CN106024687A - Chip tray pushing device - Google Patents

Chip tray pushing device Download PDF

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Publication number
CN106024687A
CN106024687A CN201610629437.0A CN201610629437A CN106024687A CN 106024687 A CN106024687 A CN 106024687A CN 201610629437 A CN201610629437 A CN 201610629437A CN 106024687 A CN106024687 A CN 106024687A
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CN
China
Prior art keywords
wafer disk
hand basket
fixed
propelling movement
work platforms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610629437.0A
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Chinese (zh)
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CN106024687B (en
Inventor
华开朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanhu District Of Jiaxing Yi Xuan Plastic Hardware Factory (general Partner)
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Individual
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Priority to CN201610629437.0A priority Critical patent/CN106024687B/en
Publication of CN106024687A publication Critical patent/CN106024687A/en
Application granted granted Critical
Publication of CN106024687B publication Critical patent/CN106024687B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

The invention discloses a chip tray pushing device. The chip tray pushing device comprises a working platform and a pushing mechanism fixed on the working platform; the pushing mechanism comprises at least one basket, jacking cylinders, pushing cylinders, a positioning assembly and a feeding mechanism, wherein the baskets load multiple chip trays, the jacking cylinders are arranged below the corresponding baskets, the pushing cylinders are arranged in front of the baskets and used for pushing the chip trays in the baskets out, and the positioning assembly and the feeding mechanism are fixed on the working platform; the positioning assembly is arranged behind the baskets and used for positioning the chip trays pushed out of the baskets through the pushing cylinders, and the feeding mechanism is arranged behind the positioning assembly and used for conveying materials to the chip trays on the positioning assembly. The chip tray pushing device can automatically complete pushing and feeding of the chip trays, manual operation is not needed, the labor intensity is reduced, and the work efficiency is improved.

Description

A kind of wafer disk pusher
Technical field
The present invention relates to wafer fab, particularly relate to a kind of wafer disk pusher.
Background technology
Diode wafer is the main raw material(s) of diode, in the production process of diode, diode wafer welding is a necessary operation, but, current diode production producer is when carrying out diode wafer welding, main by manually completing, working strength is big, and product fraction defective is higher, efficiency of assembling is low.
Summary of the invention
The technical problem to be solved is, it is provided that a kind of wafer disk pusher, it is possible to realize automatically pushing and automatic charging of wafer disk, it is not necessary to manually operate, thus reduce the labor intensity of staff, the work efficiency also improved.
In order to solve above-mentioned technical problem, the invention provides a kind of wafer disk pusher, including:
Work platforms, and it is fixed on delivery device, positioning component and feed mechanism on described work platforms, wherein, described delivery device includes at least one hand basket being mounted with multiple wafer disk, it is arranged on the jacking cylinder below described hand basket, and for the propelling movement cylinder that wafer disk is released in described hand basket, described propelling movement cylinder, described hand basket, described positioning component and described feed mechanism are arranged in order along described wafer disk Y direction.
Further, described positioning component includes the positioning installation frame being fixed on described work platforms, and at least one pair of locating piece being fixed in described positioning installation frame, every pair of locating piece is corresponding to a described hand basket, and on described locating piece, described wafer disk Y direction is provided with the guide rail movable for described wafer disk.
Further, described feed mechanism includes the first conveyer belt mechanism being fixed on described work platforms, it is arranged on the magazine on described first conveyer belt mechanism, it is arranged on described first conveyer belt mechanism one end, for accepting the hopper of the material that described first conveyer belt mechanism conveying comes, and one end is arranged on below described hopper, for accepting the second conveyer belt mechanism of material, and it is arranged on described second conveyer belt mechanism side, for the mechanical arm mechanism being adsorbed on the wafer disk on described positioning component by the material on described second conveyor structure.
Further, described positioning component also includes the propelling movement cylinder being arranged between every pair of locating piece, and it being positioned at the second jacking cylinder below described propelling movement cylinder, described propelling movement cylinder is fixed in described positioning installation frame, for described wafer disk is pushed back described hand basket.
Further, described first conveyer belt mechanism includes the conveyer belt being parallel to described wafer disk Y-axis, it is separately positioned on the driven wheel at described conveyer belt two ends, support the support seat of described driven wheel rotating shaft, and drive the driving cylinder of described drivewheel, described driving cylinder is fixed on described support seat, and described support seat is fixed on described work platforms；And/or,
Described second conveyer belt mechanism includes the Timing Belt being parallel to described wafer disk X-axis, it is separately positioned on the driven wheel at described Timing Belt two ends, support the support seat of described driven pulley, drive the driving motor of described drivewheel, and the motor mount plate of fixing described driving motor, described motor mount plate is fixed on described work platforms.
Further, described second conveyer belt mechanism also includes the material baffle being arranged on described Timing Belt both sides, and/or,
Described material baffle is provided with multiple limit material block near one end of described hopper.
Further, described mechanical arm mechanism includes being fixed on work platforms, it is respectively parallel to mechanical arm and the mechanical arm guide rail of described wafer disk Y-axis of described wafer disk X-axis, one end of described mechanical arm is can be arranged on described mechanical arm guide rail in the way of moving forward and backward along described wafer disk Y-axis relative to this mechanical arm guide rail, it is additionally provided with slide block on described mechanical arm, described slide block is can be arranged in the way of moving left and right along wafer disk X-axis relative to described mechanical arm on described mechanical arm, at least two stepper motor it is fixedly installed on described slide block, the suction nozzle being connected with described stepper motor by shaft coupling, the feeding pin being scheduled on described slide block by fixed guide, wherein, described suction nozzle and described feeding pins position are directly over described Timing Belt, described feeding pin, the top of described slide block is additionally provided with amesdial head.
Implement the embodiment of the present invention, have the advantages that
Implement this wafer disk pusher of the present invention, by the cylinder that pushes in delivery device, the multiple wafer disks in hand basket are pushed to positioning component the most automatically, by feed mechanism, the wafer disk on this positioning component is carried out automatic charging again, thus realize the propelling movement of wafer disk and feeding is all automatically performed, need not manual operation, and then reduce labor intensity, improve work efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the axonometric chart of an embodiment of a kind of wafer disk pusher of the present invention；
Fig. 2 is the structural representation of the feed mechanism of wafer disk pusher in response diagram 1；
Fig. 3 is the partial enlarged drawing of basket structure in response diagram 1；
Fig. 4 is the top view of wafer disk pusher in Fig. 1；
Fig. 5 is suction nozzle in response diagram 1, the partial enlarged drawing of structure between feeding pin and slide block.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
See Fig. 1, for the structural representation of an embodiment of a kind of wafer disk pusher of the present invention, specifically, in the present embodiment, this wafer disk pusher specifically includes work platforms 1, and is fixed on delivery device on this work platforms 1, positioning component and feed mechanism, wherein
See Fig. 1 and Fig. 2, this delivery device includes two hand baskets 22 being mounted with multiple wafer disk, and corresponding one of two propelling movement cylinder 24(each hand baskets 22 for being pushed out from hand basket 22 by wafer disk push cylinder 24), with the jacking cylinder 23 being arranged on below this hand basket, this propelling movement cylinder 24, hand basket 22, positioning component and feed mechanism are arranged in order along this wafer disk Y direction；Specifically, see Fig. 3, in the present embodiment, this hand basket 22 is by base plate 222, two side plates 223 and top board 224 enclose the square hoop of both-side opening before and after formation, and on top board 224, it is fixedly installed handle 225, multiple groove matched with wafer disk edge it is provided with, so that under the effect pushing cylinder 24, this wafer disk is pushed out in hand basket 22 along this groove on the inwall of side plate 223；Further, seeing Fig. 3, the position also corresponding to hand basket 22 in the present embodiment on work platforms 1 arranges supporting plate 221, and this supporting plate 221 is under the push rod effect of jacking cylinder 23, and this hand basket 22 can be driven to move up and down relative to this work platforms 1；Further, seeing Fig. 3, in order to prevent hand basket 22 landing from supporting plate 221, the present embodiment also can arrange multiple limited block 226 on this supporting plate 221；In the present embodiment, the number of this hand basket 22 can be adjusted as required, and correspondingly, the number of corresponding jacking cylinder 23 and propelling movement cylinder 24 is also carried out accommodation；
nullSee Fig. 1，This positioning component specifically includes the positioning installation frame 31 being fixed on work platforms 1，And the two pairs of locating pieces 32 being fixed in positioning installation frame 31，And every pair of locating piece 32 is corresponding to a hand basket 22，And on this locating piece 32, described wafer disk Y direction is provided with the guide rail movable for wafer disk，I.e. under the effect pushing cylinder 24，Wafer disk is pushed out the part then slide along this locating piece 32 of hand basket 22 to certain position，When being embodied as，Common Fig. 4，The quantity of locating piece can be adjusted according to the size of the spacing of adjacent hand basket，For example, see Fig. 1，Owing to the spacing of two hand baskets is less，Then corresponding to first pair of locating piece of first hand basket and corresponding in second pair of locating piece of second hand basket，Two adjacent locating pieces can synthesize a locating piece，Then these locating piece both sides are respectively provided with the guide rail corresponding to wafer disk edge；Further, for the ease of the wafer disk after feeding is pushed back in hand basket 22, the present embodiment also can arrange propelling movement cylinder 33 between every pair of locating piece 32, and the second jacking cylinder being positioned under this propelling movement cylinder 33, and this propelling movement cylinder 33 and the second jacking cylinder are each attached in positioning installation frame 31, owing to this propelling movement cylinder 33 just uses after wafer disk feeding, therefore, when not using this propelling movement cylinder 33, the plane of some place of this propelling movement cylinder 33 is less than two guide rail place planes on every pair of locating piece 32, and when it is desired to be used, then by the second jacking cylinder by after this propelling movement cylinder 33 jacking to corresponding height, by the push rod of this propelling movement cylinder 33, the wafer disk after feeding is pushed back in hand basket again；
See Fig. 1 and Fig. 2, this feed mechanism includes the first conveyer belt mechanism 42 being fixed on work platforms 1, it is arranged on the magazine 43 on the first conveyer belt mechanism 42, it is arranged on this first conveyer belt mechanism 42 one end, for accepting the hopper 44 of the material that the conveying of this first conveyer belt mechanism 42 comes, and one end is arranged on below this hopper 44, for accepting the second conveyer belt mechanism 45 of the material that hopper 44 conveying comes, and it is arranged on this second conveyer belt mechanism 45 side, for the mechanical arm mechanism that the material on second conveyor structure 45 is adsorbed on the wafer disk on above-mentioned positioning component；Specifically, see Fig. 4, wherein, this first conveyer belt mechanism 42 includes the conveyer belt 421 being parallel to described wafer disk Y-axis, it is separately positioned on the driven wheel at conveyer belt 421 two ends, supports the support seat of driven wheel rotating shaft, and drive the driving cylinder 424 of drivewheel, this driving cylinder 424 is fixed on support seat, and this support seat is then fixed on work platforms 1；This second conveyer belt mechanism 45 includes the Timing Belt 451 being parallel to described wafer disk X-axis, it is separately positioned on the driven wheel at Timing Belt 451 two ends, support the support seat of driven pulley, drive the driving motor 454 of drivewheel, and the motor mount plate of fixed drive motor 454, and this motor mount plate is fixed on work platforms 1；nullSee Fig. 5，This mechanical arm mechanism includes mechanical arm 47，And the mechanical arm guide rail 46 being arranged on work platforms 1 by fixed mount，This mechanical arm guide rail 46 is paralleled with wafer disk Y-axis，One end of mechanical arm 47 is can be arranged on mechanical arm guide rail 46 in the way of moving relative to this mechanical arm guide rail 46，It is provided with slide block 48 on this mechanical arm 47，This slide block 48 is can be arranged on mechanical arm 47 in the way of moving along wafer disk X-direction，Two stepper motors 49 it are fixedly installed on this slide block 48，This slide block 48 top is provided with amesdial head 412，It is additionally provided with feeding pin 411 on this slide block 48，This feeding pin 411 is fixed on this slide block by guide plate 413，The shaft coupling that these two stepper motors 49 then run through this guide plate 413 by setting is connected to suction nozzle 410，And this suction nozzle 410 and feeding pin 411 are respectively positioned on the surface of Timing Belt 451，When pushing cylinder 24 by when hand basket 22 is pushed out，Owing to pushing the limited length of cylinder 24 push rod，Therefore，Wafer disk can not completely disengage from hand basket or completely into positioning component，Now，Controlling mobile mechanical arm 47 makes feeding pin 411 insert the jack a of wafer disk one end，Then this wafer disk is pulled to move，It is made to completely disengage from hand basket，And enter positioning component，Then mechanical arm 47 returns and is drawn the material on Timing Belt 451 by suction nozzle 410，Along wafer disk Y-axis mobile mechanical arm, the material of absorption is fixed on wafer disk corresponding position again，The most if desired，Also need to control slide block move along wafer disk X-axis，And during being somebody's turn to do，Then measured, by amesdial head, the distance that slide block moves；Further the, in order to avoid material landing in transportation, the present embodiment also can arrange material baffle 456 in Timing Belt 451 both sides of the second conveyer belt mechanism 45, and this material baffle 456 is provided with multiple limit material block 457 near one end of hopper 44.
For the ease of monitoring, the present embodiment also can be arranged on the monitoring camera above mechanical arm by fixed mount.
Above disclosed only present pre-ferred embodiments, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are made, still fall within the scope that invention is contained.

Claims (4)

  1. null1. a wafer disk pusher，It is characterized in that，Including work platforms (1)，And it is fixed on the upper delivery device of described work platforms (1)、Positioning component and feed mechanism，Wherein，Described delivery device includes at least one hand basket (22) being mounted with multiple wafer disk，It is arranged on the jacking cylinder (23) of described hand basket (22) lower section，And for the propelling movement cylinder (24) that wafer disk is released in described hand basket (22)，Described propelling movement cylinder (24)，Described hand basket (22)，Described positioning component and described feed mechanism are arranged in order along described wafer disk Y direction，Described hand basket (22) is by base plate (222)，Two side plates (223) and top board (224) enclose the square hoop of both-side opening before and after formation，And it is fixedly installed handle (225) on described top board (224)，The guide rail that multiple and described wafer disk edge matches it is provided with on the inwall of described side plate (223)，On described work platforms (1), the position corresponding to described hand basket (22) is provided with supporting plate (221)，The limited block (226) for positioning described base plate (222) it is further fixedly arranged on described supporting plate (221)，Described supporting plate (221) can move up and down relative to described work platforms (1) under the push rod effect of described jacking cylinder (23).
  2. 2. wafer disk pusher as claimed in claim 1, it is characterized in that, described positioning component includes the positioning installation frame (31) being fixed on described work platforms (1), and at least one pair of locating piece (32) being fixed in described positioning installation frame (31), every pair of locating piece (32) is corresponding to a described hand basket (22), and on described locating piece (32), described wafer disk Y direction is provided with the guide rail movable for described wafer disk.
  3. 3. wafer disk pusher as claimed in claim 2, it is characterized in that, described positioning component also includes the propelling movement cylinder (33) being arranged between every pair of locating piece (32), and it is positioned at the second jacking cylinder of described propelling movement cylinder (33) lower section, described propelling movement cylinder (33) is fixed in described positioning installation frame (31), for described wafer disk pushes back described hand basket (22).
  4. 4. wafer disk pusher as claimed in claim 1, it is characterised in that also include being arranged on the monitoring camera above mechanical arm by fixed mount.
CN201610629437.0A 2014-10-17 2014-10-17 A kind of wafer disk driving means Expired - Fee Related CN106024687B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610629437.0A CN106024687B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means

Applications Claiming Priority (2)

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CN201410549877.6A CN104332439B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629437.0A CN106024687B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means

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CN106024687A true CN106024687A (en) 2016-10-12
CN106024687B CN106024687B (en) 2019-01-18

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CN201610629437.0A Expired - Fee Related CN106024687B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means
CN201610629423.9A Active CN106206389B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629436.6A Active CN106024686B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629425.8A Active CN106024685B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means
CN201610629412.0A Expired - Fee Related CN106024684B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201410549877.6A Expired - Fee Related CN104332439B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher

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CN201610629423.9A Active CN106206389B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629436.6A Active CN106024686B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629425.8A Active CN106024685B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means
CN201610629412.0A Expired - Fee Related CN106024684B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201410549877.6A Expired - Fee Related CN104332439B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher

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Cited By (2)

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CN109037129A (en) * 2018-07-19 2018-12-18 广州明森科技股份有限公司 A kind of chip rotation handling device
CN111618885A (en) * 2020-07-29 2020-09-04 山东元旭光电股份有限公司 Automatic wafer feeding device

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Publication number Priority date Publication date Assignee Title
CN106024687B (en) * 2014-10-17 2019-01-18 嘉兴市南湖区翊轩塑料五金厂（普通合伙） A kind of wafer disk driving means
CN105173690B (en) * 2015-08-18 2018-02-06 先进光电器材（深圳）有限公司 Automatic feeding and discharging device
CN105197583B (en) * 2015-10-30 2017-06-23 江苏比微曼智能科技有限公司 Trigger under pcb board
CN105314393B (en) * 2015-11-20 2017-07-28 江苏艾科瑞思封装自动化设备有限公司 Do not shut down feeding device
CN106629037A (en) * 2016-11-25 2017-05-10 深圳市诚亿自动化科技有限公司 Non-shutdown various-IC picking device
CN106783677B (en) * 2016-12-08 2023-12-05 江门格兰达物联装备有限公司 Automatic feeding equipment for trough type feed box
CN109560030B (en) * 2017-09-26 2024-02-09 Tcl环鑫半导体(天津)有限公司 Automatic circular silicon wafer rewinding machine
CN109772726B (en) * 2019-01-03 2021-02-02 大族激光科技产业集团股份有限公司 LED processing equipment and LED processing technology applying same
CN111285111B (en) * 2020-03-17 2024-09-03 黄道农 Automatic material picking machine for sliding rail
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CN106024687B (en) 2019-01-18
CN106024684A (en) 2016-10-12

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