WO2014026486A1 - 白光led发光装置 - Google Patents

白光led发光装置 Download PDF

Info

Publication number
WO2014026486A1
WO2014026486A1 PCT/CN2013/074279 CN2013074279W WO2014026486A1 WO 2014026486 A1 WO2014026486 A1 WO 2014026486A1 CN 2013074279 W CN2013074279 W CN 2013074279W WO 2014026486 A1 WO2014026486 A1 WO 2014026486A1
Authority
WO
WIPO (PCT)
Prior art keywords
phosphor
light
resin
blue
led
Prior art date
Application number
PCT/CN2013/074279
Other languages
English (en)
French (fr)
Inventor
钱志强
金正武
殷江
Original Assignee
Qian Zhiqiang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201210296271.7A external-priority patent/CN102810537B/zh
Priority claimed from CN2012105129518A external-priority patent/CN102945918A/zh
Priority claimed from CN201310005784.2A external-priority patent/CN103094461B/zh
Priority claimed from CN201310006398.5A external-priority patent/CN103078048B/zh
Application filed by Qian Zhiqiang filed Critical Qian Zhiqiang
Priority to US14/376,413 priority Critical patent/US9490402B2/en
Publication of WO2014026486A1 publication Critical patent/WO2014026486A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present invention relates to a white LED lighting device.
  • a phosphor-coated transparent substrate white LED light-emitting device In particular, a phosphor-coated transparent substrate white LED light-emitting device.
  • LED white light illumination is an efficient green lighting technology that has many advantages such as energy saving, environmental protection and long life. It works by using a combination of a blue chip and a yellow phosphor (or other combination) to obtain white light.
  • White LED as a new lighting method is based on the following working principle: LED blue chip emits blue light to illuminate phosphor (phosphor), and the phosphor is excited by blue light to emit yellow light, or mixed light of green and red light, or yellow A mixture of light and red light. The phosphors are excited by the light and mixed with a part of the blue light emitted by the blue chip to synthesize white light. In the usual packaging technique, the phosphor is uniformly cured on the surface of the chip by silica gel or resin mixing.
  • Such as CN200910036503 a white LED, using the ultra-high-enhanced blue LED chip, and then add a little pomegranate as the main phosphor on the chip, so that it produces yellow-green light under blue light excitation, and this yellow-green light can be transparent Blue light is synthesized in white light.
  • the white light emitting device of CN200710079928 includes a blue LED and a mixture of an orange phosphor and a green phosphor disposed on the blue LED.
  • An object of the present invention is to provide an apparatus for obtaining white light by irradiating a substrate containing a phosphor organic coating with blue light emitted from a blue LED chip, and a method of fabricating the same.
  • the illuminating device can effectively solve the problems of the above-mentioned white LEDs using the conventional packaging process.
  • a white light emitting device based on a fluorescent resin and a method of preparing the same are particularly, a white light emitting device based on a fluorescent resin and a method of preparing the same.
  • the invention provides a white LED light-emitting device, comprising a base, a blue LED chip, a reflector and a transparent substrate containing a phosphor coating.
  • the two ends of the reflector are respectively connected to the base and the substrate, and the reflective surface of the reflector is provided with a reflective layer.
  • the blue LED chip is disposed on a side of the base facing the phosphor coated surface of the transparent substrate, and the electrode lead of the blue LED chip passes through the base; wherein the blue LED chip is a single chip, a set of chips connected in series, parallel or mixed.
  • the phosphor coated transparent substrate is a phosphor filled resin plate.
  • the reflective layer can be a polishing layer, a metal or other plating.
  • the fluorescent resin member is obtained by sufficiently mixing or granulating a phosphor powder and a transparent or translucent resin by hot press molding.
  • the fluorescent resin element is typically a fluorescent resin cover.
  • the reflector has a cylindrical shape, and the base and the transparent substrate respectively serve as two bottom surfaces of the cylindrical shape; or the reflector has a rounded table shape or a bowl shape, the base serves as a bottom or a bottom of the round table, and the transparent substrate serves as a rounded table. Upper or at the mouth of the bowl.
  • the reflector has a rectangular parallelepiped or a chamfered shape, and the base serves as a lower base of the rectangular parallelepiped or a lower base of the chamfered table, and the transparent substrate serves as a cuboid upper base or a chamfered upper base or cover.
  • the reflector is semi-cylindrical, and the base is disposed along a straight line parallel to the semi-cylindrical rectangular surface, and the straight line falls in a plane passing through the column axis and perpendicular to the semicircular rectangular surface, the transparent planar substrate As a semi-cylindrical rectangular face.
  • the cross-sectional contour of the reflector is parabolic, the base is arranged along a straight line, the straight line coincides with the focal line of the paraboloid, and the transparent substrate serves as a cover of the reflector.
  • the transparent substrate can be of a cylindrical type.
  • the reflector has a slender rectangular or chamfered shape, the base serves as a slender rectangular or chamfered bottom, and the transparent cylindrical substrate serves as an elongated rectangular or chamfered cover.
  • the substrate is a plane; or a convex surface of a spherical surface, a hyperboloid, an elliptical surface or a paraboloid; or a cylindrical shape; or the outline of the cross section of the substrate is a part of an arc, a parabola, a hyperbola, an ellipse or other arc .
  • the phosphor in the phosphor coating is a mixture of LED yellow phosphor, a mixture of LED green phosphor and LED red phosphor, or a mixture of LED yellow phosphor and LED red phosphor in any ratio.
  • the phosphor-containing coating layer has a 2-layer coating structure, and the coating thickness of each layer is 3 micrometers to 5 millimeters; wherein the phosphors of the above two-layer coating structure are LED green phosphors and LED red phosphors, respectively. It is LED yellow phosphor and LED red phosphor.
  • the structure and preparation method of the fluorescent resin element according to the present invention include that the phosphor powder and the resin, and the ultraviolet absorber powder and other additive powders are sufficiently mixed or granulated, and obtained by hot press molding.
  • the powder of the resin having a mass ratio of 100:1 to 100:150 is sufficiently mixed with the powder of the phosphor; the mixture of the transparent or translucent resin and the phosphor is molded by heating (injection molding) Such as thermoplastic processes), after cooling, can obtain fluorescent resin sheet or other shapes of materials; transparent or translucent resin is acrylic (PMMA), PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, styrene-butadiene, Phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin. Specialized patent application content.
  • the phosphor powder may be an LED yellow phosphor.
  • the phosphor may also be a mixture of LED green phosphor and LED red phosphor, or a mixture of LED yellow phosphor and a small amount of LED red phosphor;
  • the LED blue chip may be a blue chip grown on a gemstone (A1 2 0 3 ) substrate, or a blue chip grown on a SiC substrate, or a blue chip grown on a Si substrate, or in the above three Any one of the substrates is grown and transferred to other substrates.
  • the LED blue chip can use a single LED chip, or can use multiple or multiple sets of LED chips, the purpose of which is to provide a blue light source.
  • the fluorescent resin cover has different geometric shapes, has the function of adjusting the light transmission path and improving the heat dissipation of the light emitting device; wherein the fluorescent resin cover can be a hollow cubic type or a hollow cylindrical type, and the side of the blue chip can be in contact with the fluorescent resin cover, or not Contact (disengagement, refers to a structure with a gap); wherein the fluorescent resin cover may be a hollow trapezoidal cubic type, or a hollow truncated cone type; wherein the fluorescent resin cover may be a composite structure of a hollow cylinder and an arc, the lower half It is a hollow cylinder with the side surface close to the blue chip, and the upper half of the curved body has a circular arc shape, a parabolic shape, or other curved shape.
  • the side of the blue chip can be in contact with the fluorescent resin cover or not.
  • the outer side of the fluorescent resin cover may be a hollow cubic shape, and the inner arc of the cross section of the hollow portion is a circular arc shape, or a parabolic shape, or other arc type, and the blue chip is not in contact with the fluorescent resin cover.
  • the fluorescent resin cover may be an elongated hollow arcuate body having a circular arc shape, a parabolic shape, or other curved shape.
  • the fluorescent resin cover may be a half barrel type, and its cross section is a circular arc shape, or a parabolic shape, or other arc type.
  • the fluorescent resin cover may be a flat type, and the blue chip and the heat sink are in a recessed structure.
  • the fluorescent resin cover may be a hollow arcuate body having a curved cross section, such as a parabola type or other arc type, and the blue chip and the heat sink are in a recessed structure.
  • the resin cover may have a uniform wall thickness or may be uneven.
  • the arc has a wide range of arcs or conic curves, partial lines of the oval, and other arcs that are not analytically representable, especially parabolic.
  • the fluorescent resin cover and the heat sink may be connected by a connecting member or by a certain adhesive.
  • the fluorescent resin is not in direct contact with the light-emitting surface of the LED blue chip, the heat dissipation effect is good, and the ambient temperature of the phosphor is low. Therefore, problems such as deterioration in luminescence performance due to high operating temperature of the device do not occur.
  • the powder of the resin having a mass ratio of 100:1 to 100:150 is sufficiently mixed with the powder of the phosphor; the mixture of the transparent or translucent resin and the phosphor is molded by heating, and after cooling, fluorescence is obtained.
  • Resin sheet or other shaped material; resin is acrylic (PMMA and acrylic resin), PMMA alloy resin, polycarbonate PC, PC alloy resin, epoxy, butylbenzene or phenyl sulfone resin.
  • a method of manufacturing a fluorescent resin element comprising the steps of:
  • the transparent or translucent resin resin in the step (1) may be acrylic (PMMA), PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin, etc.;
  • the phosphor powder in the step (1) has a particle diameter of between 1 ⁇ m and 60 ⁇ m;
  • the phosphor in the step (1) is an LED yellow phosphor; in order to increase the color rendering index of the white light, the phosphor may also be a mixture of the LED green phosphor and the LED red phosphor, or the LED yellow phosphor and a small amount.
  • the molding temperature is between 90 ° C and 270 ° C; but lower than the decomposition temperature of the transparent or translucent resin resin; the resin in the step (1) may be in the form of a powder or a pellet The diameter is between 1 micrometer and 60 micrometers;
  • the heating molding refers to a thermoplastic or thermosetting process, and also includes a method of injection molding or extrusion, and does not exclude other molding processes, but it is considered that the flowability of the phosphor powder during the hot press forming process is poor;
  • step (2) since the phosphor powder is not fluid or poor in fluidity, other molding methods may cause uneven distribution of the phosphor particles in the resin;
  • the obtained fluorescent resin sheet material may be subjected to secondary molding using a mold to obtain a device of a desired shape.
  • an appropriate amount of ceramic particles such as Si0 2 , or Zr0 2 , or A1 2 0 3 may be added in the step (1); wherein the volume ratio of the phosphor to the ceramic particles is 100: 1 to 100: 150 .
  • step (1) in order to enhance the anti-aging property of the transparent or translucent resin resin, an appropriate amount of ultraviolet light absorber (such as UV-327, UV326, UV328, UV531, UV-9, etc.) or an antioxidant (such as an anti-oxidant) may be added.
  • an appropriate amount of ultraviolet light absorber such as UV-327, UV326, UV328, UV531, UV-9, etc.
  • an antioxidant such as an anti-oxidant
  • O. 01 ⁇ 100 The mass ratio of the resin to the ultraviolet absorber and the resin and the antioxidant is 100: 0. 01 ⁇ 100: The oxygen agent 1076, the antioxidant 2246, the antioxidant 245, the antioxidant 1010, and the auxiliary antioxidant 168, etc.; 0. 7.
  • the LED blue chip may be a gemstone (a blue chip grown on an Al 2 (3 ⁇ 4) substrate, or a blue chip grown on a SiC substrate, or a blue chip grown on a Si substrate, or in the above three Any one of the substrates is grown and transferred to other substrates.
  • the LED blue chip 4 can use a single LED chip, or a plurality of LED chips can be used, the purpose of which is to provide a blue light source.
  • the LED blue chip is powered by the electrode 6, and the LED blue chip can emit blue light.
  • the blue light emitted by the chip excites the phosphor in the transparent or translucent resin to emit light of another wavelength, and the wavelength of the excited light depends on the nature of the phosphor itself.
  • the light emitted by the blue light excited by the blue light is mixed with a part of the blue light emitted by the blue chip to obtain light of various color temperatures.
  • the resin having a mass ratio of 100:1 to 100:150 is sufficiently mixed with the powder of the phosphor; the mixture of the transparent or translucent resin and the phosphor powder is heated and molded by heating, and then cooled.
  • Obtained fluorescent resin sheet or fluorescent resin component; transparent or translucent resin is acrylic (PMMA), PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, styrene-butadiene, phenyl sulfone resin, CR_39, MS, NAS, polyamine Grease optical resin, nylon or PC reinforced PMMA or MS resin.
  • the geometry of the fluorescent resin element also functions to adjust the light transmission path, and the distance from the blue chip can also adjust the heat dissipation effect of the light emitting device. For this reason, fluorescent resins can be processed into covers of various possible geometries, which are designed and processed according to specific needs.
  • the present invention preferably employs the above transparent resin or a substantially translucent resin, and the technique relating to the alloy resin is as follows: PC I ABS alloy: PC and ABS blend can combine the excellent properties of PC and ABS, improve the heat resistance, impact and tensile strength of ABS, reduce PC cost and melt viscosity, improve processing performance, and reduce stress in products. And the impact strength is sensitive to the thickness of the product; the impactor MBS is added to the PC and ABS; PC / PS alloy: The alloy is a partially compatible, amorphous/amorphous system. Adding PS to PC can reduce the activation energy of PC viscous flow, thus improving the processing fluidity of PC. Adding a small amount of PS can greatly reduce the viscosity of PC melt. PS can play the role of rigid organic filler in PC, PC and PS is a transparent material, the refractive index of which is very close, so the PC / PS alloy is transparent and has good optical properties.
  • PC I ABS alloy PC and ABS blend can combine the excellent properties of PC and ABS, improve the heat resistance
  • the LED chip may be a blue LED chip and a red LED chip;
  • the LED blue chip is a blue chip grown on a gemstone (A1 2 0 3 ) substrate, or a blue chip grown on a SiC substrate, or a Si substrate
  • the grown blue light chip is grown on any of the above three substrates and transferred to other substrates;
  • the red LED chip includes an I II/V compound semiconductor red light chip (such as InGa, A1P) And its derivative varieties; blue LED chip and red LED chip are a series of chips connected in series, parallel or mixed; red light luminous flux emitted by red LED chip and red light luminous flux emitted by red LED chip and blue LED chip
  • the ratio of the sum of the luminous fluxes of the emitted blue light is 0.5% to 25% ;
  • Steps for preparing the optical wavelength conversion device (1) mixing the resin powder, the phosphor powder, the binder, and the solvent into a uniform slurry, wherein the mass ratio of the resin powder to the phosphor powder is 100:1 - 20 : 150 , the mass ratio of the solvent to the binder is 100: 1 - 100: 100, and the volume ratio of the total volume of the phosphor powder plus the resin B powder mixture to the total volume of the solvent plus binder mixture is 1: 100 - 300: 100 And the powder of the resin and the powder of the phosphor have a particle diameter of between 1 micrometer and 60 micrometer; wherein the solvent is a liquid alcohol, an ether, a ketone, an ester, a hydrocarbon, and the binder is a polymer dissolved in a solvent, Acrylic resin, styrene resin, butyral resin, ethyl cellulose; (2) uniformly coating the above slurry on a resin substrate, drying the resin substrate coated with the slurry, and drying at a temperature
  • drying process in the step (2) can be carried out in the air or in a vacuum; the steps (2) and (3) in claim 5 can also be combined into one step heating step;
  • the baking process in the step (3) can be carried out in the air or in a vacuum, and the baking method is directly baking by infrared rays or heating and baking by using electric heating wire;
  • the ceramic powder such as SiO 2 , Zr0 2 , or A 1 2 3 3 is further added to the mixed powder of the phosphor powder and the resin powder, wherein the volume ratio of the phosphor powder to the ceramic particles is 100:1 to 100:150.
  • the present invention is hereby incorporated by reference in its entirety as the priority of the present application: 201310005784.2, 201210296271.7, 201210512951.8, 201310006398.5.
  • the beneficial effects of the invention are as follows: 1) The surface of the LED blue chip is not coated with the phosphor-containing silica gel or resin, so the heat dissipation problem is greatly alleviated, and the light that is excited by the phosphor is re-entered into the chip and absorbed. Luminous loss. 2) The organic coating containing the phosphor in the illuminating device is far away from the LED blue chip, so that the problem of the wavelength shift of the luminescent body and the decrease of the illuminating intensity due to the heat dissipation problem of the device can be effectively alleviated.
  • the invention can avoid the problem of light-emitting degradation of the device caused by the yellowing or reflection of silica gel or resin in the LED light-emitting device packaged by the conventional technology.
  • the light effect is obviously improved.
  • the heat dissipation problem of the chip is effectively solved, and the ambient temperature of the phosphor is low, so that the problem of deterioration of the light-emitting performance due to the high operating temperature of the device does not occur, and the light is ensured. strength.
  • the invention also has a light transmission path (a light source which can be prepared into a specific light-emitting area or concentrated light) and an improved heat dissipation of the light-emitting device.
  • Fluorescent resin cover can be designed and processed into different geometries as needed.
  • the invention utilizes the blue light emitted by the blue LED chip to illuminate the fluorescent resin cover to obtain white light, thereby alleviating the heat dissipation problem, and the phosphor does not have the phenomenon of the wavelength drift of the emission and the decrease of the luminous efficiency caused by the heat dissipation problem of the device.
  • the phosphor is not in direct contact with the light-emitting surface of the blue chip, and the luminescence loss caused by the re-entry of the light excited by the phosphor into the chip can be reduced.
  • the fluorescent light-emitting device of the manufacturing method of the present invention since the phosphor is not directly sealed on the surface of the blue chip by mixing with the silica gel or the resin, the heat dissipation problem of the chip is effectively alleviated, and the ambient temperature of the phosphor is low, so that the device does not occur high. Problems such as deterioration in luminescence performance due to operating temperature. Keeping the phosphor away from the light-emitting chip can prevent the light-emitting portion of the phosphor from being re-entered into the light loss caused by the absorption of the chip.
  • PMMA has a strong anti-aging effect during use, which is beneficial to keep the light effect of the light-emitting device from degrading.
  • FIG. 1 is a schematic view showing a white LED light-emitting device according to a first embodiment of the present invention.
  • Fig. 2 is a schematic view showing a white LED light-emitting device according to a second embodiment of the present invention.
  • Fig. 3 is a schematic view showing a white LED light-emitting device according to a third embodiment of the present invention.
  • FIG. 4 is a schematic view of a white LED light emitting device according to Embodiment 4 of the present invention.
  • Fig. 5 is a schematic view showing a white LED light-emitting device according to a fifth embodiment of the present invention.
  • Fig. 6 is a schematic view showing a white LED light-emitting device of Embodiment 6 of the present invention.
  • Fig. 7 is a schematic view showing a white LED light-emitting device of Embodiment 7 of the present invention.
  • Fig. 8 is a schematic view showing a white LED light-emitting device according to Embodiment 8 of the present invention.
  • Fig. 9 is a schematic view showing a white LED light-emitting device according to Embodiment 9 of the present invention.
  • Fig. 10 is a schematic view showing a white LED light-emitting device according to Embodiment 10 of the present invention.
  • Figure 11 is a schematic view of a white LED light-emitting device according to Embodiment 11 of the present invention.
  • Figure 12 is a schematic view of a white LED light emitting device according to Embodiment 12 of the present invention.
  • Figure 13 is a schematic view of a white LED light-emitting device according to Embodiment 13 of the present invention.
  • Figure 14 is a schematic view of a white LED light-emitting device according to Embodiment 14 of the present invention.
  • Figure 15 is a schematic view of a white LED light-emitting device according to Embodiment 15 of the present invention.
  • Figure 16 is a schematic view of a white LED light-emitting device according to Embodiment 16 of the present invention.
  • Figure 17 is a schematic view of a white LED light-emitting device according to Embodiment 17 of the present invention.
  • Figure 18 is a schematic view of a white LED light-emitting device according to Embodiment 18 of the present invention.
  • Figure 19 is a schematic view of a white LED light-emitting device according to Embodiment 19 of the present invention.
  • Figure 20 is a schematic diagram of a white LED light-emitting device according to Embodiment 20 of the present invention.
  • Figure 21 is a schematic diagram of a white LED light-emitting device according to Embodiment 21 of the present invention.
  • Figure 22 is a schematic view of a white LED light-emitting device according to Embodiment 22 of the present invention.
  • Figure 23 is a schematic diagram of a white LED light-emitting device according to Embodiment 23 of the present invention.
  • Figure 24 is a schematic view of a white LED light-emitting device according to Embodiment 24 of the present invention.
  • Figure 25 is a schematic view of a white LED light-emitting device according to Embodiment 25 of the present invention. detailed description
  • the reflective surface of the reflector is coated with a metal film or the reflector is made entirely of metal.
  • the substrate material can be glass, or acrylic (PMMA), PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin or Other transparent organic materials.
  • the reflector may have a cylindrical shape, and the base and the substrate respectively serve as two bottom surfaces of the cylindrical shape.
  • the reflector may have a rounded table shape, the base serves as a lower bottom of the round table, and the substrate serves as an inverted upper base.
  • the reflector may have a bowl shape, the base serves as a bowl bottom, and the substrate is located at the mouth of the bowl.
  • the reflector may have a rectangular parallelepiped shape, the base serves as a lower base of the rectangular parallelepiped, and the substrate serves as an upper base of the rectangular parallelepiped.
  • the reflector may have a chamfered shape, the base serves as a bottom of the chamfered platform, and the substrate serves as a crest-shaped upper base.
  • the reflector may have a semi-cylindrical shape, and the base is disposed along a straight line parallel to the semi-cylindrical rectangular surface, and the straight line falls on the column axis and is perpendicular to the semi-circular rectangular surface. In the plane, the substrate acts as a semi-cylindrical rectangular face.
  • the substrate may be convex, such as a spherical surface, or a hyperboloid, a paraboloid, or any other convex shape.
  • the reflector may have a cylindrical shape, and the base and the substrate serve as the cylindrical lower bottom and the upper cover, respectively.
  • the reflector may have a rounded table shape, the base serves as a lower bottom of the round table, and the substrate serves as an inverted top cover.
  • the reflector may have a bowl shape, the base serves as a bowl bottom, and the substrate serves as an upper cover of the bowl.
  • the reflector may have a rectangular parallelepiped shape, the base serves as a lower base of the rectangular parallelepiped, and the substrate serves as an upper cover of the rectangular parallelepiped.
  • the reflector may have a chamfered shape, the base serves as a bottom of the chamfered table, and the substrate serves as a chamfered upper cover.
  • the substrate may be of a cylindrical type, and the outline of the cross section may be a circular arc, a parabola, or a hyperbola, or any other arc.
  • the reflector may have a rectangular parallelepiped shape, the base serves as a lower base of the rectangular parallelepiped, and the substrate serves as a cover of the rectangular parallelepiped.
  • the reflector may have an elongated rectangular parallelepiped (one side longer than the other side) or a chamfered table shape, and the base serves as an elongated rectangular or chamfered bottom, and the transparent cylindrical substrate is elongated. Cuboid or chamfered cover.
  • the reflector may have a semi-cylindrical shape, and the base is disposed along a straight line parallel to the semi-cylindrical rectangular surface, and the straight line falls on the column axis and is perpendicular to the semi-circular rectangular surface.
  • the transparent cylindrical substrate serves as a semi-cylindrical cover.
  • the cross-sectional contour of the reflector may be parabolic, the base is arranged along a straight line, the straight line coincides with the focal line of the paraboloid, and the transparent cylindrical substrate serves as the cover of the illuminating device.
  • the phosphor may be a mixture of LED yellow phosphor, a mixture of LED green phosphor and LED red phosphor, or a mixture of LED yellow phosphor and LED red phosphor in any ratio, which can be adjusted by fluorescence.
  • the base has a heat dissipation function and is made of aluminum or ceramic.
  • an adapter plate or an adapter ring of various shapes is provided between the reflector and the transparent substrate, especially in the case where the shape of the substrate is a non-plate shape.
  • FIG. 1 is a schematic view of a white LED light-emitting device according to Embodiment 1 of the present invention.
  • the white LED illumination device comprises: a base 1, a blue LED chip 2, a reflector 3 and a substrate 4. The two ends of the reflector 3 are respectively connected to the base 1 and the substrate 4.
  • the blue LED chip 2 is disposed on a side of the base 1 facing the substrate 4, and the electrode leads of the blue LED chip 2 are passed out of the base 1, and a surface of the substrate 4 is coated. Phosphor-containing organic coating.
  • the phosphor in order to obtain white light, may be an LED yellow phosphor.
  • the phosphor may also be a mixture of LED green phosphor and LED red phosphor in any ratio, or a mixture of LED yellow phosphor and a small amount of LED red phosphor.
  • the color of the illuminant can be adjusted by adjusting the proportion of the phosphor, or the color temperature can be determined, and the LED light of the full color temperature range can be obtained by adjusting the ratio.
  • the phosphor-containing organic coating layer may have a two-layer coating structure, and the coating thickness of each layer is from 3 ⁇ m to 5 mm.
  • the organic materials in the two coatings are the same.
  • the phosphors in the two coatings can be LED green phosphor and LED red phosphor, respectively, or LED yellow phosphor and LED red phosphor.
  • the phosphor composition in the two layers of coating is different.
  • the base 1 of the light-emitting device has a heat dissipation function.
  • the LED blue chip 2 of the light emitting device may be epitaxially grown on the SiC substrate, or grown on the gemstone (A1203) substrate, or grown on the Si substrate, or Any of the above three substrates is grown and transferred to other substrates.
  • the LED blue chip 2 of the illuminating device may be single or multiple (chipset), and the plurality of chips may be connected in series, or in parallel, or mixed through the connecting wires.
  • a reflector 3 is disposed between the LED blue chip 2 and the substrate, and the purpose is to reflect the blue light emitted by the LED blue chip 2 onto the organic coating containing the phosphor to excite the phosphor to emit light. Part of the blue light emitted by the LED blue chip 2 is mixed to obtain white light.
  • the reflector has a cylindrical shape, and the internal reflecting surface can be plated with a metal film to enhance the light reflection effect.
  • FIG. 2 is a schematic view of a white LED light-emitting device of Embodiment 2. The difference between this embodiment and the embodiment 1 is that the reflector 7 is in the shape of a rounded table, the base 5 serves as a lower base of the rounded table shape, and the base plate 8 serves as an upper base of the rounded table shape.
  • FIG. 3 is a schematic diagram of a white LED light-emitting device according to Embodiment 3 of the present invention.
  • FIG. 4 is a schematic diagram of a white LED light-emitting device according to Embodiment 4 of the present invention.
  • the reflector has a rectangular parallelepiped shape
  • the base 13 serves as a lower base of the rectangular parallelepiped
  • the base plate 17 serves as an upper base of the rectangular parallelepiped.
  • the reflector is composed of four rectangular reflecting surfaces 15 and 16.
  • the geometrical dimensions of the opposite reflecting surfaces of the four reflecting surfaces 15 and 16 are exactly the same, and the geometrical dimensions of the adjacent two reflecting surfaces may be the same or different, and the shapes may be square or rectangular.
  • FIG. 5 is a schematic diagram of a white LED light-emitting device according to Embodiment 5 of the present invention.
  • the reflector has a chamfered shape
  • the base 18 serves as a lower base of the chamfered table
  • the base plate 22 serves as an inverted base of the inverted prism.
  • the reflector is composed of four inverted trapezoidal reflecting surfaces 20 and 21.
  • the opposite set of reflective surfaces of the four reflective surfaces 20 and 21 have the same geometrical dimensions, and the adjacent two reflective surfaces may have the same or different geometrical dimensions.
  • FIG. 6 is a schematic diagram of a white LED light-emitting device according to Embodiment 6 of the present invention.
  • the reflector has a semi-cylindrical shape with reflective surfaces 25 and 26, and the base 23 is disposed in parallel with the semi-cylindrical rectangular surface.
  • the base 23 can also be non-parallel to the semi-cylindrical rectangular surface.
  • the substrate 27 is provided as a semi-cylindrical rectangular surface.
  • FIG. 7 is a schematic diagram of a white LED light-emitting device according to Embodiment 7 of the present invention.
  • the substrate is convex, such as a spherical surface, or a hyperboloid, a paraboloid, or any other convex shape.
  • Embodiment 8 is a schematic diagram of a white LED lighting device according to Embodiment 8 of the present invention.
  • the substrate is convex, such as a spherical surface, or a hyperboloid, a paraboloid, or any other convex shape.
  • This embodiment differs from Embodiment 1 in that a connecting portion 30 is provided between the reflector and the substrate.
  • the reflector 7 is in the shape of a truncated cone
  • the base 5 serves as a lower base of the truncated cone shape
  • the substrate 31 serves as an upper cover of the apparatus.
  • FIG. 9 is a schematic diagram of a white LED light-emitting device according to Embodiment 9 of the present invention.
  • the substrate is convex, such as a spherical surface, or a hyperboloid, a paraboloid, or any other convex shape.
  • This embodiment differs from Embodiment 1 in that a connecting portion 32 is provided between the reflector and the substrate.
  • FIG. 10 is a schematic diagram of a white LED light-emitting device according to Embodiment 10 of the present invention.
  • the substrate is convex, such as a spherical surface, or a hyperboloid, a paraboloid, or any other convex shape.
  • This embodiment differs from Embodiment 1 in that a connecting portion 34 is provided between the reflector and the substrate.
  • the reflector is a rectangular parallelepiped
  • the base 13 serves as a lower base of the rectangular parallelepiped
  • the base plate 35 serves as an upper cover of the apparatus.
  • the reflector is composed of four rectangular reflecting surfaces 15 and 16.
  • the geometrical dimensions of the opposite reflecting surfaces of the four reflecting surfaces 15 and 16 are completely the same, and the geometrical dimensions of the adjacent two reflecting surfaces may be the same or different, and the shapes may be square or rectangular.
  • FIG. 11 is a schematic diagram of a white LED light-emitting device according to Embodiment 11 of the present invention.
  • the substrate is convex, such as a spherical surface, or a hyperboloid, a paraboloid, or any other convex shape.
  • This embodiment differs from Embodiment 1 in that a connecting portion 36 is provided between the reflector and the substrate.
  • the reflector has a chamfered shape
  • the base 18 serves as a lower base of the chamfered table
  • the base plate 37 serves as an upper cover of the device.
  • the reflector is composed of four inverted trapezoidal reflecting surfaces 20 and 21.
  • the opposite set of reflective surfaces of the four reflective surfaces 20 and 21 have the same geometrical dimensions, and the adjacent two reflective surfaces may have the same or different geometrical dimensions.
  • FIG. 12 is a schematic diagram of a white LED light-emitting device according to Embodiment 12 of the present invention.
  • the substrate is of a cylindrical type, and the outline of the cross section thereof may be a circular arc, a parabola, or a hyperbola, or any other arc.
  • the device does not have a reflector, and the upper surface 40 of the base 38 is plated with a metal film and has a function of reflecting light.
  • the substrate 41 is directly mounted on the base 38.
  • FIG. 13 is a schematic diagram of a white LED light-emitting device according to Embodiment 13 of the present invention.
  • the substrate is of a cylindrical type, and the outline of the cross section thereof may be a circular arc, a parabola, or a hyperbola, or any other arc.
  • This embodiment differs from Embodiment 1 in that a connecting portion 42 is provided between the reflector and the substrate.
  • FIG. 14 is a schematic diagram of a white LED lighting apparatus according to Embodiment 13 of the present invention.
  • the substrate is of a cylindrical type, and the outline of the cross section thereof may be a circular arc, a parabola, or a hyperbola, or any other arc.
  • This embodiment differs from Embodiment 1 in that a connecting portion 48 is provided between the reflector and the substrate.
  • the reflector has an elongated rectangular parallelepiped shape or an elongated chamfered table shape, and the base serves as an elongated rectangular parallelepiped or an elongated chamfered lower base, and the substrate 49 serves as an upper cover of the apparatus.
  • the reflector is composed of four rectangular or trapezoidal reflecting surfaces 46 and 47.
  • the opposite set of reflective surfaces of the four reflective surfaces 46 and 47 are identical in geometry, and the adjacent two reflective surfaces may have the same or different geometrical dimensions.
  • FIG. 15 is a schematic diagram of a white LED light-emitting device according to Embodiment 14 of the present invention.
  • the substrate is of a cylindrical type, and the outline of the cross section thereof may be a circular arc, a parabola, or a hyperbola, or any other arc.
  • This embodiment differs from Embodiment 1 in that a connecting portion 54 is provided between the reflector and the substrate.
  • the reflector has a semi-cylindrical shape, and the base is arranged along a straight line which is parallel to the semi-cylindrical rectangular surface, and the straight line falls on the column axis and is semicircular
  • the plane of the rectangular face is perpendicular.
  • the reflector has reflecting surfaces 52 and 53, and the base 50 is disposed in parallel with the semi-cylindrical rectangular surface.
  • the base 50 may also be disposed non-parallel to the semi-cylindrical rectangular surface, and the substrate 55 serves as a cover for the device.
  • the cross-sectional contour of the reflector can also be parabolic, and the base is arranged along a straight line which coincides with the focal line of the paraboloid.
  • the silicone or the mixture of the resin and the phosphor is not directly bonded to the LED blue chip for packaging, the heat dissipation effect of the LED blue chip 4 is greatly enhanced, the heat dissipation problem of the chip is greatly alleviated, and the phosphor is excited.
  • 61 is a heat sink (bracket)
  • 2 is a blue LED chip
  • a fluorescent resin cover 64, 63 It is an air gap between the fluorescent resin cover and the chip or silica gel. Since the light-emitting device does not need to change the connection mode of the blue LED chip in the conventional packaging process, the electrode and the electrode lead are omitted in the figure.
  • FIG. 16 is a schematic diagram of a white LED light-emitting device according to Embodiment 1 of the present invention.
  • the resin in the fluorescent resin cover 64 is acrylic (P Li A), and the phosphor is YAG yellow powder having a particle diameter of 10 ⁇ m.
  • the fluorescent resin cover 64 is of a hollow cube type or a hollow cylinder type, and the wall thickness is adjustable, and the side of the blue chip is closely attached to the fluorescent resin cover 64.
  • the blue light emitted from the blue LED chip 2 illuminates the fluorescent resin cover 64.
  • the phosphor in the fluorescent resin cover 64 is excited by blue light to emit yellow light, and the emitted yellow light is mixed with a part of the blue light emitted from the blue LED chip 2 to obtain white light.
  • Embodiment 17 Fig. 17 is a schematic view showing a white LED light-emitting device according to Embodiment 17 of the present invention.
  • Embodiment 16 differs from Embodiment 16 in that the side surface of the blue chip is not in contact with the fluorescent resin cover.
  • Embodiment 18 is a schematic view of a white LED light-emitting device according to Embodiment 18 of the present invention.
  • the fluorescent resin cover is a hollow trapezoidal cube type, or a hollow truncated cone type, the wall thickness is adjustable, and the side of the blue chip is not in contact with the fluorescent resin cover.
  • Embodiment 19 is a schematic view of a white LED light-emitting device according to Embodiment 19 of the present invention.
  • the fluorescent resin cover is a composite structure of a hollow cylinder and an arc body, and the lower half is a hollow cylinder, and the side of the blue chip is closely attached to the fluorescent resin cover, and the upper half is curved.
  • the cross section is a circular arc, or a parabola type, or other arc type, and the inner and outer arcs may have the same line type or may be inconsistent.
  • Embodiment 20 is a schematic view of a white LED light-emitting device according to Embodiment 20 of the present invention.
  • the fluorescent resin cover is a composite structure of a hollow cylinder and an arc body, and the lower half is a hollow cylinder, the side of the blue chip is not in contact with the fluorescent resin cover, and the upper half is curved.
  • the cross section of the body is a circular arc, or a parabola, or other arc type, and the inner and outer arcs may have the same line type or may be inconsistent.
  • FIG. 21 is a schematic diagram of a white LED light-emitting device according to Embodiment 21 of the present invention.
  • This embodiment differs from the embodiment 16 in that the fluorescent resin cover is of a hollow cubic type, the hollow portion has a circular arc shape, or a parabolic shape, or other arc type, and the fluorescent resin cover is not in contact with the blue chip.
  • FIG. 22 is a schematic diagram of a white LED light-emitting device according to Embodiment 22 of the present invention.
  • the fluorescent resin cover is a hollow arcuate body having a circular arc shape, a parabolic shape, or other arc type, and the inner and outer arc lines may be uniform or inconsistent. .
  • FIG. 23 is a schematic view of a white LED light-emitting device according to Embodiment 23 of the present invention.
  • the fluorescent resin cover is of a half barrel type, and its cross section is a circular arc shape, a parabolic shape, or another arc type, and the inner and outer arc lines may have the same line type or may be inconsistent. That is, the fluorescent resin cover is a cylindrical shape of a half barrel, and the outline of the cross section may be a part of a circular arc, or a parabola, or a hyperbola, or other arc.
  • FIG. 24 is a schematic diagram of a white LED light-emitting device according to Embodiment 24 of the present invention.
  • This embodiment differs from the embodiment 16 in that the fluorescent resin cover is of a flat type, and the blue chip and the heat sink are in a recessed structure.
  • Embodiment 25 is a schematic view of a white LED light-emitting device according to Embodiment 25 of the present invention.
  • a fluorescent resin cover (a plurality of transparent or translucent resins can be prepared, and can be referred to the related application of the present applicant) is a hollow curved body having a circular arc shape or a parabola cross section.
  • Type, or other arc type, the inner and outer arc lines can be consistent or inconsistent, and the blue chip and the heat sink are indented.
  • a small amount of a UV absorber or an antioxidant may be added to the mixed powder of the phosphor and the resin to prevent the resin from aging.
  • an appropriate amount of ceramic particles such as S i0 2 , Zr0 2 , and A1 2 0 3 are added to enhance the mixing effect of the light.
  • the secondary resin can be used to prepare the fluorescent resin.
  • the mixed powder of the resin and the phosphor is first hot pressed or injection molded (extruded) into a sheet (which can also be directly molded), and then the sheet is thermoformed into a desired shape. Fluorescent resin element.
  • the phosphor powder is sufficiently mixed with the resin powder, the ultraviolet absorber powder and the other additive powder, and is obtained by hot press molding.
  • the resin may be acrylic (PMMA, acrylic), or polycarbonate (PC), or other transparent resin (including epoxy, butylbenzene, or phenylsulfone resin, etc.);
  • the phosphor powder may be an LED yellow phosphor.
  • the phosphor may also be a mixture of LED green phosphor and LED red phosphor, or a mixture of LED yellow phosphor and a small amount of LED red phosphor.
  • Example 26 the resin material was an optical grade acrylic (PMMA VH001) having a particle diameter of 5 ⁇ m.
  • the phosphor was a YAG yellow phosphor with a particle size of 5 microns.
  • the ultraviolet absorber is UV-327 and the antioxidant is antioxidant 1010.
  • the volume ratio of acrylic to phosphor is 100:
  • the mass ratio of acrylic to UV absorber UV-327 is 100: 0.25; the mass ratio of acrylic to antioxidant 1010 is 100: 0.25.
  • the phosphor powder and the acrylic powder were thoroughly mixed, and then molded into a sheet having a thickness of 0.4 mm at 160 ° C, and cooled to room temperature to obtain a fluorescent resin.
  • the obtained fluorescent resin has a smooth surface and no burr.
  • the obtained fluorescent resin was further molded by molding at 130 ° C into a hollow cube having a wall thickness of 0.4 mm.
  • the blue light emitted from the blue chip was internally irradiated with the above fluorescent resin to obtain bright white light (126 lm/W).
  • Example 27 The temperature of the first injection molding was 190 ° C, and the secondary molding temperature was 150 ° (:.
  • Example 28 The resin raw material is not limited, such as optical grade polycarbonate PC.
  • the granulation is carried out before injection molding, and different resins can be used in different injection molding conditions.
  • the resin may be acrylic (PMMA), PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC. Both enhanced PMMA or MS resins give good results.
  • the volume ratio of resin to phosphor is generally not limited, such as 100: 1 ⁇ 100: 150, generally 100:20 100:50.

Abstract

一种白光LED发光装置，包括底座（1）、蓝光LED芯片（2）、反光罩（3）和含有荧光体涂层的透明基板（4）。反光罩（3）的两端分别连接底座（1）和基板（4）。反光罩（3）内部反射面上设有反光层。蓝光LED芯片（2）设置在底座（1）面对透明基板（4）有荧光体涂层的一面，且蓝光LED芯片（2）的电极引线穿出底座（1）。蓝光LED芯片（2）为单颗芯片或一组串联、并联或混联的芯片。透明基板（4）可以是平面型、或凸面型、或柱面型。利用蓝光LED芯片发出的蓝光照射含有荧光体涂层的透明基板来获得白光，减少了因荧光体受激发出的光线部分重新进入芯片被吸收导致的发光损失，还缓解了散热问题，荧光体也不会出现因器件散热问题导致的发光波长漂移及发光效率下降等现象。

Description

白光 LED发光装置
技术领域
本发明涉及白光 LED发光装置。 尤其是基于荧光体涂层的透明基板白光 LED发光装置。
背景技术
LED 白光照明是一种高效绿色照明技术， 具有节能、 环保及长寿命等诸多优点， 其工作原理是利用 蓝光芯片与黄色的荧光粉组合 （或其它组合方式） 来获得白光。
白光 LED作为一种新的照明方式基于以下的工作原理： LED蓝光芯片发出蓝光照射荧光体（荧光粉）， 荧光体受到蓝光的激发发出黄光、 或绿光与红光的混合光线、 或黄光与红光的混合光线。 这些荧光体受 激发出的光线与蓝光芯片发出的部分蓝光混合而合成白光。 在通常的封装技术中荧光体通过硅胶或树脂 混合均匀地被固化在芯片表面。 这种封装方式的缺点如下： 器件工作时热量来不及散发导致器件工作温 度升高， 使得荧光体的发光波长发生漂移， 且荧光体的发光强度会下降。 此外， 荧光体紧贴蓝光芯片表 面时， 由于荧光体受激发出的光线部分会重新进入芯片被吸收， 导致器件发光效率下降。 如 CN200910036503一种白光 LED,利用超高度 INGAN蓝色 LED芯片，再在芯片上加少许的钇钻石榴为主体的 荧光粉，使其在蓝光激发下产生黄绿光，而此黄绿光又可与透出的蓝光合成白光。 CN200710079928的白光 发射装置包括蓝色 LED以及设置于蓝色 LED上的橙色磷光体与绿色磷光体的混合物。
发明内容
本发明目的在于提供一种利用蓝光 LED芯片发出的蓝光照射含有荧光体有机涂层的基板来获得白光 的装置及其制备方法。 该发光装置可以有效解决上述运用传统封装工艺的白光 LED出现的问题。 尤其是 一种基于荧光树脂的白光发光装置及其制备方法。
本发明提出一种白光 LED发光装置， 包括底座、 蓝光 LED芯片、 反光罩和含有荧光体涂层的透明基 板,反光罩的两端分别连接底座和基板， 反射罩内部反射面上设有反光层， 蓝光 LED 芯片设置在底座面 对透明基板有荧光体涂层的一面，且蓝光 LED芯片的电极引线穿出底座；其中蓝光 LED芯片为单颗芯片、 一组串联、 并联或混联的芯片。
荧光体涂层的透明基板是荧光粉填充的树脂板。 反光层可以是抛光层、 金属或其它镀层。 所述的荧 光树脂元件是将包括荧光体粉末与透明或半透明树脂充分混合或造粒， 经热压模塑成型获得。 荧光树脂 元件典型的为荧光树脂罩。
反光罩呈圆柱形， 底座和透明基板分别作为所述圆柱形的两个底面； 或反光罩呈倒圆台形或碗形， 底座作为倒圆台的下底或碗底， 透明基板作为倒圆台形的上底或位于碗口的位置。
其中反光罩呈长方体或倒棱台形， 底座作为长方体的下底或倒棱台形的下底， 透明基板作为长方体 的上底或倒棱台形的上底或盖。
其中反光罩呈半圆柱形， 底座沿着一条直线设置， 该直线与半圆柱形的矩形面平行， 且该直线落在 通过柱轴并与半圆形的矩形面垂直的平面内， 透明平面基板作为半圆柱形的矩形面。
其中反光罩的截面轮廓线呈抛物线型， 底座沿着一条直线设置， 该直线与抛物面的焦线重合， 透明 基板作为反光罩的盖。 透明基板可为柱面型。 其中反光罩呈细长的长方体或倒棱台形， 底座作为细长长方体或倒棱台形的下底， 透明的柱面型基 板作为细长长方体或倒棱台形的盖。
其中的基板是平面； 或是球面、 双曲面、 椭圆面或抛物面的凸面； 或为柱面型； 或基板的截面的轮 廓线是圆弧、 抛物线、 双曲线、 椭圆或其他的弧线的一部分。
荧光体涂层中的荧光体是 LED黄色荧光粉、 任意比例的 LED绿色荧光粉与 LED红色荧光粉的混合物 或任意比例的 LED黄色荧光粉与 LED红色荧光粉的混合物。 包含荧光体涂层采用 2层涂层结构，且每层 的涂层厚度是 3微米至 5毫米； 其中上述 2层涂层结构的荧光体分别是 LED绿色荧光粉和 LED红色荧光 粉， 或分别是 LED黄色荧光粉和 LED红色荧光粉。
本发明涉及的荧光树脂元件的结构与制备方法包括， 将荧光体粉末与树脂， 也可以包括紫外线吸收 剂粉末及其他添加剂粉末充分混合或造粒， 经热压模塑成型获得。
所述荧光树脂元件， 将质量比为 100: 1~100: 150的树脂的粉末与荧光体的粉末充分混合均匀； 将透明 或半透明树脂与荧光体的混合物或造料后利用加热模压 （注塑等热塑性工艺均可）， 冷却后就可获得荧 光树脂板材或其他形状的材料； 透明或半透明树脂是亚克力（PMMA)、 PMMA合金树脂、 聚碳酸酯、 PC合 金树脂、 环氧、 丁苯、 苯砜树脂、 CR-39、 MS、 NAS、 聚氨脂光学树脂、 尼龙或 PC增强的 PMMA或 MS树 脂。 专门有专利申请的内容。
其中荧光体粉末可以是 LED黄色荧光粉。 为了提高白光的显色指数， 荧光体也可以是 LED绿色荧光 粉与 LED红色荧光粉的混合物， 或者是 LED黄色荧光粉与少量 LED红色荧光粉的混合物；
其中 LED蓝光芯片可以是宝石 (A1203)衬底上生长的蓝光芯片， 也可以是 SiC衬底上生长的蓝光芯片， 或者是 S i衬底上生长的蓝光芯片， 或是在上述三种基板中的任意一种上生长后被转移到其他基板上的。 所述 LED蓝光芯片可以使用单颗 LED芯片， 也可以使用多颗或多组 LED芯片， 其目的是提供蓝光发光光源。
其中荧光树脂罩有不同的几何形状， 具有调节光线传输路径及改善发光器件散热的功能； 其中荧光树脂罩可以是空心立方体型， 或空心圆柱体型， 蓝光芯片侧面与荧光树脂罩可接触、 也可 不接触 （脱离， 指有间隙的结构）； 其中荧光树脂罩可以是空心的梯形立方体型， 或空心的圆台型； 其中荧光树脂罩可以是空心圆柱体与弧形体的复合型结构， 下半部为空心圆柱体， 侧面紧贴蓝光芯 片， 上半部弧形体的截面为圆弧形、 或抛物线型、或其他的弧线型。 蓝光芯片侧面与荧光树脂罩可接触， 也可不接触 （脱离）。
其中荧光树脂罩外侧面可以是空心的立方体型， 空心部分的截面的内弧线为圆弧形、 或抛物线型、 或其他的弧线型， 蓝光芯片不与荧光树脂罩接触。
其中荧光树脂罩可以是长条状的空心的弧面体， 其截面为圆弧形、 或抛物线型、 或其他的弧线型。 其中荧光树脂罩可以是半桶型， 其截面是圆弧形、 或抛物线型、 或其他的弧线型。
其中荧光树脂罩可以是平面型， 蓝光芯片与热沉呈内陷型结构。
其中荧光树脂罩可以是空心的弧面体， 其截面为弧线形、 如抛物线型、 或其他的弧线型， 蓝光芯片 与热沉呈内陷型结构。 上述树脂罩壁厚可以均匀， 也可以不均匀。
弧线的范围很广， 可以是圆弧或圆锥曲线、 卵形的部分线段、 包括其它不可以解析表示的弧线， 尤 其是抛物线。
上述荧光树脂罩与热沉之间可以通过连接部件连接、 或通过某种粘结剂连接。
在该装置中， 荧光树脂与 LED蓝光芯片发光面不直接接触， 散热效果较好， 荧光体的环境温度低， 因此不会发生因器件的高工作温度导致的发光性能劣化等问题。
上述荧光树脂元件， 将质量比为 100: 1~100: 150的树脂的粉末与荧光体的粉末充分混合均匀； 将透明 或半透明树脂与荧光体的混合物利用加热模压， 冷却后就可获得荧光树脂板材或其他形状的材料； 树脂 为亚克力（PMMA和丙烯酸树酯）、 PMMA合金树脂、 聚碳酸酯 PC、 PC合金树脂、 环氧、 丁苯或苯砜树脂。
荧光树脂元件的制造方法， 包括以下步骤：
( 1 ) 将质量比为 100: 1~100: 150的透明或半透明树脂与荧光体的粉末充分混合均匀或造粒；
( 2 ) 将透明或半透明树脂树脂与荧光体的粉末混合物或造粒利用加热模压，经冷却或退火后就可获 得包含荧光体的树脂板材或其他形状的材料；
( 3 ) 步骤（1 ) 中的透明或半透明树脂树脂可以是亚克力（PMMA)、 PMMA合金树脂、 聚碳酸酯、 PC合 金树脂、 环氧、 丁苯、 苯砜树脂、 CR-39、 MS、 NAS、 聚氨脂光学树脂、 尼龙或 PC增强的 PMMA或 MS树 脂等；
( 4 ) 步骤 （1 ) 中的荧光体粉末的粒径在 1微米到 60微米之间；
( 5 ) 步骤 （1 ) 中的荧光体是 LED黄色荧光粉； 为了提高白光的显色指数， 荧光体也可以是 LED绿 色荧光粉与 LED红色荧光粉的混合物， 或者是 LED黄色荧光粉与少量 LED红色荧光粉的混合物； 其中树 脂与荧光体的体积比为 100: 1~100: 150。
( 6 ) 在步骤 （2 ) 中， 模压的温度在 90°C到 270°C之间； 但低于透明或半透明树脂树脂的分解温度； 步骤 （1 ) 中的树脂可采用粉末状， 粒径在 1微米到 60微米之间；
在步骤 （2 ) 中， 加热模压指热塑或热固性工艺， 也包括注塑或挤塑等方法， 不排除其他成型工艺， 但需考虑到在热压成型过程中荧光体粉末流动性差；
在步骤（2 ) 中， 由于荧光体粉末不具流动性或流动性差， 其他的成型方式可能导致荧光体颗粒在树 脂中分布不均匀；
考虑到所述情形， 在步骤（2 )完成后， 可以运用模具对获得的荧光树脂板材进行二次成型， 获得所 需要的形状的器件。
为了增强光线的混合效果， 可以在步骤 （1 ) 中加入适量的 Si02、 或 Zr02、 或 A1203等陶瓷颗粒； 其中 荧光体与陶瓷颗粒的体积比为 100 : 1〜100： 150。
步骤（1 )中为了增强透明或半透明树脂树脂的抗老化性能，可以加入适量的紫外光吸收剂 (如 UV-327、 UV326、 UV328、 UV531、 UV-9等）、 或抗氧化剂（如抗氧剂 1076、 抗氧剂 2246、 抗氧剂 245、 抗氧剂 1010 及辅助抗氧剂 168等）； 树脂与紫外线吸收剂及树脂与抗氧剂的质量比为 100 : 0. 01〜100： 0. 7。
LED蓝光芯片可以是宝石 (Al2(¾)衬底上生长的蓝光芯片， 也可以是 S iC衬底上生长的蓝光芯片， 或者 是 S i衬底上生长的蓝光芯片， 或是在上述三种基板中的任意一种上生长后被转移到其他基板上的。 所述 LED蓝光芯片 4可以使用单颗 LED芯片， 也可以使用多颗或多组 LED芯片， 其目的是提供蓝光发光光源。
通过电极 6给 LED蓝光芯片接通电源， LED蓝光芯片就可以发出蓝光。 芯片发出的蓝光激发透明或 半透明树脂中的荧光体发出另外一种波长的光线， 激发出的光线的波长取决于荧光体本身的性质。 荧光 体受蓝光激发发出的光线与蓝光芯片发出的部分蓝光混合后可以得到各种色温的光线。
荧光树脂元件， 将质量比为 100: 1~100: 150的树脂与荧光体的粉末充分混合均匀； 将透明或半透明树 脂与荧光体粉末的混合物或造料后利用加热模压， 冷却后就可获得荧光树脂板材或荧光树脂元件； 透明 或半透明树脂是亚克力（PMMA)、 PMMA合金树脂、聚碳酸酯、 PC合金树脂、环氧、丁苯、苯砜树脂、 CR_39、 MS、 NAS、 聚氨脂光学树脂、 尼龙或 PC增强的 PMMA或 MS树脂。 荧光树脂元件的几何形状还可以起到调 节光线传输路径的功能， 其离开蓝光芯片的距离还可以调节发光器件的散热效果。 为此， 荧光树脂可以 加工成各种可能的几何形状的罩， 需根据具体需要来设计和加工。
本发明最好采用上述透明树脂或基本半透明的树脂，有关合金树脂的技术如下述：如 PC合金即改性 PC I ABS合金： PC与 ABS共混物可以综合 PC和 ABS的优良性能， 提高 ABS的耐热性、 抗冲击和拉 伸强度， 降低 PC成本和熔体粘度， 改善加工性能， 减少制品内应力和冲击强度对制品厚度的敏感性； 在 PC和 ABS中加入抗冲击剂 MBS ; PC / PS合金： 该合金为部分兼容、 非晶 /非晶体系。 在 PC中加 入 PS可以降低 PC粘流活化能，从而改善 PC的加工流动性，加入少量的 PS可使 PC熔体粘度大幅度下 降， PS在 PC中可以起到刚性有机填料的作用， PC与 PS均为透明材料， 二者折射率非常接近， 因此 PC / PS合金透明， 具有良好的光学特性。
LED芯片可以是蓝光 LED芯片及红光 LED芯片； LED蓝光芯片是宝石 (A1203)衬底上生长的蓝光芯片， 或 是 S iC衬底上生长的蓝光芯片， 或者是 S i衬底上生长的蓝光芯片， 或是在上述三种基板中的任意一种上 生长后被转移到其他基板上的； 红光 LED芯片包括 I II/V族化合物半导体红光芯片 （如 InGa、 A1P ) 及其 衍生品种； 蓝光 LED芯片及红光 LED芯片为一组串联、 并联或混联的芯片； 红光 LED芯片所发红光的光通 量与红光 LED芯片所发红光的光通量与蓝光 LED芯片所发蓝光的光通量的总和之比为 0. 5%〜25%;
光学波长转换器件的制备方法步骤： （1)将树脂粉末、荧光体粉末、粘结剂和溶剂混和成均匀的浆料， 其中树脂粉末、荧光体粉末的质量比为 100 : 1 - 20 : 150,溶剂与粘结剂的质量比为 100： 1 - 100： 100, 荧 光体粉末加树脂 B粉末混合物的总体积与溶剂加粘结剂混合物的总体积的体积比为 1 : 100 - 300： 100, 且树脂的粉末和荧光体的粉末的粒径在 1微米到 60微米之间；， 其中溶剂是液体的醇、 醚、 酮、 酯、 烃 类， 粘结剂为溶于溶剂的聚合物、 丙烯酸类树脂、 苯乙烯树脂、 缩丁醛树脂、 乙基纤维素； （2)将上述 浆料均匀涂覆在树脂基板上， 将涂覆浆料的树脂基板干燥， 干燥温度为 40°C-130°C， 干燥时间为 5分钟 -10小时；（3)将干燥后的涂有浆料的树脂基板烘烤,烘烤温度为 100°C-260°C，升温速率为 1-10 /分钟， 烘烤时间为 5分钟 -20小时， 降温时间为 20分钟 -10小时， 在树脂基板表面得到含有荧光体与树脂的混 合涂层；
其中步骤 (2)中干燥过程能在空气中进行， 也能在真空中进行； 也可以将权利要求 5 中的步骤 （2 ) 和 （3 ) 合并为一个分步加热步骤进行；
其中步骤 (3)中烘烤过程能在空气中进行， 也能在真空中进行， 烘烤方式是利用红外线直接烘烤或利 用电热丝加热烘烤；
其中在荧光体粉末与树脂粉末的混合粉末中还加有紫外线吸收剂或抗氧化剂， 树脂粉末与紫外线吸 收剂、 或树脂粉末与抗氧剂的质量比为 100 : 0. 01〜100： 0. 7 ;
其中在荧光体粉末与树脂粉末的混合粉末中还加有 Si02、 Zr02、 或 A1203等陶瓷颗粒， 其中荧光体粉末 与陶瓷颗粒的体积比为 100： 1〜100： 150。
本发明引用以下中国申请作为本发明的优先权： 201310005784.2， 201210296271.7, 201210512951.8, 201310006398.5。
本发明的有益效果是： 1) LED蓝光芯片表面未涂覆含荧光体的硅胶或树脂， 因此散热问题大为缓解， 还会减少因荧光体受激发出的光线部分重新进入芯片被吸收所造成的发光损失。 2)发光装置中含有荧光 体的有机涂层远离 LED蓝光芯片， 因此荧光体因器件散热问题导致的发光波长漂移及发光强度下降等问 题可以有效缓解。 同时可以避免运用传统技术封装的 LED 发光器件中由于硅胶或树脂变质发黄及反光 导致的器件光效下降问题。光效会明显提高， 根据本发明制造的发光器件中， 芯片散热问题被有效解决， 荧光体的环境温度低，因此不会发生因器件的高工作温度导致的发光性能劣化等问题，且保证发光强度。 本发明还具有调节光线传输路径 （可以制备成特定发光面积或集中光线的光源） 及改善发光器件散热的
4 功能； 荧光树脂罩可以根据需要设计并加工成不同的几何形状。 本发明利用蓝光 LED芯片发出的蓝光照 射荧光树脂罩来获得白光， 缓解了散热问题， 荧光体也不会出现因器件散热问题导致的发光波长漂移及 发光效率下降等现象。 荧光体与蓝光芯片发光面不直接接触， 可以减少因荧光体受激发出的光线部分重 新进入芯片被吸收造成的发光损失。
根据本发明制造方法的的荧光发光器件， 由于荧光体没有与硅胶或树脂混合直接封接在蓝光芯片表 面， 芯片散热问题被有效缓解， 荧光体的环境温度低， 因此不会发生因器件的高工作温度导致的发光性 能劣化等问题。 荧光体远离发光芯片可以避免荧光体受激发出的光线部分重新进入芯片被吸收导致的发 光损失。 另外 PMMA在使用过程中有较强的抗老化作用， 利于保持发光器件的光效不退化。
附图说明
图 1为本发明实施例 1的白光 LED发光装置的示意图。
图 2为本发明实施例 2的白光 LED发光装置的示意图。
图 3为本发明实施例 3的白光 LED发光装置的示意图。
图 4为本发明实施例 4的白光 LED发光装置的示意图。
图 5为本发明实施例 5的白光 LED发光装置的示意图。
图 6为本发明实施例 6的白光 LED发光装置的示意图。
图 7为本发明实施例 7的白光 LED发光装置的示意图。
图 8为本发明实施例 8的白光 LED发光装置的示意图。
图 9为本发明实施例 9的白光 LED发光装置的示意图。
图 10为本发明实施例 10的白光 LED发光装置的示意图。
图 11为本发明实施例 11的白光 LED发光装置的示意图。
图 12为本发明实施例 12的白光 LED发光装置的示意图。
图 13为本发明实施例 13的白光 LED发光装置的示意图。
图 14为本发明实施例 14的白光 LED发光装置的示意图。
图 15为本发明实施例 15的白光 LED发光装置的示意图。
图 16为本发明实施例 16的白光 LED发光装置的示意图。
图 17为本发明实施例 17的白光 LED发光装置的示意图。
图 18为本发明实施例 18的白光 LED发光装置的示意图。
图 19为本发明实施例 19的白光 LED发光装置的示意图。
图 20为本发明实施例 20的白光 LED发光装置的示意图。
图 21为本发明实施例 21的白光 LED发光装置的示意图。
图 22为本发明实施例 22的白光 LED发光装置的示意图。
图 23为本发明实施例 23的白光 LED发光装置的示意图。
图 24为本发明实施例 24的白光 LED发光装置的示意图。
图 25为本发明实施例 25的白光 LED发光装置的示意图。 具体实施方式
反光罩内部反射面上镀有金属薄膜或反光罩全部为金属制成。 基板材质可以是玻璃， 或亚克力 (PMMA)、 PMMA合金树脂、 聚碳酸酯、 PC合金树脂、 环氧、 丁苯、 苯砜树脂、 CR-39、 MS、 NAS、 聚氨脂 光学树脂、 尼龙或 PC增强的 PMMA或 MS树脂或其他透明的有机材料。
所述发光装置中， 反光罩可以呈圆柱形， 底座和基板分别作为所述圆柱形的两个底面。
所述发光装置中， 反光罩可以呈倒圆台形， 底座作为倒圆台的下底， 基板作为倒圆台形的上底。 所述发光装置中， 反光罩可以呈碗形， 底座作为碗底， 基板位于碗口的位置。
所述发光装置中， 反光罩可以呈长方体， 底座作为长方体的下底， 基板作为长方体的上底。
所述发光装置中， 反光罩可以呈倒棱台形， 底座作为倒棱台形的下底， 基板作为倒棱台形的上底。 所述发光装置中， 反光罩可以呈半圆柱形， 底座沿着一条直线设置， 该直线与半圆柱形的矩形面平 行， 且该直线落在通过柱轴并与半圆形的矩形面垂直的平面内， 基板作为半圆柱形的矩形面。
所述发光装置中， 基板可以是凸面型， 如球面、 或双曲面、 抛物面、 或其他任意形状的凸面。 所述发光装置中， 反光罩可以呈圆柱形， 底座和基板分别作为所述圆柱形的下底和上盖。
所述发光装置中， 反光罩可以呈倒圆台形， 底座作为倒圆台的下底， 基板作为倒圆台形的上盖。 所述发光装置中， 反光罩可以呈碗形， 底座作为碗底， 基板作为碗的上盖。
所述发光装置中， 反光罩可以呈长方体， 底座作为长方体的下底， 基板作为长方体的上盖。
所述发光装置中， 反光罩可以呈倒棱台形， 底座作为倒棱台形的下底， 基板作为倒棱台形的上盖。 所述发光装置中， 基板可以是柱面型， 其截面的轮廓线可以是圆弧线、 抛物线、 或双曲线、 或其他 任意的弧线。
所述发光装置中， 反光罩可以呈长方体， 底座作为长方体的下底， 基板作为长方体的盖。
所述发光装置中， 反光罩可以呈细长的长方体 （一边比另一边长得多） 或倒棱台形， 底座作为细长 长方体或倒棱台形的下底， 透明的柱面型基板作为细长长方体或倒棱台形的盖。
所述发光装置中， 反光罩可以呈半圆柱形， 底座沿着一条直线设置， 该直线与半圆柱形的矩形面平 行， 且该直线落在通过柱轴并与半圆形的矩形面垂直的平面内， 透明的柱面型基板作为半圆柱形的盖。
所述发光装置中， 反光罩的截面轮廓线可以呈抛物线型， 底座沿着一条直线设置， 该直线与抛物面 的焦线重合， 透明的柱面型基板作为发光装置的盖。
所述发光装置中， 荧光体可以是 LED黄色荧光粉、 任意比例的 LED绿色荧光粉与 LED红色荧光粉的 混合物、 或任意比例的 LED黄色荧光粉与 LED红色荧光粉的混合物， 可以通过调节荧光粉的比例来调节 发光颜色， 或着说色温， 只要调节比例就可以获得全色温范围的 LED光。
所述发光装置中， 底座具有散热功能， 由铝或陶瓷制成。
实施例中还说明了反光罩与透明基板之间设有各种形状的转接板或转接环， 尤其是基板的形状是非 平板形状的情况下。
具体实施例并配合所附图式说明如下。
实施例 1， 图 1为本发明实施例 1的白光 LED发光装置的示意图。 白光 LED发光装置包括： 底座 1、 蓝光 LED芯片 2、 反光罩 3和基板 4。 反光罩 3的两端分别连接底座 1和基板 4， 蓝光 LED芯片 2设置在 底座 1面对基板 4的一面， 且蓝光 LED芯片 2的电极引线穿出底座 1， 基板 4的一个表面上涂覆含荧光 体的有机涂层。
作为具体实施例之一， 为了获得白光， 荧光体可以是 LED黄色荧光粉。 为了提高白光的显色指数， 荧光体也可以是任意比例的 LED绿色荧光粉与 LED红色荧光粉的混合物， 或者是 LED黄色荧光粉与少量 LED红色荧光粉的混合物。 可以通过调节荧光粉的比例来调节发光颜色， 或着说色温， 只要调节比例就 可以获得全色温范围的 LED光。
作为具体实施例之一， 含有荧光体的有机涂层可以采用 2层涂层结构， 且每层的涂层厚度是 3微米 至 5毫米。 两层涂层中的有机材质一致， 两层涂层中的荧光体可以分别是 LED绿色荧光粉和 LED红色荧 光粉， 或者分别是 LED黄色荧光粉和 LED红色荧光粉。 但是两层涂层中的荧光体成分不一样。
作为具体实施例之一， 发光装置的底座 1兼有散热功能。
作为具体实施例之一， 发光装置的 LED蓝光芯片 2可以是外延生长在 S iC基板上的， 或是生长在宝 石 (A1203)基板上的， 或是生长在 S i基板上的， 或是在上述三种基板中的任意一种上生长后被转移到其 他基板上的。
作为具体实施例之一， 发光装置的 LED蓝光芯片 2可以是单颗的， 或者是多颗 （芯片组） 的， 多颗 芯片组可以是通过连接线串联、 或并联、 或混联。
作为具体实施例之一， 在 LED蓝光芯片 2与基板之间设有反光罩 3， 目的是将 LED蓝光芯片 2发出 的蓝光反射到包含荧光体的有机涂层上， 激发荧光体发光， 经与 LED蓝光芯片 2发出的部分蓝光混合后 获得白光。
作为具体实施例之一， 反光罩呈圆柱形， 内部反射面可以镀上金属薄膜以加强光线反射效果。 实施例 2， 以图 2为实施例 2的白光 LED发光装置的示意图。 本实施例与实施例 1的区别在于反光 罩 7成倒圆台形， 底座 5作为倒圆台形的下底， 基板 8作为倒圆台形的上底。
实施例 3， 以图 3为本发明实施例 3的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于反光罩 11呈碗形， 底座 9作为碗底， 基板 12位于碗口的位置。 实施例 4, 以图 4为本发明实施例 4的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于反光罩呈长方体， 底座 13作为长方体的下底， 基板 17作为长方体 的上底。 反射罩由 4个矩形的反射面 15和 16构成。 4个反射面 15和 16中相对的一组反射面几何尺寸 完全相同， 相邻的两个反射面几何尺寸可以相同， 也可以不同， 其形状可以是正方形或长方形。
实施例 5， 以图 5为本发明实施例 5的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于反光罩呈倒棱台形， 底座 18作为倒棱台形的下底， 基板 22作为倒 棱台形的上底。 反射罩由 4个倒梯形的反射面 20和 21构成。 4个反射面 20和 21中相对的一组反射面 几何尺寸完全相同， 相邻的两个反射面几何尺寸可以相同， 也可以不同。
实施例 6， 以图 6为本发明实施例 6的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于反光罩呈半圆柱形， 具有反射面 25和 26， 底座 23与半圆柱形的矩 形面平行设置， 当然底座 23也可以与半圆柱形的矩形面非平行设置， 基板 27作为半圆柱形的矩形面。
实施例 7， 以图 7为本发明实施例 7的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于基板是凸面型， 如球面、 或双曲面、 抛物面、 或其他任意形状的凸 面。
本实施例与实施例 1的区别在于在反光罩与基板之间设置连接部 28。 基板 29作为装置的上盖。 实施例 8， 以图 8为本发明实施例 8的白光 LED发光装置的示意图。 本实施例与实施例 1的区别在于基板是凸面型， 如球面、 或双曲面、 抛物面、 或其他任意形状的凸 面。
本实施例与实施例 1的区别在于在反光罩与基板之间设置连接部 30。
本实施例与实施例 1的区别在于反光罩 7成倒圆台形， 底座 5作为倒圆台形的下底， 基板 31作为装 置的上盖。
实施例 9， 以图 9为本发明实施例 9的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于基板是凸面型， 如球面、 或双曲面、 抛物面、 或其他任意形状的凸 面。
本实施例与实施例 1的区别在于在反光罩与基板之间设置连接部 32。
本实施例与实施例 1的区别在于反光罩 11呈碗形， 底座 9作为碗底， 基板 33作为装置的上盖。 实施例 10， 以图 10为本发明实施例 10的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于基板是凸面型， 如球面、 或双曲面、 抛物面、 或其他任意形状的凸 面。
本实施例与实施例 1的区别在于在反光罩与基板之间设置连接部 34。
本实施例与实施例 1的区别在于反光罩呈长方体， 底座 13作为长方体的下底， 基板 35作为装置的 上盖。 反射罩由 4个矩形的反射面 15和 16构成。 4个反射面 15和 16中相对的一组反射面几何尺寸完 全相同， 相邻的两个反射面几何尺寸可以相同， 也可以不同， 其形状可以是正方形或长方形。
实施例 11， 以图 11为本发明实施例 11的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于基板是凸面型， 如球面、 或双曲面、 抛物面、 或其他任意形状的凸 面。
本实施例与实施例 1的区别在于在反光罩与基板之间设置连接部 36。
本实施例与实施例 1的区别在于反光罩呈倒棱台形， 底座 18作为倒棱台形的下底， 基板 37作为装 置的上盖。 反射罩由 4个倒梯形的反射面 20和 21构成。 4个反射面 20和 21中相对的一组反射面几何 尺寸完全相同， 相邻的两个反射面几何尺寸可以相同， 也可以不同。
实施例 12， 以图 12为本发明实施例 12的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于基板是柱面型， 其截面的轮廓线可以是圆弧线、 抛物线、 或双曲线、 或其他任意的弧线。
本实施例与实施例 1的区别在于该装置不设反射罩， 底座 38的上表面 40镀有金属薄膜， 具有反射 光线的功能。 本实施例与实施例 1的区别在于基板 41直接安在底座 38上。
实施例 13, 以图 13为本发明实施例 13的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于基板是柱面型， 其截面的轮廓线可以是圆弧线、 抛物线、 或双曲线、 或其他任意的弧线。
本实施例与实施例 1的区别在于在反光罩与基板之间设置连接部 42。
本实施例与实施例 1的区别在于反光罩呈长方体， 底座 13作为长方体的下底， 基板 43作为长方体 的盖。 反射罩由 4个矩形的反射面 15和 16构成。 4个反射面 15和 16中相对的一组反射面几何尺寸完 全相同， 相邻的两个反射面几何尺寸可以相同， 也可以不同， 其形状可以是正方形或长方形。 实施例 14， 以图 14为本发明实施例 13的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于基板是柱面型， 其截面的轮廓线可以是圆弧线、 抛物线、 或双曲线、 或其他任意的弧线。
本实施例与实施例 1的区别在于在反光罩与基板之间设置连接部 48。
本实施例与实施例 1的区别在于，反光罩呈细长的长方体或细长的倒棱台形，底座作为细长长方体或 细长倒棱台形的下底， 基板 49作为装置的上盖。 反射罩由 4个矩形或梯形的反射面 46和 47构成。 4个 反射面 46和 47中相对的一组反射面几何尺寸完全相同， 相邻的两个反射面几何尺寸可以相同， 也可以 不同。
实施例 15， 以图 15为本发明实施例 14的白光 LED发光装置的示意图。
本实施例与实施例 1的区别在于基板是柱面型， 其截面的轮廓线可以是圆弧线、 拋物线、 或双曲线、 或其他任意的弧线。
本实施例与实施例 1的区别在于，在反光罩与基板之间设置连接部 54。
本实施例与实施例 1 的区别在于， 反光罩呈半圆柱形， 底座沿着一条直线设置， 该直线与半圆柱形 的矩形面平行， 且该直线落在通过柱轴并与半圆形的矩形面垂直的平面内。 反光罩具有反射面 52和 53， 底座 50与半圆柱形的矩形面平行设置， 当然底座 50也可以与半圆柱形的矩形面非平行设置， 基板 55 作为装置的盖。
本实施例与实施例 1的区别在于， 反光罩的截面轮廓线还可以呈抛物线型，底座沿着一条直线设置， 该直线与抛物面的焦线重合。
综上所述， 不直接将硅胶或树脂与荧光体的混合物粘结在 LED蓝光芯片上进行封装， LED蓝光芯片 4 散热效果大大增强， 芯片的散热问题大大缓解， 同时减少了因荧光体受激发出的光线部分重新进入芯片 所造成的发光损失； 同时发光装置中含有荧光体的有机涂层远离 LED蓝光芯片， 因此荧光体因器件散热 问题导致的发光波长漂移及发光强度下降等问题可以有效缓解。
以下实施例参考了附图 16— 25， 在这些附图中， 相同的附图标记表示相同的部件， 图中： 61是热沉 (支架）， 2是蓝光 LED芯片， 荧光树脂罩 64， 63是荧光树脂罩和芯片间的空气间隙或硅胶。 由于该发 光器件无需改变传统封装工艺中的蓝光 LED芯片的连接方式， 在图中电极及电极引线被省略。
实施例 16， 图 16为本发明实施例 1的白光 LED发光装置的示意图。
荧光树脂罩 64中的树脂为亚克力 (P丽 A)， 荧光体为 YAG黄粉， 粒径为 10微米。
荧光树脂罩 64是空心立方体型， 或空心圆柱体型， 壁厚可调， 蓝光芯片侧面紧贴荧光树脂罩 64。 蓝光 LED芯片 2发出的蓝光照射荧光树脂罩 64， 荧光树脂罩 64中的荧光体受蓝光激发发出黄光， 发出的黄光与蓝光 LED芯片 2发出的部分蓝光混合得到白光。
实施例 17, 图 17为本发明实施例 17的白光 LED发光装置的示意图。
该实施例与实施例 16的区别在于， 蓝光芯片的侧面与荧光树脂罩不接触。
实施例 18， 图 18为本发明实施例 18的白光 LED发光装置的示意图。
该实施例与实施例 16的区别在于，荧光树脂罩是空心的梯形立方体型，或空心的圆台型，壁厚可调， 蓝光芯片侧面与荧光树脂罩不接触。
实施例 19， 图 19为本发明实施例 19的白光 LED发光装置的示意图。
9 该实施例与实施例 16的区别在于， 荧光树脂罩是空心圆柱体与弧形体的复合型结构， 下半部为空心 圆柱体， 蓝光芯片侧面紧贴荧光树脂罩， 上半部弧形体的截面为圆弧形、或抛物线型、 或其他的弧线型， 内外弧线的线型可以一致， 也可以不一致。
实施例 20， 本发明实施例 20的白光 LED发光装置的示意图。
该实施例与实施例 16的区别在于， 荧光树脂罩是空心圆柱体与弧形体的复合型结构， 下半部为空心 圆柱体， 蓝光芯片侧面与荧光树脂罩不接触， 上半部弧形体的截面为圆弧形、 或抛物线型、 或其他的弧 线型， 内外弧线的线型可以一致， 也可以不一致。
实施例 21， 图 21为本发明实施例 21的白光 LED发光装置的示意图。
该实施例与实施例 16的区别在于， 荧光树脂罩是空心的立方体型， 空心部分的截面为圆弧形、 或抛 物线型、 或其他的弧线型， 荧光树脂罩不与蓝光芯片接触。
实施例 22， 图 22为本发明实施例 22的白光 LED发光装置的示意图。
该实施例与实施例 16的区别在于， 荧光树脂罩是空心的弧面体， 其截面为圆弧形、 或抛物线型、 或 其他的弧线型， 内外弧线的线型可以一致， 也可以不一致。
实施例 23， 图 23为本发明实施例 23的白光 LED发光装置的示意图。
该实施例与实施例 16的区别在于， 荧光树脂罩是半桶型， 其截面是圆弧形、 或抛物线型、 或其他的 弧线型， 内外弧线的线型可以一致， 也可以不一致。 即荧光树脂罩是半桶的柱面型， 其截面的轮廓线可 以是圆弧的一部分、 或抛物线、 或双曲线、 或其他的弧线。
实施例 24， 图 24为本发明实施例 24的白光 LED发光装置的示意图。
该实施例与实施例 16的区别在于， 荧光树脂罩是平面型， 蓝光芯片与热沉呈内陷型结构。
实施例 25, 图 25为本发明实施例 25的白光 LED发光装置的示意图。
该实施例与实施例 16的区别在于， 荧光树脂罩（多种透明或半透明树脂均能够制备， 可参考本申请 人的相关申请） 是空心的弧面体， 其截面为圆弧形、 或抛物线型、 或其他的弧线型， 内外弧线的线型可 以一致， 也可以不一致， 蓝光芯片与热沉呈内陷型结构。
本发明的进一步改进还包括： 荧光体与树脂的混合粉末中还可以加入少量紫外线吸收剂或抗氧化剂 来防止树脂老化。 在步骤 （1 ) 中加入适量的 S i02、 Zr02、 A1203等陶瓷颗粒； 来增强光线的混合效果。 可 以采取二次成型的方法来制备荧光树脂， 先将树脂与荧光体的混合粉末热压或注塑 （挤塑） 成板材 （亦 可直接模具成型）， 再将板材二次热成型为所需形状的荧光树脂元件。
本发明涉及的荧光树脂元件 （树脂罩） 制备方法实施例， 将荧光体粉末与树脂粉末、 另包括紫外线 吸收剂粉末及其他添加剂粉末充分混合， 经热压模塑成型获得。 其中树脂可以是亚克力 (PMMA、 丙烯酸 树脂）、 或聚碳酸酯 (PC)、 或其他的透明树脂 （包括环氧、 丁苯、 或苯砜树脂等）； 无明显区别。 其中荧 光体粉末可以是 LED黄色荧光粉。 为了提高白光的显色指数， 荧光体也可以是 LED绿色荧光粉与 LED红 色荧光粉的混合物， 或者是 LED黄色荧光粉与少量 LED红色荧光粉的混合物。
实施例 26， 树脂原料为光学级亚克力 （PMMA VH001 ), 粒径为 5微米。 荧光粉为 YAG黄色荧光 粉， 粒径为 5微米。 紫外线吸收剂为 UV-327, 抗氧剂为抗氧剂 1010。 亚克力与荧光体的体积比为 100:
15%；亚克力与紫外线吸收剂 UV-327的质量比为 100: 0.25；亚克力与抗氧剂 1010的质量比为 100: 0.25。
将荧光粉粉末与亚克力粉末充分混合后， 在 160°C模压成厚度为 0.4亳米的板材， 冷却至室温即得到 荧光树脂。 获得的荧光树脂表面光滑， 无毛刺。
10 之后， 将获得的荧光树脂再在 130 °C模压二次成型为壁厚为 0.4毫米的空心立方体。 使用 1W的 SiC基板上生长的蓝光芯片， 蓝光芯片发出的蓝光在内部照射上述的荧光树脂后， 获得 明亮的白光 (126 lm/W)。
实施例 27： 第一次注塑模压的温度在 190°C， 二次模压温度在 150° (：。
实施例 28： 树脂原料不限， 如光学级聚碳酸脂 PC。 先造粒后再进行注塑， 不同的树脂可采用不同 的注塑工艺条件。 使用 1W的 SiC基板上生长的蓝光芯片， 蓝光芯片发出的蓝光在内部照射上述的荧光 树脂后， 获得明亮的白光 (118-135 lm/W)。 实施例中树脂可采用亚克力（PMMA)、 PMMA合金树脂、 聚碳酸 酯、 PC合金树脂、 环氧、 丁苯、 苯砜树脂、 CR-39、 MS、 NAS、 聚氨脂光学树脂、 尼龙或 PC增强的 PMMA 或 MS树脂均可以得到良好效果。根据不同的要求树脂与荧光体的体积比一般不限，如为 100: 1~100: 150， 一般 100:20 100:50。
以上所述仅是本发明的优选实施方式， 应当指出， 对于本技术领域的普通技术人员来说， 在不脱离 本发明原理的前提下， 还可以做出若干改进和润饰， 这些改进和润饰也应视为本发明的保护范围。
11

Claims

权利要求书
1.一种白光 LED发光装置， 其特征在于， 包括底座、 蓝光 LED芯片、 反光罩和含有荧光体涂层的透 明基板构成的波长转换器件，反光罩的两端分别连接底座和基板， 反光罩内部反射面上设有反光层， 蓝 光 LED芯片设置在底座面对透明基板有荧光体涂层的一面， 且蓝光 LED芯片的电极引线穿出底座； 其中 蓝光 LED芯片为单颗芯片、 一组串联、 并联或混联的芯片。
2.根据权利要求 1所述的白光 LED发光装置， 其特征在于反光罩呈圆柱形， 底座和透明基板分别作 为所述圆柱形的两个底面； 或反光罩呈倒圆台形或碗形， 底座作为倒圆台的下底或碗底， 透明基板作为 倒圆台形的上底或位于碗口的位置； 当反光罩呈长方体或倒棱台形， 底座作为长方体的下底或倒棱台形 的下底， 透明基板作为长方体的上底或倒棱台形的上底或盖。 当反光罩呈半圆柱形， 底座沿着一条直线 设置， 该直线与半圆柱形的矩形面平行， 且该直线落在通过柱轴并与半圆形的矩形面垂直的平面内， 透 明平面基板作为半圆柱形的矩形面。
3.根据权利要求 1所述的白光 LED发光装置， 其特征在于， 其中反光罩的截面轮廓线呈抛物线型， 底座沿着一条直线设置， 该直线与抛物面的焦线重合， 透明基板作为反光罩的盖； 或反光罩呈细长的长 方体或倒棱台形， 底座作为细长长方体或倒棱台形的下底， 透明的柱面型基板作为细长长方体或倒棱台 形的盖。
4.根据权利要求 1-3之一所述的白光 LED发光装置， 其特征在于， 其中荧光体涂层的透明基板是平 面、 柱面型、 球面、 双曲面、 椭圆面、 抛物面的凸面； 或透明基板的截面的轮廓线是圆弧、 抛物线、 双 曲线、 椭圆或其他的弧线的一部分。
5.根据权利要求 1-3之一所述的白光 LED发光装置， 其特征在于， 荧光体涂层荧光体是 LED黄色荧 光粉、 任意比例的 LED绿色荧光粉与 LED红色荧光粉的混合物或任意比例的 LED黄色荧光粉与 LED红色 荧光粉的混合物。
6.根据权利要求 5所述的白光 LED发光装置， 其特征在于， 包含荧光体涂层采用 2层涂层结构,且每 层的涂层厚度是 3微米至 5毫米； 其中上述 2层涂层结构的荧光体分别是 LED绿色荧光粉和 LED红色荧 光粉， 或分别是 LED黄色荧光粉和 LED红色荧光粉。
7. 根据权利要求 1所述的白光 LED发光装置， 其特征在于， 含有荧光体涂层的透明基板的构成如下 述：
(1)将质量比为 100: 1~100: 150的透明或半透明树脂与荧光体的粉末充分混合均匀或造粒；
( 2 ) 将树脂与荧光体的混合物或造粒利用加热模压， 冷却后就可获得荧光树脂板材或器件； 透明或半透明树脂为亚克力、 PMMA合金树脂、 聚碳酸酯 PC、 PC合金树脂、 环氧、 丁苯、 苯砜树脂、 CR-39、 MS、 NAS、 聚氨脂光学树脂、 尼龙或 PC增强的 PMMA或 MS树脂；
荧光体的粒径在 1微米到 60微米之间。
8. 根据权利要求 7所述的白光 LED发光装置， 其特征是采取二次成型的方法来制备荧光树脂， 先将 透明或半透明树脂与荧光体的混合粉末热压成板材， 再将板材二次热成型为所需形状的荧光树脂器件。
9. 根据权利要求 7— 8中之一所述的白光 LED发光装置， 其特征是发光器件包含有热沉， LED蓝光 芯片和荧光树脂元件； 荧光树脂元件置于 LED蓝光芯片上部； 荧光树脂元件加工成各种几何形状的罩， 以调节光线传输路径及改善散热效果。
10、根据权利要求 7所述的白光 LED发光装置，其特征是光学波长转换器件为含有荧光体涂层的基板， 包含荧光体的有机涂层制备在透明基板上， 基板是透明或半透明的树脂； 有机涂层包含一种或几种荧光 体与有机溶剂及粘结剂的混合物。 光学波长转换器件的荧光体粉末与有机溶剂及粘结剂形成浆料后涂覆 在基板上， 其中的荧光体粉末与有机溶剂加粘结剂混合物的体积比为 1%〜120<¾ ; 通过加热使得有机液 体与荧光体粉末固化在一起， 固化温度低于有机基板的固化温度 10 °C以上； 使用玻璃基板时固化温度 最高到 150-180° (。
11、 根据权利要求 10所述的白光 LED发光装置， 其特征是光学波长转换器件基板是平面板， 或是球 面、 柱面、 椭球面、 卵形面、 双曲面或抛物面的一部分曲面形状的板材。
12、 根据权利要求 10或 11所述的白光 LED发光装置， 其特征是所述的光学波长转换器件的有机涂 层为一层或二层， 其中的荧光体是 LED黄色荧光粉、 LED绿色荧光粉或 LED红色荧光粉， 或上述任意 二种荧光粉的混合物； 二层含荧光体涂层结构中， 第一涂层和第二涂层中的荧光粉成分为上述的任意二 种。
13、根据权利要求 12所述的白光 LED发光装置，其特征是光学波长转换器件构成的白光发光器件中： 透明基板包含荧光体涂层的一面面对蓝光芯片背对蓝光芯片； 发光器件中包含荧光体涂层的基板是一层 或二层包含荧光体涂层的基板； 二层涂层中的荧光体在发光器件中的蓝光芯片或芯片组所发出的蓝光激 发下发出绿光、 红光或黄光； 或者是上述任意两种光的混合光； 这些被激发出的混合光线与蓝光芯片或 芯片组发出的部分蓝光混合后得到白光。
14、根据权利要求 12所述的白光 LED发光装置，其特征是光学波长转换器件构成的白光发光器件中： 在含有蓝光激发下发出短波长光线的荧光体涂层设置在迎着蓝光芯片的第一层， 之后是含有蓝光激发下 发出较长波长光线的荧光体涂层。 包含荧光体的荧光体涂层的厚度根据蓝光芯片或芯片组所发出的蓝光 的光通量 （光强） 来调节。
15、根据权利要求 12所述的白光 LED发光装置，其特征是光学波长转换器件构成的白光发光器件中： 含有蓝光激发下发出短波长光线的荧光体涂层被激发出的部分短波长光线还激发含有蓝光激发下发出 较长波长光线的荧光体涂层中的荧光体发出较长波长的光； 适当增加含有蓝光激发下发出短波长光线的 荧光体涂层的厚度来调节发光器件的白光质量。
16、根据权利要求 12所述的基于荧光树脂的白光 LED发光装置， 其特征在于荧光树脂元件为荧光树 脂罩， 荧光树脂罩距蓝光 LED芯片有间隙； 透明或半透明树脂是亚克力（PMMA)、 PMMA合金树脂、 聚碳酸 酯、 PC合金树脂、 环氧、 丁苯、 苯砜树脂、 CR-39、 MS、 NAS、 聚氨脂光学树脂、 尼龙或 PC增强的 PMMA 或 MS树脂。
17、根据权利要求 16所述的基于荧光树脂的白光 LED发光装置， 其特征在于， 其中荧光树脂罩为空 心立方体型或空心圆柱体型， 壁厚可调， 蓝光芯片侧面紧贴荧光树脂罩或与荧光树脂罩有间隙； 荧光树 脂罩或为空心的梯形、立方体型或空心的圆台型， 壁厚可调， 蓝光芯片侧面与荧光树脂罩紧贴或有间隙； 荧光树脂罩是空心圆柱体与弧面形体的复合型结构， 下半部为空心圆柱体， 蓝光芯片侧面荧光树脂罩紧 贴或有间隙， 上半部弧面形体的截面为弧线形、 抛物线型、 或其他的弧线型； 其中荧光树脂罩外侧面是 空心的立方体型， 空心部分的截面的内弧为弧线形、 抛物线型、 或其他的弧线型， 荧光树脂罩与蓝光芯 片接触或有间隙。
18、根据权利要求 16所述的基于荧光树脂的白光 LED发光装置， 其特征在于， 其中荧光树脂罩是空 心的弧面体， 其截面为圆弧形、 或抛物线型、 或其他的弧线型， 内外弧线的线型一致或相异；
或荧光树脂罩是半桶型， 其截面是圆弧形、 或抛物线型、 或其他的弧线型， 罩的内外弧线的线型一 致或相异； 或荧光树脂罩是平面型或空心的弧面体， 空心的弧面体截面为圆弧形、 或抛物线型、 或其他 的弧线型， 蓝光芯片与热沉呈内陷型结构。
19、 根据权利要求 1所述的白光 LED发光装置， 其特征在于， LED芯片是蓝光 LED芯片及红光 LED芯片； LED蓝光芯片是宝石 (A1203)衬底上生长的蓝光芯片， 或是 SiC衬底上生长的蓝光芯片， 或者是 Si衬底上生 长的蓝光芯片， 或是在上述三种基板中的任意一种上生长后被转移到其他基板上的； 红光 LED芯片包括 III/V族化合物半导体红光芯片（如 InGa、 A1P)及其衍生品种； 蓝光 LED芯片及红光 LED芯片为一组串联、 并联或混联的芯片； 红光 LED芯片所发红光的光通量与红光 LED芯片所发红光的光通量与蓝光 LED芯片所 发蓝光的光通量的总和之比为 0. 5%〜25%。
20、 根据权利要求 19所述的白光 LED发光装置， 其特征在于， 光学波长转换器件的制备方法步骤： (1)将树脂粉末、 荧光体粉末、 粘结剂和溶剂混和成均匀的浆料， 其中树脂粉末、 荧光体粉末的质量比 为 100 : 1— 20 : 150， 溶剂与粘结剂的质量比为 100: 1— 100: 100, 荧光体粉末加树脂 B粉末混合物的总 体积与溶剂加粘结剂混合物的总体积的体积比为 1 : 100- 300： 100,且树脂的粉末和荧光体的粉末的粒 径在 1微米到 60微米之间；， 其中溶剂是液体的醇、 醚、 酮、 酯、 烃类， 粘结剂为溶于溶剂的聚合物、 丙烯酸类树脂、 苯乙烯树脂、 缩丁醛树脂、 乙基纤维素； （2)将上述浆料均匀涂覆在树脂基板上， 将涂 覆浆料的树脂基板干燥， 干燥温度为 40°C-130°C， 干燥时间为 5分钟 -10小时； （3)将干燥后的涂有浆 料的树脂基板烘烤,烘烤温度为 100°C-260°C， 升温速率为 1-1CTC/分钟， 烘烤时间为 5分钟 -20小时， 降温时间为 20分钟 -10小时， 在树脂基板表面得到含有荧光体与树脂的混合涂层。
21、 权利要求 20中所述的光学波长转换组件的制备方法， 其特征在于， 其中步骤 (2)中干燥过程能 在空气中进行， 也能在真空中进行； 或将步骤 （2 ) 和 （3 ) 合并为一个分步加热步骤进行。
22、 权利要求 20中所述的光学波长转换组件的制备方法， 其特征在于， 其中步骤 (3)中烘烤过程能 在空气中进行或在真空中进行， 烘烤方式是利用红外线直接烘烤或利用电热丝加热烘烤。
23、 根据权利要求 20所述的白光发生装置， 其特征在于， 其中在荧光体粉末与树脂粉末的混合粉末 中还加有紫外线吸收剂或抗氧化剂， 树脂粉末与紫外线吸收剂、 或树脂粉末与抗氧剂的质量比为 100 : 0. 01〜跳 0. 7。
24、 根据权利要求 20— 23之一所述的白光发光装置， 其特征在于， 其中在荧光体粉末与树脂粉末的 混合粉末中还加有 Si02、 Zr02、 或 A1203陶瓷颗粒， 其中荧光体粉末与陶瓷颗粒的体积比为 100: 1〜100：
PCT/CN2013/074279 2012-08-17 2013-04-16 白光led发光装置 WO2014026486A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/376,413 US9490402B2 (en) 2012-08-17 2013-04-16 LED light-emitting device for white light

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
CN201210296271.7A CN102810537B (zh) 2012-08-17 2012-08-17 白光led发光装置
CN201210296271.7 2012-08-17
CN201210512951.8 2012-12-05
CN2012105129518A CN102945918A (zh) 2012-12-05 2012-12-05 一种暖白光led发光装置
CN201310005784.2A CN103094461B (zh) 2013-01-08 2013-01-08 光学波长转换组件、其制备方法及白光发光装置
CN201310006398.5 2013-01-08
CN201310006398.5A CN103078048B (zh) 2013-01-08 2013-01-08 白光发光装置
CN201310005784.2 2013-01-08

Publications (1)

Publication Number Publication Date
WO2014026486A1 true WO2014026486A1 (zh) 2014-02-20

Family

ID=50101235

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2013/074279 WO2014026486A1 (zh) 2012-08-17 2013-04-16 白光led发光装置

Country Status (2)

Country Link
US (1) US9490402B2 (zh)
WO (1) WO2014026486A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202015105686U1 (de) * 2015-10-26 2017-01-27 Tridonic Gmbh & Co Kg Weißes Licht abstrahlendes LED-Modul
CN105470246B (zh) * 2015-12-21 2016-09-28 福建中科芯源光电科技有限公司 固态荧光体集成光源的双通道导热封装结构及封装方法
WO2018015243A1 (en) 2016-07-18 2018-01-25 Telefonaktiebolaget Lm Ericsson (Publ) Operation related to user equipment using secret identifier
CN106992237A (zh) * 2017-02-28 2017-07-28 江西省木林森照明有限公司 一种新型led支架及led灯珠
CN111721745B (zh) * 2020-06-29 2023-01-20 上海应用技术大学 一种荧光粉老化的检测装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011044274A1 (en) * 2009-10-09 2011-04-14 Intematix Corporation Solid-state lamps with passive cooling
CN102130282A (zh) * 2011-02-12 2011-07-20 西安神光安瑞光电科技有限公司 白光led封装结构及封装方法
CN102142501A (zh) * 2010-01-28 2011-08-03 海洋王照明科技股份有限公司 一种led封装结构
WO2011109097A1 (en) * 2010-03-03 2011-09-09 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
WO2011109094A1 (en) * 2010-03-03 2011-09-09 Cree, Inc. Led lamp incorporating remote phosphor and diffuser with heat dissipation features
CN102646674A (zh) * 2012-04-26 2012-08-22 南通脉锐光电科技有限公司 白光led发光装置
CN102810537A (zh) * 2012-08-17 2012-12-05 南通脉锐光电科技有限公司 白光led发光装置
CN102945918A (zh) * 2012-12-05 2013-02-27 南通脉锐光电科技有限公司 一种暖白光led发光装置
CN102945914A (zh) * 2012-08-17 2013-02-27 南通脉锐光电科技有限公司 一种用于光学波长转换的荧光玻璃涂层及白光发光装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100344002C (zh) * 2001-08-20 2007-10-17 昭和电工株式会社 多色发光灯和光源
DE10146719A1 (de) * 2001-09-20 2003-04-17 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
US7902560B2 (en) * 2006-12-15 2011-03-08 Koninklijke Philips Electronics N.V. Tunable white point light source using a wavelength converting element
JP5006102B2 (ja) * 2007-05-18 2012-08-22 株式会社東芝 発光装置およびその製造方法
TW200951359A (en) * 2008-06-06 2009-12-16 Taiwan Solutions Systems Corp LED lamp module and its fabricating method
US8188486B2 (en) * 2008-09-16 2012-05-29 Osram Sylvania Inc. Optical disk for lighting module
JP5791034B2 (ja) * 2010-02-26 2015-10-07 国立研究開発法人物質・材料研究機構 発光装置
KR101743918B1 (ko) * 2010-11-22 2017-06-07 삼성전자주식회사 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011044274A1 (en) * 2009-10-09 2011-04-14 Intematix Corporation Solid-state lamps with passive cooling
CN102142501A (zh) * 2010-01-28 2011-08-03 海洋王照明科技股份有限公司 一种led封装结构
WO2011109097A1 (en) * 2010-03-03 2011-09-09 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
WO2011109094A1 (en) * 2010-03-03 2011-09-09 Cree, Inc. Led lamp incorporating remote phosphor and diffuser with heat dissipation features
CN102130282A (zh) * 2011-02-12 2011-07-20 西安神光安瑞光电科技有限公司 白光led封装结构及封装方法
CN102646674A (zh) * 2012-04-26 2012-08-22 南通脉锐光电科技有限公司 白光led发光装置
CN102810537A (zh) * 2012-08-17 2012-12-05 南通脉锐光电科技有限公司 白光led发光装置
CN102945914A (zh) * 2012-08-17 2013-02-27 南通脉锐光电科技有限公司 一种用于光学波长转换的荧光玻璃涂层及白光发光装置
CN102945918A (zh) * 2012-12-05 2013-02-27 南通脉锐光电科技有限公司 一种暖白光led发光装置

Also Published As

Publication number Publication date
US20150021635A1 (en) 2015-01-22
US9490402B2 (en) 2016-11-08

Similar Documents

Publication Publication Date Title
CN106206904B (zh) 一种波长转换装置、荧光色轮及发光装置
US9500325B2 (en) LED lamp incorporating remote phosphor with heat dissipation features
TWI739009B (zh) 波長轉換元件、投影裝置及波長轉換元件的製作方法
TWI823976B (zh) 波長轉換元件、製造其之方法、光轉換裝置、及產生白光的方法
WO2016173525A1 (zh) 一种波长转换装置、发光装置及投影装置
CN101123286A (zh) 发光二极管封装结构和方法
WO2014026486A1 (zh) 白光led发光装置
WO2017077739A1 (ja) 発光体、発光装置、照明装置、および発光体の製造方法
JP2012089316A (ja) 光源装置および照明装置
US11578264B2 (en) Phosphor wheel with inorganic binder
JP2016092271A (ja) 蛍光体シートおよび照明装置
WO2009140829A1 (zh) 一种低衰减高光效led照明装置及制备方法
CN107910426B (zh) 一种磁性荧光粉复合材料及其平面涂覆方法
CN102800795A (zh) 基于荧光树脂的白光led发光装置
EP2848861A1 (en) Illumination device
JP6997869B2 (ja) 波長変換素子および光源装置
US10418537B1 (en) High-power remote phosphor white LED heat-dissipation package
JP2022069537A (ja) 改良された無機結合剤を伴う光変換デバイス
TWI611145B (zh) 調整構件及發光裝置
WO2013159664A1 (zh) 一种白光led发光装置及制备方法
CN110556464A (zh) 发光二极管封装结构及封装方法
CN108011011B (zh) 一种led的封装结构
CN203118943U (zh) 一种cob灯源板结构
WO2019136831A1 (zh) 波长转换装置及其光源
WO2016074404A1 (zh) 一种远程荧光粉透镜和制造方法及其应用

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13829235

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 14376413

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13829235

Country of ref document: EP

Kind code of ref document: A1