CN103762296B - 一种发光二极管封装结构 - Google Patents
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Abstract
本发明是一种发光二极管封装结构。包括LED支架杯碗,置于LED支架杯碗上的LED芯片,对LED支架杯碗及置于LED支架杯碗上的LED芯片进行灌封保护,在LED芯片的外侧与透明灌封材料的外侧之间装设有在常温下为固体、在LED芯片稳定工作时为透明液体的相变材料。本发明采用相变材料直接作为灌封材料的一部分,覆盖在LED芯片的上方,LED芯片工作时产生的热量将被相变材料吸收。相变材料相变过程中会大量的吸收热量,以及相变材料的热导系数和热容相对于传统的硅胶和环氧树脂要高,使得LED的结温要比使用传统的灌封材料要低。同时,由于液相的相变材料在可见光波段几乎透明,且折射率较传统的灌封材料要高,在降低LED芯片的结温同时,有效提高LED的出光。
Description
技术领域
本发明是一种发光二极管封装结构,属于发光二极管封装结构的改造技术。
背景技术
发光二极管Light Emitting Diode(简称LED)是一种固体发光器件。白光LED由于其光效高、无辐射、寿命长、低功耗和环保等优点,被誉为替代荧光灯和白炽灯的第四代照明光源。功率型的发光二极管在照明、显示、汽车前置灯、装饰等领域得到越来越广泛的应用。功率型LED的工作功率通常在1~5瓦,如此大的功率密度将在芯片内部产生大量的热量。如果芯片和相应封装结构的散热没有处理好,会导致LED输出光强的衰减和长期可靠性的劣化。因此,功率型LED的散热管理非常的重要,也越来越受到科技人员的关注。各种LED的散热技术,包括翅片热沉、强制对流和远场荧光粉等都被广泛研究以加强LED结构的散热。但同时也注意到,研究人员通常会关注如何提高芯片在支架和基板方向的散热通道的热耗热能力,而往灌封材料方向上的散热通道往往由于硅胶或环氧树脂材料的低导热率而被忽略。
相变材料Phase change material (简称PCM) 是一种具有高热融,可以存储和释放大量热量的材料,广泛的用于能源存储、数据存储、冷确等领域。研究人员也尝试在LED系统里使用相变材料进行控温。如美国专利US8427036B2将光源系统浸没在相变材料中,利变相变材料在相变过程中的温度稳定性来控温;在工程领域也经常制作一些利用水的相变降温的回流热管作为LED的热沉。LED领域现有的技术都是在LED器件或系统的外部利用相变材料进行控温。其优点就是设计灵活,相变材料的用量较大,能达到较为理想的控温效果。但同时,也会使得整个系统体积庞大,不便于灯具的设计,另外,额外的控温成本也会提高。
发明内容
本发明的目的在于考虑上述问题而提供一种可提高LED封装结构散热能力并提高输出光强的发光二极管封装结构。本发明不仅节省空间、成本低、使用安全、操作方便,使用寿命长。
本发明的技术方案是:本发明的发光二极管封装结构,包括LED支架杯碗,置于LED支架杯碗上的LED芯片,对LED支架杯碗及置于LED支架杯碗上的LED芯片进行灌封保护,LED芯片连接有LED金属引线,LED支架杯碗连接有支架引脚,其中在LED芯片的外侧与透明灌封材料的外侧之间装设有在常温下为固体、在LED芯片稳定工作时为透明液体的相变材料。
上述相变材料灌注在LED芯片的外侧,相变材料将LED芯片密封包裹,透明灌封材料将相变材料及LED芯片密封包裹。
上述相变材料灌注在透明灌封材料的任何位置。
本发明发光二极管封装结构由于采用相变材料直接作为灌封材料的一部分,覆盖在LED芯片的上方的结构,LED芯片工作时产生的热量将被相变材料吸收。相变材料相变过程中会大量的吸收热量,以及相变材料的热导系数和热容相对于传统的硅胶和环氧树脂要高,使得LED的结温要比使用传统的灌封材料要低。同时,由于液相的相变材料在可见光波段几乎透明,且折射率较传统的灌封材料要高,在降低LED芯片的结温同时,能有效的提高LED的出光。本发明是一种设计巧妙,性能优良,方便实用的发光二极管封装结构。
附图说明
图1为本发明实施例1的LED封装结构剖面图;
图2为本发明实施例2的LED封装结构剖面图。
具体实施方式
实施例:
本发明的结构示意图如图1所示,本发明的发光二极管封装结构,包括LED支架杯碗4,置于LED支架杯碗4上的LED芯片1,对LED支架杯碗4及置于LED支架杯碗4上的LED芯片1进行灌封保护,LED芯片1连接有LED金属引线7,LED支架杯碗4连接有支架引脚5,其中在LED芯片1的外侧与透明灌封材料3的外侧之间装设有相变材料2,相变材料2在常温下为固体,在LED芯片1稳定工作时为透明液体。
本实施例中,上述相变材料2灌注在LED芯片1的外侧,相变材料2将LED芯片1密封包裹,透明灌封材料3将相变材料2及LED芯片1密封包裹。上述LED支架杯碗4支承在支架塑料外壳6上。
在保证被透明灌封材料3密封包裹的前提下,上述相变材料2的形状是半球状,或椭球状,或圆柱状,或其它能改善LED出光质量的规则和不规则的形状。
本实施例中,上述相变材料2是熔点大于20℃但小于100℃、液相为透明的材料。上述相变材料2可以是石蜡,或是硬脂酸,或是月桂酸。
上述相变材料2以集中的形式位于LED芯片1和透明灌封材料3之间,或是相变材料2和其它封装材料,如部分灌封材料或荧光粉或其它相变材料混合后,再灌封于LED芯片1和透明灌封材料3之间。
此外,上述LED芯片1中装设有一颗LED,或多颗LED,或者是多个芯片的集成。
另外,上述LED芯片1是单色LED,或是白光LED;上述LED封装结构适用于垂直结构和平面结构的LED,适用于绝缘衬底和导电衬底的LED。
本实施例中,为降低LED芯片1的结温,相变材料的相变潜热、热导系数和热容应尽量高,同时其重量应该在保证透明灌封材料能密封包裹的前提下,适当增大。
此外,为提高LED封装结构的出光,液态的透明相变材料的折射率应当尽量大。
所述相变材料的位置可以是直接覆盖在LED裸芯片上面,也可以在保证透明灌封材料能密封包裹的前提下,处于透明灌封材料与LED芯片之间的任何位置。
本实施例中,上述相变材料2是石蜡,具体封装方法如下:如图1所示的LED封装结构,以固晶的方式将LED芯片1固定支架杯碗4中,通过金丝球焊或压焊的方法,在LED芯片上引出金属引线7。石蜡被加热至液体状,将已设计好孔径形状和大小的掩模板放到芯片上方。液态石蜡缓慢倒入掩模板上,以固定的形状滴落到LED芯片1的上面。待冷却后,石蜡变成固体状,如图1所示的相变材料2。LED芯片1可以通入一定的高电流若干秒,使得LED芯片1界面上的石蜡稍微熔化,冷却后LED芯片1与石蜡形成良好的接触。按LED封装的流程,在芯片支架上盖入透镜模条,将液态的透明灌封材料3灌入模条中。透明灌封材料3的固化应与传统的固化方法有所区别。第一阶段的固化温度应该要低于相变材料的熔点(在此例中为石蜡)以避免液态的相变材料与液体的灌封材料混合在一起。此例中,石蜡的熔点约为50℃,采用第一阶段的固化温度为50℃,固化时间为20个小时。此过程中,透明灌封材料3由液体缓慢变成固体。然后,第二阶段的固化温度约为100℃(此温度应根据不同的灌封材料作相对应的调整),固化时间为1小时。将透镜模条脱模后,样品继续在150℃下固化2个小时。最后,获得如图1所示的LED封装结构。
实施例2:
本发明实施例2与实施例1相似,本发明实施例2与实施例1不同的地方在于:所述的以石蜡为例子的相变材料2可以在保证透明灌封材料3能密封包裹的前提下,不直接覆盖在LED芯片1的表面,而是相变材料2灌注在透明灌封材料3与LED芯片1之间的任意位置。
当然,以上所述仅是本发明的较佳实施方式,故凡依本发明专利申请范围所述的构造,特征及原理所做的等效变化或修饰,均包括于本发明专利申请范围内。
Claims (7)
1.一种发光二极管封装结构,包括LED支架杯碗(4),置于LED支架杯碗(4)上的LED芯片(1),对LED支架杯碗(4)及置于LED支架杯碗(4)上的LED芯片(1)进行灌封保护,LED芯片(1)连接有LED金属引线(7),LED支架杯碗(4)连接有支架引脚(5),其特征在于在LED芯片(1)的外侧与透明灌封材料(3)的外侧之间装设有在常温下为固体、在LED芯片(1)稳定工作时为透明液体的相变材料(2);上述相变材料(2)灌注在LED芯片(1)的外侧,相变材料(2)将LED芯片(1)密封包裹,透明灌封材料(3)将相变材料(2)及LED芯片(1)密封包裹。
2.根据权利要求1所述的发光二极管封装结构,其特征在于在保证被透明灌封材料(3)密封包裹的前提下,上述相变材料(2)的形状是半球状,或椭球状,或圆柱状。
3.根据权利要求2所述的发光二极管封装结构,其特征在于上述相变材料(2)是熔点大于20℃但小于100℃、液相为透明的材料。
4.根据权利要求2所述的发光二极管封装结构,其特征在于上述相变材料(2)以集中的形式位于芯片和透明灌封材料之间,或是相变材料(2)与其它的封装材料或荧光粉混合后,再灌封于LED芯片(1)和透明灌封材料(3)之间。
5.根据权利要求2所述的发光二极管封装结构,其特征在于上述LED芯片(1)中装设有一颗LED,或多颗LED,或者是多个芯片的集成。
6.根据权利要求2所述的发光二极管封装结构,其特征在于上述LED芯片(1)是单色LED,或是白光LED;上述LED封装结构适用于垂直结构和平面结构的LED,适用于绝缘衬底和导电衬底的LED。
7.一种发光二极管封装结构的封装方法如下:其特征在于包括有如下步骤:
1)以固晶的方式将LED芯片固定支架杯碗中,通过金丝球焊或压焊的方法,在LED芯片上引出金属引线;
2)石蜡被加热至液体状,将已设计好孔径形状和大小的掩模板放到芯片上方;
3)液态石蜡缓慢倒入掩模板上,以固定的形状滴落到LED芯片的上面;
4)待冷却后,石蜡变成固体状,LED芯片通入高电流,使得LED芯片界面上的石蜡稍微熔化,冷却后LED芯片与石蜡形成接触;
5)按LED封装的流程,在芯片支架上盖入透镜模条,将液态的透明灌封材料灌入模条中,透明灌封材料由液体缓慢变成固体;
6)透明灌封材料固化后将透镜模条脱模后,样品继续在150℃下固化,最后,获得LED封装结构。
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