CN105807576B - 曝光装置和制造设备的方法 - Google Patents

曝光装置和制造设备的方法 Download PDF

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Publication number
CN105807576B
CN105807576B CN201610019083.8A CN201610019083A CN105807576B CN 105807576 B CN105807576 B CN 105807576B CN 201610019083 A CN201610019083 A CN 201610019083A CN 105807576 B CN105807576 B CN 105807576B
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China
Prior art keywords
substrate
exposure
optical system
exposure device
light
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CN201610019083.8A
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English (en)
Chinese (zh)
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CN105807576A (zh
Inventor
斋藤顺敬
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Canon Inc
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Canon Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
    • G03F7/2028—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction of an edge bead on wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201610019083.8A 2015-01-16 2016-01-12 曝光装置和制造设备的方法 Active CN105807576B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015007122A JP6661270B2 (ja) 2015-01-16 2015-01-16 露光装置、露光システム、および物品の製造方法
JP2015-007122 2015-01-16

Publications (2)

Publication Number Publication Date
CN105807576A CN105807576A (zh) 2016-07-27
CN105807576B true CN105807576B (zh) 2019-01-22

Family

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Family Applications (1)

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CN201610019083.8A Active CN105807576B (zh) 2015-01-16 2016-01-12 曝光装置和制造设备的方法

Country Status (5)

Country Link
US (1) US9829794B2 (enExample)
JP (1) JP6661270B2 (enExample)
KR (1) KR101988084B1 (enExample)
CN (1) CN105807576B (enExample)
TW (1) TWI604278B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
CN108803245B (zh) * 2017-04-28 2020-04-10 上海微电子装备（集团）股份有限公司 硅片处理装置及方法
JP2019096669A (ja) * 2017-11-20 2019-06-20 東京エレクトロン株式会社 基板処理装置及び塗布モジュールのパラメータの調整方法並びに記憶媒体
JP7202828B2 (ja) * 2018-09-26 2023-01-12 東京エレクトロン株式会社 基板検査方法、基板検査装置および記録媒体
JP6608507B2 (ja) * 2018-11-28 2019-11-20 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
JP7170524B2 (ja) * 2018-12-14 2022-11-14 キヤノントッキ株式会社 基板載置方法、成膜方法、成膜装置、有機ｅｌパネルの製造システム
JP7204507B2 (ja) * 2019-02-05 2023-01-16 キオクシア株式会社 露光方法および露光装置
JP7038178B2 (ja) * 2020-10-29 2022-03-17 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
JP7619805B2 (ja) * 2020-12-29 2025-01-22 川崎重工業株式会社 ロボットシステム及び撮影方法
TW202501598A (zh) * 2023-04-17 2025-01-01 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置

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JPH09186066A (ja) * 1995-12-27 1997-07-15 Sony Corp 周辺露光方法および装置
JP3172085B2 (ja) * 1996-03-18 2001-06-04 キヤノン株式会社 周辺露光装置
JP3552600B2 (ja) * 1998-07-13 2004-08-11 東京エレクトロン株式会社 基板処理装置
JP4642543B2 (ja) * 2005-05-09 2011-03-02 東京エレクトロン株式会社 周縁露光装置、塗布、現像装置及び周縁露光方法
EP1983555B1 (en) * 2006-01-19 2014-05-28 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus and device manufacturing method
DE102008004762A1 (de) 2008-01-16 2009-07-30 Carl Zeiss Smt Ag Projektionsbelichtungsanlage für die Mikrolithographie mit einer Messeinrichtung
CN101339367B (zh) * 2008-08-14 2010-06-02 上海微电子装备有限公司 投影曝光装置及校正照明光束动态位置误差的装置与方法
JP5404216B2 (ja) * 2009-07-02 2014-01-29 キヤノン株式会社 露光方法、露光装置及びデバイス製造方法
US8514395B2 (en) 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
TWI417188B (zh) * 2009-11-19 2013-12-01 Sibelco Asia Pte Ltd A copper foil substrate and an impregnating liquid for producing the copper foil substrate
CN103034062B (zh) * 2011-09-29 2014-11-26 中芯国际集成电路制造(北京)有限公司 用于晶片边缘曝光的方法、光学模块和自动聚焦系统
JP2013172106A (ja) * 2012-02-22 2013-09-02 Canon Inc 描画装置及び物品の製造方法
JP6023451B2 (ja) * 2012-04-05 2016-11-09 キヤノン株式会社 照明光学系、露光装置及びデバイス製造方法
DE102012212194B4 (de) 2012-07-12 2017-11-09 Carl Zeiss Smt Gmbh Mikrolithographische Projektionsbelichtungsanlage und Verfahren zur Veränderung einer optischen Wellenfront in einem katoptrischen Objektiv einer solchen Anlage
TWM487460U (zh) 2014-04-16 2014-10-01 Chime Ball Technology Co Ltd 曝光機之曝光平台
CN204086811U (zh) 2014-08-06 2015-01-07 叙丰企业股份有限公司 曝光设备的光源装置

Also Published As

Publication number Publication date
KR101988084B1 (ko) 2019-09-30
TWI604278B (zh) 2017-11-01
KR20160088802A (ko) 2016-07-26
US20160209763A1 (en) 2016-07-21
JP6661270B2 (ja) 2020-03-11
US9829794B2 (en) 2017-11-28
JP2016134444A (ja) 2016-07-25
TW201627778A (zh) 2016-08-01
CN105807576A (zh) 2016-07-27

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