CN105814690B - 用于半导体器件的边缘终止和对应的制造方法 - Google Patents

用于半导体器件的边缘终止和对应的制造方法 Download PDF

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CN105814690B
CN105814690B CN201480068737.5A CN201480068737A CN105814690B CN 105814690 B CN105814690 B CN 105814690B CN 201480068737 A CN201480068737 A CN 201480068737A CN 105814690 B CN105814690 B CN 105814690B
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termination
trench
substrate
guard ring
region
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CN105814690A (zh
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M.安托尼奧
F.尤德里
I.尼斯托
M.拉希莫
C.科瓦斯塞
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Hitachi Energy Ltd
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ABB Schweiz AG
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
    • H10D12/038—Manufacture or treatment of IGBTs of vertical IGBTs having a recessed gate, e.g. trench-gate IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H10D12/441—Vertical IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H10D12/441—Vertical IGBTs
    • H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • H10D30/0297—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs using recessing of the gate electrodes, e.g. to form trench gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H10D30/665—Vertical DMOS [VDMOS] FETs having edge termination structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/104—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices having particular shapes of the bodies at or near reverse-biased junctions, e.g. having bevels or moats
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H10D62/107—Buried supplementary regions, e.g. buried guard rings 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/111—Field plates
    • H10D64/112—Field plates comprising multiple field plate segments

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CN201480068737.5A 2013-12-16 2014-12-03 用于半导体器件的边缘终止和对应的制造方法 Active CN105814690B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13197534 2013-12-16
EP13197534.4 2013-12-16
PCT/EP2014/076443 WO2015090971A1 (en) 2013-12-16 2014-12-03 Edge termination for semiconductor devices and corresponding fabrication method

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CN105814690A CN105814690A (zh) 2016-07-27
CN105814690B true CN105814690B (zh) 2020-01-21

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US (1) US9859360B2 (enExample)
EP (1) EP3084833B1 (enExample)
JP (1) JP6576926B2 (enExample)
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WO (1) WO2015090971A1 (enExample)

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DE102015212464B4 (de) * 2015-07-03 2019-05-23 Infineon Technologies Ag Leistungshalbleiterrandstruktur und Verfahren zu deren Herstellung
US10998443B2 (en) * 2016-04-15 2021-05-04 Taiwan Semiconductor Manufacturing Co., Ltd. Epi block structure in semiconductor product providing high breakdown voltage
EP3545557B1 (en) * 2016-11-24 2020-12-30 ABB Power Grids Switzerland AG Power semiconductor device with floating field rings termination
US10312710B1 (en) * 2017-01-31 2019-06-04 The United States Of America, As Represented By The Secretary Of The Navy Energy recovery pulse forming network
CN108461541A (zh) * 2017-02-17 2018-08-28 中芯国际集成电路制造(上海)有限公司 Igbt的终端结构、igbt器件及其制造方法
CN108054196B (zh) * 2017-12-08 2020-09-04 南京溧水高新创业投资管理有限公司 半导体功率器件的终端结构及其制作方法
DE102019103899A1 (de) * 2019-02-15 2020-08-20 Infineon Technologies Ag Leistungshalbleiterbauelement und Verfahren zur Verarbeitung eines Leistungshalbleiterbauelements
CN111293172B (zh) * 2020-02-19 2023-10-10 北京工业大学 一种逆阻igbt的终端结构
WO2024203120A1 (ja) * 2023-03-30 2024-10-03 ローム株式会社 半導体装置

Citations (5)

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US20010035561A1 (en) * 2000-03-24 2001-11-01 Franz Hirler Semiconductor configuration
JP2007109712A (ja) * 2005-10-11 2007-04-26 Shindengen Electric Mfg Co Ltd トランジスタ、ダイオード
US20080042172A1 (en) * 2006-08-03 2008-02-21 Infineon Technologies Austria Ag Semiconductor component having a space saving edge structure
CN101969068A (zh) * 2010-08-06 2011-02-09 浙江大学 一种高压功率半导体器件的边缘终端结构
CN103165604A (zh) * 2011-12-19 2013-06-19 英飞凌科技奥地利有限公司 具有节省空间的边缘结构的半导体部件

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JP4735235B2 (ja) * 2005-12-19 2011-07-27 トヨタ自動車株式会社 絶縁ゲート型半導体装置およびその製造方法
JP5188037B2 (ja) * 2006-06-20 2013-04-24 株式会社東芝 半導体装置
JP2009088345A (ja) * 2007-10-01 2009-04-23 Toshiba Corp 半導体装置
CN102473721B (zh) * 2009-07-31 2015-05-06 富士电机株式会社 半导体装置
US8680613B2 (en) * 2012-07-30 2014-03-25 Alpha And Omega Semiconductor Incorporated Termination design for high voltage device
US8785279B2 (en) * 2012-07-30 2014-07-22 Alpha And Omega Semiconductor Incorporated High voltage field balance metal oxide field effect transistor (FBM)
CN103715232B (zh) * 2012-09-28 2017-10-10 中国科学院微电子研究所 用于半导体功率器件的沟槽式终端及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010035561A1 (en) * 2000-03-24 2001-11-01 Franz Hirler Semiconductor configuration
JP2007109712A (ja) * 2005-10-11 2007-04-26 Shindengen Electric Mfg Co Ltd トランジスタ、ダイオード
US20080042172A1 (en) * 2006-08-03 2008-02-21 Infineon Technologies Austria Ag Semiconductor component having a space saving edge structure
CN101969068A (zh) * 2010-08-06 2011-02-09 浙江大学 一种高压功率半导体器件的边缘终端结构
CN103165604A (zh) * 2011-12-19 2013-06-19 英飞凌科技奥地利有限公司 具有节省空间的边缘结构的半导体部件

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Publication number Publication date
EP3084833A1 (en) 2016-10-26
EP3084833B1 (en) 2017-09-13
JP6576926B2 (ja) 2019-09-18
US20160300904A1 (en) 2016-10-13
US9859360B2 (en) 2018-01-02
CN105814690A (zh) 2016-07-27
JP2017504964A (ja) 2017-02-09
WO2015090971A1 (en) 2015-06-25

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