CN105900180B - 导电糊剂、连接结构体及连接结构体的制造方法 - Google Patents

导电糊剂、连接结构体及连接结构体的制造方法 Download PDF

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Publication number
CN105900180B
CN105900180B CN201580004070.7A CN201580004070A CN105900180B CN 105900180 B CN105900180 B CN 105900180B CN 201580004070 A CN201580004070 A CN 201580004070A CN 105900180 B CN105900180 B CN 105900180B
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conductive paste
electrode
scolding tin
mentioned
object component
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English (en)
Chinese (zh)
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CN105900180A (zh
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久保田敬士
石泽英亮
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/115—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
    • H01L2224/1152—Self-assembly, e.g. self-agglomeration of the bump material in a fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
CN201580004070.7A 2014-06-05 2015-06-02 导电糊剂、连接结构体及连接结构体的制造方法 Active CN105900180B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-116583 2014-06-05
JP2014116583 2014-06-05
PCT/JP2015/065905 WO2015186704A1 (ja) 2014-06-05 2015-06-02 導電ペースト、接続構造体及び接続構造体の製造方法

Publications (2)

Publication Number Publication Date
CN105900180A CN105900180A (zh) 2016-08-24
CN105900180B true CN105900180B (zh) 2018-07-06

Family

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CN201580004070.7A Active CN105900180B (zh) 2014-06-05 2015-06-02 导电糊剂、连接结构体及连接结构体的制造方法

Country Status (5)

Country Link
JP (2) JP5860191B1 (ko)
KR (1) KR102392995B1 (ko)
CN (1) CN105900180B (ko)
TW (1) TWI670729B (ko)
WO (1) WO2015186704A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180044224A (ko) * 2015-08-24 2018-05-02 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JP7321979B2 (ja) * 2015-12-18 2023-08-07 株式会社レゾナック 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板
JP6782413B2 (ja) * 2015-12-18 2020-11-11 昭和電工マテリアルズ株式会社 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板
KR101820468B1 (ko) * 2016-11-21 2018-01-19 ㈜ 엘프스 자가 융착형 도전접속 페이스트
JP6600019B2 (ja) * 2017-09-08 2019-10-30 株式会社タムラ製作所 電子基板の製造方法および異方性導電ペースト
CN111417488A (zh) * 2017-12-22 2020-07-14 积水化学工业株式会社 焊锡粒子、导电材料、焊锡粒子的保管方法、导电材料的保管方法、导电材料的制造方法、连接结构体及连接结构体的制造方法
JP7389657B2 (ja) * 2020-01-21 2023-11-30 積水化学工業株式会社 導電ペースト及び接続構造体
JP7405196B2 (ja) * 2020-07-14 2023-12-26 株式会社レゾナック 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板

Citations (8)

* Cited by examiner, † Cited by third party
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TW200503872A (en) * 2003-06-09 2005-02-01 Senju Metal Industry Co Solder paste
CN102144432A (zh) * 2008-09-05 2011-08-03 住友电木株式会社 导电连接材料、使用该导电连接材料的端子之间的连接方法以及连接端子的制造方法
CN102204420A (zh) * 2008-11-06 2011-09-28 住友电木株式会社 制造电子器件的方法及电子器件
CN102576766A (zh) * 2009-10-15 2012-07-11 日立化成工业株式会社 导电性粘接剂、太阳能电池及其制造方法、以及太阳能电池模块
CN102859797A (zh) * 2010-04-22 2013-01-02 积水化学工业株式会社 各向异性导电材料及连接结构体
CN102939645A (zh) * 2010-06-15 2013-02-20 索尼化学&信息部件株式会社 连接结构体的制造方法
CN103443869A (zh) * 2012-02-21 2013-12-11 积水化学工业株式会社 导电性粒子、导电性粒子的制造方法、导电材料及连接结构体
CN103843469A (zh) * 2011-09-30 2014-06-04 株式会社村田制作所 电子装置、接合材料以及电子装置的制造方法

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JP2006035259A (ja) * 2004-07-27 2006-02-09 Denso Corp ソルダペースト
JPWO2008023452A1 (ja) 2006-08-25 2010-01-07 住友ベークライト株式会社 接着テープ、接合体および半導体パッケージ
TWI522409B (zh) * 2008-03-27 2016-02-21 Sekisui Chemical Co Ltd Conductive particles, anisotropic conductive materials and connecting structures
US8420722B2 (en) * 2008-07-10 2013-04-16 Electronics And Telecommunications Research Institute Composition and methods of forming solder bump and flip chip using the same
CN102576948B (zh) * 2009-10-28 2015-04-01 住友电木株式会社 导电连接材料和使用其的端子间的连接方法
JP2012064853A (ja) * 2010-09-17 2012-03-29 Sekisui Chem Co Ltd 半導体素子接合用接着剤及び半導体素子の接合方法
JP5613220B2 (ja) * 2011-12-20 2014-10-22 積水化学工業株式会社 電子部品接続材料及び接続構造体
JP5989397B2 (ja) * 2012-05-09 2016-09-07 積水化学工業株式会社 半導体装置の製造方法及び半導体接合用接着剤
JP2013251366A (ja) 2012-05-31 2013-12-12 Sony Corp 組立体の製造方法、組立体および電子機器
KR102076066B1 (ko) * 2012-07-03 2020-02-11 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
JP6112797B2 (ja) * 2012-07-30 2017-04-12 国立大学法人大阪大学 電子部品の実装方法、回路基板の作製方法及び電子部品のはんだ接合部の形成方法、並びに、接続層付きプリント配線板及びシート状接合部材
JP2014056816A (ja) * 2012-08-10 2014-03-27 Sekisui Chem Co Ltd 導電材料及び接続構造体
JP6061644B2 (ja) * 2012-09-24 2017-01-18 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200503872A (en) * 2003-06-09 2005-02-01 Senju Metal Industry Co Solder paste
CN102144432A (zh) * 2008-09-05 2011-08-03 住友电木株式会社 导电连接材料、使用该导电连接材料的端子之间的连接方法以及连接端子的制造方法
CN102204420A (zh) * 2008-11-06 2011-09-28 住友电木株式会社 制造电子器件的方法及电子器件
CN102576766A (zh) * 2009-10-15 2012-07-11 日立化成工业株式会社 导电性粘接剂、太阳能电池及其制造方法、以及太阳能电池模块
CN102859797A (zh) * 2010-04-22 2013-01-02 积水化学工业株式会社 各向异性导电材料及连接结构体
CN102939645A (zh) * 2010-06-15 2013-02-20 索尼化学&信息部件株式会社 连接结构体的制造方法
CN103843469A (zh) * 2011-09-30 2014-06-04 株式会社村田制作所 电子装置、接合材料以及电子装置的制造方法
CN103443869A (zh) * 2012-02-21 2013-12-11 积水化学工业株式会社 导电性粒子、导电性粒子的制造方法、导电材料及连接结构体

Also Published As

Publication number Publication date
JPWO2015186704A1 (ja) 2017-04-20
CN105900180A (zh) 2016-08-24
TW201606797A (zh) 2016-02-16
KR20170016313A (ko) 2017-02-13
JP2016103481A (ja) 2016-06-02
KR102392995B1 (ko) 2022-05-02
WO2015186704A1 (ja) 2015-12-10
TWI670729B (zh) 2019-09-01
JP5860191B1 (ja) 2016-02-16

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