CN106206389B - A kind of wafer disk pusher - Google Patents

A kind of wafer disk pusher Download PDF

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Publication number
CN106206389B
CN106206389B CN201610629423.9A CN201610629423A CN106206389B CN 106206389 B CN106206389 B CN 106206389B CN 201610629423 A CN201610629423 A CN 201610629423A CN 106206389 B CN106206389 B CN 106206389B
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CN
China
Prior art keywords
wafer disk
fixed
hand basket
mechanical arm
conveyer belt
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Active
Application number
CN201610629423.9A
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Chinese (zh)
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CN106206389A (en
Inventor
华开朗
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Jiangsu Jingtai Electric Power Technology Co.,Ltd.
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XINGHUA LIANFU FOOD Co Ltd
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Priority to CN201610629423.9A priority Critical patent/CN106206389B/en
Publication of CN106206389A publication Critical patent/CN106206389A/en
Application granted granted Critical
Publication of CN106206389B publication Critical patent/CN106206389B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Abstract

The invention discloses a kind of wafer disk pushers, it includes workbench, and it is fixed on delivery device on workbench, delivery device includes the jacking cylinder for being mounted at least one hand basket of multiple wafer disks and being arranged below the hand basket, it is arranged in front of the hand basket, push cylinder for releasing the wafer disk in the hand basket, the wafer disk pusher further includes the positioning component and feed mechanism being fixed on the workbench, the positioning component is arranged at the rear of the hand basket, wafer disk for the push cylinder to be pushed out from the hand basket positions, the feed mechanism is arranged at the rear of the positioning component, material is conveyed for the wafer disk on the positioning component.The wafer disk pusher of the present invention can be automatically performed push and the feeding of wafer disk, do not need manual operation, thereby reduce labor intensity, improve working efficiency.

Description

A kind of wafer disk pusher
Technical field
The present invention relates to wafer fab more particularly to a kind of wafer disk pushers.
Background technology
Diode wafer is the main raw material(s) of diode, and in the production process of diode, diode wafer welding is One necessary process, however, current diode production producer is when carrying out diode wafer welding, mainly by manually come It completes, great work intensity, bad rate is higher for product, efficiency of assembling is low.
Invention content
Technical problem to be solved by the present invention lies in provide a kind of wafer disk pusher, can realize wafer disk Automatic push and automatic charging need not be operated manually, to reduce the labor intensity of staff, the work also improved Make efficiency.
In order to solve the above technical problem, the present invention provides a kind of wafer disk pushers, including：
Workbench, and it is fixed on delivery device, positioning component and feed mechanism on the workbench, wherein institute It includes at least one hand basket for being mounted with multiple wafer disks to state delivery device, and the jacking cylinder below the hand basket is arranged, with And the push cylinder for releasing wafer disk out of described hand basket, the push cylinder, the hand basket, the positioning component and The feed mechanism is arranged in order along the wafer disk Y direction.
Further, the positioning component includes the positioning installation frame being fixed on the workbench, and is fixed on At least a pair of of locating piece in the positioning installation frame, each pair of locating piece correspond to a hand basket, and on the locating piece The guide rail being moved forward and backward for the wafer disk is provided with along the wafer disk Y direction.
Further, the feed mechanism includes the first conveyer belt mechanism being fixed on the workbench, and setting exists Magazine in the first conveyer belt mechanism is arranged in first conveyer belt mechanism one end, defeated for accepting described first The hopper for the material that tape-feed conveying comes and one end are arranged below the hopper, and second for accepting material is defeated Tape-feed, and be arranged in second conveyer belt mechanism side, for the material on the second conveyor structure to be inhaled The mechanical arm mechanism being attached on the wafer disk on the positioning component.
Further, the positioning component further includes the push cylinder being arranged between each pair of locating piece, and is located at The second jacking cylinder below the push cylinder, the push cylinder are fixed in the positioning installation frame, and being used for will be described Wafer disk pushes back the hand basket.
Further, the first conveyer belt mechanism includes being parallel to the conveyer belt of the wafer disk Y-axis, is respectively set Driven wheel at the conveyer belt both ends supports the support base of the driven wheel shaft, and the driving driving wheel Driving cylinder, the driving cylinder is fixed on the support base, and the support base is fixed on the workbench；With/ Or,
Second conveyer belt mechanism includes the synchronous belt for being parallel to the wafer disk X-axis, is separately positioned on the synchronization Driven wheel with both ends supports the support base of the driven wheel, drives the drive motor of the driving wheel, and fixed institute The motor mount plate of drive motor is stated, the motor mount plate is fixed on the workbench.
Further, second conveyer belt mechanism further includes the material baffle being arranged in the synchronous belt both sides, and/ Or, the material baffle is provided with multiple limits close to one end of the hopper expects block.
Further, the mechanical arm mechanism includes being fixed on workbench, is respectively parallel to the wafer disk X The mechanical arm guide rail of the mechanical arm of axis and the wafer disk Y-axis, one end of the mechanical arm is with can be relative to the mechanical arm guide rail The mode being moved forward and backward along the wafer disk Y-axis is mounted on the mechanical arm guide rail, and sliding block is additionally provided on the mechanical arm, The sliding block by can relative to the mechanical arm along wafer disk X-axis move left and right in a manner of be mounted on the mechanical arm on, it is described At least two stepper motors are fixedly installed on sliding block, the suction nozzle being connected with the stepper motor by shaft coupling passes through guiding The feeding pin being fixed on the sliding block, wherein the suction nozzle and the feeding pin are located at right over the synchronous belt, described to send Material is sold, and amesdial head is additionally provided at the top of the sliding block.
Implement the embodiment of the present invention, has the advantages that：
Wafer disk pusher for implementing the present invention, by the push cylinder in delivery device by multiple crystalline substances in hand basket Automatic push carry out automatic charging to piece disk to positioning component, then by feed mechanism to the wafer disk on the positioning component one by one, from And realize that the push of wafer disk and feeding are all automatically performed, manual operation is not needed, labor intensity is thereby reduced, is improved Working efficiency.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with Obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of stereogram of an embodiment of wafer disk pusher of the present invention；
Fig. 2 is the structural schematic diagram of the feed mechanism of wafer disk pusher in response diagram 1；
Fig. 3 is the partial enlarged view of basket structure in response diagram 1；
Fig. 4 is the vertical view of wafer disk pusher in Fig. 1；
Fig. 5 is the partial enlarged view of structure between suction nozzle, feeding pin and sliding block in response diagram 1.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts Embodiment shall fall within the protection scope of the present invention.
It is a kind of structural schematic diagram of an embodiment of wafer disk pusher of the present invention referring to Fig. 1, specifically, this The wafer disk pusher specifically includes workbench 1 in embodiment, and is fixed on delivery device on the workbench 1, fixed Hyte part and feed mechanism, wherein
Referring to Fig. 1 and Fig. 2, which includes being mounted with two hand baskets 22 of multiple wafer disks, and being used for will be brilliant Two push cylinders 24 (each hand basket 22 corresponds to a push cylinder 24) that piece disk is pushed out from hand basket 22, and be arranged at this Jacking cylinder 23 below hand basket, the push cylinder 24, hand basket 22, positioning component and feed mechanism are along the wafer disk Y direction It is arranged in order；Specifically, referring to Fig. 3, the hand basket 22 is by bottom plate 222 in the present embodiment, and two side plates 223 and top plate 224 enclose The rectangular hoop of the front and rear sides opening formed is closed, and is fixedly installed handle 225 on top plate 224, is set on the inner wall of side plate 223 It is equipped with the multiple and matched groove of chip plate edge, so that under the action of push cylinder 24, the wafer disk is recessed along this Slot is pushed out in hand basket 22；Further, referring to Fig. 3, correspond to the position of hand basket 22 in the present embodiment also on workbench 1 Supporting plate 221 is set, and the supporting plate 221 can drive the hand basket 22 flat relative to the work under the push rod effect of jacking cylinder 23 Platform 1 moves up and down；Further, referring to Fig. 3, hand basket 22 slides from supporting plate 221 in order to prevent, and the present embodiment can also be at this Multiple limited blocks 226 are set on supporting plate 221；In the present embodiment, the number of the hand basket 22 can be adjusted as needed, accordingly The number of ground, corresponding jacking cylinder 23 and push cylinder 24 is also adaptively adjusted；
Referring to Fig. 1, which specifically includes the positioning installation frame 31 being fixed on workbench 1, and is fixed on Two pairs of locating pieces 32 in positioning installation frame 31, and each pair of locating piece 32 corresponds to a hand basket 22, and 32 upper edge of locating piece The wafer disk Y direction is provided with the guide rail being moved forward and backward for wafer disk, i.e., under the action of push cylinder 24, wafer disk quilt It releases guide rail of the part of hand basket 22 then on the locating piece 32 and slides into certain position, when it is implemented, common Fig. 4, it can root The quantity that locating piece is adjusted according to the size of distance between adjacent hand basket, for example, see Fig. 1, due between two hand baskets distance compared with It is small, then correspond to first pair of locating piece of first hand basket and corresponds in second pair of locating piece of second hand basket, it is adjacent Two locating pieces can synthesize a locating piece, then the guide rail corresponding to chip plate edge is respectively set in the locating piece both sides；Into One step, for the ease of pushing back the wafer disk after feeding in hand basket 22, the present embodiment can also be between each pair of locating piece 32 Push cylinder 33, and the second jacking cylinder under the push cylinder 33 are set, and the push cylinder 33 and second jacks Cylinder is each attached in positioning installation frame 31, since the push cylinder 33 just uses after wafer disk feeding, do not make When with the push cylinder 33, the plane most where point of the push cylinder 33 is flat less than two guide rails place on each pair of locating piece 32 Face, and when it is desired to be used, then the push cylinder 33 is jacked to corresponding height, then by the push gas by the second jacking cylinder The push rod of cylinder 33 pushes back the wafer disk after feeding in hand basket；
Referring to Fig. 1 and Fig. 2, which includes the first conveyer belt mechanism being fixed on workbench 1, and setting is the Magazine 43 on one conveyer belt mechanism is arranged in the first conveyer belt mechanism one end, for accepting the first conveyer belt mechanism The hopper 44 for the material that conveying comes and one end are arranged below the hopper 44, the material come for accepting the conveying of hopper 44 The second conveyer belt mechanism, and be arranged in the second conveyer belt mechanism side, for by the material on second conveyor structure The mechanical arm mechanism being adsorbed on the wafer disk on above-mentioned positioning component；Specifically, referring to Fig. 4, wherein the first conveyer belt machine Structure includes the conveyer belt 421 for being parallel to the wafer disk Y-axis, is separately positioned on the driven wheel at 421 both ends of conveyer belt, support The support base of driven wheel shaft, and the driving cylinder 424 of driving wheel is driven, which is fixed on support base On, which is then fixed on workbench 1；Second conveyer belt mechanism includes the synchronization for being parallel to the wafer disk X-axis Band 451 is separately positioned on the driven wheel at 451 both ends of synchronous belt, supports the support base of driven wheel, drives the driving of driving wheel Motor 454, and the motor mount plate of drive motor 454 is fixed, and the motor mount plate is fixed on workbench 1；Referring to Fig. 5, the mechanical arm mechanism include mechanical arm 47, and are mounted on the mechanical arm guide rail 46 on workbench 1 by fixed frame, should Mechanical arm guide rail 46 is parallel with wafer disk Y-axis, the side of one end of mechanical arm 47 can be moved relative to the mechanical arm guide rail 46 Formula is mounted on mechanical arm guide rail 46, is provided with sliding block 48 on the mechanical arm 47, the sliding block 48 along wafer disk X-direction can move Dynamic mode is mounted on mechanical arm 47, and there are two stepper motor 49, the 48 top settings of sliding block for fixed setting on the sliding block 48 There is amesdial head 412, feeding pin 411 is additionally provided on the sliding block 48, which is fixed on the cunning by guide plate 413 On block, and shaft coupling of two stepper motors 49 then by setting through the guide plate 413 is connected separately with suction nozzle 410, and The suction nozzle 410 and feeding pin 411 are respectively positioned on the surface of synchronous belt 451, when push cylinder 24 in hand basket 22 by being pushed out, by In the limited length of 24 push rod of push cylinder, therefore, wafer disk can not completely disengage hand basket or completely into positioning component, this When, control mobile mechanical arm 47 makes feeding pin 411 be inserted into the jack a of wafer disk one end, then pulls the wafer disk to move, makes It completely disengages hand basket, and enters positioning component, and then mechanical arm 47 returns and draws the object on synchronous belt 451 by suction nozzle 410 Material, then the material of absorption is fixed on corresponding position on wafer disk along wafer disk Y-axis mobile mechanical arm, certainly if desired, also Control slide block is needed to be moved along wafer disk X-axis, and during being somebody's turn to do, then the distance of sliding block movement is measured by amesdial head；Into one Step the, in order to avoid landing of the material in transportational process, the present embodiment can also be in 451 liang of the synchronous belt of the second conveyer belt mechanism Material baffle 456 is arranged in side, and the material baffle 456 is provided with multiple limits close to one end of hopper 44 and expects block 457.
For the ease of monitoring, the present embodiment can also pass through fixed mount setting square monitoring camera on the robotic arm.
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly It encloses, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and is wanted according to right of the present invention Equivalent variations made by asking, still belong to the scope covered by the invention.

Claims (1)

1. a kind of wafer disk pusher, which is characterized in that including workbench（1）, and it is fixed on the workbench（1） Upper delivery device, positioning component and feed mechanism, wherein the delivery device includes be mounted with multiple wafer disks at least one Hand basket（22）, it is arranged in the hand basket（22）The jacking cylinder of lower section（23）, and for by wafer disk from the hand basket（22） The push cylinder of interior release（24）, the push cylinder（24）, the hand basket（22）, the positioning component and the feed mechanism It is arranged in order along the wafer disk Y direction, the positioning component includes being fixed on the workbench（1）On location and installation Frame（31）, and it is fixed on the positioning installation frame（31）On at least a pair of of locating piece（32）, each pair of locating piece（32）It is corresponding In a hand basket（22）, and the locating piece（32）Wafer disk Y direction described in upper edge is provided with for before the wafer disk The guide rail moved afterwards, the feed mechanism include being fixed on the workbench（1）On first conveyer belt mechanism, setting exist Magazine in the first conveyer belt mechanism（43）, it is arranged in first conveyer belt mechanism one end, for accepting described The hopper for the material that the conveying of one conveyer belt mechanism comes（44）And one end is arranged in the hopper（44）Lower section, for accepting Second conveyer belt mechanism of material, and be arranged in second conveyer belt mechanism side, it is used for the second conveyor Material on structure is adsorbed to the mechanical arm mechanism on the wafer disk on the positioning component, and the positioning component further includes setting In each pair of locating piece（32）Between push cylinder（33）, and it is located at the push cylinder（33）Second jacking gas of lower section Cylinder, the push cylinder（33）It is fixed on the positioning installation frame（31）On, for the wafer disk to be pushed back the hand basket （22）, the first conveyer belt mechanism includes being parallel to the conveyer belt of the wafer disk Y-axis（421）, it is separately positioned on described defeated Send band（421）The driven wheel at both ends supports the support base of the driven wheel shaft, and drives the driving wheel Drive cylinder（424）, the driving cylinder（424）It is fixed on the support base, it is flat that the support base is fixed on the work Platform（1）On；
Second conveyer belt mechanism includes the synchronous belt for being parallel to the wafer disk X-axis（451）, it is separately positioned on described same Walk band（451）The driven wheel at both ends supports the support base of the driven wheel, drives the drive motor of the driving wheel （454）, and the fixed drive motor（454）Motor mount plate, the motor mount plate is fixed on the workbench （1）On, second conveyer belt mechanism further includes being arranged in the synchronous belt（451）The material baffle of both sides（456）,
The material baffle（456）Close to the hopper（44）One end be provided with multiple limits material blocks（457）, the mechanical arm machine Structure includes being fixed on workbench（1）On, it is respectively parallel to the mechanical arm of the wafer disk X-axis（47）With the wafer disk Y The mechanical arm guide rail of axis（46）, the mechanical arm（47）One end with can be relative to the mechanical arm guide rail along the wafer disk Y-axis The mode of back-and-forth motion is mounted on the mechanical arm guide rail（46）On, the mechanical arm（47）On be additionally provided with sliding block（48）, institute State sliding block（48）With can be relative to the mechanical arm（47）The mode moved left and right along wafer disk X-axis is mounted on the mechanical arm （47）On, the sliding block（48）On be fixedly installed at least two stepper motors（49）, pass through shaft coupling and the stepper motor （49）Connected suction nozzle（410）, pass through guide plate（413）It is fixed on the sliding block（48）On feeding pin（411）, wherein institute State suction nozzle（410）With the feeding pin（411）Positioned at the synchronous belt（451）Surface, the feeding pin（411）, the cunning Block（48）Top be additionally provided with amesdial head (412), the hand basket（22）For by bottom plate（222）, two side plates（223）With Top plate（224）The rectangular hoop for the front and rear sides opening being enclosed, and the top plate（224）On be fixedly installed handle （225）, the side plate（223）Inner wall on be provided with multiple with the matched guide rail of chip plate edge, the work is flat Platform（1）It is upper to correspond to the hand basket（22）Position be provided with supporting plate（221）, the supporting plate（221）On be further fixedly arranged on use In the positioning bottom plate（222）Limited block（226）, the supporting plate（221）Under the push rod effect of the jacking cylinder (23) It can be relative to the workbench（1）It further includes by fixed mount setting in machinery to move up and down the wafer disk pusher Monitoring camera above arm.
CN201610629423.9A 2014-10-17 2014-10-17 A kind of wafer disk pusher Active CN106206389B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610629423.9A CN106206389B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610629423.9A CN106206389B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201410549877.6A CN104332439B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher

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CN201410549877.6A Division CN104332439B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher

Publications (2)

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CN106206389A CN106206389A (en) 2016-12-07
CN106206389B true CN106206389B (en) 2018-10-09

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CN201610629436.6A Active CN106024686B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201410549877.6A Expired - Fee Related CN104332439B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629412.0A Expired - Fee Related CN106024684B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629425.8A Active CN106024685B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means
CN201610629423.9A Active CN106206389B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629437.0A Expired - Fee Related CN106024687B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means

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CN201410549877.6A Expired - Fee Related CN104332439B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629412.0A Expired - Fee Related CN106024684B (en) 2014-10-17 2014-10-17 A kind of wafer disk pusher
CN201610629425.8A Active CN106024685B (en) 2014-10-17 2014-10-17 A kind of wafer disk driving means

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CN106024686B (en) * 2014-10-17 2018-06-08 惠安三兴石材有限公司 A kind of wafer disk pusher
CN105173690B (en) * 2015-08-18 2018-02-06 先进光电器材（深圳）有限公司 Automatic feeding and discharging device
CN105197583B (en) * 2015-10-30 2017-06-23 江苏比微曼智能科技有限公司 Trigger under pcb board
CN105314393B (en) * 2015-11-20 2017-07-28 江苏艾科瑞思封装自动化设备有限公司 Do not shut down feeding device
CN106629037A (en) * 2016-11-25 2017-05-10 深圳市诚亿自动化科技有限公司 Non-shutdown various-IC picking device
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CN106024684A (en) 2016-10-12
CN104332439B (en) 2017-03-01
CN106206389A (en) 2016-12-07
CN104332439A (en) 2015-02-04
CN106024685B (en) 2019-01-01
CN106024685A (en) 2016-10-12
CN106024686B (en) 2018-06-08
CN106024687B (en) 2019-01-18
CN106024687A (en) 2016-10-12
CN106024684B (en) 2018-06-15

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