CN106206389A - A kind of wafer disk pusher - Google Patents

A kind of wafer disk pusher Download PDF

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Publication number
CN106206389A
CN106206389A CN201610629423.9A CN201610629423A CN106206389A CN 106206389 A CN106206389 A CN 106206389A CN 201610629423 A CN201610629423 A CN 201610629423A CN 106206389 A CN106206389 A CN 106206389A
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CN
China
Prior art keywords
wafer disk
mechanical arm
fixed
hand basket
conveyer belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610629423.9A
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Chinese (zh)
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CN106206389B (en
Inventor
华开朗
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Jiangsu Jingtai Electric Power Technology Co.,Ltd.
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华开朗
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Priority to CN201410549877.6A priority Critical patent/CN104332439B/en
Priority to CN201610629423.9A priority patent/CN106206389B/en
Publication of CN106206389A publication Critical patent/CN106206389A/en
Application granted granted Critical
Publication of CN106206389B publication Critical patent/CN106206389B/en
Active legal-status Critical Current
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of waers
    • H01L21/67781Batch transfer of wafers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Abstract

The invention discloses a kind of wafer disk pusher, it includes work platforms, and it is fixed on delivery device on work platforms, delivery device includes that at least one hand basket being mounted with multiple wafer disk is arranged on the jacking cylinder below described hand basket, it is arranged on described hand basket front, for the propelling movement cylinder that the wafer disk in described hand basket is released, described wafer disk pusher also includes being fixed on the positioning component on described work platforms and feed mechanism, described positioning component is arranged on the rear of described hand basket, for the wafer disk that described propelling movement cylinder is pushed out from described hand basket is positioned, described feed mechanism is arranged on the rear of described positioning component, material is carried for the wafer disk on described positioning component.This wafer disk pusher of the present invention can be automatically performed propelling movement and the feeding of wafer disk, it is not necessary to manual operation, and then reduces labor intensity, improves work efficiency.

Description

A kind of wafer disk pusher
Technical field
The present invention relates to wafer fab, particularly relate to a kind of wafer disk pusher.
Background technology
Diode wafer is the main raw material(s) of diode, and in the production process of diode, diode wafer welding is One necessary operation, but, current diode production producer is when carrying out diode wafer welding, mainly by artificial next Completing, working strength is big, and product fraction defective is higher, efficiency of assembling is low.
Summary of the invention
The technical problem to be solved is, it is provided that a kind of wafer disk pusher, it is possible to realize wafer disk Automatically push and automatic charging, it is not necessary to manually operate, thus reduce the labor intensity of staff, the work also improved Make efficiency.
In order to solve above-mentioned technical problem, the invention provides a kind of wafer disk pusher, including:
Work platforms, and be fixed on delivery device, positioning component and feed mechanism on described work platforms, wherein, described in push away Send mechanism to include being mounted with at least one hand basket of multiple wafer disk, be arranged on the jacking cylinder below described hand basket, Yi Jiyong In the propelling movement cylinder that wafer disk is released in described hand basket, described propelling movement cylinder, described hand basket, described positioning component and described Feed mechanism is arranged in order along described wafer disk Y direction.
Further, described positioning component includes the positioning installation frame being fixed on described work platforms, and is fixed on At least one pair of locating piece in described positioning installation frame, every pair of locating piece corresponds to a described hand basket, and on described locating piece Described wafer disk Y direction is provided with the guide rail movable for described wafer disk.
Further, described feed mechanism includes the first conveyer belt mechanism being fixed on described work platforms, is arranged on Magazine on described first conveyer belt mechanism, is arranged on described first conveyer belt mechanism one end, is used for accepting described first defeated Tape-feed carries the hopper of the material come, and one end is arranged on below described hopper, defeated for accepting the second of material Tape-feed, and it is arranged on described second conveyer belt mechanism side, for being inhaled by the material on described second conveyor structure The mechanical arm mechanism being attached on the wafer disk on described positioning component.
Further, described positioning component also includes the propelling movement cylinder being arranged between every pair of locating piece, and is positioned at The second jacking cylinder below described propelling movement cylinder, described propelling movement cylinder is fixed in described positioning installation frame, for by described Wafer disk pushes back described hand basket.
Further, described first conveyer belt mechanism includes the conveyer belt being parallel to described wafer disk Y-axis, is respectively provided with At the driven wheel at described conveyer belt two ends, support the support seat of described driven wheel rotating shaft, and drive described drivewheel Driving cylinder, described driving cylinder is fixed on described support seat, and described support seat is fixed on described work platforms;With/ Or,
Described second conveyer belt mechanism includes the Timing Belt being parallel to described wafer disk X-axis, is separately positioned on described Timing Belt two The driven wheel of end, supports the support seat of described driven pulley, drives the driving motor of described drivewheel, and fixing described in drive The motor mount plate of dynamic motor, described motor mount plate is fixed on described work platforms.
Further, described second conveyer belt mechanism also includes the material baffle being arranged on described Timing Belt both sides, and/ Or,
Described material baffle is provided with multiple limit material block near one end of described hopper.
Further, described mechanical arm mechanism includes being fixed on work platforms, is respectively parallel to described wafer disk X The mechanical arm of axle and the mechanical arm guide rail of described wafer disk Y-axis, one end of described mechanical arm is with can be relative to this mechanical arm guide rail The mode movable along described wafer disk Y-axis is arranged on described mechanical arm guide rail, and described mechanical arm is additionally provided with slide block, Described slide block is can be arranged in the way of moving left and right along wafer disk X-axis relative to described mechanical arm on described mechanical arm, described Being fixedly installed at least two stepper motor on slide block, the suction nozzle being connected with described stepper motor by shaft coupling, by guiding The feeding pin being fixed on described slide block, wherein, described suction nozzle and described feeding pins position directly over described Timing Belt, described in give Material pin, the top of described slide block is additionally provided with amesdial head.
Implement the embodiment of the present invention, have the advantages that
Implement this wafer disk pusher of the present invention, by the propelling movement cylinder in delivery device by the multiple wafer disks in hand basket The most automatically push to positioning component, then by feed mechanism, the wafer disk on this positioning component carried out automatic charging, thus real Propelling movement and the feeding of existing wafer disk are all automatically performed, it is not necessary to manual operation, and then reduce labor intensity, improve work Efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the axonometric chart of an embodiment of a kind of wafer disk pusher of the present invention;
Fig. 2 is the structural representation of the feed mechanism of wafer disk pusher in response diagram 1;
Fig. 3 is the partial enlarged drawing of basket structure in response diagram 1;
Fig. 4 is the top view of wafer disk pusher in Fig. 1;
Fig. 5 is suction nozzle in response diagram 1, the partial enlarged drawing of structure between feeding pin and slide block.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise Embodiment, broadly falls into the scope of protection of the invention.
See Fig. 1, for the structural representation of an embodiment of a kind of wafer disk pusher of the present invention, specifically, this In embodiment, this wafer disk pusher specifically includes work platforms 1, and is fixed on delivery device on this work platforms 1, fixed Hyte part and feed mechanism, wherein,
Seeing Fig. 1 and Fig. 2, this delivery device includes two hand baskets 22 being mounted with multiple wafer disk, and for by wafer disk Corresponding one of two the propelling movement cylinder 24(each hand baskets 22 being pushed out from hand basket 22 push cylinder 24), and it is arranged on this hand basket The jacking cylinder 23 of lower section, this propelling movement cylinder 24, hand basket 22, positioning component and feed mechanism are along this wafer disk Y direction successively Arrangement;Specifically, seeing Fig. 3, in the present embodiment, this hand basket 22 is by base plate 222, and two side plates 223 and top board 224 enclose shape The square hoop of both-side opening before and after one-tenth, and on top board 224, it is fixedly installed handle 225, the inwall of side plate 223 is provided with Multiple grooves matched with wafer disk edge, so that under the effect pushing cylinder 24, this wafer disk pushes away along this groove Send in hand basket 22;Further, seeing Fig. 3, the position also corresponding to hand basket 22 in the present embodiment on work platforms 1 is arranged Supporting plate 221, and this supporting plate 221 is under the push rod effect of jacking cylinder 23, and this hand basket 22 can be driven relative on this work platforms 1 Lower movement;Further, seeing Fig. 3, in order to prevent hand basket 22 landing from supporting plate 221, the present embodiment also can be at this supporting plate Multiple limited block 226 is set on 221;In the present embodiment, the number of this hand basket 22 can be adjusted as required, correspondingly, right The jacking cylinder 23 answered and the number pushing cylinder 24 are also carried out accommodation;
Seeing Fig. 1, this positioning component specifically includes the positioning installation frame 31 being fixed on work platforms 1, and is fixed on location Two pairs of locating pieces 32 on installing rack 31, and the every pair of locating piece 32 corresponding on a hand basket 22, and this locating piece 32 along described Wafer disk Y direction is provided with the guide rail movable for wafer disk, and i.e. under the effect pushing cylinder 24, wafer disk is pushed out Then the slide along this locating piece 32 is to certain position for the part of hand basket 22, when being embodied as, and common Fig. 4, can be according to phase The size of the spacing of adjacent hand basket adjusts the quantity of locating piece, for example, see Fig. 1, owing to the spacing of two hand baskets is less, then Corresponding to first pair of locating piece of first hand basket with corresponding in second pair of locating piece of second hand basket, adjacent two are fixed Position block can synthesize a locating piece, then these locating piece both sides are respectively provided with the guide rail corresponding to wafer disk edge;Further, For the ease of pushing back in hand basket 22 by the wafer disk after feeding, the present embodiment also can arrange propelling movement between every pair of locating piece 32 Cylinder 33, and the second jacking cylinder being positioned under this propelling movement cylinder 33, and this propelling movement cylinder 33 and the second jacking cylinder the most solid It is scheduled in positioning installation frame 31, owing to this propelling movement cylinder 33 just uses after wafer disk feeding, therefore, does not use this propelling movement During cylinder 33, the plane of some place of this propelling movement cylinder 33 is less than two guide rail place planes on every pair of locating piece 32, and works as When needing to use, then by the second jacking cylinder by after this propelling movement cylinder 33 jacking to corresponding height, then by this propelling movement cylinder 33 Wafer disk after feeding is pushed back in hand basket by push rod;
Seeing Fig. 1 and Fig. 2, this feed mechanism includes the first conveyer belt mechanism 42 being fixed on work platforms 1, is arranged on first Magazine 43 on conveyer belt mechanism 42, is arranged on this first conveyer belt mechanism 42 one end, is used for accepting this first conveying belt machine Structure 42 carries the hopper 44 of the material come, and one end is arranged on below this hopper 44, for accepting what hopper 44 conveying came Second conveyer belt mechanism 45 of material, and it is arranged on this second conveyer belt mechanism 45 side, for by second conveyor structure Material on 45 is adsorbed to the mechanical arm mechanism on the wafer disk on above-mentioned positioning component;Specifically, seeing Fig. 4, wherein, this is years old One conveyer belt mechanism 42 includes the conveyer belt 421 being parallel to described wafer disk Y-axis, be separately positioned on conveyer belt 421 two ends master, Driven pulley, supports the support seat of driven wheel rotating shaft, and the driving cylinder 424 of driving drivewheel, and this driving cylinder 424 is solid Being scheduled on support seat, this support seat is then fixed on work platforms 1;This second conveyer belt mechanism 45 includes being parallel to described wafer The Timing Belt 451 of dish X-axis, is separately positioned on the driven wheel at Timing Belt 451 two ends, supports the support seat of driven pulley, drives main The driving motor 454 of driving wheel, and the motor mount plate of fixed drive motor 454, and this motor mount plate is fixed on work and puts down On platform 1;Seeing Fig. 5, this mechanical arm mechanism includes mechanical arm 47, and is arranged on the machinery on work platforms 1 by fixed mount Arm guide rail 46, this mechanical arm guide rail 46 parallels with wafer disk Y-axis, and one end of mechanical arm 47 is with can be relative to this mechanical arm guide rail 46 modes moved are arranged on mechanical arm guide rail 46, and this mechanical arm 47 is provided with slide block 48, and this slide block 48 is with can be along wafer The mode that dish X-direction moves is arranged on mechanical arm 47, and this slide block 48 is fixedly installed two stepper motors 49, this slide block 48 tops are provided with amesdial head 412, and this slide block 48 is additionally provided with feeding pin 411, and this feeding pin 411 is by guide plate 413 Being fixed on this slide block, the shaft coupling that these two stepper motors 49 then run through this guide plate 413 by setting is connected to Suction nozzle 410, and this suction nozzle 410 and feeding pin 411 be respectively positioned on the surface of Timing Belt 451, when pushing cylinder 24 by hand basket 22 When being pushed out, due to push cylinder 24 push rod limited length, therefore, wafer disk can not completely disengage from hand basket or completely into Positioning component, now, controls mobile mechanical arm 47 and makes feeding pin 411 insert the jack a of wafer disk one end, then pull this crystalline substance Sheet dish moves so that it is completely disengages from hand basket, and enters positioning component, and then mechanical arm 47 returns and drawn synchronization by suction nozzle 410 With the material on 451, then along wafer disk Y-axis mobile mechanical arm, the material of absorption is fixed on wafer disk corresponding position, when The most if desired, in addition it is also necessary to control slide block and move along wafer disk X-axis, and during being somebody's turn to do, then measured slide block by amesdial head and move Distance;Further, in order to avoid material landing in transportation, the present embodiment also can be at the second conveyer belt mechanism 45 Timing Belt 451 both sides material baffle 456 is set, and this material baffle 456 is provided with multiple limit material near one end of hopper 44 Block 457.
For the ease of monitoring, the present embodiment also can be arranged on the monitoring camera above mechanical arm by fixed mount.
The above disclosed present pre-ferred embodiments that is only, can not limit the right model of the present invention with this certainly Enclose, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and want according to right of the present invention Seek made equivalent variations, still fall within the scope that invention is contained.

Claims (1)

1. a wafer disk pusher, it is characterised in that include work platforms (1), and be fixed on described work platforms (1) Upper delivery device, positioning component and feed mechanism, wherein, described delivery device includes being mounted with at least one of multiple wafer disk Hand basket (22), is arranged on the jacking cylinder (23) of described hand basket (22) lower section, and is used for wafer disk from described hand basket (22) The propelling movement cylinder (24) of interior release, described propelling movement cylinder (24), described hand basket (22), described positioning component and described feed mechanism Being arranged in order along described wafer disk Y direction, described positioning component includes the location and installation being fixed on described work platforms (1) Frame (31), and at least one pair of locating piece (32) being fixed in described positioning installation frame (31), every pair of locating piece (32) is corresponding In a described hand basket (22), and it is provided with for before described wafer disk along described wafer disk Y direction on described locating piece (32) The guide rail of rear movement, described feed mechanism includes the first conveyer belt mechanism (42) being fixed on described work platforms (1), arranges Magazine (43) on described first conveyer belt mechanism (42), is arranged on described first conveyer belt mechanism (42) one end, is used for Accept the hopper (44) of the material that the conveying of described first conveyer belt mechanism (42) comes, and one end is arranged under described hopper (44) Side, for accepting second conveyer belt mechanism (45) of material, and it is arranged on described second conveyer belt mechanism (45) side, For the mechanical arm mechanism that the material on described second conveyor structure (45) is adsorbed on the wafer disk on described positioning component, Described positioning component also includes the propelling movement cylinder (33) being arranged between every pair of locating piece (32), and is positioned at described propelling movement cylinder (33) the second jacking cylinder of lower section, described propelling movement cylinder (33) is fixed in described positioning installation frame (31), for by described Wafer disk pushes back described hand basket (22), and described first conveyer belt mechanism (42) includes the conveying being parallel to described wafer disk Y-axis Band (421), is separately positioned on the driven wheel at described conveyer belt (421) two ends, supports the support of described driven wheel rotating shaft Seat, and drive the driving cylinder (424) of described drivewheel, described driving cylinder (424) is fixed on described support seat, described Support seat to be fixed on described work platforms (1);And/or,
Described second conveyer belt mechanism (45) includes the Timing Belt (451) being parallel to described wafer disk X-axis, is separately positioned on described The driven wheel at Timing Belt (451) two ends, supports the support seat of described driven pulley, drives the driving motor of described drivewheel (454), and the motor mount plate of fixing described driving motor (454), described motor mount plate is fixed on described work platforms (1), on, described second conveyer belt mechanism (45) also includes the material baffle (456) being arranged on described Timing Belt (451) both sides, And/or,
Described material baffle (456) is provided with multiple limit material block (457), described mechanical arm machine near one end of described hopper (44) Structure includes being fixed on work platforms 1, is respectively parallel to the mechanical arm (47) of described wafer disk X-axis and described wafer disk Y-axis Mechanical arm guide rail (46), one end of described mechanical arm (47) is with can be relative to this mechanical arm guide rail along before described wafer disk Y-axis The mode of rear movement is arranged on described mechanical arm guide rail (46), and described mechanical arm (47) is additionally provided with slide block (48), described Slide block (48) is can be arranged on described mechanical arm (47) in the way of moving left and right along wafer disk X-axis relative to described mechanical arm (47) On, described slide block (48) is fixedly installed at least two stepper motor (49), by shaft coupling and described stepper motor (49) The suction nozzle (410) being connected, the feeding pin (411) being fixed on described slide block (48) by guide plate (413), wherein, described suction Mouth (410) and described feeding pin (411) are positioned at directly over described Timing Belt (451), described feeding pin (411), described slide block (48) top is additionally provided with amesdial head (412), and described hand basket (22) is by base plate (222), two side plates (223) and top board (224) enclose the square hoop of both-side opening before and after formation, and on described top board (224), be fixedly installed handle (225), institute Stating and be provided with the guide rail that multiple and described wafer disk edge matches on the inwall of side plate (223), described work platforms (1) is upper right The position of hand basket described in Ying Yu (22) is provided with supporting plate (221), described supporting plate (221) is further fixedly arranged on for positioning described The limited block (226) of base plate (222), described supporting plate (221) can be relative to institute under the push rod effect of described jacking cylinder (23) State work platforms (1) to move up and down described wafer disk pusher and also include being arranged on the monitoring above mechanical arm by fixed mount Camera lens.
CN201610629423.9A 2014-10-17 2014-10-17 A kind of wafer disk pusher Active CN106206389B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201410549877.6A CN104332439B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629423.9A CN106206389B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher

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CN201610629423.9A CN106206389B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher

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CN106206389A true CN106206389A (en) 2016-12-07
CN106206389B CN106206389B (en) 2018-10-09

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CN201610629412.0A Expired - Fee Related CN106024684B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629436.6A Active CN106024686B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629437.0A Expired - Fee Related CN106024687B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means
CN201610629423.9A Active CN106206389B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629425.8A Active CN106024685B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means
CN201410549877.6A Expired - Fee Related CN104332439B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher

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CN201610629436.6A Active CN106024686B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629437.0A Expired - Fee Related CN106024687B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means

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CN106024684B (en) * 2014-10-17 2018-06-15 泉州信辉家具有限公司 A kind of wafer disk pusher
CN105173690B (en) * 2015-08-18 2018-02-06 先进光电器材(深圳)有限公司 Automatic feeding and discharging device
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CN106024684B (en) 2018-06-15
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CN104332439A (en) 2015-02-04
CN106024687B (en) 2019-01-18
CN106024684A (en) 2016-10-12
CN106024687A (en) 2016-10-12
CN106024685A (en) 2016-10-12
CN106024686A (en) 2016-10-12
CN106024685B (en) 2019-01-01
CN106024686B (en) 2018-06-08

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