JP2000269245A - Manufacturing apparatus of semiconductor devices - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor device manufacturing apparatus, where arrangements associated with a modification in a lead frame can be easily carried out in a short time. SOLUTION: A device has a structure, where lead frames 44 each mounted with a semiconductor chip 43, are fed to a frame feeder and then transferred from the frame feeder to a package molding part by a frame transfer section to mold a package, where the frame transfer section is equipped at a main body 48 of a loader jig 46, which is provided with a movable chuck 55 that is set continuously variable in pinching width, corresponding to the width of the chip 43 and pinches the long side of the lead frame 44 and a frame chuck mechanism 49 equipped with a chuck drive motor 56, that drives the chuck 55 through the intermediary of a pole screw 57, and furthermore a tablet housing block 50, which houses a package molding tablet, is detachably fixed to the main body 48 of the loader jig 46 by a T-shaped pin 53.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a semiconductor device in which a lead frame on which a semiconductor chip is mounted is transported to a package mold section by a frame transport section.

[0002]

2. Description of the Related Art The prior art will be described with reference to FIGS. FIG. 4 is a perspective view showing a main part of the frame transport unit, and FIG. 5 is a view showing a schematic configuration of the frame transport unit.
5A is a perspective view showing a state before assembling, FIG. 5B is a perspective view showing a state after assembling, and FIG. 6 is a perspective view showing a frame feeder portion.

In FIGS. 4 to 6, reference numeral 1 denotes a frame transport unit, and 2 denotes a frame feeder unit. After a lead frame 4 to which a semiconductor chip 3 is attached is supplied to the frame feeder unit 2 from the outside, Frame transport unit 1
Is supplied to a package mold (not shown) by
At the same time, the package is molded using the tablets fed and supplied.

[0004] The frame transport section 1 includes a loader jig 6 and four fixing pieces 7 on a loader carrier 5 formed in a substantially square frame shape.
It is constituted by screwing. The loader jig 6 includes a plurality of frame chuck mechanisms 9 disposed on the lower surface side of the flat plate-shaped main body 8 so as to hang down in the square frame of the loader carrier 5, and has a space between adjacent frame chuck mechanisms 9. A tablet storage box 10 in which tablets for forming a predetermined number of packages are stored in advance is fixed by screws. The frame chuck mechanism 9 drives the movable chuck 12 with respect to the fixed chuck 11 in the direction of arrow A by means of the chuck driving cylinder 13 so that the chuck pieces 11a, 11a, The long side portion of the lead frame 4 is sandwiched between 12a in the width direction.

Further, a plurality of operation holes 14 are formed in the main body 8 at a portion where the tablet storage box 10 is attached, and the operation holes 14 have an H-shape of a tablet pushing mechanism 15 provided on the upper surface side of the main body 8. An extrusion bar 17 attached to an extrusion frame 16 is inserted. And
By operating the tablet push-out mechanism 15 in the direction of arrow B, the tablet can be smoothly fed out from a push-out hole (not shown) formed on the lower surface of the tablet storage box 10. Reference numeral 18 denotes a positioning pin for positioning the lead frame 4, and reference numeral 19 denotes a receiving portion of the air pipe valve 20 and the sensor connector 21 provided on the loader jig 6 and introduced from outside.

On the other hand, the frame feeder section 2 is configured such that a substantially rectangular parallelepiped fixed frame member 22 and a substantially rectangular parallelepiped movable frame member 23 are provided so as to face each other with the longitudinal direction being horizontal. Further, on the movable frame member 23, an adjustment shaft 24 erected from the opposing surface of the fixed frame member 22 is urged to widen the gap between the fixed frame member 22 and the movable frame member 23. An adjustment spring 25 is provided between the two and extends therethrough.

Further, a plurality of flat disk-shaped idle rollers 26 are arranged in the longitudinal direction on the opposing surfaces of the fixed side frame member 22 and the movable side frame member 23, respectively. The lead frame 4 supplied in a horizontal state in the arrangement direction of the rollers 26 is supported on the rollers 26 of the movable side frame member 23,
2 can be moved in the direction of arrow C to the frame reaching position on one end side.

The fixed side frame member 22 is provided just above the frame reaching position on one end side so that the lead frame 4
The arrival detection sensor 27 that detects the arrival of
The inside of the elongated hole 30 of the support member 29 is moved forward and backward in the moving direction of the lead frame 4 indicated by the arrow D while loosening and tightening the 8, so that the position can be adjusted according to the change of the length of the lead frame 4. Have been. Further, between the opposing surfaces of the fixed frame member 22 and the movable frame member 23, a substantially rectangular lead frame turning member 31 is moved up and down so as to be located immediately below the lead frame 4 moved by the rollers 26. It is provided as possible.

An end piece 32 is attached to the distal end of the adjustment shaft 24 that penetrates the movable frame member 23, and is provided between the end piece 32 and the back surface of the opposing surface of the movable frame member 23. The width adjustment block 33 can be sandwiched by compressing the adjustment spring 25. Then, the width adjusting block 33 having a different width dimension.
The width between the opposing surfaces of the fixed frame member 22 and the movable frame member 23 can be adjusted to the width of the lead frame 4 by appropriately selecting and sandwiching the width matching block 33. ing.

[0010] With this configuration, the lead frame 4 supplied to the frame feeder section 2 is supported by the rollers 26, the leading end is fed to the frame arrival position, and the arrival is detected by the arrival detection sensor 27. Then, the lead frame turning member 31 rises to support the lead frame 4 from the back side. Thereafter, the lead frame 4 is sandwiched by the frame chuck mechanism 9 of the frame transport section 1 and transported to the package mold section, and the package is molded using the tablets stored and supplied in the tablet storage box 10 transported at the same time. .

However, in the above prior art,
When the kind to be manufactured changes and the lead frame 4 and the package change, the loader jig 6 fixed to the loader carrier 5 is removed, and the newly changed lead frame 4 is changed.
It is necessary to fix the frame chuck mechanism 9 that fits the width dimension of the above, and the loader jig 6 that has the tablet storage box 10 that stores the tablet that fits the changed package. Also, in the frame feeder section 2, the width adjustment block 33 is selected and replaced so as to conform to the changed width dimension of the lead frame 4, or the adjustment knob 28 is loosened to change the arrival position changed by the change of the lead frame 4. In addition, it is necessary to visually adjust the position of the arrival detection sensor 27.

[0012] For this reason, it takes a lot of setup time to change the product type, and it is strongly desired to be able to quickly respond to the product type change without any trouble in order to efficiently operate the apparatus.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to reduce the time and effort required for setting up a lead frame by changing it. An object of the present invention is to provide a semiconductor device manufacturing apparatus capable of operating the apparatus efficiently.

[0014]

According to the present invention, there is provided an apparatus for manufacturing a semiconductor device, comprising: a lead frame to which a semiconductor chip is attached; a frame feeder to which the lead frame is supplied; A frame transport unit for transporting the lead frame, the frame transport unit having a continuously variable clamping width corresponding to the width dimension of the lead frame, and a frame chuck mechanism for clamping a long side portion of the lead frame. And a control unit for controlling the holding width of the frame transport unit, and a lead frame to which a semiconductor chip is attached, and The frame feeder to which the lead frame is supplied, and the lead frame packaged from the frame feeder A frame transport section for transporting the frame feed section, and wherein the frame feeder section has a continuously variable clamping width corresponding to the supplied lead frame, and further comprises a frame feeder section. It is characterized by comprising a control unit for controlling the clamping width of, further, the control unit is characterized by performing automatic control according to the type of semiconductor chip, A lead frame to which the semiconductor chip is attached, a frame feeder section to which the lead frame is supplied, and a frame transport section that transports the lead frame from the frame feeder section to the package mold section, wherein the frame transport section includes a package mold. Tablet storage block is detachably provided. And a frame feeder section to which the lead frame is supplied, and a frame transfer section to transfer the lead frame from the frame feeder section to the package mold section, wherein the frame feeder section is provided with the supplied lead. It is provided with an arrival detection sensor for detecting the arrival of the frame, and the arrival detection sensor is attached so as to change its position continuously in the longitudinal direction of the lead frame.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIGS. FIG. 1 is a diagram showing a main part of the frame transport unit, and FIG. 1A is a perspective view of the main part.
FIG. 2B is a perspective view of a T-shaped pin, FIG. 2 is a perspective view showing a schematic configuration of a frame transport section, and FIG. 3 is a perspective view showing a frame feeder section.

1 to 3, reference numeral 40 denotes a control unit for controlling the operation of each unit of the apparatus. Motors and cylinders, which will be described later, also operate according to the contents programmed in the control unit 40 in advance.
For example, adjustment of the dimensions of each part due to the change of manufacturing type, etc.
It is automatically changed just by inputting the product name. Reference numeral 41 denotes a frame transport unit, and reference numeral 42 denotes a frame feeder unit. The lead frame 44 to which the semiconductor chip 43 is attached is pushed to the frame feeder unit 42 from outside, for example, by a frame magazine (not shown). Thereafter, the package is supplied to a package molding unit (not shown) by the frame transport unit 41, and the package is molded using the tablet which is transported and supplied at the same time.

The frame transport section 41 is constructed by screwing four fixing pieces 47 of a loader jig 46 to a loader carrier 45 having a substantially square frame shape formed in the same manner as the above-mentioned conventional one. The loader jig 46 includes a plurality of frame chuck mechanisms 49 disposed on the lower surface side of the flat plate-shaped main body 48 so as to hang down in the square frame of the loader carrier 45, and has a space between adjacent frame chuck mechanisms 49.
A tablet storage box 50 in which tablets for forming a predetermined number of packages are stored in advance is detachably attached.

That is, the mounting of the tablet storage box 50 to the main body 48 is performed by aligning the fixing holes 52 formed at both ends of the upper surface of the tablet storage box 50 with the mounting holes 51 formed in the main body 48, and This is performed by a one-touch operation in which the pins 53 are inserted into the mounting holes 51 from the upper surface side of the main body 48, and the tips are inserted into the fixing holes 52 and fixed. Thus, by removing the T-shaped pin 53, the tablet storage box 50 can be attached, removed, or replaced.

The frame chuck mechanism 49 rotates the movable chuck 55 with respect to the fixed chuck 54 and the ball screw 57 by rotating the chuck driving motor 56.
Alternatively, it is configured to be driven via the transmission belt 58 and moved in the direction of the arrow X to adjust the interval in accordance with the width dimension of the lead frame 44. Further, a chuck piece 55a is provided at a lower end of the movable chuck 55, and a pressing piece 5 is provided above the chuck piece 55a.
5b is attached to the tip of the drive rod 60 of the presser piece drive cylinder 59, and moves forward and backward in the direction of arrow Z.
Is arranged so as to sandwich one long side portion. The other long side of the lead frame 44 is inserted between upper and lower pairs of chuck pieces 54 a provided at the lower end of the fixed side chuck 54.

Further, the main body 48 is formed with an oval operation hole 61 at a portion where the tablet storage box 50 is attached, and the operation hole 61 has an H of a tablet pushing mechanism 62 provided on the upper surface side of the main body 48. An extruded plate 64 attached to a shaped extrusion frame 63 is inserted.
By operating the tablet push-out mechanism 62 in the direction of the arrow Y, the push-out plate 64 moves up and down in the storage groove 65 of the tablet storage box 50, and the tablet is smoothly fed out from an extrusion hole (not shown) formed on the lower surface side. You can do it. Reference numeral 66 denotes a receiving portion of the air piping valve 67 and the sensor connector 68 which are provided on the loader jig 46 and introduced from outside.

On the other hand, the frame feeder section 42 has a structure in which a substantially rectangular parallelepiped fixed frame member 69 and a substantially rectangular parallelepiped movable frame member 70 are provided so as to face each other with the longitudinal direction being horizontal. In addition, ball screws 71 and 72 vertically provided on the movable frame member 70 so as to be spaced apart in the longitudinal direction and rotate freely on the facing surface of the fixed frame member 69 so as to increase the spacing between the facing surfaces. A spring 73 is provided between the screws and screwed therethrough.

One ball screw 71 is directly connected to and driven by the rotating shaft of a width changing motor 74, and the other ball screw 72 is connected to a width changing motor 74 via a transmission belt 75.
Is driven to rotate. Thus, by rotating the width changing motor 74 in the forward / reverse direction, the interval between the fixed frame member 69 and the movable frame member 70 can be freely set, and the width between the opposed surfaces of the fixed frame member 69 and the movable frame member 70 can be set. Can be appropriately adjusted to the width of the lead frame 44.

Further, a plurality of flat disk-shaped idle rollers 76 are arranged in the longitudinal direction on the opposing surfaces of the fixed frame member 69 and the movable frame member 70, respectively. The lead frame 44 supplied from the frame magazine is supported on the rollers 76 of the movable frame member 70 in the horizontal direction in the direction in which the rollers 76 are arranged. It can be moved to.

The fixed side frame member 69 is provided just above the frame reaching position on one end side so as to be connected to the lead frame 4.
The arrival detection sensor 77 which detects the arrival of the lead frame 4 is moved back and forth by the sensor drive motor 78 in the arrangement direction of the rollers 76, that is, in the direction of the arrow P which is the moving direction of the lead frame 4, and the position is adjusted according to the change in the length of the lead frame 4. It is provided to enable Further, between the opposed surfaces of the fixed frame member 69 and the movable frame member 70,
A substantially rectangular lead frame turning member 79 is provided so as to be able to ascend and descend so as to be located immediately below the lead frame 44 moved by the rollers 76.

With such a configuration, the lead frame 44 supplied to the frame feeder section 42 is supported by the rollers 76, the leading end is fed to the frame reaching position, and the arrival is detected by the arrival detecting sensor 77. Then, the lead frame turning member 79 rises to support the lead frame 44 from the back side. Thereafter, the lead frame 44 is sandwiched by the frame chuck mechanism 49 of the frame transport unit 41, transported to the package mold unit, and the package is molded using the tablet stored and supplied in the tablet storage box 50 transported at the same time. .

Further, the type of the lead frame 44 changes.
When the length and width dimensions are changed to those different from the conventional ones, the control by the control unit 40 is started according to the input product name, and the width change motor 74 and the sensor drive motor are controlled in the frame feeder unit 42. 78 is driven, the width between the opposing surfaces of the fixed frame member 69 and the movable frame member 70 is adjusted to the width of the lead frame 44, and the position of the arrival detection sensor 77 is adjusted. At this time, since the positioning is not performed by visual observation, it can be performed accurately without any trouble.

In the frame transport section 41, the chuck driving motor 56 of the frame chuck mechanism 49 is driven to move the movable chuck 55, and the distance between the fixed chuck 54 and the movable chuck 55 is the width of the lead frame 44. The interval is adjusted to match. Further, the tablet storage box 50 is mounted with the T-shaped pin 5
3, the tablet can be easily replaced with a new tablet storage box 50 by inserting and removing the T-shaped pin 53.

With such a configuration, it is possible to remove the loader jig 46 from the loader carrier 45 and to perform the troublesome work of fixing the loader jig 46, and also to prepare a kind-specific width matching block or the like. Therefore, it is possible to easily cope with the change of the product type, without having to replace it or to perform the visual adjustment of the position, to greatly reduce the setup time, and to improve the operation efficiency of the apparatus.

[0029]

As is apparent from the above description, according to the present invention, the setup for changing the lead frame can be performed in a short time without any trouble, and the apparatus can be operated efficiently. It works.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a main part of a frame transport unit according to an embodiment of the present invention. FIG. 1A is a perspective view of the main part, and FIG.
(B) is a perspective view of a T-shaped pin.

FIG. 2 is a perspective view illustrating a schematic configuration of a frame transport unit according to the embodiment of the present invention.

FIG. 3 is a perspective view showing a frame feeder unit according to the embodiment of the present invention.

FIG. 4 is a perspective view showing a main part of a conventional frame transport unit.

5A and 5B are diagrams showing a schematic configuration of a conventional frame transport unit, and FIG. 5A is a perspective view showing a state before assembling;
(B) is a perspective view showing the state after assembling.

FIG. 6 is a perspective view showing a frame feeder section of a conventional example.

[Explanation of symbols]

 Reference Signs List 40 control unit 41 frame transport unit 42 frame feeder unit 43 semiconductor chip 44 lead frame 45 loader carrier 46 loader jig 48 body 49 frame chuck mechanism 50 tablet storage box 51 mounting hole 52 Fixing hole 53 ... T-shaped pin 54 ... Fixed side chuck 55 ... Movable side chuck 55b ... Holding piece 56 ... Chuck drive motor 57,71,72 ... Ball screw 58,75 ... Transmission belt 59 ... Holding piece driving cylinder 69 ... Fixed side Frame member 70: movable side frame member 74: width changing motor 77: arrival detection sensor 78: sensor driving motor

Continued on the front page (72) Inventor Yasuhiro Hakoishi 6-6 Kita Industrial Park, Kitakami City, Iwate Prefecture Iwate Toshiba Electronics Co., Ltd. F-term (reference) 5F061 AA01 BA01 CA21 DD01 DD03 DD04

Claims (5)

[Claims] A lead frame to which a semiconductor chip is attached; a frame feeder unit to which the lead frame is supplied; and a frame transfer unit that transfers the lead frame from the frame feeder unit to a package mold unit. The semiconductor device according to claim 1, wherein the frame transport unit is configured to continuously vary a holding width corresponding to a width dimension of the lead frame and to include a frame chuck mechanism for holding a long side portion of the lead frame. manufacturing device. 2. The apparatus for manufacturing a semiconductor device according to claim 1, further comprising a control unit that controls a holding width of the frame transport unit. 3. A lead frame to which a semiconductor chip is attached, a frame feeder section to which the lead frame is supplied, and a frame transport section that transports the lead frame from the frame feeder section to a package mold section, The apparatus for manufacturing a semiconductor device, wherein the frame feeder section has a continuously variable holding width corresponding to the supplied lead frame. 4. The semiconductor device manufacturing apparatus according to claim 3, further comprising a control unit for controlling a holding width of said frame feeder unit. 5. The semiconductor device manufacturing apparatus according to claim 2, wherein said control unit performs automatic control according to a type of said semiconductor chip.