CN105917529B - 连接体、连接体的制造方法、连接方法、各向异性导电粘接剂 - Google Patents
连接体、连接体的制造方法、连接方法、各向异性导电粘接剂 Download PDFInfo
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- CN105917529B CN105917529B CN201580004803.7A CN201580004803A CN105917529B CN 105917529 B CN105917529 B CN 105917529B CN 201580004803 A CN201580004803 A CN 201580004803A CN 105917529 B CN105917529 B CN 105917529B
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- conductive particles
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- anisotropic conductive
- adhesive
- liquid crystal
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010070103.0A CN111508855B (zh) | 2014-01-16 | 2015-01-13 | 连接体及其制造方法、连接方法、各向异性导电粘接剂 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014006285A JP2015135878A (ja) | 2014-01-16 | 2014-01-16 | 接続体、接続体の製造方法、接続方法、異方性導電接着剤 |
| JP2014-006285 | 2014-01-16 | ||
| PCT/JP2015/050619 WO2015108025A1 (ja) | 2014-01-16 | 2015-01-13 | 接続体、接続体の製造方法、接続方法、異方性導電接着剤 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010070103.0A Division CN111508855B (zh) | 2014-01-16 | 2015-01-13 | 连接体及其制造方法、连接方法、各向异性导电粘接剂 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105917529A CN105917529A (zh) | 2016-08-31 |
| CN105917529B true CN105917529B (zh) | 2020-02-21 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580004803.7A Active CN105917529B (zh) | 2014-01-16 | 2015-01-13 | 连接体、连接体的制造方法、连接方法、各向异性导电粘接剂 |
| CN202010070103.0A Active CN111508855B (zh) | 2014-01-16 | 2015-01-13 | 连接体及其制造方法、连接方法、各向异性导电粘接剂 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010070103.0A Active CN111508855B (zh) | 2014-01-16 | 2015-01-13 | 连接体及其制造方法、连接方法、各向异性导电粘接剂 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10175544B2 (https=) |
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| KR102593532B1 (ko) * | 2016-06-03 | 2023-10-26 | 삼성디스플레이 주식회사 | 이방성 도전 필름 및 이를 이용한 디스플레이 장치 |
| JP6435555B2 (ja) * | 2016-11-09 | 2018-12-12 | 本田技研工業株式会社 | 導電部品固定構造 |
| US11566250B2 (en) | 2017-10-26 | 2023-01-31 | Noroo Ic Co., Ltd. | Production and separation of 3-hydroxypropionic acid |
| SG11202003616PA (en) | 2017-10-26 | 2020-05-28 | Noroo Ic Co Ltd | Production and separation of 3-hydroxypropionic acid |
| JP7185252B2 (ja) | 2018-01-31 | 2022-12-07 | 三国電子有限会社 | 接続構造体の作製方法 |
| JP7046351B2 (ja) | 2018-01-31 | 2022-04-04 | 三国電子有限会社 | 接続構造体の作製方法 |
| JP7160302B2 (ja) * | 2018-01-31 | 2022-10-25 | 三国電子有限会社 | 接続構造体および接続構造体の作製方法 |
| EP4130062B1 (en) * | 2020-03-26 | 2025-07-09 | Sekisui Chemical Co., Ltd. | Resin particles, electrically conductive particles, electrically conductive material, and connection structure |
| JP2023149878A (ja) * | 2022-03-31 | 2023-10-16 | デクセリアルズ株式会社 | 接続構造体及びその製造方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2015135878A (ja) | 2015-07-27 |
| CN111508855B (zh) | 2024-01-02 |
| CN105917529A (zh) | 2016-08-31 |
| WO2015108025A1 (ja) | 2015-07-23 |
| KR20160108324A (ko) | 2016-09-19 |
| US20160327826A1 (en) | 2016-11-10 |
| TW201540811A (zh) | 2015-11-01 |
| KR102386367B1 (ko) | 2022-04-13 |
| CN111508855A (zh) | 2020-08-07 |
| US10175544B2 (en) | 2019-01-08 |
| TWI661027B (zh) | 2019-06-01 |
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