CN106085335A - 一种应用于led植物生长灯芯片封装的有机硅改性聚氨酯导热聚光膜 - Google Patents
一种应用于led植物生长灯芯片封装的有机硅改性聚氨酯导热聚光膜 Download PDFInfo
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 18
- 239000010703 silicon Substances 0.000 title claims abstract description 18
- 229920002635 polyurethane Polymers 0.000 title claims abstract description 17
- 239000004814 polyurethane Substances 0.000 title claims abstract description 17
- 230000008635 plant growth Effects 0.000 title claims abstract description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 8
- 229920001709 polysilazane Polymers 0.000 claims abstract description 8
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000000839 emulsion Substances 0.000 claims description 6
- 229920001451 polypropylene glycol Polymers 0.000 claims description 6
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 5
- XQSFXFQDJCDXDT-UHFFFAOYSA-N hydroxysilicon Chemical compound [Si]O XQSFXFQDJCDXDT-UHFFFAOYSA-N 0.000 claims description 5
- 239000003921 oil Substances 0.000 claims description 5
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000018044 dehydration Effects 0.000 claims description 3
- 238000006297 dehydration reaction Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 230000003044 adaptive effect Effects 0.000 abstract description 2
- 238000005282 brightening Methods 0.000 abstract description 2
- 230000002209 hydrophobic effect Effects 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 239000000741 silica gel Substances 0.000 abstract description 2
- 229910002027 silica gel Inorganic materials 0.000 abstract description 2
- 238000004513 sizing Methods 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- -1 4-diisocyanate 10 Chemical compound 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011527 polyurethane coating Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明公开了一种应用于LED植物生长灯芯片封装的有机硅改性聚氨酯导热聚光膜，用以取代传统的硅胶层，这种涂层具有优良的疏水阻湿效果，更加适应于植物生长棚内的环境，加入的石墨烯、异丙醇铝、聚硅氮烷等物料，进一步提高了胶料的导热性和光学性能，聚光增亮效果明显，极大地提高了灯具对植物的有效照射率，且使用简单，使用时直接将其涂覆在芯片或者荧光粉层上固化即可。
Description
技术领域
本发明涉及LED封装胶技术领域，尤其涉及一种应用于LED植物生长灯芯片封装的有机硅改性聚氨酯导热聚光膜。
背景技术
植物生长过程中光照是一个至关重要的因素，在种植过程中，因为自然条件的变化，尤其是在晚秋和冬季，植物的光照明显不足，此时室内补充照明就显得尤为重要了。LED光源是近年来崛起的在农业领域较为理想的人工光源，较之传统光源，LED光源节能环保，光谱纯净，贴合植物生长的波长范围，拥有巨大的市场需求量。
LED植物生长灯多是由若干均匀分布的单灯组合而成，其中单灯是由若干个发光芯片封装而成，生产过程一般为固晶、焊线、灌封、切割、测试、包装这几个流程，其中灌封胶的性能将直接影响到芯片的出光效率和使用寿命，目前LED植物灯在应用过程中存在的问题主要是发光效率低，光分散度高，而大功率的芯片封装又存在散热性差、使用寿命短等问题。
发明内容
本发明目的就是为了弥补已有技术的缺陷，提供一种应用于LED植物生长灯芯片封装的有机硅改性聚氨酯导热聚光膜。
本发明是通过以下技术方案实现的：
一种应用于LED植物生长灯芯片封装的有机硅改性聚氨酯导热聚光膜，所述的改性硅胶导热聚光膜由以下重量份的原料制得：聚丙二醇40-50、羟基硅油20-30、甲苯-2，4-二异氰酸酯10-15、二月桂酸二丁基锡0.1-0.2、石墨烯4-5、聚硅氮烷5-8、异丙醇铝0.4-0.5、丁基缩水甘油醚5-10。
所述的有机硅改性聚氨酯导热聚光膜由以下步骤制得：
（1）先将聚丙二醇与羟基硅油混合，在110℃条件下真空脱水处理，完全脱除水分后冷却至50-60℃，滴加甲苯-2，4-二异氰酸酯，边滴加边搅拌，滴加完毕后恒温反应3-5h，反应结束后滴加二月桂酸二丁基锡，升温至60-70℃，反应1-2h，过滤出料，得有机硅改性聚氨酯乳液备用；
（2）将异丙醇铝、石墨烯、聚硅氮烷投入丁基缩水甘油醚中，密闭超声搅拌混合5-8h，制成透明溶胶，随后与步骤（1）制备的有机硅改性聚氨酯乳液混合，继续超声分散2-3h，所得混合物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全固化即完成封装。
本发明在LED植物灯芯片封装中用有机硅改性聚氨酯涂层取代传统的硅胶层，这种涂层具有优良的疏水阻湿效果，更加适应于植物生长棚内的环境，加入的石墨烯、异丙醇铝、聚硅氮烷等物料，进一步提高了胶料的导热性和光学性能，聚光增亮效果明显，极大地提高了灯具对植物的有效照射率，且使用简单，使用时直接将其涂覆在芯片或者荧光粉层上固化即可。
具体实施方式
该实例例的的改性硅胶导热聚光膜由以下重量份的原料制得：聚丙二醇40、羟基硅油20、甲苯-2，4-二异氰酸酯10、二月桂酸二丁基锡0.1、石墨烯4、聚硅氮烷5、异丙醇铝0.4、丁基缩水甘油醚5。
该有机硅改性聚氨酯导热聚光膜由以下步骤制得：
（1）先将聚丙二醇与羟基硅油混合，在110℃条件下真空脱水处理，完全脱除水分后冷却至50℃，滴加甲苯-2，4-二异氰酸酯，边滴加边搅拌，滴加完毕后恒温反应3h，反应结束后滴加二月桂酸二丁基锡，升温至60℃，反应1h，过滤出料，得有机硅改性聚氨酯乳液备用；
（2）将异丙醇铝、石墨烯、聚硅氮烷投入丁基缩水甘油醚中，密闭超声搅拌混合5h，制成透明溶胶，随后与步骤（1）制备的有机硅改性聚氨酯乳液混合，继续超声分散2h，所得混合物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全固化即完成封装。
产品性能测试结果如下：
拉伸强度：52.6MPa；吸水率%（25℃）：0.72；折射率：1.542；透光率：85.7%；热导率：1.05W/(m.k)。
Claims (2)
1.一种应用于LED植物生长灯芯片封装的有机硅改性聚氨酯导热聚光膜，其特征在于，所述的改性硅胶导热聚光膜由以下重量份的原料制得：聚丙二醇40-50、羟基硅油20-30、甲苯-2，4-二异氰酸酯10-15、二月桂酸二丁基锡0.1-0.2、石墨烯4-5、聚硅氮烷5-8、异丙醇铝0.4-0.5、丁基缩水甘油醚5-10。
2.如权利要求1所述的一种应用于LED植物生长灯芯片封装的有机硅改性聚氨酯导热聚光膜，其特征在于，所述的有机硅改性聚氨酯导热聚光膜由以下步骤制得：
（1）先将聚丙二醇与羟基硅油混合，在110℃条件下真空脱水处理，完全脱除水分后冷却至50-60℃，滴加甲苯-2，4-二异氰酸酯，边滴加边搅拌，滴加完毕后恒温反应3-5h，反应结束后滴加二月桂酸二丁基锡，升温至60-70℃，反应1-2h，过滤出料，得有机硅改性聚氨酯乳液备用；
（2）将异丙醇铝、石墨烯、聚硅氮烷投入丁基缩水甘油醚中，密闭超声搅拌混合5-8h，制成透明溶胶，随后与步骤（1）制备的有机硅改性聚氨酯乳液混合，继续超声分散2-3h，所得混合物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全固化即完成封装。
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| CN108441005A (zh) * | 2018-05-05 | 2018-08-24 | 泉州三欣新材料科技有限公司 | 一种超亲水防腐涂层溶胶及其制备方法和应用 |
| CN113025317A (zh) * | 2019-12-25 | 2021-06-25 | Tcl集团股份有限公司 | 量子点复合材料及其制备方法 |
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| CN105623586A (zh) * | 2015-12-29 | 2016-06-01 | 安徽安大华泰新材料有限公司 | 一种耐热耐候性聚氨酯灌封胶的制备方法 |
| CN105669967A (zh) * | 2016-04-20 | 2016-06-15 | 中国工程物理研究院化工材料研究所 | 聚醚高分子刷杂化的纳米无机材料及其制备方法 |
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| CN105008274A (zh) * | 2013-02-20 | 2015-10-28 | 特斯拉纳米涂料有限公司 | 官能化石墨材料 |
| CN105623586A (zh) * | 2015-12-29 | 2016-06-01 | 安徽安大华泰新材料有限公司 | 一种耐热耐候性聚氨酯灌封胶的制备方法 |
| CN105669967A (zh) * | 2016-04-20 | 2016-06-15 | 中国工程物理研究院化工材料研究所 | 聚醚高分子刷杂化的纳米无机材料及其制备方法 |
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| CN108441005A (zh) * | 2018-05-05 | 2018-08-24 | 泉州三欣新材料科技有限公司 | 一种超亲水防腐涂层溶胶及其制备方法和应用 |
| CN113025317A (zh) * | 2019-12-25 | 2021-06-25 | Tcl集团股份有限公司 | 量子点复合材料及其制备方法 |
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