CN105359265B - 原位可移除式静电夹盘 - Google Patents

原位可移除式静电夹盘 Download PDF

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Publication number
CN105359265B
CN105359265B CN201480038576.5A CN201480038576A CN105359265B CN 105359265 B CN105359265 B CN 105359265B CN 201480038576 A CN201480038576 A CN 201480038576A CN 105359265 B CN105359265 B CN 105359265B
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China
Prior art keywords
electrostatic chuck
electrode
top surface
esc
liter
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CN201480038576.5A
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Chinese (zh)
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CN105359265A (zh
Inventor
迈克尔·S·考克斯
劳拉·哈夫雷查克
史蒂芬·V·桑索尼
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Applied Materials Inc
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Applied Materials Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833Details of electrostatic chucks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49815Disassembling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
CN201480038576.5A 2013-08-05 2014-07-22 原位可移除式静电夹盘 Active CN105359265B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361862462P 2013-08-05 2013-08-05
US61/862,462 2013-08-05
PCT/US2014/047656 WO2015020791A1 (en) 2013-08-05 2014-07-22 In-situ removable electrostatic chuck

Publications (2)

Publication Number Publication Date
CN105359265A CN105359265A (zh) 2016-02-24
CN105359265B true CN105359265B (zh) 2018-12-14

Family

ID=52427453

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480038576.5A Active CN105359265B (zh) 2013-08-05 2014-07-22 原位可移除式静电夹盘

Country Status (6)

Country Link
US (2) US9508584B2 (cg-RX-API-DMAC7.html)
JP (1) JP6423880B2 (cg-RX-API-DMAC7.html)
KR (2) KR101876501B1 (cg-RX-API-DMAC7.html)
CN (1) CN105359265B (cg-RX-API-DMAC7.html)
TW (2) TWI629747B (cg-RX-API-DMAC7.html)
WO (1) WO2015020791A1 (cg-RX-API-DMAC7.html)

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US10008399B2 (en) 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
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WO2017123818A1 (en) * 2016-01-12 2017-07-20 Grabit, Inc. Methods and systems for combined negative pressure and electroadhesion-based manipulation in manufacturing
US11011355B2 (en) * 2017-05-12 2021-05-18 Lam Research Corporation Temperature-tuned substrate support for substrate processing systems
KR102098129B1 (ko) * 2018-04-23 2020-04-07 주식회사 엠와이에스 정전기 척
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US10957520B2 (en) 2018-09-20 2021-03-23 Lam Research Corporation Long-life high-power terminals for substrate support with embedded heating elements
US11260679B2 (en) * 2018-12-21 2022-03-01 Kateeva, Inc. Gripping for print substrates
KR102651311B1 (ko) 2019-06-03 2024-03-27 삼성전자주식회사 마이크로폰들을 이용하여 사용자의 음성을 분석하는 전자 장치 및 모바일 장치
WO2020255319A1 (ja) * 2019-06-20 2020-12-24 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法
US11887878B2 (en) 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
WO2021136628A1 (en) * 2019-12-31 2021-07-08 Asml Holding N.V. Systems and methods for manufacturing a double-sided electrostatic clamp
US12334315B2 (en) * 2020-04-30 2025-06-17 Applied Materials, Inc. Cooled substrate support assembly for radio frequency environments
JP7683605B2 (ja) * 2020-06-29 2025-05-27 住友大阪セメント株式会社 静電チャック装置
US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US20220076978A1 (en) * 2020-09-09 2022-03-10 Applied Materials, Inc. Alignment of an electrostatic chuck with a substrate support
CN114695048A (zh) * 2020-12-30 2022-07-01 中微半导体设备(上海)股份有限公司 下电极组件和包含下电极组件的等离子体处理装置
JP2022165477A (ja) * 2021-04-20 2022-11-01 日新イオン機器株式会社 ウエハ支持装置
CN114220758B (zh) * 2021-11-29 2025-05-23 北京北方华创微电子装备有限公司 晶圆承载装置及工艺腔室
KR102757922B1 (ko) 2022-07-29 2025-01-21 세메스 주식회사 기판 지지 장치 및 이를 포함하는 기판 처리 장치
US20240249965A1 (en) * 2023-01-19 2024-07-25 Applied Materials, Inc. Substrate support carrier having multiple ceramic discs
TWI844352B (zh) * 2023-05-03 2024-06-01 劉華煒 半導體製程真空腔之靜電吸盤快速排氣結構
WO2025075661A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Electrostatically secured substrate support assembly

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CN101310366A (zh) * 2006-03-22 2008-11-19 东京毅力科创株式会社 等离子体处理装置

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US20050016685A1 (en) * 2003-06-30 2005-01-27 Canon Kabushiki Kaisha Substrate holding technique
CN101310366A (zh) * 2006-03-22 2008-11-19 东京毅力科创株式会社 等离子体处理装置

Also Published As

Publication number Publication date
WO2015020791A1 (en) 2015-02-12
KR20170124620A (ko) 2017-11-10
CN105359265A (zh) 2016-02-24
TW201513262A (zh) 2015-04-01
JP6423880B2 (ja) 2018-11-14
KR101876501B1 (ko) 2018-07-10
TWI613752B (zh) 2018-02-01
US9508584B2 (en) 2016-11-29
JP2016531438A (ja) 2016-10-06
US20170062260A1 (en) 2017-03-02
US20150036259A1 (en) 2015-02-05
TWI629747B (zh) 2018-07-11
KR20160041982A (ko) 2016-04-18
US9773692B2 (en) 2017-09-26
TW201729337A (zh) 2017-08-16

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