CN106098915A - 一种应用于led植物生长灯芯片封装的纳米钙钛矿改性硅胶 - Google Patents
一种应用于led植物生长灯芯片封装的纳米钙钛矿改性硅胶 Download PDFInfo
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Abstract
本发明公开了一种应用于LED植物生长灯芯片封装的纳米钙钛矿改性硅胶，这种改性硅胶在制备过程中，纳米钙钛矿、纳米氧化锌预先经过硅烷偶联剂处理，提高其在硅胶中的分散性，获得了具有良好聚光、散热、耐老化的改性硅胶，加入的异丙醇铝溶胶进一步提高了材料的导热性能，最终制得了室温即可固化的复合封装膜，以其封装的芯片或者荧光层密封效果好，出光强度高，光线集中，极大地提高了植物的有效照射率，高效节能，且使用简单，直接将其涂覆在芯片或者荧光粉层上固化即可。
Description
技术领域
本发明涉及LED封装胶技术领域，尤其涉及一种应用于LED植物生长灯芯片封装的纳米钙钛矿改性硅胶。
背景技术
植物生长过程中光照是一个至关重要的因素，在种植过程中，因为自然条件的变化，尤其是在晚秋和冬季，植物的光照明显不足，此时室内补充照明就显得尤为重要了。LED光源是近年来崛起的在农业领域较为理想的人工光源，较之传统光源，LED光源节能环保，光谱纯净，贴合植物生长的波长范围，拥有巨大的市场需求量。
LED植物生长灯多是由若干均匀分布的单灯组合而成，其中单灯是由若干个发光芯片封装而成，生产过程一般为固晶、焊线、灌封、切割、测试、包装这几个流程，其中灌封胶的性能将直接影响到芯片的出光效率和使用寿命，目前LED植物灯在应用过程中存在的问题主要是发光效率低，光分散度高，而大功率的芯片封装又存在散热性差、使用寿命短等问题。
发明内容
本发明目的就是为了弥补已有技术的缺陷，提供一种应用于LED植物生长灯芯片封装的纳米钙钛矿改性硅胶。
本发明是通过以下技术方案实现的：
一种应用于LED植物生长灯芯片封装的纳米钙钛矿改性硅胶，所述的改性硅胶由以下重量份的原料制得：乙烯基MQ硅树脂50-60、纳米钙钛矿1-2、乙烯基硅油30-40、含氢硅油5-10、硅烷偶联剂0.4-0.5、纳米氧化锌5-8、卡斯特铂金催化剂0.1、异丙醇铝0.5-1、丁基缩水甘油醚5-10。
所述的改性硅胶由以下步骤制得：
（1）将纳米钙钛矿、纳米氧化锌与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶，随后投入步骤（1）制备的物料，继续超声分散2-3h，所得物料备用；
（3）将其它剩余物料混合搅拌混合均匀后滴加步骤（2）制备的物料，边滴加边搅拌，滴加完毕后混合物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其固化后即完成封装。
本发明制备了一种用于LED植物生长灯的纳米钙钛矿改性硅胶，在制备过程中，纳米钙钛矿、纳米氧化锌预先经过硅烷偶联剂处理，提高其在硅胶中的分散性，获得了具有良好聚光、散热、耐老化的改性硅胶，加入的异丙醇铝溶胶进一步提高了材料的导热性能，最终制得了室温即可固化的复合封装膜，以其封装的芯片或者荧光层密封效果好，出光强度高，光线集中，极大地提高了植物的有效照射率，高效节能，且使用简单，直接将其涂覆在芯片或者荧光粉层上固化即可。
具体实施方式
该实例例的改性硅胶由以下重量份的原料制得：乙烯基MQ硅树脂50、纳米钙钛矿1、乙烯基硅油30、含氢硅油5、硅烷偶联剂0.4、纳米氧化锌5、卡斯特铂金催化剂0.1、异丙醇铝0.5、丁基缩水甘油醚5。
该改性硅胶由以下步骤制得：
（1）将纳米钙钛矿、纳米氧化锌与硅烷偶联剂混合研磨分散20min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3h，制成透明溶胶，随后投入步骤（1）制备的物料，继续超声分散2h，所得物料备用；
（3）将其它剩余物料混合搅拌混合均匀后滴加步骤（2）制备的物料，边滴加边搅拌，滴加完毕后混合物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其固化后即完成封装。
产品性能测试结果如下：
拉伸强度：58.3MPa；吸水率%（25℃）：0.80；折射率：1.562；透光率：84.2%。
Claims (2)
1.一种应用于LED植物生长灯芯片封装的纳米钙钛矿改性硅胶，其特征在于，所述的改性硅胶由以下重量份的原料制得：乙烯基MQ硅树脂50-60、纳米钙钛矿1-2、乙烯基硅油30-40、含氢硅油5-10、硅烷偶联剂0.4-0.5、纳米氧化锌5-8、卡斯特铂金催化剂0.1、异丙醇铝0.5-1、丁基缩水甘油醚5-10。
2.如权利要求1所述的一种应用于LED植物生长灯芯片封装的纳米钙钛矿改性硅胶，其特征在于，所述的改性硅胶由以下步骤制得：
（1）将纳米钙钛矿、纳米氧化锌与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶，随后投入步骤（1）制备的物料，继续超声分散2-3h，所得物料备用；
（3）将其它剩余物料混合搅拌混合均匀后滴加步骤（2）制备的物料，边滴加边搅拌，滴加完毕后混合物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其固化后即完成封装。
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107541101A (zh) * | 2017-08-11 | 2018-01-05 | 深圳市大材液态金属科技有限公司 | 一种空调压缩机涂料及其制备方法 |
| CN113372912A (zh) * | 2021-05-28 | 2021-09-10 | 西安建筑科技大学 | 一种钙钛矿量子点复合YAG:Ce荧光粉材料及其制备方法、应用 |
| CN114479743A (zh) * | 2022-03-07 | 2022-05-13 | 上海回天新材料有限公司 | 一种用于tws耳机粘接的反应型聚氨酯热熔胶及其制备方法 |
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| CN102719213A (zh) * | 2012-07-06 | 2012-10-10 | 江苏泰特尔化工有限公司 | 一种改性纳米氧化锌掺杂脂环族环氧树脂led封装胶 |
| CN102850804A (zh) * | 2012-08-22 | 2013-01-02 | 深圳天鼎精细化工制造有限公司 | 一种led用透明双组分有机硅灌封胶及其制备方法 |
| CN103466703A (zh) * | 2013-09-29 | 2013-12-25 | 安徽工业大学 | 钛酸铋纳米针及其制备方法 |
| CN104130741A (zh) * | 2014-06-29 | 2014-11-05 | 惠州市永卓科技有限公司 | 一种cob-led灌封用透明有机硅胶及其制备方法 |
| CN104164596A (zh) * | 2014-07-22 | 2014-11-26 | 安徽冠宇光电科技有限公司 | 一种led用含改性粉煤灰的铝基复合散热材料 |
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2016
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Patent Citations (5)
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| CN102719213A (zh) * | 2012-07-06 | 2012-10-10 | 江苏泰特尔化工有限公司 | 一种改性纳米氧化锌掺杂脂环族环氧树脂led封装胶 |
| CN102850804A (zh) * | 2012-08-22 | 2013-01-02 | 深圳天鼎精细化工制造有限公司 | 一种led用透明双组分有机硅灌封胶及其制备方法 |
| CN103466703A (zh) * | 2013-09-29 | 2013-12-25 | 安徽工业大学 | 钛酸铋纳米针及其制备方法 |
| CN104130741A (zh) * | 2014-06-29 | 2014-11-05 | 惠州市永卓科技有限公司 | 一种cob-led灌封用透明有机硅胶及其制备方法 |
| CN104164596A (zh) * | 2014-07-22 | 2014-11-26 | 安徽冠宇光电科技有限公司 | 一种led用含改性粉煤灰的铝基复合散热材料 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107541101A (zh) * | 2017-08-11 | 2018-01-05 | 深圳市大材液态金属科技有限公司 | 一种空调压缩机涂料及其制备方法 |
| CN113372912A (zh) * | 2021-05-28 | 2021-09-10 | 西安建筑科技大学 | 一种钙钛矿量子点复合YAG:Ce荧光粉材料及其制备方法、应用 |
| CN114479743A (zh) * | 2022-03-07 | 2022-05-13 | 上海回天新材料有限公司 | 一种用于tws耳机粘接的反应型聚氨酯热熔胶及其制备方法 |
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