CN106085323A - 一种应用于led植物生长灯芯片封装的弹性耐久改性环氧树脂胶 - Google Patents
一种应用于led植物生长灯芯片封装的弹性耐久改性环氧树脂胶 Download PDFInfo
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 5
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- 239000000463 material Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 5
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- 238000004806 packaging method and process Methods 0.000 abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002313 adhesive film Substances 0.000 abstract description 2
- 230000032683 aging Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 150000002500 ions Chemical class 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 241000196324 Embryophyta Species 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- XPMIYFHIYRSSMO-UHFFFAOYSA-N 1-[2-(2-fluorophenyl)cyclopropyl]propan-1-one Chemical compound CCC(=O)C1CC1C1=CC=CC=C1F XPMIYFHIYRSSMO-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明公开了一种应用于LED植物生长灯芯片封装的弹性耐久改性环氧树脂胶，这种改性环氧胶中加入了经离子液体溶解的细菌纤维素，达到增强增韧的效果，提高了胶层的力学性能，并加入纳米二氧化钛、异丙醇铝等原料，使得封装胶膜具有良好的导热性和耐光老化性，同时还有效的改善了LED芯片的出光效率，膜层透明度高，提高了灯具的有效照射率，以此树脂胶封装的LED灯高效节能、经久耐用，且使用简单，使用时直接将其涂覆在芯片或者荧光粉层上室温固化即可。
Description
技术领域
本发明涉及LED封装胶技术领域，尤其涉及一种应用于LED植物生长灯芯片封装的弹性耐久改性环氧树脂胶。
背景技术
植物生长过程中光照是一个至关重要的因素，在种植过程中，因为自然条件的变化，尤其是在晚秋和冬季，植物的光照明显不足，此时室内补充照明就显得尤为重要了。LED光源是近年来崛起的在农业领域较为理想的人工光源，较之传统光源，LED光源节能环保，光谱纯净，贴合植物生长的波长范围，拥有巨大的市场需求量。
LED植物生长灯多是由若干均匀分布的单灯组合而成，其中单灯是由若干个发光芯片封装而成，生产过程一般为固晶、焊线、灌封、切割、测试、包装这几个流程，其中灌封胶的性能将直接影响到芯片的出光效率和使用寿命，目前LED植物灯在应用过程中存在的问题主要是发光效率低，光分散度高，而大功率的芯片封装又存在散热性差、使用寿命短等问题。
发明内容
本发明目的就是为了弥补已有技术的缺陷，提供一种应用于LED植物生长灯芯片封装的弹性耐久改性环氧树脂胶。
本发明是通过以下技术方案实现的：
一种应用于LED植物生长灯芯片封装的弹性耐久改性环氧树脂胶，所述的弹性耐久改性环氧树脂胶由以下重量份的原料制得：双酚A环氧树脂60-80、细菌纤维素4-5、2-溴-2-(2-氟苯基)-1-环丙基乙酮0.4-0.5、纳米二氧化钛4-5、间苯二胺15-20、硅烷偶联剂0.2-0.5、1-环氧丙基-3-甲基咪唑六氟磷酸盐10-15、异丙醇铝0.4-0.5、丁基缩水甘油醚5-8。
所述的弹性耐久改性环氧树脂胶由以下步骤制得：
（1）将纳米二氧化钛与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶备用；
（3）将细菌纤维素投入1-环氧丙基-3-甲基咪唑六氟磷酸盐中，搅拌至其完全溶解，随后将其与双酚A环氧树脂混合均匀，依次加入步骤（1）、步骤（2）制备的物料以及其它剩余物料，搅拌混合均匀后经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全固化后即完成封装。
本发明利用改性的环氧树脂胶对LED芯片进行封装处理，这种改性环氧胶中加入了经离子液体溶解的细菌纤维素，达到增强增韧的效果，提高了胶层的力学性能，并加入纳米二氧化钛、异丙醇铝等原料，使得封装胶膜具有良好的导热性和耐光老化性，同时还有效的改善了LED芯片的出光效率，膜层透明度高，提高了灯具的有效照射率，以此树脂胶封装的LED灯高效节能、经久耐用，且使用简单，使用时直接将其涂覆在芯片或者荧光粉层上室温固化即可。
具体实施方式
一种应用于LED植物生长灯芯片封装的弹性耐久改性环氧树脂胶，该环氧树脂胶由以下重量份的原料制得：双酚A环氧树脂60、细菌纤维素4、2-溴-2-(2-氟苯基)-1-环丙基乙酮0.4、纳米二氧化钛4、间苯二胺15、硅烷偶联剂0.2、1-环氧丙基-3-甲基咪唑六氟磷酸盐10、异丙醇铝0.4、丁基缩水甘油醚5。
这种改性环氧树脂胶由以下步骤制得：
（1）将纳米二氧化钛与硅烷偶联剂混合研磨分散20min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3h，制成透明溶胶备用；
（3）将细菌纤维素投入1-环氧丙基-3-甲基咪唑六氟磷酸盐中，搅拌至其完全溶解，随后将其与双酚A环氧树脂混合均匀，依次加入步骤（1）、步骤（2）制备的物料以及其它剩余物料，搅拌混合均匀后经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全固化后即完成封装。
产品性能测试结果如下：
拉伸强度：62.8MPa；吸水率%（25℃）：0.75；折射率：1.548；透光率：85.8%。
Claims (2)
1.一种应用于LED植物生长灯芯片封装的弹性耐久改性环氧树脂胶，其特征在于，所述的弹性耐久改性环氧树脂胶由以下重量份的原料制得：双酚A环氧树脂60-80、细菌纤维素4-5、2-溴-2-(2-氟苯基)-1-环丙基乙酮0.4-0.5、纳米二氧化钛4-5、间苯二胺15-20、硅烷偶联剂0.2-0.5、1-环氧丙基-3-甲基咪唑六氟磷酸盐10-15、异丙醇铝0.4-0.5、丁基缩水甘油醚5-8。
2.如权利要求1所述的一种应用于LED植物生长灯芯片封装的弹性耐久改性环氧树脂胶，其特征在于，所述的弹性耐久改性环氧树脂胶由以下步骤制得：
（1）将纳米二氧化钛与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶备用；
（3）将细菌纤维素投入1-环氧丙基-3-甲基咪唑六氟磷酸盐中，搅拌至其完全溶解，随后将其与双酚A环氧树脂混合均匀，依次加入步骤（1）、步骤（2）制备的物料以及其它剩余物料，搅拌混合均匀后经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全固化后即完成封装。
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102746814A (zh) * | 2012-07-11 | 2012-10-24 | 上海中新裕祥化工有限公司 | 新型改性纳米二氧化钛掺杂脂环族环氧树脂led封装胶 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102746814A (zh) * | 2012-07-11 | 2012-10-24 | 上海中新裕祥化工有限公司 | 新型改性纳米二氧化钛掺杂脂环族环氧树脂led封装胶 |
Non-Patent Citations (1)
| Title |
|---|
| 王彪等: "细菌纤维素增强环氧树脂透明复合材料的制备与性能", 《天津科技大学学报》 * |
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