-80、间苯二胺10-20、氧化石墨烯1-2、纳米氧化锆5-8、碳纳米管0.4-0.5、硅烷偶联剂0.4-0.5、异丙醇铝0.4-0.5、丁基缩水甘油醚5-10。
2.如权利要求1所述的一种应用于LED植物生长灯芯片封装的导热聚光室温固化改性环氧树脂胶，其特征在于，所述的改性环氧树脂胶由以下步骤制得：
（1）将纳米氧化锆与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝、碳纳米管投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶备用；
（3）将氧化石墨烯与间苯二胺搅拌混合均匀，再加入双酚A环氧树脂，搅拌混合均匀后投入步骤（1）、步骤（2）制备的物料，搅拌混合均匀，所得物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全干燥后即完成封装。
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106674895A (zh) * | 2016-12-13 | 2017-05-17 | 安徽兆利光电科技有限公司 | 一种led灯软胶封装树脂 |
| CN107365478A (zh) * | 2017-08-21 | 2017-11-21 | 张浩杰 | 一种屏蔽辐射的电子封装材料及其制备方法和应用 |
| CN111073572A (zh) * | 2019-12-30 | 2020-04-28 | 上海多迪高分子材料有限公司 | 一种双组份常温固化环氧树脂灌封胶、制备及其使用方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104559881A (zh) * | 2013-10-25 | 2015-04-29 | 上海联浪新材料科技有限公司 | 一种纳米结构光热双固化透明导热环氧胶及其制备方法 |
| CN104910846A (zh) * | 2015-06-15 | 2015-09-16 | 南京工业大学 | 一种导热导电胶黏剂及其制备方法 |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104559881A (zh) * | 2013-10-25 | 2015-04-29 | 上海联浪新材料科技有限公司 | 一种纳米结构光热双固化透明导热环氧胶及其制备方法 |
| CN104910846A (zh) * | 2015-06-15 | 2015-09-16 | 南京工业大学 | 一种导热导电胶黏剂及其制备方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106674895A (zh) * | 2016-12-13 | 2017-05-17 | 安徽兆利光电科技有限公司 | 一种led灯软胶封装树脂 |
| CN107365478A (zh) * | 2017-08-21 | 2017-11-21 | 张浩杰 | 一种屏蔽辐射的电子封装材料及其制备方法和应用 |
| CN111073572A (zh) * | 2019-12-30 | 2020-04-28 | 上海多迪高分子材料有限公司 | 一种双组份常温固化环氧树脂灌封胶、制备及其使用方法 |
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Application publication date: 20160914 |